EK-Supremacy Elite Edition Series Universal CPU Water Block
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Intel® Xeon® Processor E3-1200 V2 Product Family and LGA 1155 Socket
Intel® Xeon® Processor E3-1200 v2 Product Family and LGA 1155 Socket Thermal/Mechanical Specifications and Design Guidelines May 2012 Document Number: 324973-001 NFORMATIONLegal Lines and Disclaimers IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Xeon® processor E3-1200 v2 product family and Intel® C200 Series Chipset family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. -
Intel ® Xeon ® Processor 3500 Series
Intel® Xeon® Processor 3500 Series Datasheet, Volume 1 July 2009 Document Number: 321332-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Xeon® Processor 3500 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. -
Intel® Core™ I7 Processor Family for the LGA-2011 Socket
Intel® Core™ i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1 Supporting Desktop Intel® Core™ i7-3960X and i7-3970X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-39xxK and i7-38xx Processor Series for the LGA-2011 Socket This is volume 1 of 2. February 2014 Reference Number: 326196-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References ............................................. -
ESC4000 G3/G3S Series 2U Rackmount Server User Guide E9711 First Edition October 2014
ESC4000 G3/G3S Series 2U Rackmount Server User Guide E9711 First Edition October 2014 Copyright © 2014 ASUSTeK COMPUTER INC. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). ASUS provides this manual “as is” without warranty of any kind, either express or implied, including but not limited to the implied warranties or conditions of merchantability or fitness for a particular purpose. In no event shall ASUS, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of use or data, interruption of business and the like), even if ASUS has been advised of the possibility of such damages arising from any defect or error in this manual or product. Specifications and information contained in this manual ae furnished for informational use only, and are subject to change at any time without notice, and should not be construed as a commitment by ASUS. ASUS assumes no responsibility or liability for any errors or inaccuracies that may appear in this manual, including the products and software described in it. Product warranty or service will not be extended if: (1) the product is repaired, modified or altered, unless such repair, modification of alteration is authorized in writing by ASUS; or (2) the serial number of the product is defaced or missing. -
Pcie-H610 Pcie-Q670-R20
Single Board Computer Full-size www.ieiworld.com PCIE-Q670-R20 PCIE-H610 Full-size PICMG 1.3 CPU card supports LGA 1155 32nm Intel® Core™ i7/i5/i3, Pentium® or Full-size PICMG 1.3 CPU Card supports 32nm LGA 1155 Intel® Core™ i7/i5/i3, Pentium® Celeron® CPU with Intel® Q67, DDR3, VGA, dual Intel® PCIe GbE, SATA 6Gb/s, PCIe Mini, or Celeron® CPU with Intel® H61, DDR3, VGA, USB 2.0, SATA 3Gb/s, Dual Realtek PCIe HD Audio and RoHS GbE, HD Audio and RoHS Dual-channel DDR3 Front panel 2 x RS-232 4 x SATA 3Gb/s 2 x RS-232 I²C Dual-channel DDR3 1333/1066 MHz SMBus TPM KB/MS Front RS-422/485 