DOCSLIB.ORG

Intel Lga 775 Ga

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Intel Lga 775 Ga INDEX Heat Sink For: UNIVERSAL LGA 2011 LGA 1156/1155 LGA 1366/1155 LGA 775 Cooljag LGA 771 Cooljag is a renowned manufacturer of cooling devices specialized in the “skiving” technology. Since establishment in the year 2001, Cooljag has ventured and advanced in the field of skiving and has became a leader in mastering this technology. P-M However, Cooljag is not self-contented for its achievements in the technology alone, and has evolved to become a thermal total solution provider. Being customer oriented and focused on thermal solutions, Cooljag targets specific thermal problems of our PGA989/BGA989 customers and finds the best overall solution for heat transfer, airflow, noise and cost, with all kinds of technologies. From our very own skiving technology to extrusion and even stacked fins with heat Pipes, we can find and customize the best solution suited Socket 754/939/940/ to our customers needs. 1207eATX/C32 Company Profile • 1986 Company founded • 1995 Development of own brand-Jagwire 1207(long size) • 1996 Received ISO 9002 certificate 5th National award for small to medium enterprises AMD G34/AM2/AM3 • 1997 Honored with Excellence award • 1998 Honored with Rising Star award Retails • 2001 development of the other own brand-Cooljag(as thermal total solution provider) Received ISO 9001 certificate • 2002 Monthly capacity of heatsink : 1,000,000pcs Acessory • 2006 All products are RoHS compliant • 2007 Received TS16949 certificate • 2008 Received OASAS-18001 & ISO-14001 certificate • 2009 TPM activties Water Cooling • 2010 Received ISO13485 certificate Heatsink Cooljag in Skiving Cooljag has advanced in the skiving technology as not only we have achieved the thinnest of fins and thinnest of pitches, but also achieved in the highest of fin heights, widest of fin width, and the largest effective single block heat sink in the world. Thus Industrial not only Cooljag can create the smallest heat sinks for water cooling, we also can create the biggest heat sinks for thermal solutions other than the use of computers, for example, high power electricity, heavy machinery, LED, automobile and many other different industries. This breakthrough will not only broaden the vision of Cooljag as ETX a thermal solution provider, but will also extend the usage of skiving technology, and bring its benefits to all the industries with heat problems. 2 INDEX 04 06 08 12 16 18 22 24 26 28 30 33 34 Environment and Community 36 Recognizing our vital role as responsible global citizens, we strive to produce products that meet the exacting requirements of government agencies for performance, safety 38 and environmental impact. Our primary thermal system products are RoHs certified. INDEX 3 Intel UNIVERSAL JYC8L05AGC-A Material AL+CU CORE Socket Type LGA 775/1366/1356/1155/1156 Weight ( g ) 338 Cooler Dimension 123.64L*123.64W*42.1H (L*W*H mm) JYC8L05AGC-0 Material AL+CU CORE Socket Type LGA 1366/1356/1155/1156 Weight ( g ) 338 Cooler Dimension 123.64L*123.64W*42.1H (L*W*H mm) 1156 1366 Model Name JYC8L05AGC-A Application 1.5U Active System JYC0B44ASPG Material AL+CU CORE Socket H1/Xeon 3400 Material AL fins+Pipe+CU base series/Xeon 3426 series/ Socket Type LGA 1366/1356/1155/1156 