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Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems. -
Microcode Revision Guidance August 31, 2019 MCU Recommendations
microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. -
"PCOM-B216VG-ECC.Pdf" (581 Kib)
Intel® Arrandale processor based Type II COM Express module support ECC DDR3 SDRAM PCOM-B216VG-ECC with Gigabit Ethernet 204pin ECC DDR3 SODIMM socket ® Intel QM57 ® Intel Arrandale processor FEATURES GENERAL CPU & Package: Intel® 45nm Arrandale Core i7/i5/i3 or Celeron P4505 ® Processor The Intel Arrandale and QM57 platform processor up to 2.66 GHz with 4MB Cache in FC-BGA package with turbo boost technology to maximize DMI x4 Link: 4.8GT/s (Full-Duplex) CPU & Graphic performance Chipset/Core Logic Intel® QM57 ® Intel Arrandale platform support variously System Memory Up to 8GB ECC DDR3 800/1066 SDRAM on two SODIMM sockets powerful processor from ultra low power AMI BIOS to mainstream performance type BIOS Storage Devices SATA: Support four SATA 300 and one IDE Supports Intel® intelligent power sharing Expansion Interface VGA and LVDS technology to reduce TDP (Thermal Six PCI Express x1 Design Power) LPC & SPI Interface High definition audio interface ® ® Enhance Intel vPro efficiency by Intel PCI 82577LM GbE PHY and AMT6.0 Hardware Monitoring CPU Voltage and Temperature technology Power Requirement TBA Support two ECC DDR3 800/1066 SDRAM on Dimension Dimension: 125(L) x 95(W) mm two SODIMM sockets, up to 8GB memory size Environment Operation Temperature: 0~60 °C Storage Temperature: -20~80 °C Operation Humidity: 5~90% I/O ORDERING GUIDE MIO N/A IrDA N/A PCOM-B216VG-ECC ® Standard Ethernet One Intel 82577LM Gigabit Ethernet PHY Intel® Arrandale processor based Type II COM Express module with ECC DDR3 SDRAM and Audio N/A Gigabit Ethernet USB Eight USB ports Keyboard & Mouse N/A CPU Intel® Core i7-610E SV (4M Cache, 2.53 GHz) Support List Intel® Core i7-620LE LV (4M Cache, 2.00 GHz) Intel® Core i7-620UE ULV (4M Cache, 1.06 GHz) Intel® Core i5-520E SV (3M Cache, 2.40 GHz) Intel® Celeron P4505 SV (2M Cache, 1.86 GHz) DISPLAY Graphic Controller Intel® Arrandale integrated Graphics Media Accelerator (Gen 5.75 with 12 execution units) * Specifications are subject to change without notice. -
Sgxometer: Open and Modular Benchmarking for Intel SGX
SGXoMeter: Open and Modular Benchmarking for Intel SGX Mohammad Mahhouk Nico Weichbrodt Rüdiger Kapitza TU Braunschweig, Germany TU Braunschweig, Germany TU Braunschweig, Germany ABSTRACT mobile devices like phones and tablets. Also, personal computers, Intel’s Software Guard Extensions (SGX) are currently the most laptops and servers can be secured using AMD Secure Encrypted wide-spread commodity trusted execution environment, which Virtualisation [22, 23], and Intel SGX [24, 27]. provides integrity and confidentiality of sensitive code and data. Intel SGX promises with its isolated memory regions, so called Thereby, it offers protection even against privileged attackers and enclaves, both confidentiality and integrity protection of the sen- various forms of physical attacks. As a technology that only be- sitive data and code running inside them against malicious and came available in late 2015, it has received massive interest and privileged software. It also provides local and remote attestation undergone a rapid evolution. Despite first ad-hoc attempts, there is mechanisms [21] to ensure the authenticity and integrity of the so far no standardised approach to benchmark the SGX hardware, running enclaves, adding protection against forging attempts. Thus, its associated environment, and techniques that were designed to the utilisation of SGX in cloud services can considerably reduce harden SGX-based applications. the customers’ reluctance of using them. Furthermore, Intel has re- In this paper, we present SGXoMeter, an open and modular leased a Software Development Kit (SDK)[18] to ease programming framework designed to benchmark different SGX-aware CPUs, with SGX. It introduces wrappers for low-level instructions and `code revisions, SDK versions and extensions to mitigate side- provides a high-level interface that offers multiple functionalities, channel attacks. -
