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Intel® Xeon® Processor E3-1200 V2 Product Family and LGA 1155 Socket

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Intel Xeon Processor E3-1200 v2 Product Family and LGA 1155 Socket

Thermal/Mechanical Specifications and Design Guidelines

May 2012

Document Number: 324973-001

Legal Lines and Disclaimers

NFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

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The Intel Xeon processor E3-1200 v2 product family and Intel C200 Series Chipset family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel® Turbo Boost Technology - requires a system with Intel® Turbo Boost Technology capability. Consult your PC manufacturer. Performance varies depending on hardware, software and system configuration. For more information, visit http://www.intel.com/technology/turboboost Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com. Intel, Intel Xeon, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2012, Intel Corporation. All Rights Reserved.

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  • Thermal/Mechanical Specifications and Design Guidelines

Contents

1

Introduction..............................................................................................................9 1.1 1.2
References .........................................................................................................9 Definition of Terms............................................................................................ 10

  • 2
  • Package Mechanical and Storage Specifications....................................................... 11

  • 2.1
  • Package Mechanical Specifications....................................................................... 11

2.1.1 Package Mechanical Drawing.................................................................... 12 2.1.2 Processor Component Keep-Out Zones...................................................... 12 2.1.3 Package Loading Specifications ................................................................ 13 2.1.4 Package Handling Guidelines.................................................................... 13 2.1.5 Package Insertion Specifications............................................................... 13 2.1.6 Processor Mass Specification.................................................................... 13 2.1.7 Processor Materials................................................................................. 14 2.1.8 Processor Markings................................................................................. 14 2.1.9 Processor Land Coordinates..................................................................... 15

  • Processor Storage Specifications ......................................................................... 16
  • 2.2

3

LGA1155 Socket ...................................................................................................... 17

  • 3.1
  • Board Layout.................................................................................................... 18

3.1.1 Suggested Silkscreen Marking for Socket Identification................................ 20 Attachment to Motherboard ................................................................................ 20 Socket Components........................................................................................... 21 3.3.1 Socket Body Housing.............................................................................. 21 3.3.2 Solder Balls........................................................................................... 21 3.3.3 Contacts ............................................................................................... 21 3.3.4 Pick and Place Cover............................................................................... 21 Package Installation / Removal ........................................................................... 23 3.4.1 Socket Standoffs and Package Seating Plane.............................................. 23 Durability......................................................................................................... 23 Markings.......................................................................................................... 24 Component Insertion Forces ............................................................................... 24 Socket Size ...................................................................................................... 24
3.2 3.3

3.4 3.5 3.6 3.7 3.8

4

Independent Loading Mechanism (ILM)................................................................... 25

  • 4.1
  • Design Concept................................................................................................. 25

4.1.1 ILM Assembly Design Overview................................................................ 25 4.1.2 ILM Back Plate Design Overview............................................................... 26 4.1.3 Shoulder Screw and Fasteners Design Overview ......................................... 27 Assembly of ILM to a Motherboard....................................................................... 28 ILM Interchangeability ....................................................................................... 29 Markings.......................................................................................................... 29 ILM Cover ........................................................................................................ 30
4.2 4.3 4.4 4.5

56
LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications .. 33

5.1 5.2 5.3 5.4 5.5
Component Mass............................................................................................... 33 Package/Socket Stackup Height .......................................................................... 33 Loading Specifications........................................................................................ 34 Electrical Requirements...................................................................................... 35 Environmental Requirements .............................................................................. 36

Thermal Specifications ............................................................................................ 37 6.1 Thermal Specifications ....................................................................................... 37

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6.1.1 Intel Xeon Processor E3-1290 v2 (87W) Thermal Profile.......................... 41

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6.1.2 Intel Xeon Processor E3-1200 v2 Series (77W) Thermal Profile ................ 42

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6.1.3 Intel Xeon Processor E3-1200 v2 Series (69W) Thermal Profile ................ 44