CPU Type Nehalem-EP/Westmere- EP/Bloomfield/Pentium 4/ Weight ( g ) 311 Pentium D Cooler Dimension Weight ( g ) 338 90L*90W*62.5H (L*W*H mm) Cooler Dimension 123.64L*123.64W*42.1H (L*W*H mm) Fan Dimension 80*80*15 installation kit Screw+Spring Back Plate Optional Fin Process Extrusion 4 INTEL UNIVERSAL INTEL UNIVERSAL Intel UNIVERSAL JYC9L06AGC-A Material AL+CU CORE Socket Type LGA 775/1366/1356 Weight ( g ) 536 Cooler Dimension 123.64L*123.64W*61.4H (L*W*H mm) JYC9L06AGC-0 Material AL+CU CORE Socket Type LGA 1366/1356/1155/1156 Weight ( g ) 536 Cooler Dimension 123.64L*123.64W*61.4H (L*W*H mm) JYC1B45ATPG Material AL fins+Pipe+CU base Socket Type LGA 1366/1356/1155/1156 Weight ( g ) 375 Cooler Dimension 90L*90W*64.3H (L*W*H mm) JYC8L05AGC-0 JYC9L06AGC-A JYC9L06AGC-0 JYC0B44ASPG JYC1B45ATPG 1.5U Active 2U Active 2U Active 2U Passive 2U Active AL+CU CORE AL+CU CORE AL+CU CORE AL fins+Pipe+CU base AL fins+Pipe+CU base Socket H1/Xeon 3400 Socket H1/Xeon 3400 Socket H1/Xeon 3400 Socket H1/Xeon 3400 Socket H1/Xeon 3400 series/Xeon 3426 series/ series/Xeon 3426 series/ series/Xeon 3426 series/ series/Xeon 3426 series/ series/Xeon 3426 series/ Nehalem-EP/Westmere- Nehalem-EP/Westmere- Nehalem-EP/Westmere- Nehalem-EP/Westmere- Nehalem-EP/Westmere- EP/Bloomfield/Pentium 4/ EP/Bloomfield EP/Bloomfield EP/Bloomfield EP/Bloomfield Pentium D 338 536 536 311 375 123.64L*123.64W*42.1H 123.64L*123.64W*61.4H 123.64L*123.64W*61.4H 90Lx90Wx62.5H 90Lx90Wx64.3H 80*80*15 90*90*25 90*90*25 - 60*60*25 Push Pin Srew+Spring Push Pin screw+spring screw+spring - Optional - Optional Optional Extrusion Extrusion Extrusion Stacked Stacked INTEL UNIVERSAL INTEL UNIVERSAL 5 Intel LGA 2011 Square & Narrow Socket R Square & Socket R Narrow JAC0R06C Material Copper Socket Type LGA 2011 Square Weight ( g ) 486 Cooler Dimension 90L*90W*26H (L*W*H mm) JAC0R11ATC Copper base with Material Aluminum fin Socket Type LGA 2011 Square Weight ( g ) 479 Cooler Dimension 90L*90W*25.5H (L*W*H mm) Model Name JAC0R06C Application 1U Passive JYC0R03ATC System Material Copper base with Aluminum fin Material Copper Socket Type LGA 2011 Square For Intel® Xeon® E5- 2600 (Code name: Weight ( g ) 425 CPU Type Sandy Bridge -EP) Cooler Dimension LGA 2011-S 90L*90W*27H (L*W*H mm) Weight ( g ) 486 Cooler Dimension 90L*90W*26H (L*W*H mm) Fan Dimension - installation kit Screw + Spring Back Plate Optional Fin Process Skived 6 INTEL LGA2011 Intel LGA 2011 Square & Narrow Socket R Square & Socket R Narrow JACLR02C Material Copper Socket Type LGA 2011 Square Weight ( g ) 472 Cooler Dimension 90L*90W*27H (L*W*H mm) JYC0R05ATP Material Aluminum fin with heatpipe Socket Type LGA 2011 Square Weight ( g ) 430 Cooler Dimension 90L*90W*64.3H (L*W*H mm) JYC1R04ATPG-0 Material Aluminum fin with heatpipe Socket Type LGA 2011 Square Weight ( g ) 390 Cooler Dimension 90L*90W*64.3H (L*W*H mm) JAC0R10ATC Copper base with Material Aluminum fin Socket Type LGA 2011 Square Weight ( g ) 457 Cooler Dimension 104L*70W*25.5H (L*W*H mm) JAC0R11ATC JYC0R03ATC JACLR02C JAC0R10ATC JYC0R05ATP JYC1R04ATPG-0 1U Passive 1U Passive 1U Active 1U Passive 2U Passive 2U Active Copper base with Copper base with Copper base with Aluminum fin with Aluminum fin with Copper Aluminum fin Aluminum fin Aluminum fin heatpipe heatpipe For