A Superscalar Out-Of-Order X86 Soft Processor for FPGA
A Superscalar Out-of-Order x86 Soft Processor for FPGA Henry Wong University of Toronto, Intel [email protected] June 5, 2019 Stanford University EE380 1 Hi! ● CPU architect, Intel Hillsboro ● Ph.D., University of Toronto ● Today: x86 OoO processor for FPGA (Ph.D. work) – Motivation – High-level design and results – Microarchitecture details and some circuits 2 FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT6-LUT 6-LUT6-LUT 3 6-LUT 6-LUT FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT 6-LUT 6-LUT 6-LUT 4 6-LUT 6-LUT FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 5 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 6 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References ............................................. -
SOM-5992 COM Express R3.0 Type 7 Module
Intel Xeon Processor D-1500 SOM-5992 COM Express R3.0 Type 7 Module NEW Features Intel® Xeon® Processor D-1500 Product Family COM Express R3.0 Basic Module Type 7 pin out 2~16 core processor, with max. TDP 45W Dual-CH DDR4 2400 w/ECC, max. 128GB High speed Ethernet (dual 10GBASE-KR interfaces, one GbE) Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1) Supports iManager, Embedded Software APIs and Wise-PaaS/RMM Software APIs: Utilities: Specifications Form Factor COM Express Basic Module Form Factor Pin-out Type COM Express R3.0 Type 7 compatible Xeon Xeon Xeon Xeon Xeon Pentium Pentium Xeon Xeon Pentium CPU D-1577 D-1548 D-1537 D-1528 D-1527 D1517 D1508 D-1559 D-1539 D1519 Base Frequency 1.3 GHz 2.0 GHz 1.7 GHz 1.9 GHz 2.2 GHz 1.6 GHz 2.2 GHz 1.5 GHz 1.6 GHz 1.5 GHz Max Single Core Turbo 2.1 GHz 2.6 GHz 2.3 GHz 2.5 GHz 2.7 GHz 2.2 GHz 2.6 GHz 2.1 GHz 2.2 GHz 2.1 GHz Processor System Frequency Cores 16 8 8 6 4 4 2 12 8 4 LLC 24MB 12MB 12MB 9MB 6MB 6MB 3MB 18MB 12MB 6MB CPU TDP 45W 45W 35W 35W 35W 25W 25W 45W 35W 25W BIOS AMI UEFI 128Mbit Technology DDR4 1866/2133/2400MHz Max. Frequency 2133 MHz 2400 MHz 2133 MHz 2133 MHz 2133 MHz 2133 MHz 1866 MHz 2133 MHz 2133 MHz 2133 MHz Memory ECC Support ECC and non-ECC Max. -
Evaluation of the Intel Sandy Bridge-EP Server Processor
Evaluation of the Intel Sandy Bridge-EP server processor Sverre Jarp, Alfio Lazzaro, Julien Leduc, Andrzej Nowak CERN openlab, March 2012 – version 2.2 Executive Summary In this paper we report on a set of benchmark results recently obtained by CERN openlab when comparing an 8-core “Sandy Bridge-EP” processor with Intel’s previous microarchitecture, the “Westmere-EP”. The Intel marketing names for these processors are “Xeon E5-2600 processor series” and “Xeon 5600 processor series”, respectively. Both processors are produced in a 32nm process, and both platforms are dual-socket servers. Multiple benchmarks were used to get a good understanding of the performance of the new processor. We used both industry-standard benchmarks, such as SPEC2006, and specific High Energy Physics benchmarks, representing both simulation of physics detectors and data analysis of physics events. Before summarizing the results we must stress the fact that benchmarking of modern processors is a very complex affair. One has to control (at least) the following features: processor frequency, overclocking via Turbo mode, the number of physical cores in use, the use of logical cores via Simultaneous Multi-Threading (SMT), the cache sizes available, the memory configuration installed, as well as the power configuration if throughput per watt is to be measured. Software must also be kept under control and we show that a change of operating system or compiler can lead to different results, as well. We have tried to do a good job of comparing like with like. In summary, we obtained a performance improvement of 9 – 20% per core and 46 – 60% improvement across all cores available. -
The Intel X86 Microarchitectures Map Version 2.0
The Intel x86 Microarchitectures Map Version 2.0 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • Variant: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128 -
