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Thermal Interface Material Comparison: Thermal Pads Vs
Thermal Interface Material Comparison: Thermal Pads vs. Thermal Grease Publication # 26951 Revision: 3.00 Issue Date: April 2004 © 2004 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel, or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Trademarks AMD, the AMD Arrow logo, AMD Athlon, AMD Duron, AMD Opteron and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. -
2021 User Guide
i Pro Fortran Linux Absoft Pro Fortran User Guide Absoft Fortran Linux Fortran User Guide 5119 Highland Road, PMB 398 Waterford, MI 48327 U.S.A. Tel (248) 220-1190 Fax (248) 220-1194 [email protected] All rights reserved. No part of this publication may be reproduced or used in any form by any means, without the prior written permission of Absoft Corporation. THE INFORMATION CONTAINED IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE AND RELIABLE. HOWEVER, ABSOFT CORPORATION MAKES NO REPRESENTATION OF WARRANTIES WITH RESPECT TO THE PROGRAM MATERIAL DESCRIBED HEREIN AND SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. FURTHER, ABSOFT RESERVES THE RIGHT TO REVISE THE PROGRAM MATERIAL AND MAKE CHANGES THEREIN FROM TIME TO TIME WITHOUT OBLIGATION TO NOTIFY THE PURCHASER OF THE REVISION OR CHANGES. IN NO EVENT SHALL ABSOFT BE LIABLE FOR ANY INCIDENTAL, INDIRECT, SPECIAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE PURCHASER'S USE OF THE PROGRAM MATERIAL. U.S. GOVERNMENT RESTRICTED RIGHTS — The software and documentation are provided with RESTRICTED RIGHTS. Use, duplication, or disclosure by the Government is subject to restrictions set forth in subparagraph (c) (1) (ii) of the Rights in Technical Data and Computer Software clause at 252.227-7013. The contractor is Absoft Corporation, 2111 Cass Lake Rd. Ste 102, Keego Harbor, Michigan 48320. ABSOFT CORPORATION AND ITS LICENSOR(S) MAKE NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, REGARDING THE SOFTWARE. ABSOFT AND ITS LICENSOR(S) DO NOT WARRANT, GUARANTEE OR MAKE ANY REPRESENTATIONS REGARDING THE USE OR THE RESULTS OF THE USE OF THE SOFTWARE IN TERMS OF ITS CORRECTNESS, ACCURACY, RELIABILITY, CURRENTNESS, OR OTHERWISE. -
50X50x41mm Socket 7/370 CPU Cooler Fan W/ Heatsink and TX3 and LP4 Startech ID: FANP1003LD
50x50x41mm Socket 7/370 CPU Cooler Fan w/ Heatsink and TX3 and LP4 StarTech ID: FANP1003LD StarTech.com's Socket 7/Socket 730 CPU cooler fan optimizes heat dissipation and removal by combining a large aluminum heatsink and 5cm brushless ball-bearing fan, helping to ensure ideal operating conditions for your hard working CPU. A broadly compatible CPU cooling solution, the Socket 7/Socket 730 CPU cooler fan provides quiet cooling for Socket 370(PPGA) Celerons, Socket 7 Pentiums, AMD K6, K6-2 and Cyrix chips and is powered using a TX3 (3-lead) connection to either the computer power supply or the motherboard (direct). When powered directly from the motherboard, the fan speed and operating status can be monitored for ideal performance. Capable of moving up to 8.84 CFM of air away from the CPU, the Socket 7/Socket 730 CPU cooler fan features a high-efficiency fan blade design and is backed by StarTech.com's 2-year warranty and free lifetime technical support. Applications Socket Type: Socket 7 & Socket 370 VIA : C3, Cyrix III & Cyrix MII up to 500 MHz Intel : Celeron up to 500 MHz AMD : K-6 series up to 500 MHz Replace the stock OEM cooler or a failed Socket 7/370 heatsink fan assembly www.startech.com 1 800 265 1844 Features Aluminum heatsink 50mm ball bearing fan Solid metal retention clip Technical Specifications Warranty 2 Years Fan Bearing Type Ball Bearing Fan Dimensions 50 x 50 x 12.7mm 2 x 2 x 0.5in Heatsink Dimensions 50 x 50 x 22mm 2 x 2 x 0.85in Heatsink Type Aluminum Air Flow Rate 8.84 CFM Fan RPM 4500 Noise Level 28 dBA Connector Type(s) 1 - Molex Fan (3 pin; TX3) Female Color Black Product Height 1.9 in [49 mm] Product Length 1.9 in [49 mm] Product Weight 2.9 oz [81 g] Product Width 1.6 in [40 mm] Input Voltage 12 DC Shipping (Package) Weight 0.3 lb [0.1 kg] Included in Package 1 - Pentium/K6/Celeron 3-Lead CPU Fan Included in Package 1 - 3-pin to dual LP4 Molex Adapter Cable Included in Package 1 - Packet of Thermal Compound Certifications, Reports and Compatibility www.startech.com 1 800 265 1844. -