1333/1066 MHz SMBus panel KB/MS 2 x SATA 6Gb/s RS-422/485 I²C TPM FDD 2 x RS-232 LPTDIO LPT IR DIO CF-115XC-R10 USB 2.0 USB 2.0 IR 1U chassis compatible LAN1 Intel ® Intel® LAN Q67 LAN2 H61 VGA VGA IO-KIT-001-R20 DVI cable included in 4 x SATA 3Gb/s PCIe Mini TPM 1.2 Support 4 x USB 2.0 DVI-D Audio DVI model 6 x USB 2.0 Features ● PICMG 1.3 full-size graphics grade solution DDR3 1.35V ● LGA 1155 Intel® Core™ i7/i5/i3, Pentium® or Celeron® processors supported 1333 DDR3 SATA 3Gb/s ● Up to 16 GB 1333 MHz dual-channel DDR3 SDRAM ● Supports dual independent display by VGA Features TPM 1.2 Support ● Supports RAID function via SATA 6Gb/s and SATA 3Gb/s ● TPM v1.2 hardware security provided by the TPM module ● Full-size PICMG 1.3 graphics grade solution ● IEI One Key Recovery solution allows you to create rapid OS backup and recovery ● LGA 1155 Intel® Core™ i7/i5/i3, Pentium® or Celeron® processor supported ● Dual-channel 1333/1066 MHz DDR3/DDR3L SDRAM supported up -
CPU) MCU / MPU / DSP This Page of Product Is Rohs Compliant
INTEL Central Processing Units (CPU) MPU /DSP MCU / This page of product is RoHS compliant. CENTRAL PROCESSING UNITS (CPU) Intel Processor families include the most powerful and flexible Central Processing Units (CPUs) available today. Utilizing industry leading 22nm device fabrication techniques, Intel continues to pack greater processing power into smaller spaces than ever before, providing desktop, mobile, and embedded products with maximum performance per watt across a wide range of applications. Atom Celeron Core Pentium Xeon For quantities greater than listed, call for quote. MOUSER Intel Core Cache Data Price Each Package Processor Family Code Freq. Size No. of Bus Width TDP STOCK NO. Part No. Series Name (GHz) (MB) Cores (bit) (Max) (W) 1 10 Desktop Intel 607-DF8064101211300Y DF8064101211300S R0VY FCBGA-559 D2550 Atom™ Cedarview 1.86 1 2 64 10 61.60 59.40 607-CM8063701444901S CM8063701444901S R10K FCLGA-1155 G1610 Celeron® Ivy Bridge 2.6 2 2 64 55 54.93 52.70 607-RK80532RC041128S RK80532RC041128S L6VR PPGA-478 - Celeron® Northwood 2.0 0.0156 1 32 52.8 42.00 40.50 607-CM8062301046804S CM8062301046804S R05J FCLGA-1155 G540 Celeron® Sandy Bridge 2.5 2 2 64 65 54.60 52.65 607-AT80571RG0641MLS AT80571RG0641MLS LGTZ LGA-775 E3400 Celeron® Wolfdale 2.6 1 2 64 65 54.93 52.70 607-HH80557PG0332MS HH80557PG0332MS LA99 LGA-775 E4300 Core™ 2 Conroe 1.8 2 2 64 65 139.44 133.78 607-AT80570PJ0806MS AT80570PJ0806MS LB9J LGA-775 E8400 Core™ 2 Wolfdale 3.0 6 2 64 65 207.04 196.00 607-AT80571PH0723MLS AT80571PH0723MLS LGW3 LGA-775 E7400 Core™ 2 Wolfdale -
Risk Factors
Risk Factors •Today’s presentations contain forward-looking statements. All statements made that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ materially. Please refer to our most recent Earnings Release and our most recent Form 10-Q or 10-K filing for more information on the risk factors that could cause actual results to differ. •If we use any non-GAAP financial measures during the presentations, you will find on our website, intc.com, the required reconciliation to the most directly comparable GAAP financial measure. Rev. 4/19/11 Today’s News The world’s first 3-D Tri-Gate transistors on a production technology New 22nm transistors