  • Thermal/Mechanical Specifications and Design Guidelines
  • 3

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6.1.4 Intel Xeon Processor E3-1285L v2 (65W) Thermal Profile.........................45

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6.1.5 Intel Xeon processor E3-1265L v2 (45W) Thermal Profile.........................47

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6.1.6 Intel Xeon processor E3-1220L v2 (17W) Thermal Profile.........................48 6.1.7 Processor Specification for Operation Where Digital

  • Thermal Sensor Exceeds T
  • ............................................................49

CONTROL

6.1.8 Thermal Metrology..................................................................................55 Processor Thermal Features ................................................................................56 6.2.1 Processor Temperature............................................................................56 6.2.2 Adaptive Thermal Monitor........................................................................56 6.2.3 Digital Thermal Sensor ............................................................................58 6.2.4 PROCHOT# Signal ..................................................................................59 6.2.5 THERMTRIP# Signal................................................................................60
6.2 6.3

®

Intel Turbo Boost Technology............................................................................60

®

6.3.1 Intel Turbo Boost Technology Frequency..................................................60

®

6.3.2 Intel Turbo Boost Technology Graphics Frequency.....................................61 6.3.3 Thermal Considerations ...........................................................................61

®

6.3.4 Intel Turbo Boost Technology Power Monitoring........................................61

®

6.3.5 Intel Turbo Boost Technology Power Control.............................................62

78

PECI Interface .........................................................................................................65

  • 7.1
  • Platform Environment Control Interface (PECI) ......................................................65

7.1.1 Introduction...........................................................................................65

Sensor Based Thermal Specification Design Guidance..............................................67

8.1 8.2
Sensor Based Specification Overview (DTS 1.0) .....................................................67 Sensor Based Thermal Specification .....................................................................68 8.2.1 TTV Thermal Profile.................................................................................68

  • 8.2.2 Specification When DTS value is Greater than T
  • ...............................69

CONTROL

  • 8.3
  • Thermal Solution Design Process .........................................................................69

8.3.1 Boundary Condition Definition ..................................................................69 8.3.2 Thermal Design and Modelling..................................................................70 8.3.3 Thermal Solution Validation......................................................................70

  • Fan Speed Control (FSC) Design Process...............................................................71
  • 8.4

8.5

  • 8.4.1 DTS 1.1 A New Fan Speed Control Algorithm without T
  • Data ..............71

AMBIENT

System Validation..............................................................................................73

9

1U Thermal Solution ................................................................................................75 9.1 9.2
Performance Targets..........................................................................................75 1U Collaboration Heatsink...................................................................................76 9.2.1 Heatsink Performance .............................................................................76 9.2.2 Thermal Solution ....................................................................................78 9.2.3 Assembly...............................................................................................78 1U Reference Heatsink .......................................................................................79 9.3.1 Heatsink Performance .............................................................................79 9.3.2 Thermal Solution ....................................................................................80 9.3.3 Assembly...............................................................................................80 Geometric Envelope for 1U Thermal Mechanical Design...........................................80 Thermal Interface Material..................................................................................81 Heat Pipe Thermal Consideration .........................................................................81
9.3 9.4 9.5 9.6

10

Active Tower Thermal Solution ................................................................................83 10.1 Introduction......................................................................................................83 10.2 Mechanical Specifications....................................................................................84
10.2.1 Cooling Solution Dimensions ....................................................................84 10.2.2 Retention Mechanism and Heatsink Attach Clip Assembly .............................85
10.3 Electrical Requirements ......................................................................................85
10.3.1 Active Tower Heatsink Power Supply .........................................................85
10.4 Cooling Requirements ........................................................................................87

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  • Thermal/Mechanical Specifications and Design Guidelines

  • 11
  • Thermal Solution Quality and Reliability Requirements............................................ 89