Intel® Xeon® E5- For Intel® Xeon® E5- For Intel® Xeon® E5- For Intel® Xeon® For Intel® Xeon® E5- For Intel® Xeon® E5- 2600 (Code name: 2600 (Code name: 2600 (Code name: E5-2600(Code 2600 (Code name: 2600 (Code name: Sandy Bridge -EP) Sandy Bridge -EP) Sandy Bridge -EP) name:Sandy Brige-EP) Sandy Bridge -EP) Sandy Bridge -EP) LGA 2011-S LGA 2011-S LGA 2011-S LGA 2011-R LGA 2011-S LGA 2011-S 479 425 472 457 430 390 90L*90W*25.5H 90L*90W*27H 90L*90W*27H 104L*70W*25.5H 90L*90.2W*64.3H 90L*90W*64.3H - - 75*75*15 - - 60*60*25 Screw + Spring Screw + Spring Screw + Spring Screw + Spring Screw + Spring Screw + Spring Optional Optional Optional Optional Optional Optional Skived stacked Skived Skived stacked stacked 7 Intel LAG 1156/1155 Socket H / Socket H2 JAC0L06C Material CU Socket Type LGA 1156/1155 Weight ( g ) 521 Cooler Dimension 85L*85W*26H (L*W*H mm) JAC0L04A Material AL Socket Type LGA 1156/1155 Weight ( g ) 220 Cooler Dimension 85L*85W*26H (L*W*H mm) JACLL03C Material CU Socket Type LGA 1156/1155 Weight ( g ) 382 Cooler Dimension 84L*84W*28H (L*W*H mm) 8 LGA 1156 INTEL LGA 1156 Intel LAG 1156/1155 Socket H/Socket H2 JAC9L13A Material AL Socket Type LGA 1156/1155 Weight ( g ) 417 Cooler Dimension 90L*90W*68H (L*W*H mm) JAC0L11A JAC7L07C Material AL Material CU Socket Type LGA 1156/1155 Socket Type LGA 1156/1155 Weight ( g ) 380 Weight ( g ) 424 Cooler Dimension Cooler Dimension 90L*82.2W*64.9H 84L*84W*26.4H (L*W*H mm) (L*W*H mm) Model Name JAC0L06C JAC0L04A JACLL03C JAC9L13A JAC0L11A JAC7L07C Application 1U Passive 1U Passive 1U Active 2U Active 2U Passive 1U Active System Material CU AL CU AL AL CU Socket H1/Xeon 3400 Socket H1/Xeon 3400 Socket H1/Xeon 3400 Socket H1/Xeon 3400 Socket H1/Xeon 3400 Socket H1/Xeon 3400 CPU Type series/ series/ series/ series/ series/ series/ Xeon 3426 series Xeon 3426 series Xeon 3426 series Xeon 3426 series Xeon 3426 series Xeon 3426 series Weight ( g ) 521 220 382 417 380 424 Cooler Dimension 85L*85W*26H 85L*85W*26H 84L*84W*28H 90L*90W*68H 90L*82.2W*64.9H 84L*84W*26.4H (L*W*H mm) Fan Dimension - - Blower 75*75*15 60*60*20 - 70*70*10 installation kit Screw + Spring Screw + Spring Screw + Spring Screw + Spring Screw + Spring Screw + Spring Back Plate Optional Optional Optional Optional Optional Optional Fin Process Skived Skived Skived Skived Skived Skived INTEL LGA 1156 LGA 1156 9 Intel LGA 1366/1356 Socket B/Socket B2 JYC0B39CTA Material AL fins+CU base Intel Approved Socket Type LGA 1366/1356 Weight ( g ) 423 Cooler Dimension 89.8L*89.8W*27H (L*W*H mm) JAC7B15A Material AL Socket Type LGA 1366/1356 Weight ( g ) 239.5 Cooler Dimension 89L*89W*26H (L*W*H mm) JAC7B15C Material CU Socket Type LGA 1366/1356 Weight ( g ) 485 Cooler Dimension 89L*89W*26H (L*W*H mm) 10 LGA 1366 INTEL LGA 1366 Intel LGA 1366/1356 Socket B/Socket B2 JAC0B12A Material AL Socket Type LGA 1366/1356 Weight ( g ) 220 Cooler Dimension 90L*90W*27H (L*W*H mm) JAC0B04C Material CU Socket Type LGA 1366/1356 Weight ( g ) 486 Cooler Dimension 90L*90W*26H (L*W*H mm) Model Name JYC0B39CTA JAC7B15A JAC7B15C JAC0B12A JAC0B04C Application 1U Passive
Load more

Recommended publications
  • Multiprocessing Contents
    Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References .............................................
    [Show full text]