Intelligent Systems and Platforms Transforming the Industrial Cloud Era
Intelligent Systems and Platforms Transforming the Industrial Cloud Era With innovative technologies from cloud computing (industrial server, video server), edge computing (fanless, slim & portable devices), to high performance embedded systems. Advantech transforms embedded systems into intelligent systems with smart, secure, energy-saving features, built with Industrial Cloud Services and professional Overview System Design-To-Order Services (System DTOS). Advantech’s intelligent systems are designed to target vertical markets in intelligent transportation, factory automation/machine automation, cloud infrastructure, intelligent video application. Industrial Server & Storage Industrial Cloud Intelligent Vision Systems Intelligent Video Systems Intelligent Systems Data Acquisition Modules Intelligent Transportation Systems 0-4 Star Products Intelligent Video Solution DVP-7011UHE DVP-7011MHE DVP-7017HE DVP-5311D Overview 1-ch H.264 4K HDMI 2.0 PCIe 1-ch Full HD H.264 M.2 Video 1-ch Full HD H.264 Mini PCIe Video (DVI-DVI), Control and Video Capture Card with SDK Capture Card with SDK Video Capture Card with SDK Data Transmission Extender • 1-channel 4K HDMI 2.0 video input with • 1 channel HDMI/DVI-D/DVI-A/YPbPr • 1 channel SDI channel video inputs with • Supports High Resolution 1920x1200 @ H.264 software compression channel video inputs with H.264 software H.264 software compression 60Hz WUXGA compression • 60/50 fps (NTSC/PAL) at up to • 30/25 fps (NTSC/PAL) at up to full HD • Zero pixel loss with TMDS signal correction 4096 x 2160p -
PCA-6189 Full-Sized PCI/ISA-Bus Socket 479 Pentium® M/ Celeron® M Processor-Based CPU Card User's Manual
PCA-6189 Full-sized PCI/ISA-bus socket 479 Pentium® M/ Celeron® M processor-based CPU card User’s Manual Copyright Notice This document is copyrighted, 2005, by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right to make improve- ments to the products described in this manual at any time without notice. No part of this manual may be reproduced, copied, translated or transmit- ted in any form or by any means without the prior written permission of Advantech Co., Ltd. Information provided in this manual is intended to be accurate and reliable. However, Advantech Co., Ltd. assumes no responsibility for its use, nor for any infringements upon the rights of third parties which may result from its use. Acknowledgements •AWARD is a trademark of Phoenix Technologies Ltd. •IBM and PC are trademarks of International Business Machines Corpo- ration. •Intel®, Pentium® M / Celeron® M are trademarks of Intel Corporation. •WinBond is a trademark of Winbond Corporation. All other product names or trademarks are the properties of their respec- tive owners. Part No. 2002618900 4th Edition Printed in Taiwan March 2005 PCA-6189 User’s Manual ii 1.0.1 A Message to the Customer Advantech customer services Each and every Advantech product is built to the most exacting specifica- tions to ensure reliable performance in the harsh and demanding conditions typical of industrial environments. Whether your new Advantech equipment is destined for the laboratory or the factory floor, you can be assured that your product will provide the reliability and ease of operation for which the name Advantech has come to be known. -