11.1 Reference Heatsink Thermal Verification............................................................... 89 11.2 Mechanical Environmental Testing ....................................................................... 89
11.2.1 Recommended Test Sequence.................................................................. 90 11.2.2 Post-Test Pass Criteria ............................................................................ 90 11.2.3 Recommended BIOS/Processor/Memory Test Procedures............................. 90
11.3 Material and Recycling Requirements ................................................................... 91

ABCDE

Component Suppliers............................................................................................... 93 Mechanical Drawings............................................................................................... 95 Socket Mechanical Drawings ................................................................................. 115 Package Mechanical Drawings............................................................................... 121 LGA 115X Processor Tools ..................................................................................... 125

Figures

  • 2-1
  • Processor Package Assembly Sketch .................................................................... 11

Package View ................................................................................................... 12 Processor Top-Side Markings .............................................................................. 14 Processor Package Lands Coordinates .................................................................. 15 LGA1155 Socket with Pick and Place Cover ........................................................... 17 LGA1155 Socket Contact Numbering (Top View of Socket)...................................... 18 LGA1155 Socket Land Pattern (Top View of Board) ................................................ 19 Suggested Board Marking................................................................................... 20 Attachment to Motherboard ................................................................................ 20 Pick and Place Cover.......................................................................................... 22 Package Installation / Removal Features............................................................... 23 ILM Assembly with Installed Processor ................................................................. 26 Back Plate........................................................................................................ 27 Shoulder Screw................................................................................................. 27 ILM Assembly ................................................................................................... 28 Pin1 and ILM Lever............................................................................................ 29 ILM Cover ........................................................................................................ 30 ILM Cover and PnP Cover Interference ................................................................. 31 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .......................... 36 Thermal Test Vehicle Thermal Profile for
2-2 2-3 2-4 3-1 3-2 3-3 3-4 3-5 3-6 3-7 4-1 4-2 4-3 4-4 4-5 4-6 4-7 5-1 6-1

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Intel Xeon Processor E3-1290 v2 (87W)........................................................... 41
6-2

6-3 6-4 6-5 6-6
Thermal Test Vehicle Thermal Profile for

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Intel Xeon Processor E3-1200 v2 Series (77W) ................................................. 42 Thermal Test Vehicle Thermal Profile for

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Intel Xeon Processor E3-1200 v2 Series (69W) ................................................. 44 Thermal Test Vehicle Thermal Profile for

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Intel Xeon Processor E3-1285L v2 (65W) ......................................................... 45 Thermal Test Vehicle Thermal Profile for

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Intel Xeon processor E3-1265L v2 (45W) ......................................................... 47 Thermal Test Vehicle Thermal Profile for

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Intel Xeon processor E3-1220L v2 (17W) ......................................................... 48 TTV Case Temperature (TCASE) Measurement Location.......................................... 55 Frequency and Voltage Ordering.......................................................................... 57 Package Power Control....................................................................................... 63 Comparison of Case Temperature versus Sensor Based Specification........................ 68 DTS 1.1 Definition Points.................................................................................... 72
6-7 6-8 6-9 8-1 8-2