have an unprecedented combination of power savings and performance gains. These benefits will enable new innovations across a broad range of devices from the smallest handheld devices to powerful cloud-based servers. The transition to 3-D transistors continues the pace of technology advancement, fueling Moore’s Law for years to come. The world’s first demonstration of a 22nm microprocessor -- code-named Ivy Bridge -- that will be the first high-volume chip to use 3-D Tri-Gate transistors. Energy-Efficient Performance Built on Moore’s Law 1 65nm 45nm 32nm 22nm 1x 0.1x > 50% 0.01x reduction Lower Active Power Active Lower Lower Transistor Leakage Transistor Lower Active Power per Transistor (normalized) Transistor per Power Active 0.001x Constant Performance 0.1 65nm 45nm 32nm 22nm Higher Transistor Performance (Switching Speed) Planar Planar Planar Tri-Gate Source: Intel 22 nm Tri-Gate transistors increase the benefit from a new technology generation Source: Intel Transistor Innovations Enable Technology Cadence 2003 2005 2007 2009 2011 90 nm 65 nm 45 nm 32 nm 22 nm Invented 2nd Gen. -
HP Z800 Workstation Overview
QuickSpecs HP Z800 Workstation Overview HP recommends Windows Vista® Business 1. 3 External 5.25" Bays 2. Power Button 3. Front I/O: 3 USB 2.0, 1 IEEE 1394a, 1 Headphone out, 1 Microphone in DA - 13278 North America — Version 2 — April 13, 2009 Page 1 QuickSpecs HP Z800 Workstation Overview 4. Choice of 850W, 85% or 1110W, 89% Power Supplies 9. Rear I/O: 1 IEEE 1394a, 6 USB 2.0, 1 serial, PS/2 keyboard/mouse 5. 12 DIMM Slots for DDR3 ECC Memory 2 RJ-45 to Integrated Gigabit LAN 1 Audio Line In, 1 Audio Line Out, 1 Microphone In 6. 3 External 5.25” Bays 10. 2 PCIe x16 Gen2 Slots 7. 4 Internal 3.5” Bays 11.. 2 PCIe x8 Gen2, 1 PCIe x4 Gen2, 1 PCIe x4 Gen1, 1 PCI Slot 8. 2 Quad Core Intel 5500 Series Processors 12 3 Internal USB 2.0 ports Form Factor Rackable Minitower Compatible Operating Genuine Windows Vista® Business 32-bit* Systems Genuine Windows Vista® Business 64-bit* Genuine Windows Vista® Business 32-bit with downgrade to Windows® XP Professional 32-bit custom installed** Genuine Windows Vista® Business 64-bit with downgrade to Windows® XP Professional x64 custom installed** HP Linux Installer Kit for Linux (includes drivers for both 32-bit & 64-bit OS versions of Red Hat Enterprise Linux WS4 and WS5 - see: http://www.hp.com/workstations/software/linux) For detailed OS/hardware support information for Linux, see: http://www.hp.com/support/linux_hardware_matrix *Certain Windows Vista product features require advanced or additional hardware. -
Intel® Core™ I7 Processor Families for the LGA2011-0 Socket
® Intel Core™ i7 Processor Families for the LGA2011-0 Socket Thermal Mechanical Specification and Design Guide — Supporting Desktop Intel® Core™ i7-3970X and i7-3960X Extreme Edition Processor Series for the LGA2011-0 Socket — Supporting Intel® Core™ i7-3000K Processor Series and Intel® Core™ i7-3000 Processor Series for the LGA2011-0 Socket — Supporting Desktop Intel® Core™ i7-4960X Extreme Edition Processor Series for the LGA2011 Socket — Supporting Desktop Intel® Core™ i7-49xx and i7-48xx Processor Series for the LGA2011 Socket November 2013 326199-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The processors and LGA2011-0 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. -
