DOCSLIB.ORG

Quad-Core Intel® Xeon® Processor 5400 Series

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Quad-Core Intel® Xeon® Processor 5400 Series Quad-Core Intel® Xeon® Processor 5400 Series Datasheet April 2008 Reference Number: 318589-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Quad-Core Intel® Xeon® Processor 5400 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. 64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium, Intel Xeon, Enhanced Intel SpeedStep Technology, Intel 64 Technology, Intel Virtualization Technology, Intel Thermal Monitor and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2007-2008, Intel Corporation. 2 Quad-Core Intel® Xeon® Processor 5400 Series Datasheet Contents 1Introduction..............................................................................................................9 1.1 Terminology ..................................................................................................... 10 1.2 State of Data .................................................................................................... 13 1.3 References ....................................................................................................... 13 2 Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications................ 15 2.1 Front Side Bus and GTLREF ................................................................................ 15 2.2 Power and Ground Lands.................................................................................... 16 2.3 Decoupling Guidelines........................................................................................ 16 2.3.1 VCC Decoupling...................................................................................... 16 2.3.2 VTT Decoupling ...................................................................................... 16 2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 16 2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 17 2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]).................................. 17 2.4.2 PLL Power Supply................................................................................... 18 2.5 Voltage Identification (VID) ................................................................................ 19 2.6 Reserved, Unused, and Test Signals..................................................................... 21 2.7 Front Side Bus Signal Groups.............................................................................. 22 2.8 CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 24 2.9 Test Access Port (TAP) Connection....................................................................... 24 2.10 Platform Environmental Control Interface (PECI) DC Specifications........................... 24 2.10.1 DC Characteristics .................................................................................. 24 2.10.2 Input Device Hysteresis .......................................................................... 25 2.11 Mixing Processors.............................................................................................. 26 2.12 Absolute Maximum and Minimum Ratings ............................................................. 26 2.13 Processor DC Specifications ................................................................................ 27 2.13.1 Flexible Motherboard Guidelines (FMB) ...................................................... 27 2.13.2 VCC Overshoot Specification .................................................................... 37 2.13.3 Die Voltage Validation............................................................................. 38 2.14 AGTL+ FSB Specifications................................................................................... 38 3 Mechanical Specifications ........................................................................................ 43 3.1 Package Mechanical Drawings ............................................................................. 43 3.2 Processor Component Keepout Zones................................................................... 47 3.3 Package Loading Specifications ........................................................................... 47 3.4 Package Handling Guidelines............................................................................... 48 3.5 Package Insertion Specifications.......................................................................... 48 3.6 Processor Mass Specifications ............................................................................. 48 3.7 Processor Materials............................................................................................ 48 3.8 Processor Markings............................................................................................ 48 3.9 Processor Land Coordinates ................................................................................ 49 4Land Listing............................................................................................................. 51 4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments ........................... 51 4.1.1 Land Listing by Land Name...................................................................... 51 4.1.2 Land Listing by Land Number................................................................... 61 5 Signal Definitions .................................................................................................... 71 5.1 Signal Definitions .............................................................................................. 71 6 Thermal Specifications ............................................................................................ 83 6.1 Package Thermal Specifications........................................................................... 83 6.1.1 Thermal Specifications ............................................................................ 83 6.1.2 Thermal Metrology ................................................................................. 93 6.2 Processor Thermal Features................................................................................ 94 Quad-Core Intel® Xeon® Processor 5400 Series Datasheet 3 6.2.1 Intel® Thermal Monitor Features...............................................................94 6.2.2 On-Demand Mode...................................................................................96 6.2.3 PROCHOT# Signal ..................................................................................96 6.2.4 FORCEPR# Signal ...................................................................................97 6.2.5 THERMTRIP# Signal ................................................................................97 6.3 Platform Environment Control Interface (PECI) ......................................................97 6.3.1 Introduction...........................................................................................97 6.3.2 PECI Specifications .................................................................................99 7Features................................................................................................................ 101 7.1 Power-On Configuration Options ........................................................................ 101 7.2 Clock Control and Low Power States................................................................... 101 7.2.1 Normal State ....................................................................................... 102 7.2.2 HALT or Extended HALT State................................................................. 102 7.2.3 Stop-Grant State .................................................................................. 104 7.2.4
Load more

