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Intel® Xeon® Processor E3-1200 V2 Product Family and LGA 1155 Socket
Intel® Xeon® Processor E3-1200 v2 Product Family and LGA 1155 Socket Thermal/Mechanical Specifications and Design Guidelines May 2012 Document Number: 324973-001 NFORMATIONLegal Lines and Disclaimers IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Xeon® processor E3-1200 v2 product family and Intel® C200 Series Chipset family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. -
Microcode Revision Guidance August 31, 2019 MCU Recommendations
microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. -
Intel® Server Board S3420GP
Intel® Server Board S3420GP Technical Product Specification Intel order number E65697-010 Revision 2.4 January, 2011 Enterprise Platforms and Services Division - Marketing Revision History Intel® Server Board S3420GP TPS Revision History Date Revision Modifications Number Feb. 2009 0.3 Initial release. May 2009 0.5 Update block diagram. July. 2009 0.9 Updated POST error code and diagram. Aug. 2009 1.0 Updated MTBF. Nov. 2009 1.1 Additional details for memory configuration. Dec. 2009 1.2 Added Intel® Server Board S3420GPV details. Dec. 2009 2.0 Updated processor name. Jan. 2010 2.1 Corrected the typo. Apr. 2010 2.2 Corrected the typo, updated processor name and remove CCC certification marking information. July. 2010 2.3 Corrected the typo. Jan.2011 2.4 Corrected the typo. Added RDIMM support on S3420GPV. Updated Table 45. Add USB device readiness beep code information. ii Revision 2.4 Intel order number E65697-010 Intel® Server Board S3420GP TPS Disclaimers Disclaimers Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. -
MBP4ASG41M-VS3.Pdf
ASRock > G41M-VS3 Página 1 de 2 Home | Global / English [Change] About ASRock Products News Support Forum Download Awards Dealer Zone Where to Buy Products G41M-VS3 Motherboard Series »G41M-VS3 Translate »Overview & Specifications ■ Supports FSB1333/1066/800/533 MHz CPUs »Download ■ Supports Dual Channel DDR3 1333(OC) ■ Intel® Graphics Media Accelerator X4500, Pixel Shader 4.0, DirectX 10, Max. shared »Manual memory 1759MB »FAQ ■ EuP Ready »CPU Support List ■ Supports ASRock XFast RAM, XFast LAN, XFast USB Technologies ■ Supports Instant Boot, Instant Flash, OC DNA, ASRock OC Tuner (Up to 158% CPU »Memory QVL frequency increase) »Beta Zone ■ Supports Intelligent Energy Saver (Up to 20% CPU Power Saving) ■ Free Bundle : CyberLink DVD Suite - OEM and Trial; Creative Sound Blaster X-Fi MB - Trial This model may not be sold worldwide. Please contact your local dealer for the availability of this model in your region. Product Specifications General - LGA 775 for Intel® Core™ 2 Extreme / Core™ 2 Quad / Core™ 2 Duo / Pentium® Dual Core / Celeron® Dual Core / Celeron, supporting Penryn Quad Core Yorkfield and Dual Core Wolfdale processors - Supports FSB1333/1066/800/533 MHz CPU - Supports Hyper-Threading Technology - Supports Untied Overclocking Technology - Supports EM64T CPU - Northbridge: Intel® G41 Chipset - Southbridge: Intel® ICH7 - Dual Channel DDR3 memory technology - 2 x DDR3 DIMM slots - Supports DDR3 1333(OC)/1066/800 non-ECC, un-buffered memory Memory - Max. capacity of system memory: 8GB* *Due to the operating system limitation, the actual memory size may be less than 4GB for the reservation for system usage under Windows® 32-bit OS. For Windows® 64-bit OS with 64-bit CPU, there is no such limitation. -
Evolution of Microprocessor Performance