Mainboard Diagram
2012 ATX Industrial Motherboard NAF93-Q77 Based on Intel® Q77 Panther Point Platform for Ivy Bridge Jetway Computer Corporation Phone: 510-857-0130 Fax: 510-857-0138 38507 Cherry St., Ste E, Newark, CA 94560 www.jetwaycomputer.com NAF93-Q77 ATX Industrial Motherboard 1. Intel® Q77 Express Chipset HI08 2. Socket LGA 1155 for 3rd generation Intel Core i3, i5, i7 Processors 3. Dual Channel DDR3-1066/1333 up to 32GB 4. Intel 82579LM & 82574L PCI-E Gigabit LAN 5. Intel Active Management Technology (iAMT 8.0) 6. 2 * SATA2 6Gb/s, 4 * SATA2 3Gb/s with RAID 7. 1 * mSATA Slot for Embedded SSD 8. 1 * PCI-E 3.0 x16, 1 * PCI-E x4, 1 * PCI-E x1, 4 * PCI 9. 1 * PCI Express Mini Card Slot (half-size) 10. 10 * Serial Ports Onboard, TPM 1.2 Header 11. All Solid Polymer Capacitors for Improved Reliability 12. Industrial Embedded Platform with 5-Year Availability 2 / 3 NAF93-Q77 Specifications Model No: NAF93 HI08 Part No: JNAF93-Q77 Processor Socket LGA 1155 for 3nd-generation Intel Core i3, i5, i7 & Pentium processors (Ivy Bridge), Supports Turbo Boost 2.0, 64-bit, Hyper-Threading, Virtualization (VT-d), and Intel HD graphics on selected models* Chipset Intel Q77 Express chipset Video Intel HD graphics built into processors” Memory 4 * 240-pin DIMM Sockets for un-buffered dual channel DDR3-1066/1333 up to 32GB Storage 2 * SATA3 6Gb/s supporting RAID 0, 1 and 4 * SATA2 3Gb/s supporting RAID 0, 1, 5, 10 1 * mSATA 3Gb/s for embedded SSD Expansion Slots 1 * PCI Express 3.0 x16, 1 * PCI Express x4, 1 * PCI Express x1, 4 * PCI LAN 1 * Intel 82579LM PCI-E gigabit -
Cooler Cpu S1155 Thermaltake
CLP0556 COOLER CPU S1155 THERMALTAKE Especificaciones Model CLP0556 Type Fan & Heatsinks Fan Size 92mm Compatibility LGA 1156 / 1155 RPM 1,900 ~ 2,300 RPM Air Flow 39.7 CFM Noise Level 22 dBA Power Connector 4 Pin Heatsink Material Aluminum Extrusion Fan Dimensions 0.98" x 3.62" x 3.62" Heatsink Dimensions 2.39" x 3.77" x 3.77" Weight 302 g Input Voltage 6 V to 12 V CLP0534 COOLER CPU S1155 THERMALTAKE SLIM X3 Especificaciones Model CLP0534 LGA1156 73W Compatibility LGA1155 65W LGA775 65W Dimension 92*99*36 mm Heatsink Material AL Fin+ AL Base Heatpipe ∮6 *2 Fan Dimension 80*80*15 mm Rated Voltage 12V Power Input 12V Fan Speed 1200 ~ 2400 RPM Max. Air Flow 10.814~22.35CFM Max. Air Pressure 0.458~1.93mm-H2O Noise 20~26.9 dBA Life Expectation 30000 hrs Connector 4PIN PWM Weight 180g CLP0575 COOLER CPU S1155 /AM3+ THERMALTAKE FRIO OCK CLP0575 COOLER CPU S1155 /AM3+ THERMALTAKE FRIO OCK Especificaciones Model FrioOCK Intel Socket LGA 2011 LGA 1366 Core i7 LGA 1156 Core i7 Core i5 Core i3 LGA 775 Core 2 Extreme Core 2 Quad Core 2 Duo Pentium D Pentium 4 Pentium Celeron D Celeron AMD Socket Compatibility AM3 Phenom II X6 Phenom II X4 Phenom II X3 Phenom II X2 AM2+ / AM2 Phenom X4 Phenom X3 Athlon 64 FX Athlon 64 X2 Athlon 64 Sempron Dimension 143(L) x 136.8(W) x 158.4(H) mm P/N CLP0575 (JANコード: 4560167554700) Heatsink Material Aluminum Fins & Copper Base Heatpipe 6mm x 6 PCS Fan Dimension 130(L) x 130(H) x 25(W) mm Rated Voltage 12 V Rated Current 1.2A Started Voltage 7 V Power Input 14.40 W Fan Speed 1200 ~ 2100 RPM Max.