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2 LGA1366 Socket Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series and LGA1366 Socket Thermal and Mechanical Design Guide March 2011 Document Number: 320837-005 2 Thermal and Mechanical Design Guide INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained at: http://www.intel.com/design/literature.htm The Intel® Core™ i7-900 desktop processor Extreme Edition series, Intel® Core™ i7-900 desktop series processor, and Intel® Core™ i7-900 desktop series processor on 32-nm process and LGA1366 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, the Intel logo, Intel, Pentium, Core and Core Inside are trademarks of Intel Corporation in the U.S. and other countries. * Other brands and names may be claimed as the property of others. Copyright © 2008–2011, Intel Corporation. 3 Thermal and Mechanical Design Guide Contents 1 Introduction ............................................................................................................. 9 1.1 References........................................................................................................10 1.2 Definition of Terms ............................................................................................10 2 LGA1366 Socket.......................................................................................................13 2.1 Board Layout ....................................................................................................15 2.2 Attachment to Motherboard.................................................................................16 2.3 Socket Components ...........................................................................................16 2.3.1 Socket Body Housing...............................................................................16 2.3.2 Solder Balls ...........................................................................................16 2.3.3 Contacts................................................................................................17 2.3.4 Pick and Place Cover ...............................................................................17 2.4 Package Installation / Removal............................................................................18 2.4.1 Socket Standoffs and Package Seating Plane ..............................................18 2.5 Durability .........................................................................................................19 2.6 Markings ..........................................................................................................19 2.7 Component Insertion Forces................................................................................19 2.8 Socket Size.......................................................................................................19 3 Independent Loading Mechanism (ILM) ...................................................................21 3.1 Design Concept .................................................................................................21 3.1.1 ILM Cover Assembly Design Overview .......................................................21 3.1.2 ILM Back Plate Design Overview ...............................................................22 3.2 Assembly of ILM to a Motherboard .......................................................................23 3.3 ILM Cover.........................................................................................................24 4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications..27 4.1 Component Mass ...............................................................................................27 4.2 Package/Socket Stackup Height...........................................................................27 4.3 Socket Maximum Temperature ............................................................................27 4.4 Loading Specifications ........................................................................................28 4.5 Electrical Requirements ......................................................................................29 4.6 Environmental Requirements...............................................................................30 5 Sensor Based Thermal Specification Design Guidance ..............................................31 5.1 Sensor Based Specification Overview....................................................................31 5.2 Sensor Based Thermal Specification .....................................................................32 5.2.1 TTV Thermal Profile.................................................................................32 5.2.2 Specification When DTS value is Greater than TCONTROL.............................33 5.3 Thermal Solution Design Process .........................................................................34 5.3.1 Boundary Condition Definition ..................................................................34 5.3.2 Thermal Design and Modelling ..................................................................35 5.3.3 Thermal Solution Validation......................................................................36 5.4 Fan Speed Control (FSC) Design Process...............................................................37 5.4.1 Fan Speed Control Algorithm without TAMBIENT Data..................................38 5.4.2 Fan Speed Control Algorithm with TAMBIENT Data ......................................39 5.5 System Validation..............................................................................................40 5.6 Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL ...........41 6 Reference Thermal Solution .....................................................................................43 6.1 Geometric Envelope for the Intel® Reference Thermal Mechanical Design ..................43 6.2 ATX Reference Thermal Solution ..........................................................................44 6.2.1 Reference Thermal Solution Assembly .......................................................44 6.2.2 Heatsink Mass and Center of Gravity .........................................................45 4 Thermal and Mechanical Design Guide 6.2.3 Thermal Interface Material....................................................................... 45 6.3 Reference Heat Pipe Thermal Solution .................................................................. 45 6.3.1 Heat Pipe Thermal Solution Assembly........................................................ 45 6.3.2 Heatsink Mass and Center of Gravity......................................................... 46 6.4 Absolute Processor Temperature ......................................................................... 46 7 Thermal Solution Quality and Reliability Requirements............................................ 47 7.1 Reference Heatsink Thermal Verification ..............................................................
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