EvolutionEvolution ofof MicroprocessorMicroprocessor PerformancePerformance So far we examined static & dynamic techniques to improve the performance of single-issue (scalar) pipelined CPU designs including: static & dynamic scheduling, static & dynamic branch predication. Even with these improvements, the restriction of issuing a single instruction per cycle still limits the ideal CPI = 1 Multiple Issue (CPI <1) Multi-cycle Pipelined T = I x CPI x C (single issue) Superscalar/VLIW/SMT Original (2002) Intel Predictions 1 GHz ? 15 GHz to ???? GHz IPC CPI > 10 1.1-10 0.5 - 1.1 .35 - .5 (?) Source: John P. Chen, Intel Labs We next examine the two approaches to achieve a CPI < 1 by issuing multiple instructions per cycle: 4th Edition: Chapter 2.6-2.8 (3rd Edition: Chapter 3.6, 3.7, 4.3 • Superscalar CPUs • Very Long Instruction Word (VLIW) CPUs. Single-issue Processor = Scalar Processor EECC551 - Shaaban Instructions Per Cycle (IPC) = 1/CPI EECC551 - Shaaban #1 lec # 6 Fall 2007 10-2-2007 ParallelismParallelism inin MicroprocessorMicroprocessor VLSIVLSI GenerationsGenerations Bit-level parallelism Instruction-level Thread-level (?) (TLP) 100,000,000 (ILP) Multiple micro-operations Superscalar /VLIW per cycle Simultaneous Single-issue CPI <1 u Multithreading SMT: (multi-cycle non-pipelined) Pipelined e.g. Intel’s Hyper-threading 10,000,000 CPI =1 u uuu u u Chip-Multiprocessors (CMPs) u Not Pipelined R10000 e.g IBM Power 4, 5 CPI >> 1 uuuuuuu u AMD Athlon64 X2 u uuuuu Intel Pentium D u uuuuuuuu u u 1,000,000 u uu uPentium u u uu i80386 u i80286 -
Conroe and Allendale Electrical, Mechanical, and Thermal
Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 March 2009 Document Number: 321321-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Xeon® Processor 5500 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications.Current characterized errata are available on request. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References ............................................. -
Intel® Core™ Microarchitecture • Wrap Up
EW N IntelIntel®® CoreCore™™ MicroarchitectureMicroarchitecture MarchMarch 8,8, 20062006 Stephen L. Smith Bob Valentine Vice President Architect Digital Enterprise Group Intel Architecture Group Agenda • Multi-core Update and New Microarchitecture Level Set • New Intel® Core™ Microarchitecture • Wrap Up 2 Intel Multi-core Roadmap – Updates since Fall IDF 3 Ramping Multi-core Everywhere 4 All products and dates are preliminary and subject to change without notice. Refresher: What is Multi-Core? Two or more independent execution cores in the same processor Specific implementations will vary over time - driven by product implementation and manufacturing efficiencies • Best mix of product architecture and volume mfg capabilities – Architecture: Shared Caches vs. Independent Caches – Mfg capabilities: volume packaging technology • Designed to deliver performance, OEM and end user experience Single die (Monolithic) based processor Multi-Chip Processor Example: 90nm Pentium® D Example: Intel Core™ Duo Example: 65nm Pentium D Processor (Smithfield) Processor (Yonah) Processor (Presler) Core0 Core1 Core0 Core1 Core0 Core1 Front Side Bus Front Side Bus Front Side Bus *Not representative of actual die photos or relative size 5 Intel® Core™ Micro-architecture *Not representative of actual die photo or relative size 6 Intel Multi-core Roadmap 7 Intel Multi-core Roadmap 8 Intel® Core™ Microarchitecture Based Platforms Platform 2006 20072007 Caneland Platform (2007) MP Servers Tigerton (QC) (2007) Bensley Platform (Q2’06)/ Glidewell Platform (Q2’06) ) DP Servers/ Woodcrest (Q3’06) DP Workstation Clovertown (QC) (Q1’07) Kaylo Platform (Q3’06)/ Wyloway Platform (Q3 ’06) UP Servers/ Conroe (Q3’06) UP Workstation Kentsfield (QC) (Q1’07) Bridge Creek Platform (Mid’06) Desktop -Home Conroe (Q3’06) Kentsfield (QC) (Q1’07) Desktop -Office Averill Platform (Mid’06) Conroe (Q3’06) Mobile Client Napa Platform (Q1’06) Merom (2H’06) All products and dates are preliminary 9 Note: only Intel® Core™ microarchitecture QC refers to Quad-Core and subject to change without notice. -
Desktop 3Rd Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket
Desktop 3rd Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket Thermal Mechanical Specifications and Design Guidelines (TMSDG) January 2013 Document Number: 326767-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A “Mission Critical Application” is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined”. -
Evaluation of the Intel Sandy Bridge-EP Server Processor
Evaluation of the Intel Sandy Bridge-EP server processor Sverre Jarp, Alfio Lazzaro, Julien Leduc, Andrzej Nowak CERN openlab, March 2012 – version 2.2 Executive Summary In this paper we report on a set of benchmark results recently obtained by CERN openlab when comparing an 8-core “Sandy Bridge-EP” processor with Intel’s previous microarchitecture, the “Westmere-EP”. The Intel marketing names for these processors are “Xeon E5-2600 processor series” and “Xeon 5600 processor series”, respectively. Both processors are produced in a 32nm process, and both platforms are dual-socket servers. Multiple benchmarks were used to get a good understanding of the performance of the new processor. We used both industry-standard benchmarks, such as SPEC2006, and specific High Energy Physics benchmarks, representing both simulation of physics detectors and data analysis of physics events. Before summarizing the results we must stress the fact that benchmarking of modern processors is a very complex affair. One has to control (at least) the following features: processor frequency, overclocking via Turbo mode, the number of physical cores in use, the use of logical cores via Simultaneous Multi-Threading (SMT), the cache sizes available, the memory configuration installed, as well as the power configuration if throughput per watt is to be measured. Software must also be kept under control and we show that a change of operating system or compiler can lead to different results, as well. We have tried to do a good job of comparing like with like. In summary, we obtained a performance improvement of 9 – 20% per core and 46 – 60% improvement across all cores available. -
Nt* and Rtl* INT 2Eh CALL Ntdll!Kifastsystemcall
ȘFĢ: Fųřțįm’ș Đěřįvǻțįvě Bỳ Jǿșěpħ Ŀǻňđřỳ ǻňđ Ųđį Șħǻmįř Țħě Ŀǻbș țěǻm ǻț ȘěňțįňěŀǾňě řěčěňțŀỳ đįșčǿvěřěđ ǻ șǿpħįșțįčǻțěđ mǻŀẅǻřě čǻmpǻįģň șpěčįfįčǻŀŀỳ țǻřģěțįňģ ǻț ŀěǻșț ǿňě Ěųřǿpěǻň ěňěřģỳ čǿmpǻňỳ. Ųpǿň đįșčǿvěřỳ, țħě țěǻm řěvěřșě ěňģįňěěřěđ țħě čǿđě ǻňđ běŀįěvěș țħǻț bǻșěđ ǿň țħě ňǻțųřě, běħǻvįǿř ǻňđ șǿpħįșțįčǻțįǿň ǿf țħě mǻŀẅǻřě ǻňđ țħě ěxțřěmě měǻșųřěș įț țǻķěș țǿ ěvǻđě đěțěčțįǿň, įț ŀįķěŀỳ pǿįňțș țǿ ǻ ňǻțįǿň-șțǻțě șpǿňșǿřěđ įňįțįǻțįvě, pǿțěňțįǻŀŀỳ ǿřįģįňǻțįňģ įň Ěǻșțěřň Ěųřǿpě. Țħě mǻŀẅǻřě įș mǿșț ŀįķěŀỳ ǻ đřǿppěř țǿǿŀ běįňģ ųșěđ țǿ ģǻįň ǻččěșș țǿ čǻřěfųŀŀỳ țǻřģěțěđ ňěțẅǿřķ ųșěřș, ẅħįčħ įș țħěň ųșěđ ěįțħěř țǿ įňțřǿđųčě țħě pǻỳŀǿǻđ, ẅħįčħ čǿųŀđ ěįțħěř ẅǿřķ țǿ ěxțřǻčț đǻțǻ ǿř įňșěřț țħě mǻŀẅǻřě țǿ pǿțěňțįǻŀŀỳ șħųț đǿẅň ǻň ěňěřģỳ ģřįđ. Țħě ěxpŀǿįț ǻffěčțș ǻŀŀ věřșįǿňș ǿf Mįčřǿșǿfț Ẅįňđǿẅș ǻňđ ħǻș běěň đěvěŀǿpěđ țǿ bỳpǻșș țřǻđįțįǿňǻŀ ǻňțįvįřųș șǿŀųțįǿňș, ňěxț-ģěňěřǻțįǿň fįřěẅǻŀŀș, ǻňđ ěvěň mǿřě řěčěňț ěňđpǿįňț șǿŀųțįǿňș țħǻț ųșě șǻňđbǿxįňģ țěčħňįqųěș țǿ đěțěčț ǻđvǻňčěđ mǻŀẅǻřě. (bįǿměțřįč řěǻđěřș ǻřě ňǿň-řěŀěvǻňț țǿ țħě bỳpǻșș / đěțěčțįǿň țěčħňįqųěș, țħě mǻŀẅǻřě ẅįŀŀ șțǿp ěxěčųțįňģ įf įț đěțěčțș țħě přěșěňčě ǿf șpěčįfįč bįǿměțřįč věňđǿř șǿfțẅǻřě). Ẅě běŀįěvě țħě mǻŀẅǻřě ẅǻș řěŀěǻșěđ įň Mǻỳ ǿf țħįș ỳěǻř ǻňđ įș șțįŀŀ ǻčțįvě. İț ěxħįbįțș țřǻįțș șěěň įň přěvįǿųș ňǻțįǿň-șțǻțě Řǿǿțķįțș, ǻňđ ǻppěǻřș țǿ ħǻvě běěň đěșįģňěđ bỳ mųŀțįpŀě đěvěŀǿpěřș ẅįțħ ħįģħ-ŀěvěŀ șķįŀŀș ǻňđ ǻččěșș țǿ čǿňșįđěřǻbŀě řěșǿųřčěș. Ẅě vǻŀįđǻțěđ țħįș mǻŀẅǻřě čǻmpǻįģň ǻģǻįňșț ȘěňțįňěŀǾňě ǻňđ čǿňfįřměđ țħě șțěpș ǿųțŀįňěđ běŀǿẅ ẅěřě đěțěčțěđ bỳ ǿųř Đỳňǻmįč Běħǻvįǿř Țřǻčķįňģ (ĐBȚ) ěňģįňě. Mǻŀẅǻřě Șỳňǿpșįș Țħįș șǻmpŀě ẅǻș ẅřįțțěň įň ǻ mǻňňěř țǿ ěvǻđě șțǻțįč ǻňđ běħǻvįǿřǻŀ đěțěčțįǿň. Mǻňỳ ǻňțį-șǻňđbǿxįňģ țěčħňįqųěș ǻřě ųțįŀįżěđ. -
The Intel X86 Microarchitectures Map Version 2.0
The Intel x86 Microarchitectures Map Version 2.0 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • Variant: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128