  • Replace Nine Older Servers with One Dell Emc Poweredge Vrtx
    COMPARING PERFORMANCE AND COST: DELL EMC POWEREDGE VRTX WITH ONE DELL EMC POWEREDGE M830 SERVER VS. A LEGACY SOLUTION Businesses using multiple outdated server0 sSERVER for email, database, NODES and fileVS. and A LEGACY SOLUTION print workloads stand to benefit greatly by consolidating these workloads onto a single new server and running them in virtual machines. In tests in the Principled Technologies datacenter, the Dell EMC PowerEdge VRTX with a Dell EMC PowerEdge M830 blade server, powered by the Intel Xeon processor E5-4650 v3, was able to simultaneously run email, database, and simulated file and print workloads in a VMware® vSphere® virtual environment. The VRTX performed the work of nine older servers—four database servers, four file and print servers, and one Exchange server. It achieved similar or even better performance while requiring less space and power than a legacy disparate hardware solution,1 which translates to a lower five-year TCO. Combining servers, networking, and shared storage into an all-in-one solution, the PowerEdge VRTX can deliver big performance and savings. 1 In June 2013, Principled Technologies conducted testing comparing the performance of (1) the Dell PowerEdge VRTX with a Dell PowerEdge M620 server and (2) a legacy hardware solution. The results for the legacy solution that we cite in this report are from that earlier study. For more details, see the report for that study, available at www.principledtechnologies.com/Dell/VRTX_performance_TCO_0713.pdf. JULY 2015 (Revised January 2017) A PRINCIPLED
    [Show full text]
  • HP Xw6600 Workstation Overview
    QuickSpecs HP xw6600 Workstation Overview HP recommends Windows Vista® Business 1. Monitor (sold separately) 8. 2 PCI, 2 PCI Express x8 mechanical/x4 electrical 2. Mouse (USB or PS/2) 9. 2 PCI Express x16 Gen2 Graphics Bus 3. Standard Keyboard (USB or PS/2) 10. 5 USB 2.0 (rear), 1 USB 2.0 (internal), 1 standard serial port 4. Front IO: 2 USB 2.0, IEEE-1394 (optional), headphone out (only available via internal header with optional module), 2 and microphone in PS/2, 1 RJ-45, audio line in, audio line out, and microphone in. 5. 3.5" external bay for optional floppy drive 6. 2 external 5.25" bays 11. Dual-Core or Quad-Core Intel® Xeon® Processors 7. 2 internal 3.5" bays (convertible to 3 internal 2.5" bays) 12. 650 watt 80 PLUS high efficiency power supply Form Factor Minitower Compatible Operating Genuine Windows Vista® Business 64-bit* Systems Genuine Windows Vista® Business 32-bit* Genuine Windows Vista® 64-bit downgrade to Genuine Microsoft® Windows® XP Professional 64-bit** Genuine Windows Vista® 32-bit downgrade to Genuine Microsoft® Windows® XP Professional 32-bit** Red Hat Enterprise Linux® WS 5 64-bit HP Linux Installer Kit for Linux (includes drivers for both 32-bit & 64-bit OS versions of Red Hat Enterprise Linux WS4 and WS5 see: http://www.hp.com/workstations/software/linux) For detailed OS/hardware support information for Linux, see: http://www.hp.com/support/linux_hardware_matrix * Certain Windows Vista product features require advanced or additional hardware. See http://www.microsoft.com/windowsvista/getready/hardwarereqs.mspx and http://www.microsoft.com/windowsvista/getready/capable.mspx for details.