  • Thermal/Mechanical Specifications and Design Guidelines
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9-1 9-2 9-3 9-4 9-5 9-6
1U Collaboration Heatsink Performance Curves......................................................76 1U Collaboration Heatsink Performance Curves......................................................77 1U Collaboration Heatsink Assembly.....................................................................78 1U Reference Heatsink Performance Curves ..........................................................79 KOZ 3-D Model (Top) in 1U Server.......................................................................80 TTV Die Size and Orientation...............................................................................81
10-1 Mechanical Representation of the Solution.............................................................83 10-2 Physical Space Requirements for the Solution (Side View).......................................84 10-3 Physical Space Requirements for the Solution (Top View)........................................85 10-4 Fan Power Cable Connector Description ...............................................................86 10-5 Baseboard Power Header Placement Relative to Processor Socket.............................86 10-6 Active Tower Heatsink Airspace keep-out Requirements (side view)..........................87 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9
Socket / Heatsink / ILM keep-out Zone Primary Side for 1U (Top) ............................96 Socket / Heatsink / ILM keep-out Zone Secondary Side for 1U (Bottom) ...................97 Socket / Processor / ILM keep-out Zone Primary Side for 1U (Top)...........................98 Socket / Processor / ILM keep-out Zone Secondary Side for 1U (Bottom) ..................99 1U Collaboration Heatsink Assembly...................................................................100 1U Collaboration Heatsink.................................................................................101 1U Reference Heatsink Assembly .......................................................................102 1U Reference Heatsink .....................................................................................103 1U Heatsink Screw...........................................................................................104
B-10 Heatsink Compression Spring............................................................................105 B-11 Heatsink Load Cup...........................................................................................106 B-12 Heatsink Retaining Ring....................................................................................107 B-13 Heatsink Backplate Assembly ............................................................................108 B-14 Heatsink Backplate ..........................................................................................109 B-15 Heatsink Backplate Insulator.............................................................................110 B-16 Heatsink Backplate Stud...................................................................................111 B-17 Thermocouple Attach Drawing...........................................................................112 B-18 1U ILM Shoulder Screw ....................................................................................113 B-19 1U ILM Standard 6-32 Thread Fastener...............................................................114 C-1 C-2 C-3 C-4
Socket Mechanical Drawing (Sheet 1 of 4)...........................................................116 Socket Mechanical Drawing (Sheet 2 of 4)...........................................................117 Socket Mechanical Drawing (Sheet 3 of 4)...........................................................118 Socket Mechanical Drawing (Sheet 4 of 4)...........................................................119
D-1 Processor Package Drawing (Sheet 1 of 2) ..........................................................122 D-2 Processor Package Drawing (Sheet 2of 2) ...........................................................123

  • E-1
  • LGA 115X Processor Tools.................................................................................125

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  • EK Water Blocks EK-Velocity, Processor, 4-Pin, 4-Pin, LGA 1150

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    EK Water Blocks EK-Velocity, Processor, 4-pin, 4-pin, LGA 1150 (Socket H3),LGA 1151 (Socket H4),LGA 1155 (Socket H2),LGA 1156 (Socket H),LGA 2011-v3..., RoHS, Intel LGA- 1150/1151/1155/1156 Intel LGA- 2011(-3) Intel LGA-2066 EK-Velocity - Copper + Plexi Group Coolers Manufacturer EK Water Blocks Manufacturer item no. 3831109810194 EAN/UPC 3831109810194 Description EK-Velocity is the new high-performance flagship premium quality CPU water block for modern Intel processors. It features a fresh design that will enable a vast number of variations and options for enthusiasts and demanding users as well! EK® Velocity series CPU water blocks embed the 5th generation of the award- winning EK® CPU water block cooling engine, further tweaked for performance and optimal coolant flow! Low hydraulic flow restriction enables this product to be used in setups using weaker water pumps or lower pump speeds for added silent operation, while still achieving top performance! EK Velocity water block Copper Plexi The purest copper available on the market is used for the EK-Velocity cold plate which is precisely machined to a dense micro-fin structure. The contact surface itself is machine polished for a better contact with the CPU IHS. This version of the water block features a nickel-plated copper cold plate with a CNC machined high-quality glass like Acrylic top piece. The new cooling engine is characterized by the top-integrated jet nozzle which is combined with a thicker jet plate allowing a more precise bow control. The simplified water block structure offers a more optimized coolant flow and easier maintenance, while the interchangeable thick jet plate ensures the best contact surface for mainstream and HEDT Intel platforms.
  • ASMB-782 LGA 1155 Intel® Xeon® E3 V2 ATX Server Board with 2 Pcie X16 Slots (X8 Link), 2 Pcie X4, USB 3.0, Pcie Gen III, Quad Lans Startup Manual

