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Operaciones Auxiliares De Montaje De Componentes Informáticos

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AULAAULA CULTURALCULTURAL CURSOCURSO 2012/20132012/2013 CualificaciónCualificación ProfesionalProfesional PqpiPqpi OperacionesOperaciones AuxiliaresAuxiliares dede MontajeMontaje yy MantenimientoMantenimiento dede SistemasSistemas MicroinformáticosMicroinformáticos CUALIFICACIÓN PROFESIONAL: OPERACIONES AUXILIARES DE MONTAJE Y MANTENIMIENTO DE SISTEMAS MICROINFORMÁTICOS (IFC361_1) CONTENIDOS Modulo Formativo I: Operaciones auxiliares de montaje de equipos microinformáticos 1. Elementos básicos eléctricos y electrónicos. • Conceptos de electricidad: intensidad, tensión, resistencia. • Ley de Ohm. • Corriente continua y corriente alterna. • Magnitudes eléctricas. • Aparatos de medición de magnitudes eléctricas. • Pilas y baterías. • Pulsadores. • Interruptores. • Fuentes de alimentación. • Componentes electrónicos: resistencias, condensadores, diodos, transistores, leds. • Circuitos integrados. • Seguridad en el uso de herramientas y componentes eléctricos y electrónicos. • Seguridad eléctrica: medidas de prevención de riesgos eléctricos, daños producidos por descarga eléctrica. 2. Arquitectura del ordenador. • Unidades funcionales de un sistema informático. • La unidad central de proceso. • La memoria. • El sistema de Entrada/Salida: soportes y periféricos. Carcasas, tipos. 3. Componentes internos de los equipos microinformáticos. • Fuentes de alimentación, tipos. • Ventiladores y disipadores de calor. • La placa base, el chipset, la EPROM. • Microprocesadores, zócalos y tipos. • Memorias RAM, características y formatos. • Buses y conectores de datos. • Cableado y conectores de potencia. • Zócalos y bahías de expansión. • Tarjetas de expansión, características. • Tipos de tarjetas de expansión: gráfica, de sonido, de red, … • Tipos y elementos de fijación de los componentes a las carcasas. • Dispositivos de almacenamiento: discos duros, características y tipos; lectores/grabadores ópticos y magneto-ópticos, características y tipos. • Otros componentes 4. Conectores y buses externos de un sistema microinformático. • Puertos: paralelo, serie, USB, Firewire (IEEE 1394). • Conectores inalámbricos: puerto infrarrojo (IrDA), radiofrecuencia (bluetooth). • Cableado de red: tipos de cable y conectores. 5. Periféricos microinformáticos. • Periféricos básicos: monitor, teclado, ratón e impresoras. • Otros periféricos: altavoces, micrófonos, escáner, dispositivos multimedia. • Dispositivos de conectividad: módem, repetidor, conmutador, router. 6. Técnicas de montaje, sustitución y conexión de componentes y periféricos microinformáticos. • Guías de montaje. • Herramientas utilizadas en los procedimientos de montaje, sustitución o conexión de componentes y periféricos informáticos. • Procedimientos de instalación y fijación de componentes microinformáticos a la carcasa y a la placa base. • Conexión de dispositivos periféricos en el sistema microinformático. 7. Técnicas de verificación y testeo de equipos microinformáticos. • Software de testeo y verificación. • Procedimientos de testeo y verificación. 8. Seguridad en las operaciones de montaje, sustitución y conexión de componentes y periféricos microinformáticos. • Normas de prevención de riesgos laborales. • Normas de protección del medio ambiente. • Criterios y condiciones de seguridad en los procedimientos. • Prevención de accidentes más comunes. • Equipos de protección individual y medios de seguridad. Mó dulo Formativo II: Operaciones auxiliares de mantenimiento de equipos microinformáticos. 1. Instalación de sistemas operativos. Microsoft Windows y Linux. 2. Técnicas auxiliares de mantenimiento de sistemas microinformáticos. • Mantenimiento de sistemas microinformáticos. Importancia. • Niveles de mantenimiento. 