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Intel Xeon Processor E3-1200 v2 Product Family and LGA 1155 Socket
Thermal/Mechanical Specifications and Design Guidelines
May 2012
Document Number: 324973-001
Legal Lines and Disclaimers
NFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
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The Intel Xeon processor E3-1200 v2 product family and Intel C200 Series Chipset family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel® Turbo Boost Technology - requires a system with Intel® Turbo Boost Technology capability. Consult your PC manufacturer. Performance varies depending on hardware, software and system configuration. For more information, visit http://www.intel.com/technology/turboboost Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com. Intel, Intel Xeon, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2012, Intel Corporation. All Rights Reserved.
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- Thermal/Mechanical Specifications and Design Guidelines
Contents
1
Introduction..............................................................................................................9 1.1 1.2
References .........................................................................................................9 Definition of Terms............................................................................................ 10
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- Package Mechanical and Storage Specifications....................................................... 11
- 2.1
- Package Mechanical Specifications....................................................................... 11
2.1.1 Package Mechanical Drawing.................................................................... 12 2.1.2 Processor Component Keep-Out Zones...................................................... 12 2.1.3 Package Loading Specifications ................................................................ 13 2.1.4 Package Handling Guidelines.................................................................... 13 2.1.5 Package Insertion Specifications............................................................... 13 2.1.6 Processor Mass Specification.................................................................... 13 2.1.7 Processor Materials................................................................................. 14 2.1.8 Processor Markings................................................................................. 14 2.1.9 Processor Land Coordinates..................................................................... 15
- Processor Storage Specifications ......................................................................... 16
- 2.2
3
LGA1155 Socket ...................................................................................................... 17
- 3.1
- Board Layout.................................................................................................... 18
3.1.1 Suggested Silkscreen Marking for Socket Identification................................ 20 Attachment to Motherboard ................................................................................ 20 Socket Components........................................................................................... 21 3.3.1 Socket Body Housing.............................................................................. 21 3.3.2 Solder Balls........................................................................................... 21 3.3.3 Contacts ............................................................................................... 21 3.3.4 Pick and Place Cover............................................................................... 21 Package Installation / Removal ........................................................................... 23 3.4.1 Socket Standoffs and Package Seating Plane.............................................. 23 Durability......................................................................................................... 23 Markings.......................................................................................................... 24 Component Insertion Forces ............................................................................... 24 Socket Size ...................................................................................................... 24
3.2 3.3
3.4 3.5 3.6 3.7 3.8
4
Independent Loading Mechanism (ILM)................................................................... 25
- 4.1
- Design Concept................................................................................................. 25
4.1.1 ILM Assembly Design Overview................................................................ 25 4.1.2 ILM Back Plate Design Overview............................................................... 26 4.1.3 Shoulder Screw and Fasteners Design Overview ......................................... 27 Assembly of ILM to a Motherboard....................................................................... 28 ILM Interchangeability ....................................................................................... 29 Markings.......................................................................................................... 29 ILM Cover ........................................................................................................ 30
4.2 4.3 4.4 4.5
56
LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications .. 33
5.1 5.2 5.3 5.4 5.5
Component Mass............................................................................................... 33 Package/Socket Stackup Height .......................................................................... 33 Loading Specifications........................................................................................ 34 Electrical Requirements...................................................................................... 35 Environmental Requirements .............................................................................. 36
Thermal Specifications ............................................................................................ 37 6.1 Thermal Specifications ....................................................................................... 37
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6.1.1 Intel Xeon Processor E3-1290 v2 (87W) Thermal Profile.......................... 41
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6.1.2 Intel Xeon Processor E3-1200 v2 Series (77W) Thermal Profile ................ 42
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6.1.3 Intel Xeon Processor E3-1200 v2 Series (69W) Thermal Profile ................ 44
- Thermal/Mechanical Specifications and Design Guidelines
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6.1.4 Intel Xeon Processor E3-1285L v2 (65W) Thermal Profile.........................45
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6.1.5 Intel Xeon processor E3-1265L v2 (45W) Thermal Profile.........................47
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6.1.6 Intel Xeon processor E3-1220L v2 (17W) Thermal Profile.........................48 6.1.7 Processor Specification for Operation Where Digital
- Thermal Sensor Exceeds T
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CONTROL