SOCKETS (Zocalos)
Instituto ITES Armado, Reparación y Mantención PC. Prof: Vladimir Zúñiga C. SOCKETS (zocalos) LGA 775 Especificaciones Tipo LGA Factores de forma Flip-chip land grid array del chip Contactos 775 Protocolo del FSB Quad-Pumped Frecuencia del 533 MT/s, 800 MT/s, 1066 FSB MT/s, 1333 MT/s, 1600 MT/s Dimesiones del 1.47 × 1.47 inches[1] procesador Procesadores Intel Pentium 4 (2.66 - 3.80 GHz) Intel Celeron D (2.53 - 3.60 GHz ) Intel Pentium 4 Extreme Edition (3.20 - 3.73 GHz) Intel Pentium D (2.66 - 3.60 GHz) Pentium Dual-Core (1.40 - 2.80 GHz) Intel Core 2 Duo (1.60 - 3.33 GHz) Intel Core 2 Extreme (2.66 - 3.20 GHz) Intel Core 2 Quad (2.33 - 3.00 GHz) Intel Xeon (1.86-3.40 GHz) Intel 'Core' Celeron (1.60 - 2.40 GHz) El zócalo LGA 775, también conocido como Socket T o Socket 775, es uno de los zócalos utilizados por Intel para dar soporte a los microprocesadores Pentium 4. Entre otros aspectos, se diferencia de los anteriores 370 (para Pentium III) y del Socket 423 y 478 (para los primeros Pentium 4) en que carece de pines. Las velocidades de bus disponibles para esta arquitectura van desde 533Mhz hasta 1600MHz. Este tipo de zócalo es el "estándar" para casi todos los procesadores de consumo de Intel para equipos sobremesa y algunos portátiles. Desde los "Celeron D" hasta los "Core 2 Duo", pasando por los "Pentium D", su principal atractivo es que los procesadores para LGA 775 carecen de pines; es decir que la placa base es la que contiene los contactos para comunicarse con el procesador. -
Features and Specifications
Chapter 1 Features and Specifications This chapter lists the features and specifications of the Predator G3-710 Desktop Computer. NOTE The items listed in this section are for reference only. The exact configuration of your PC depends on the model purchased. System Features Component Description Operating system support • Microsoft Windows 10 ML x64 • Microsoft Windows 10 SL x64 Processor • LGA 1151 socket type • Supports the following Intel Kabylake-S processors: – Intel Core i7 7700K 4.2G 8M 2400 Quad Core 95W – Intel Core i5 7600K 3.8G 8M 2400 Quad Core 95W Chipset Intel Skylake B150 chipset Graphics controller One PCIe x16 graphics card (nVidia GTX1080/1070/1060) Hardware monitor Super I/O Memory Support DDR4 1.2V 2400MHz U-DIMMs (4GB, 8GB or 16GB) dual channel up to 64GB total memory PCI expansion options • One PCI Express x16 slot • Two PCI Express x1 slots • Two M.2 slots Display • Dual independent display support • Maximum resolution – HDMI: 1920 x 1080 @ 60 Hz – Display Port: 4096 x 2304 @ 60 Hz Audio Realtek ALC662-VD 5.1 Channel High Definition Audio Codec I/O ports • Front panel – Two USB 3.0 ports – One Headphone jack – One Microphone jack – One SD card reader slot • Rear panel – One Display port – One HDMI-OUT port – Four USB 3.0 ports – Two USB 2.0 ports – One Ethernet jack (RJ45) – One Microphone jack – One line-out jack – One line-in jack – One power connector Hard disk drive (HDD) • Three HDD bays supporting 3.5-inch or 2.5-inch SATA 3.0 HDD • Support 7200 rpm SATA HDD in 1TB/2TB/3TB/4TB capacities Predator G3-710 Desktop -
User's Guide PN: 961Ć047Ć081
6950 Enterprise Gateway Server USER’S GUIDE """""""""""""""""""""""""""" PN: 961-047-091 Revision D September 1999 " NOTICE The information contained herein is proprietary and is provided solely for the purpose of allowing customers to operate and service Intermec manufactured equipment and is not to be released, reproduced, or used for any other purpose without written permission of Intermec. Disclaimer of Warranties. The sample source code included in this document is presented for reference only. The code does not necessarily represent complete, tested programs. The