    ASMB-782 LGA 1155 Intel® Xeon® E3 V2 ATX Server Board with 2 Pcie X16 Slots (X8 Link), 2 Pcie X4, USB 3.0, Pcie Gen III, Quad Lans Startup Manual

    ASMB-782 LGA 1155 Intel® Xeon® E3 V2 ATX Server Board with 2 PCIe x16 slots (x8 link), 2 PCIe x4, USB 3.0, PCIe Gen III, Quad LANs Startup Manual Packing List Specifications Before you begin installing your card, please make sure that Standard SBC Functions the following items have been shipped: • CPU: LGA 1155 Intel® Xeon® E3 / E3 v2 / 2nd and 3rd • 1 ASMB-782 Startup Manual Core™ i3 / Pentium processors • 1 Driver CD (user’s manual is included) • BIOS: AMI 64 Mb SPI BIOS • 2 Serial ATA HDD data cables • Chipset: Intel® C216 • 2 Serial ATA HDD power cables • System memory: Dual Channel DDR3 ECC/Non-ECC • 1 I/O port bracket 1066/1333/1600 MHz unbuffered DIMM, Max. 32 GB • 1 Warranty card Note: Due to the inherent limitations of PC architecture, the system may not fully detect 32 GB RAM If any of these items are missing or damaged, please con- when 32 GB RAM is installed. tact your distributor or sales representative immediately. • SATA2/SATA3 Interface: 4 SATA2 3 Gb/s ports, 2 SATA3 6Gb/s ports to support Intel Matrix Storage with software RAID 0, 1, 10 & 5. (for Windows only) Note: Acrobat Reader is required to view any PDF • Serial ports: Two serial ports, only support RS-232 file.Acrobat Reader can be downloaded at: http://www.adobe.com/downloads/ (Acrobat is a • Parallel port: One parallel port, supports SPP/EPP/ECP trademark of Adobe) modes. • Keyboard/mouse connector: Supports standard PS/2 keyboard and mouse • Watchdog timer: 255 level timer intervals • USB 3.0: Supports up to four USB 3.0 ports.
  • EK-Supremacy Elite Edition Series Universal CPU Water Block

    EK-Supremacy Elite Edition Series Universal CPU Water Block

    EK-Supremacy Elite Edition series universal CPU water block installation manual This product is intended for installation only by expert users. Please consult with a qualified technician for installation. Improper installation may result in damage to your equipment. EK Water Blocks assumes no liability whatsoever, expressed or implied, for the use of these products, nor their installation. The following instructions are subject to change without notice. Please visit our web site at www.ekwb.com for updates. Before installation of this product please read important notice, disclosure and warranty conditions printed on the back of the box. Before you start using this product please follow these basic guidelines: 1. Please carefully read the manual before through before beginning with the installation process! 2. Please remove your motherboard from the computer to assure safest mounting process in order to prevent any possible damages to your CPU and/or motherboard’s circuit board (PCB). 3. The EK High Flow and EK-PSC type fittings require only a small amount of force to screw them firmly in place since the liquid seal is ensured by the rubber o-ring gaskets. 4. The use of corrosion inhibiting coolants is always recommended for any liquid cooling system. STEP 1: GENERAL INFORMATION ON PRODUCT COMPATIBILITY STEP 2: TABLE OF CONTENT Congratulations on your purchase of EK-Supremacy universal CPU water block. This The following items are enclosed with each EK-Supremacy water block: water block is pre-assembled* for use with modern AMD or Intel
  • Sb330-Crm Sb330-Crm