    [Show full text]
  • Evolution of the Pentium
    Chapter 7B – The Evolution of the Intel Pentium This chapter attempts to trace the evolution of the modern Intel Pentium from the earliest CPU chip, the Intel 4004. The real evolution begins with the Intel 8080, which is an 8–bit design having features that permeate the entire line. Our discussion focuses on three organizations. IA–16 The 16–bit architecture found in the Intel 8086 and Intel 80286. IA–32 The 32–bit architecture found in the Intel 80386, Intel 80486, and most variants of the Pentium design. IA–64 The 64–bit architecture found in some high–end later model Pentiums. The IA–32 has evolved from an early 4–bit design (the Intel 4004) that was first announced in November 1971. At that time, memory came in chips no larger than 64 kilobits (8 KB) and cost about $1,600 per megabyte. Before moving on with the timeline, it is worth recalling the early history of Intel. Here, we quote extensively from Tanenbaum [R002]. “In 1968, Robert Noyce, inventor of the silicon integrated circuit, Gordon Moore, of Moore’s law fame, and Arthur Rock, a San Francisco venture capitalist, formed the Intel Corporation to make memory chips. In the first year of operation, Intel sold only $3,000 worth of chips, but business has picked up since then.” “In September 1969, a Japanese company, Busicom, approached Intel with a request for it to manufacture twelve custom chips for a proposed electronic calculator. The Intel engineer assigned to this project, Ted Hoff, looked at the plan and realized that he could put a 4–bit general–purpose CPU on a single chip that would do the same thing and be simpler and cheaper as well.
    [Show full text]
  • Lista Sockets.Xlsx
    Data de Processadores Socket Número de pinos lançamento compatíveis Socket 0 168 1989 486 DX 486 DX 486 DX2 Socket 1 169 ND 486 SX 486 SX2 486 DX 486 DX2 486 SX Socket 2 238 ND 486 SX2 Pentium Overdrive 486 DX 486 DX2 486 DX4 486 SX Socket 3 237 ND 486 SX2 Pentium Overdrive 5x86 Socket 4 273 março de 1993 Pentium-60 e Pentium-66 Pentium-75 até o Pentium- Socket 5 320 março de 1994 120 486 DX 486 DX2 486 DX4 Socket 6 235 nunca lançado 486 SX 486 SX2 Pentium Overdrive 5x86 Socket 463 463 1994 Nx586 Pentium-75 até o Pentium- 200 Pentium MMX K5 Socket 7 321 junho de 1995 K6 6x86 6x86MX MII Slot 1 Pentium II SC242 Pentium III (Cartucho) 242 maio de 1997 Celeron SEPP (Cartucho) K6-2 Socket Super 7 321 maio de 1998 K6-III Celeron (Socket 370) Pentium III FC-PGA Socket 370 370 agosto de 1998 Cyrix III C3 Slot A 242 junho de 1999 Athlon (Cartucho) Socket 462 Athlon (Socket 462) Socket A Athlon XP 453 junho de 2000 Athlon MP Duron Sempron (Socket 462) Socket 423 423 novembro de 2000 Pentium 4 (Socket 423) PGA423 Socket 478 Pentium 4 (Socket 478) mPGA478B Celeron (Socket 478) 478 agosto de 2001 Celeron D (Socket 478) Pentium 4 Extreme Edition (Socket 478) Athlon 64 (Socket 754) Socket 754 754 setembro de 2003 Sempron (Socket 754) Socket 940 940 setembro de 2003 Athlon 64 FX (Socket 940) Athlon 64 (Socket 939) Athlon 64 FX (Socket 939) Socket 939 939 junho de 2004 Athlon 64 X2 (Socket 939) Sempron (Socket 939) LGA775 Pentium 4 (LGA775) Pentium 4 Extreme Edition Socket T (LGA775) Pentium D Pentium Extreme Edition Celeron D (LGA 775) 775 agosto de
    [Show full text]
  • Computer Organization and Assembly Language CSC-210 Laboratory
    Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Computer Organization and Assembly Language CSC-210 Laboratory Manual 3rd Edition 2017/2018 Name: Number: ٍ :Section Department: 1 Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Table of Contents Lab (1): Computer Anatomy ....................................................................................................... 4 Objectives ............................................................................................................................... 4 What is a Computer? ............................................................................................................... 4 System ..................................................................................................................................... 4 1. Motherboard ............................................................................................................. 5 2. Central Processing Unit (CPU) ...................................................................................... 6 3. Memory .................................................................................................................... 6 4. Video Adapter ............................................................................................................ 7 5. Operating System ......................................................................................................
    [Show full text]
  • Dual-Core Intel® Xeon® Processor 5100 Series
    Product Brief Dual-Core Intel® Xeon® Processor 5100 Series Dual-Core Intel® Xeon® Processor 5100 Series Driving Energy-efficient Performance in New Dual-Processor Platforms Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing. The 64-bit Dual-Core Intel® Xeon® processor 51001 series enables next-generation platforms that can drive energy-efficient infrastructures to optimize data center density, reduce total cost of ownership (TCO), and improve business continuity, redefining what DP servers and workstations should deliver to help businesses be more efficient, dependable, and agile. The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel® 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and over 3 times the performance/watt of previous- generation single-core Intel® Xeon® processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2 times the performance and over 2 times the performance/watt of previous-generation dual-core Intel Xeon processors.2 Confidently deliver more services with hardware-assisted virtualization and enhanced reliability in a 64-bit, dual-core platform The Dual-Core Intel Xeon processor 5100 Intel® Core™ microarchitecture series matched with Intel advanced server delivers industry-leading performance and helps build energy-efficient technologies help IT operations deliver more infrastructures with Dual-Core services in the same power envelope and work Intel® Xeon® Processor 5100 series more efficiently.
    [Show full text]
  • Quad-Core Intel® Xeon® Processor 5400 Series
    Quad-Core Intel® Xeon® Processor 5400 Series Datasheet August 2008 318589-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Quad-Core Intel® Xeon® Processor 5400 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. 64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information.