code is provided AS IS WITH ALL FAULTS." ALL WARRANTIES ARE EXPRESSLY DISCLAIMED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. We welcome your comments concerning this publication. Although every effort has been made to keep it free of errors, some may occur. When reporting a specific problem, please describe it briefly and include the book title and part number, as well as the paragraph or figure number and the page number. Send your comments to: Intermec Technologies Corporation Publications Department 550 Second Street SE Cedar Rapids, IA 52401 INTERMEC and NORAND are registered trademarks and ENTERPRISE WIRELESS LAN, UAP, and UNIVERSAL ACCESS POINT are trademarks of Intermec Technologies Corporation. 1996 Intermec Technologies Corporation. All rights reserved. Acknowledgments AS/400 and IBM are registered trademarks of International Business Machines Corporation. DEC, VAX, and VT220 are registered trademarks of Digital Equipment Corporation. UNIX is a registered trademark of UNIX System Laboratories, Inc. B CAUTION: Intermec Technologies Corporation suggests you buy cables from us to connect with other devices. Our cables are safe, meet FCC rules, and suit our products. -
User's Manual User's Manual
User’s Manual (English Edition) Intel Pentium 4 Socket 478 CPU AMD Athlon/ Duron/Athlon XP Socket 462 CPU AMD Athlon 64 Socket 754 CPU ZM-WB2 Gold * Please read before installation http://www.zalman.co.kr http://www.zalmanusa.com 1. Features 1) Gold plated pure copper base maximizes cooling performance and prevents CPU blocks from galvanic corrosion 2) Intel Pentium 4 (Socket 478), AMD Athlon/Duron/Athlon XP (Socket 462),Athlon 64 (Socket 754) compatible design for broad compatibility. 3) Three types of compression fitting are offered for use with water tubes (8X10mm,8X11mm,10X13mm) * Zalman Tech. Co., Ltd. is not responsible for any damage resulting from CPU OVERCLOCKING. 2. Specifications Part No Part name Q’ ty Weight (g) Use 1 CPU block 1 447.0 CPU mountimg 2 Hand screw 2 8.0 Clip mountimg 3 Thermal grease 1 1.8 Apply to cpu core 4 Clip 1 9.6 CPU block mountimg 5 User’s manual 1 6 Clip supports 2 8.2 Socket 478 7 Clip supports A 2 5.0 Socket 462 8 Clip supports B 2 5.0 Socket 462 9 Bolts 4 0.8 Clip supports, A, B-type 10 Paper washer 1 set 7, 8 mountimg 11 Nipple 2 6.2 Socket 754 mountimg 12 Back plate 60.0 Socket 754 mountimg Fitting to 13 Fitting 3 set 8 x 10mm, 8 x 11mm, 10 x 13mm tubes NOTE 1) The maximum weight for the cooler is specified as 450g/450g/300g for socket 478/754/462 respectively. Special care should be taken when moving a computer equipped with a cooler which exceeds the relevant weight limit. -
System Management BIOS (SMBIOS) Reference 6 Specification
1 2 Document Number: DSP0134 3 Date: 2011-01-26 4 Version: 2.7.1 5 System Management BIOS (SMBIOS) Reference 6 Specification 7 Document Type: Specification 8 Document Status: DMTF Standard 9 Document Language: en-US 10 System Management BIOS (SMBIOS) Reference Specification DSP0134 11 Copyright Notice 12 Copyright © 2000, 2002, 2004–2011 Distributed Management Task Force, Inc. (DMTF). All rights 13 reserved. 14 DMTF is a not-for-profit association of industry members dedicated to promoting enterprise and systems 15 management and interoperability. Members and non-members may reproduce DMTF specifications and 16 documents, provided that correct attribution is given. As DMTF specifications may be revised from time to 17 time, the particular version and release date should always be noted. 18 Implementation of certain elements of this standard or proposed standard may be subject to third party 19 patent rights, including provisional patent rights (herein "patent rights"). DMTF makes no representations 20 to users of the standard as to the existence of such rights, and is not responsible to recognize, disclose, 21 or identify any or all such third party patent right, owners or claimants, nor for any incomplete or 22 inaccurate identification or disclosure of such rights, owners or claimants. DMTF shall have no liability to 23 any party, in any manner or circumstance, under any legal theory whatsoever, for failure to recognize, 24 disclose, or identify any such third party patent rights, or for such party’s reliance on the standard or 25 incorporation -