    Sb330-Crm Sb330-Crm

    SB330-CRM SB330-CRM Realtek Intel LAN LAN COM2 Features Specifications Mic-in VGA PS/2 Line-in Mouse CHIPSET Intel® Q67 PCH PROCESSOR TRUSTED PLATFORM MODULE (TPM) - optional Line-out PS/2 K/B microATX CPU Intel® Core™ i7/i5/i3 • LGA 1155 socket for: • Provides a Trusted PC for secure transactions DVI-I COM1 - Intel® Core™ i7-2600 (3.4GHz, 95W) • Provides software license protection, enforcement and password USB 2.0 ® ® (DVI-D signal) Intel Pentium - Intel® Core™ i5-2400 (3.1GHz, 95W) protection ® MEMORY 4 DDR3 DIMM up to 32GB - Intel Core™ i3-2120 (3.3GHz, 65W) - Intel® Pentium® G850 REAR PANEL I/O PORTS EXPANSION 1 PCIe x16, 1 PCIe x4, 2 PCI • New microarchitecture on 32nm process technology • 1 mini-DIN-6 PS/2 mouse port COM3 DISPLAY OUTPUTS 1 DVI-I (DVI-D signal), 1 VGA • Intel® Advanced Vector Extensions (Intel® AVX) Instructions • 1 mini-DIN-6 PS/2 keyboard port • Intel® Turbo Boost Technology COM4 • 2 DB-9 serial ports 12V power LAN 2 Gigabit LAN PCIe x4 - Supports RS232/422/485 (RS232 and/or Power) COM 6 COM CHIPSET • 1 DB-15 VGA port PCI1 • Intel® Q67 PCH (Platform Controller Hub) PCI2 USB 12 USB 2.0 • 1 DVI-I port (DVI-D signal) COM5 • 2 RJ45 LAN ports PCIe x16 SYSTEM MEMORY SATA 6 SATA (2 SATA 3.0, 4 SATA 2.0) • 4 USB 2.0/1.1 ports COM6 • Four 240-pin DDR3 DIMM sockets DIO 8-bit DIO • Supports DDR3 1066/1333MHz • Mic-in, line-in and line out jacks LGA 1155 • Supports dual channel memory interface • Supports up to 32GB system memory I/O CONNECTORS • 4 connectors for 8 external USB 2.0/1.1 ports USB 2.0 CPU fan • DRAM device
  • Shuttle XPC System H3 6700H

    Shuttle XPC System H3 6700H

    Product Specification Mini-PC complete system with Intel System "Sandy Bridge" technology H3 6700H This model combines superb energy efficiency with high computing power. It also offers all the latest connection options, e.g. USB 3.0 and SATA 6 Gbit/s. The choice of compatible CPU models includes Intel Core i3, Core i5 and Core i7, which can then be combined with up to 16 GB RAM and a powerful 3D graphics card. Experience the second generation of Intel Core processors now. Feature Highlights Black aluminium chassis (12.8 litre) H3 chassis Bays: 1x 5.25“ external, 2x 3.5“ int./ext. O.S. Windows 7 Home Premium / Professional Intel processor with socket 1155 CPU Range: Pentium or Core i3 / i5 / i7 Shuttle I.C.E. Heat-pipe cooling system Chipset Intel H67 Express PCH (Southbridge) Integrated Intel HD graphics with HDMI 1.4a and DVI-I outputs or Graphics AMD/ATI or NVIDIA graphics card PCI-Express 16X Memory Up to 16GB DDR3-1333 memory urposes only. urposes DVD writer or Blu-ray combo/writer Storage Serial ATA hard disk or SSD (8.9cm/3.5”) Optional 2nd hard disk or card reader 7.1-ch HD-audio, SPDIF output GigaBit LAN (RJ45) Other 4x USB 3.0 (2x front, 2x rear) connectors 7x USB 2.0 (1x front, 4x rear, 2x onboard) optional: RS232 COM-Port optional: Mini-PCIe WLAN-n module Images for illustration purposes only. Power 300 Watt power supply (80 PLUS Bronze) supply Warranty 24 Months Pick-Up-And-Return Service Application Home-Media It is possible to modify certain components BTO of this configuration.