3. Herramientas de diagnóstico de sistemas microinformáticos. 4. Mantenimiento de Unidades de almacenamiento. • Mantenimiento periódico de unidades de almacenamiento. • Mantenimiento de soportes de información. 5. Elementos consumibles de sistemas microinformáticos. • Tipos y características. • Medidas de conservación y reciclaje de elementos consumibles. • Seguridad en procedimientos de manipulación y sustitución de elementos consumibles. 6. Métodos de replicación física de particiones y discos duros en sistemas microinformáticos. • Particiones de discos: tipos de particiones y herramientas de gestión. • Herramientas de creación e implantación de imágenes y réplicas de sistemas: orígenes de información, procedimientos de implantación de imágenes y réplicas de sistemas, procedimientos de verificación de imágenes y réplicas de sistemas. 7. Técnicas de etiquetado, embalaje, almacenamiento y traslado de equipos y componentes informáticos. • Procedimientos de etiquetado. • Herramientas y accesorios de etiquetado. • Conservación y buen funcionamiento de las herramientas de etiquetado. • Software de etiquetado. • Etiquetado de componentes de un sistema microinformático. • Etiquetado de consumibles: técnicas de prensado de soportes CD/DVD, multimedia y uso de aplicadores de prensado. • Embalaje de componentes internos de un sistema microinformático. • Embalaje de periféricos. • Normas de almacenamiento, catalogación y conservación de componentes y periféricos de un sistema microinformático. • Precauciones a considerar en el traslado de sistemas microinformáticos. 8. Tratamiento de residuos informáticos. • Concepto. Finalidad. Métodos. • Tratamiento, eliminación y aprovechamiento de residuos informáticos. • Lugares de reciclaje y eliminación de residuos informáticos. Modulo Formativo III: Operaciones auxiliares con tecnologías de la información y la comunicación. 1. El sistema operativo en el uso básico de las TIC. • Características. • Clasificación de los sistemas operativos. • Tipos de sistemas operativos. • Windows 7: la interfaz gráfica de usuario, el escritorio. • Windows 7: gestión de archivos y carpetas. 2. Redes de área local en el uso básico de las TIC. • Usos y características. • Acceso a recursos compartidos. • Redes inalámbricas. 3. Entornos multimedia en el uso básico de las TIC. • ¿Que es multimedia? • Dispositivos y aplicaciones multimedia. • Formatos multimedia. 4. El procesador de textos en el uso básico de las TIC (*). • Estructura y funciones de un procesador de textos. • Aplicación de formato a documentos. • Inserción de objetos en documentos. • Configuración de página. • El corrector ortográfico. 5. Otras aplicaciones ofimáticas en el uso básico de las TIC (*). • Aplicaciones ofimáticas de hoja de cálculo, base de datos y presentaciones. • Funcionalidades y usos. 6. Internet en el uso básico de las TIC. • Características y usos. • Documentos Web. • Navegación por la Web: navegadores Web, configuración del navegador (*), descripción y funcionamiento del navegador (*). • Buscadores: características y usos. (*) → Estos temas serán explicados de forma práctica en el aula de taller, mediante ejercicios prácticos, otros manuales externos o vídeotutoriales. INTRODUCCIÓN IDENTIFICACIÓN DEL MÓDULO El objetivo principal de este curso es capacitar a los alumnos, para realizar operaciones de montaje y mantenimiento de equipos microinformáticos y sus periféricos, para realizar operaciones de etiquetado, embalaje y traslado de equipos, así como también que adquieran los conocimientos necesarios para desenvolverse en las tecnologías de la información y comunicación. UNIDADES DE COMPETENCIA Las competencias profesionales que conlleva este curso son: • Montaje y sustitución de componentes internos. • Montaje y sustitución de periféricos. • Procedimientos y programas de testeo. • Procesos rutinarios