Lecture Note 7. IA: History and Features
System Programming Lecture Note 7. IA: History and Features October 30, 2020 Jongmoo Choi Dept. of Software Dankook University http://embedded.dankook.ac.kr/~choijm (Copyright © 2020 by Jongmoo Choi, All Rights Reserved. Distribution requires permission) Objectives Discuss Issues on ISA (Instruction Set Architecture) ü Opcode and operand addressing modes Apprehend how ISA affects system program ü Context switch, memory alignment, stack overflow protection Describe the history of IA (Intel Architecture) Grasp the key technologies in recent IA ü Pipeline and Moore’s law Refer to Chapter 3, 4 in the CSAPP and Intel SW Developer Manual 2 Issues on ISA (1/2) Consideration on ISA (Instruction Set Architecture) asm_sum: addl $1, %ecx movl -4(%ebx, %ebp, 4), %eax call func1 leave ü opcode issues § how many? (add vs. inc è RISC vs. CISC) § multi functions? (SISD vs. SIMD vs. MIMD …) ü operand issues § fixed vs. variable operands f bits n bits n bits n bits § fixed: how many? opcode operand 1 operand 2 operand 3 § operand addressing modes f bits n bits n bits ü performance issues opcode operand 1 operand 2 § pipeline f bits n bits § superscalar opcode operand 1 § multicore 3 Issues on ISA (2/2) Features of IA (Intel Architecture) ü Basically CISC (Complex Instruction Set Computing) § Variable length instruction § Variable number of operands (0~3) § Diverse operand addressing modes § Stack based function call § Supporting SIMD (Single Instruction Multiple Data) ü Try to take advantage of RISC (Reduced Instruction Set Computing) § Micro-operations -
Inside Intel® Core™ Microarchitecture and Smart Memory Access an In-Depth Look at Intel Innovations for Accelerating Execution of Memory-Related Instructions
White Paper Inside Intel® Core™ Microarchitecture and Smart Memory Access An In-Depth Look at Intel Innovations for Accelerating Execution of Memory-Related Instructions Jack Doweck Intel Principal Engineer, Merom Lead Architect Intel Corporation Entdecken Sie weitere interessante Artikel und News zum Thema auf all-electronics.de! Hier klicken & informieren! White Paper Intel Smart Memory Access and the Energy-Efficient Performance of the Intel Core Microarchitecture Introduction . 2 The Five Major Ingredients of Intel® Core™ Microarchitecture . 3 Intel® Wide Dynamic Execution . 3 Intel® Advanced Digital Media Boost . 4 Intel® Intelligent Power Capability . 4 Intel® Advanced Smart Cache . 5 Intel® Smart Memory Access . .5 How Intel Smart Memory Access Improves Execution Throughput . .6 Memory Disambiguation . 7 Predictor Lookup . 8 Load Dispatch . 8 Prediction Verification . .8 Watchdog Mechanism . .8 Instruction Pointer-Based (IP) Prefetcher to Level 1 Data Cache . .9 Traffic Control and Resource Allocation . 10 Prefetch Monitor . 10 Summary . .11 Author’s Bio . .11 Learn More . .11 References . .11 2 Intel Smart Memory Access and the Energy-Efficient Performance of the Intel Core Microarchitectures White Paper Introduction The Intel® Core™ microarchitecture is a new foundation for Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art, power-efficient multi-core microarchi- tecture delivers increased performance and performance per watt, thus increasing overall energy efficiency. Intel Core microarchitecture extends the energy-efficient philosophy first delivered in Intel's mobile microarchitecture (Intel® Pentium® M processor), and greatly enhances it with many leading edge microarchitectural advancements, as well as some improvements on the best of Intel NetBurst® microarchitecture. -
Intel Xeon Processor Can Be Identified by the Following Values
Intel® Xeon® Processor Specification Update December 2006 Notice: The Intel® Xeon® processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this specification update. Document Number: 249678-056 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://developer.intel.com/design/litcentr. Intel®, the Intel® logo, Pentium®, Pentium® III Xeon™, Celeron, Intel® NetBurst™ and Intel® Xeon™ are trademarks or registered trademarks of Intel® Corporation or its subsidiaries in the United States and other countries.