6.1.8 Thermal Metrology..................................................................................55 Processor Thermal Features ................................................................................56 6.2.1 Processor Temperature............................................................................56 6.2.2 Adaptive Thermal Monitor........................................................................56 6.2.3 Digital Thermal Sensor ............................................................................58 6.2.4 PROCHOT# Signal ..................................................................................59 6.2.5 THERMTRIP# Signal................................................................................60
6.2 6.3
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Intel Turbo Boost Technology............................................................................60
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6.3.1 Intel Turbo Boost Technology Frequency..................................................60
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6.3.2 Intel Turbo Boost Technology Graphics Frequency.....................................61 6.3.3 Thermal Considerations ...........................................................................61
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6.3.4 Intel Turbo Boost Technology Power Monitoring........................................61
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6.3.5 Intel Turbo Boost Technology Power Control.............................................62
78
PECI Interface .........................................................................................................65
- 7.1
- Platform Environment Control Interface (PECI) ......................................................65
7.1.1 Introduction...........................................................................................65
Sensor Based Thermal Specification Design Guidance..............................................67
8.1 8.2
Sensor Based Specification Overview (DTS 1.0) .....................................................67 Sensor Based Thermal Specification .....................................................................68 8.2.1 TTV Thermal Profile.................................................................................68
- 8.2.2 Specification When DTS value is Greater than T
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CONTROL
- 8.3
- Thermal Solution Design Process .........................................................................69
8.3.1 Boundary Condition Definition ..................................................................69 8.3.2 Thermal Design and Modelling..................................................................70 8.3.3 Thermal Solution Validation......................................................................70
- Fan Speed Control (FSC) Design Process...............................................................71
- 8.4
8.5
- 8.4.1 DTS 1.1 A New Fan Speed Control Algorithm without T
- Data ..............71
AMBIENT
System Validation..............................................................................................73
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1U Thermal Solution ................................................................................................75 9.1 9.2
Performance Targets..........................................................................................75 1U Collaboration Heatsink...................................................................................76 9.2.1 Heatsink Performance .............................................................................76 9.2.2 Thermal Solution ....................................................................................78 9.2.3 Assembly...............................................................................................78 1U Reference Heatsink .......................................................................................79 9.3.1 Heatsink Performance .............................................................................79 9.3.2 Thermal Solution ....................................................................................80 9.3.3 Assembly...............................................................................................80 Geometric Envelope for 1U Thermal Mechanical Design...........................................80 Thermal Interface Material..................................................................................81 Heat Pipe Thermal Consideration .........................................................................81
9.3 9.4 9.5 9.6
10
Active Tower Thermal Solution ................................................................................83 10.1 Introduction......................................................................................................83 10.2 Mechanical Specifications....................................................................................84
10.2.1 Cooling Solution Dimensions ....................................................................84 10.2.2 Retention Mechanism and Heatsink Attach Clip Assembly .............................85
10.3 Electrical Requirements ......................................................................................85
10.3.1 Active Tower Heatsink Power Supply .........................................................85
10.4 Cooling Requirements ........................................................................................87
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- Thermal/Mechanical Specifications and Design Guidelines
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- Thermal Solution Quality and Reliability Requirements............................................ 89
11.1 Reference Heatsink Thermal Verification............................................................... 89 11.2 Mechanical Environmental Testing ....................................................................... 89
11.2.1 Recommended Test Sequence.................................................................. 90 11.2.2 Post-Test Pass Criteria ............................................................................ 90 11.2.3 Recommended BIOS/Processor/Memory Test Procedures............................. 90
11.3 Material and Recycling Requirements ................................................................... 91
ABCDE
Component Suppliers............................................................................................... 93 Mechanical Drawings............................................................................................... 95 Socket Mechanical Drawings ................................................................................. 115 Package Mechanical Drawings............................................................................... 121 LGA 115X Processor Tools ..................................................................................... 125
Figures
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- Processor Package Assembly Sketch .................................................................... 11