de comprobación y limpieza de soportes. • Sustitución de cableado y consumibles de periféricos. • Aplicar procedimientos de clonación de equipos. • Intervenir en procesos de etiquetado, embalaje y traslado de equipos. • Manejar sistemas de archivos. • Utilizar dispositivos y aplicaciones multimedia. • Utilizar aplicaciones ofimáticas. • Utilizar los recursos de Internet. MODULO FORMATIVO I: OPERACIONES AUXILIARES DE MONTAJE DE COMPONENTES INFORMÁTICOS 1-ELEMENTOS BÁSICOS ELÉCTRICOS Y ELECTRÓNICOS 1.1-INTENSIDAD, TENSIÓN ELÉCTRICA Y LEY DE OHM O RESISTENCIA DE LOS MATERIALES La intensidad es el flujo de carga por segundo que recorre un material. La unidad de medida de la intensidad se denomina Amperio (A). Esta carga puede ser tanto positiva como negativa. Si conseguimos mantener el campo eléctrico o lo que es lo mismo conseguimos un diferencia de potencial entre dos puntos del material, la corriente circulará de forma ininterrumpida. Esto se consigue con un generador, que es un dispositivo que nos proporciona esa diferencia de potencial entre dos puntos, como por ejemplo una pila. La intensidad depende de las características del material, es decir hay materiales en los que los electrones les cuesta más avanzar y otros materiales en los que les cuesta menos, a esta facilidad de recorrer un material le llamamos resistencia eléctrica del material (Ley de Ohm), su unidad de medida es el ohmio (Ω). Por tanto podemos deducir que cuanto mayor sea la resistencia de un material, menor será la intensidad. Esto se puede explicar de la siguiente manera: imagina que empujas bloques de hierro ladera arriba hasta un montículo, tú serías el generador (pila) y los bloques de hierro harían de corriente eléctrica. Si la ladera es de arena te costaría más energía arrastrar los bloques, en cambio, si la ladera fuera de asfalto o de hielo, te costaría menos energía. La diferencia de potencial que conseguimos en un circuito eléctrico a través de los generadores, lo llamamos tensión eléctrica. 1.2-CORRIENTE
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    2012 ATX Industrial Motherboard NAF93-Q77 Based on Intel® Q77 Panther Point Platform for Ivy Bridge Jetway Computer Corporation Phone: 510-857-0130 Fax: 510-857-0138 38507 Cherry St., Ste E, Newark, CA 94560 www.jetwaycomputer.com NAF93-Q77 ATX Industrial Motherboard 1. Intel® Q77 Express Chipset HI08 2. Socket LGA 1155 for 3rd generation Intel Core i3, i5, i7 Processors 3. Dual Channel DDR3-1066/1333 up to 32GB 4. Intel 82579LM & 82574L PCI-E Gigabit LAN 5. Intel Active Management Technology (iAMT 8.0) 6. 2 * SATA2 6Gb/s, 4 * SATA2 3Gb/s with RAID 7. 1 * mSATA Slot for Embedded SSD 8. 1 * PCI-E 3.0 x16, 1 * PCI-E x4, 1 * PCI-E x1, 4 * PCI 9. 1 * PCI Express Mini Card Slot (half-size) 10. 10 * Serial Ports Onboard, TPM 1.2 Header 11. All Solid Polymer Capacitors for Improved Reliability 12. Industrial Embedded Platform with 5-Year Availability 2 / 3 NAF93-Q77 Specifications Model No: NAF93 HI08 Part No: JNAF93-Q77 Processor Socket LGA 1155 for 3nd-generation Intel Core i3, i5, i7 & Pentium processors (Ivy Bridge), Supports Turbo Boost 2.0, 64-bit, Hyper-Threading, Virtualization (VT-d), and Intel HD graphics on selected models* Chipset Intel Q77 Express chipset Video Intel HD graphics built into processors” Memory 4 * 240-pin DIMM Sockets for un-buffered dual channel DDR3-1066/1333 up to 32GB Storage 2 * SATA3 6Gb/s supporting RAID 0, 1 and 4 * SATA2 3Gb/s supporting RAID 0, 1, 5, 10 1 * mSATA 3Gb/s for embedded SSD Expansion Slots 1 * PCI Express 3.0 x16, 1 * PCI Express x4, 1 * PCI Express x1, 4 * PCI LAN 1 * Intel 82579LM PCI-E gigabit
  • Gigabyte GA-Z97X-UD7 TH LGA 1150 Z97 Dual Thunderbolt 2 ATX Motherboard Affordable Deal

    Gigabyte GA-Z97X-UD7 TH LGA 1150 Z97 Dual Thunderbolt 2 ATX Motherboard Affordable Deal

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