    [Show full text]
  • Building the Digital Infrastructure PEAK 8920VL2 User Manual
    Building the Digital Infrastructure PEAK 8920VL2 User Manual Version 1.01 Nov 29, 2006 Preface Packing Materials Checklist Copyright Notice Item Description Q’ty Copyright © 2006 NEXCOM All rights reserved. No part of this manual may be reproduced, trans- 1 PEAK8920VL2 BOARD SET 1 mitted, transcribed, stored in a retrieval system, or translated into any 2 CPU COOLER 2 language or computer language, in any form or by any means (elec- 3 PS/2 KB/Mouse Y CABLE 1 tronic, mechanical, photocopying, recording, or otherwise), without 4 CABLE SET (SIO+PIO P2.00)/(SIO P2.00)/IDE66 1 the express written permission of NEXCOM Information provided in this manual is intended to be accurate and reliable. However, the 5 QUICK REFERENCE GUIDE 1 original manufacturer assumes no responsibility for its use, nor for 6 CD DRIVER 1 any infringements upon the rights of third parties that may result from such use. Acknowledgements Intel and Pentium are trademarks of Intel Corporation. Microsoft Windows® is a registered trademark of Microsoft Corp. All other product names or trademarks are properties of their respec- tive owners. Copyright © 2006 NEXCOM International Co., LTD. All rights reserved PEAK 8920VL2 User Manual PEAK 8920VL2 User Manual Declaration of Conformity Installation Suggestions CE Ensure you have a stable, clean working environment. Dust and dirt This product has passed the CE test for environmental specifications can get into components and cause a malfunction. Use containers to when shielded cables are used for external wiring. We recommend keep small components separated. the use of shielded cables. Please contact your local supplier for Adequate lighting and proper tools can prevent you from acciden- ordering information.
    [Show full text]
  • Operaciones Auxiliares De Montaje De Componentes Informáticos
    AULAAULA CULTURALCULTURAL CURSOCURSO 2012/20132012/2013 CualificaciónCualificación ProfesionalProfesional PqpiPqpi OperacionesOperaciones AuxiliaresAuxiliares dede MontajeMontaje yy MantenimientoMantenimiento dede SistemasSistemas MicroinformáticosMicroinformáticos CUALIFICACIÓN PROFESIONAL: OPERACIONES AUXILIARES DE MONTAJE Y MANTENIMIENTO DE SISTEMAS MICROINFORMÁTICOS (IFC361_1) CONTENIDOS Modulo Formativo I: Operaciones auxiliares de montaje de equipos microinformáticos 1. Elementos básicos eléctricos y electrónicos. • Conceptos de electricidad: intensidad, tensión, resistencia. • Ley de Ohm. • Corriente continua y corriente alterna. • Magnitudes eléctricas. • Aparatos de medición de magnitudes eléctricas. • Pilas y baterías. • Pulsadores. • Interruptores. • Fuentes de alimentación. • Componentes electrónicos: resistencias, condensadores, diodos, transistores, leds. • Circuitos integrados. • Seguridad en el uso de herramientas y componentes eléctricos y electrónicos. • Seguridad eléctrica: medidas de prevención de riesgos eléctricos, daños producidos por descarga eléctrica. 2. Arquitectura del ordenador. • Unidades funcionales de un sistema informático. • La unidad central de proceso. • La memoria. • El sistema de Entrada/Salida: soportes y periféricos. Carcasas, tipos. 3. Componentes internos de los equipos microinformáticos. • Fuentes de alimentación, tipos. • Ventiladores y disipadores de calor. • La placa base, el chipset, la EPROM. • Microprocesadores, zócalos y tipos. • Memorias RAM, características y formatos. • Buses y conectores