Package View ................................................................................................... 12 Processor Top-Side Markings .............................................................................. 14 Processor Package Lands Coordinates .................................................................. 15 LGA1155 Socket with Pick and Place Cover ........................................................... 17 LGA1155 Socket Contact Numbering (Top View of Socket)...................................... 18 LGA1155 Socket Land Pattern (Top View of Board) ................................................ 19 Suggested Board Marking................................................................................... 20 Attachment to Motherboard ................................................................................ 20 Pick and Place Cover.......................................................................................... 22 Package Installation / Removal Features............................................................... 23 ILM Assembly with Installed Processor ................................................................. 26 Back Plate........................................................................................................ 27 Shoulder Screw................................................................................................. 27 ILM Assembly ................................................................................................... 28 Pin1 and ILM Lever............................................................................................ 29 ILM Cover ........................................................................................................ 30 ILM Cover and PnP Cover Interference ................................................................. 31 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .......................... 36 Thermal Test Vehicle Thermal Profile for
2-2 2-3 2-4 3-1 3-2 3-3 3-4 3-5 3-6 3-7 4-1 4-2 4-3 4-4 4-5 4-6 4-7 5-1 6-1
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Intel Xeon Processor E3-1290 v2 (87W)........................................................... 41
6-2
6-3 6-4 6-5 6-6
Thermal Test Vehicle Thermal Profile for
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Intel Xeon Processor E3-1200 v2 Series (77W) ................................................. 42 Thermal Test Vehicle Thermal Profile for
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Intel Xeon Processor E3-1200 v2 Series (69W) ................................................. 44 Thermal Test Vehicle Thermal Profile for
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Intel Xeon Processor E3-1285L v2 (65W) ......................................................... 45 Thermal Test Vehicle Thermal Profile for
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Intel Xeon processor E3-1265L v2 (45W) ......................................................... 47 Thermal Test Vehicle Thermal Profile for
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Intel Xeon processor E3-1220L v2 (17W) ......................................................... 48 TTV Case Temperature (TCASE) Measurement Location.......................................... 55 Frequency and Voltage Ordering.......................................................................... 57 Package Power Control....................................................................................... 63 Comparison of Case Temperature versus Sensor Based Specification........................ 68 DTS 1.1 Definition Points.................................................................................... 72
6-7 6-8 6-9 8-1 8-2
- Thermal/Mechanical Specifications and Design Guidelines
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9-1 9-2 9-3 9-4 9-5 9-6
1U Collaboration Heatsink Performance Curves......................................................76 1U Collaboration Heatsink Performance Curves......................................................77 1U Collaboration Heatsink Assembly.....................................................................78 1U Reference Heatsink Performance Curves ..........................................................79 KOZ 3-D Model (Top) in 1U Server.......................................................................80 TTV Die Size and Orientation...............................................................................81
10-1 Mechanical Representation of the Solution.............................................................83 10-2 Physical Space Requirements for the Solution (Side View).......................................84 10-3 Physical Space Requirements for the Solution (Top View)........................................85 10-4 Fan Power Cable Connector Description ...............................................................86 10-5 Baseboard Power Header Placement Relative to Processor Socket.............................86 10-6 Active Tower Heatsink Airspace keep-out Requirements (side view)..........................87 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9
Socket / Heatsink / ILM keep-out Zone Primary Side for 1U (Top) ............................96 Socket / Heatsink / ILM keep-out Zone Secondary Side for 1U (Bottom) ...................97 Socket / Processor / ILM keep-out Zone Primary Side for 1U (Top)...........................98 Socket / Processor / ILM keep-out Zone Secondary Side for 1U (Bottom) ..................99 1U Collaboration Heatsink Assembly...................................................................100 1U Collaboration Heatsink.................................................................................101 1U Reference Heatsink Assembly .......................................................................102 1U Reference Heatsink .....................................................................................103 1U Heatsink Screw...........................................................................................104
B-10 Heatsink Compression Spring............................................................................105 B-11 Heatsink Load Cup...........................................................................................106 B-12 Heatsink Retaining Ring....................................................................................107 B-13 Heatsink Backplate Assembly ............................................................................108 B-14 Heatsink Backplate ..........................................................................................109 B-15 Heatsink Backplate Insulator.............................................................................110 B-16 Heatsink Backplate Stud...................................................................................111 B-17 Thermocouple Attach Drawing...........................................................................112 B-18 1U ILM Shoulder Screw ....................................................................................113 B-19 1U ILM Standard 6-32 Thread Fastener...............................................................114 C-1 C-2 C-3 C-4
Socket Mechanical Drawing (Sheet 1 of 4)...........................................................116 Socket Mechanical Drawing (Sheet 2 of 4)...........................................................117 Socket Mechanical Drawing (Sheet 3 of 4)...........................................................118 Socket Mechanical Drawing (Sheet 4 of 4)...........................................................119
D-1 Processor Package Drawing (Sheet 1 of 2) ..........................................................122 D-2 Processor Package Drawing (Sheet 2of 2) ...........................................................123
- E-1
- LGA 115X Processor Tools.................................................................................125