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components the FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED in THIS CHAPTER
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components THE FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED IN THIS CHAPTER: Ûß1.2 Explain motherboard components, types and features Nß Form Factor Nß ATX / BTX, Nß micro ATX Nß NLX Nß I/O interfaces Material Nß Sound Nß Video Nß USB 1.1 and 2.0 Nß Serial Nß IEEE 1394 / FireWire Nß Parallel Nß NIC Nß Modem Nß PS/2 Nß Memory slots Nß RIMM Nß DIMM Nß SODIMM CopyrightedNß SIMM Nß Processor sockets Nß Bus architecture 86498book.indb 1 7/22/09 5:37:17 AM Nß Bus slots Nß PCI Nß AGP Nß PCIe Nß AMR Nß CNR Nß PCMCIA Chipsets Nß BIOS / CMOS / Firmware Nß POST Nß CMOS battery Nß Riser card / daughterboard Nß [Additional subobjectives covered in chapter 2] Ûß1.4 Explain the purpose and characteristics of CPUs and their features Nß Identify CPU types Nß AMD Nß Intel Nß Hyper threading Nß Multi core Nß Dual core Nß Triple core Nß Quad core Nß Onchip cache Nß L1 Nß L2 Nß Speed (real vs. actual) Nß 32 bit vs. 64 bit Ûß1.5 Explain cooling methods and devices Nß Heat sinks Nß CPU and case fans 86498book.indb 2 7/22/09 5:37:18 AM Nß Liquid cooling systems Nß Thermal compound Ûß1.6 Compare and contrast memory types, characteristics and their purpose Nß Types Nß DRAM Nß SRAM Nß SDRAM Nß DDR / DDR2 / DDR3 Nß RAMBUS Nß Parity vs. Non-parity Nß ECC vs. non-ECC Nß Single sided vs. double sided Nß Single channel vs. -
Discover, Develop, Deliver with the New Intel® Celeron® Processor
Product Brief The New Intel® Celeron® Processor THE NEW INTEL® CELERON® PROCESSOR DISCOVER DEVELOP DELIVER The new Intel® Celeron® processor built around Intel’s latest microarchitecture and manufactured on Intel’s state-of-the-art 14nm process technology delivers Intel level performance that lets you enjoy entertainment and get your work done. Get performance and value you can count on with an Intel Celeron processor. When paired with the latest Intel® H110 Chipset, Intel Celeron processor-based PCs are an ideal choice for editing photos one minute and watching movies the next, and going from spreadsheets to gaming in a flash. That’s serious processing. Only with Intel Inside®. Product Brief The New Intel® Pentium® MAKES VIDEO CREATION AND TECHNOLOGY The new 14nm Intel Celeron processor brings support for the latest CONVERSION technologies such as DDR4 RAM memory that enables PCs to have a high memory data transfer speed at a lower power as compared to FAST AND EASY DDR3. Intel HD graphics 510 delivers some great graphics with support up to 4K resolution and 3 independent displays. Intel Quick Sync Video technology delivers amazing hardware acceleration that makes video conversion and creation fast and easy. 2 INTEL ® CELERON® PROCESSOR FEATT URES A A GLANCE INTEL ® CELERON® G39XX FEATURES BENEFITS Socket LGA 1151 Dual-Core Runs two independent processor cores in Manufacturing 14nm Processing one physical package at the same frequency. Process Intel® Smart The shared cache is dynamically allocated Processor Base Up to 2.9 GHz Cache to each processor core, based on workload. Frequency on G39XX Efficient last-level cache data usage and instant communication between the core Intel® Smart Cache 2 MB L3 shared and memory.