    [Show full text]
  • IC70 Mini-ITX SBC ® TM Intel Core I5-520M 2.4Ghz Processor, Mini-ITX Motherboard W/DC 12V Input
    IC70 Mini-ITX SBC ® TM Intel Core i5-520M 2.4GHZ Processor, Mini-ITX Motherboard W/DC 12V Input DDR3 SO-DIMM socket CPU Socket DIO Mini PCIe slot(WiFi) Features SATA • Socket G1 for Intel® Core™ i5 - 520M COM Port Processor DC-in • Mini ITX Form Factor PS/2 LVDS • DDR3 800/1066MHz dual-channel SDRAM RS-232 supported up to 8 GB RS-232/422/485 DVI • 12V Single Voltage Power Input VGA HDMI • Dual display supported by VGA / dual-channel LAN PCIe x16 slot 24-bit LVDS / HDMI / DVI USB COM Port Mini PCIe slot(3G) Audio Jack Specification Socket G1 (PGA988) Intel® i5 - 520M 2.4GHz processor with CPU 1066/800 MHz FSB (Arrandale Core) Bottom View System Memory Two DDR3 1066/800MHz SO-DIMM supported (system max. 8GB) System Specification System Chipset Intel® 5 series Chipset (HM55) BIOS AMI UEFI BIOS Super IO Chipset Winbond W83628UHG Integrated Gfx Gen5.75, supports DirectX 10 and OpenGL 2.1 Analog monitor resolution up to 2048 x 1536 @75Hz Display Specification Display Interface HDMI/DVI interface, supports max. resolution 1920 x 1200 @60Hz Dual-channel 18/24-bit LVDS, supports max resolution 1600 x 1200 @60Hz Audio Realtek ALC886 HD codec (Line-in, Line out, Mic-in) Ethernet Dual Broadcom BCM57780 PCIe GbE LAN controller 4 x USB 2.0 2 x RS-232 (COM3, COM4) 1 x RS-232/422/485 (COM1) 2 x RS-45 for LAN Rear I/O Board Dimension 1 x VGA 1 x Audio Jack (Line-in, Line-out, Mic-in) 170.0 163.2 2 x PS/2 (KB/MS) 5.8 1 x (+12V) DC-in Power Jack 1 x RS-232 (COM2) 2x5 pin-header 4.3 2 x RS-232 (COM5, COM6) 2x10 pin-header 4 x USB 1 x HDMI connector (Erect
    [Show full text]
  • Typy Gniazd I Procesorów
    TYPY GNIAZD I PROCESORÓW AMD Socket • Socket 5 - AMD K5. • Socket 7 - AMD K6. • Super Socket 7 - AMD K6-2, AMD K6-III. • Socket 462 (zwany tak Ŝe Socket A) - AMD Athlon, Duron, Athlon XP, Athlon XP-M, Athlon MP, i Sempron. • Socket 463 (zwany tak Ŝe Socket NexGen) - NexGen Nx586. • Socket 563 - AMD Athlon XP-M (µ-PGA Socket). • Socket 754 - AMD Athlon 64, Sempron, Turion 64. Obsługa pojedynczego kanału pami ęci DDR-SDRAM, tzw. single-channel. • Socket 939 - AMD Athlon 64, Athlon 64 FX, Athlon 64 X2, Sempron, Turion 64, Opteron (seria 100). Obsługa podwójnego kanału pami ęci DDR-SDRAM, tzw. dual-channel. • Socket 940 - AMD Opteron (seria 100, 200, 800), Athlon 64 FX. Obsługa podwójnego kanału pami ęci DDR-SDRAM, tzw. dual- channel. • Socket 1207 (zwane tak Ŝe Socket F) - Supports AMD Opteron (seria 200, 800). Zast ąpił Socket 940. Obsługa dual-channel DDR2- SDRAM. • Socket AM2 - AMD Athlon 64 FX, Athlon 64 X2, Sempron, Turion 64, Opteron (seria 100). Obsługa dual-channel DDR2-SDRAM. Posiada 940 pinów. • Socket AM2+ - AMD Athlon X2, Athlon X3, Athlon X4, Phenom X2, Phenom X3, Phenom X4, Sempron, Phenom II. Obsługa dual- channel DDR2-SDRAM, oraz Obsługa dual-channel DDR3-SDRAM i HyperTransport 3 z mniejszym zapotrzebowaniem na energi ę. Posiada 940 pinów. • Socket AM3 - gniazdo pod procesor AMD, charakteryzuj ący si ę obsług ą dual-channel DDR3-SDRAM, oraz HyperTransport 3. Phenom II X2, Phenom X3, Phenom X4, Phenom X6, Athlon II X2, Athlon X3, Athlon X4, Sempron. • Socket FM1 - gniazdo pod procesor AMD Vision z nowej serii APU, wykonany w w 32 nanometrowym procesie produkcyjnym.
    [Show full text]