Recommended publications
  • Intel Lga 775 Ga
    INDEX Heat Sink For: UNIVERSAL LGA 2011 LGA 1156/1155 LGA 1366/1155 LGA 775 Cooljag LGA 771 Cooljag is a renowned manufacturer of cooling devices specialized in the “skiving” technology. Since establishment in the year 2001, Cooljag has ventured and advanced in the field of skiving and has became a leader in mastering this technology. P-M However, Cooljag is not self-contented for its achievements in the technology alone, and has evolved to become a thermal total solution provider. Being customer oriented and focused on thermal solutions, Cooljag targets specific thermal problems of our PGA989/BGA989 customers and finds the best overall solution for heat transfer, airflow, noise and cost, with all kinds of technologies. From our very own skiving technology to extrusion and even stacked fins with heat Pipes, we can find and customize the best solution suited Socket 754/939/940/ to our customers needs. 1207eATX/C32 Company Profile • 1986 Company founded • 1995 Development of own brand-Jagwire 1207(long size) • 1996 Received ISO 9002 certificate 5th National award for small to medium enterprises AMD G34/AM2/AM3 • 1997 Honored with Excellence award • 1998 Honored with Rising Star award Retails • 2001 development of the other own brand-Cooljag(as thermal total solution provider) Received ISO 9001 certificate • 2002 Monthly capacity of heatsink : 1,000,000pcs Acessory • 2006 All products are RoHS compliant • 2007 Received TS16949 certificate • 2008 Received OASAS-18001 & ISO-14001 certificate • 2009 TPM activties Water Cooling • 2010 Received ISO13485 certificate Heatsink Cooljag in Skiving Cooljag has advanced in the skiving technology as not only we have achieved the thinnest of fins and thinnest of pitches, but also achieved in the highest of fin heights, widest of fin width, and the largest effective single block heat sink in the world.
    [Show full text]
  • Multiprocessing Contents
    Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References .............................................
    [Show full text]
  • Replace Nine Older Servers with One Dell Emc Poweredge Vrtx
    COMPARING PERFORMANCE AND COST: DELL EMC POWEREDGE VRTX WITH ONE DELL EMC POWEREDGE M830 SERVER VS. A LEGACY SOLUTION Businesses using multiple outdated server0 sSERVER for email, database, NODES and fileVS. and A LEGACY SOLUTION print workloads stand to benefit greatly by consolidating these workloads onto a single new server and running them in virtual machines. In tests in the Principled Technologies datacenter, the Dell EMC PowerEdge VRTX with a Dell EMC PowerEdge M830 blade server, powered by the Intel Xeon processor E5-4650 v3, was able to simultaneously run email, database, and simulated file and print workloads in a VMware® vSphere® virtual environment. The VRTX performed the work of nine older servers—four database servers, four file and print servers, and one Exchange server. It achieved similar or even better performance while requiring less space and power than a legacy disparate hardware solution,1 which translates to a lower five-year TCO. Combining servers, networking, and shared storage into an all-in-one solution, the PowerEdge VRTX can deliver big performance and savings. 1 In June 2013, Principled Technologies conducted testing comparing the performance of (1) the Dell PowerEdge VRTX with a Dell PowerEdge M620 server and (2) a legacy hardware solution. The results for the legacy solution that we cite in this report are from that earlier study. For more details, see the report for that study, available at www.principledtechnologies.com/Dell/VRTX_performance_TCO_0713.pdf. JULY 2015 (Revised January 2017) A PRINCIPLED
    [Show full text]
  • HP Xw6600 Workstation Overview
    QuickSpecs HP xw6600 Workstation Overview HP recommends Windows Vista® Business 1. Monitor (sold separately) 8. 2 PCI, 2 PCI Express x8 mechanical/x4 electrical 2. Mouse (USB or PS/2) 9. 2 PCI Express x16 Gen2 Graphics Bus 3. Standard Keyboard (USB or PS/2) 10. 5 USB 2.0 (rear), 1 USB 2.0 (internal), 1 standard serial port 4. Front IO: 2 USB 2.0, IEEE-1394 (optional), headphone out (only available via internal header with optional module), 2 and microphone in PS/2, 1 RJ-45, audio line in, audio line out, and microphone in. 5. 3.5" external bay for optional floppy drive 6. 2 external 5.25" bays 11. Dual-Core or Quad-Core Intel® Xeon® Processors 7. 2 internal 3.5" bays (convertible to 3 internal 2.5" bays) 12. 650 watt 80 PLUS high efficiency power supply Form Factor Minitower Compatible Operating Genuine Windows Vista® Business 64-bit* Systems Genuine Windows Vista® Business 32-bit* Genuine Windows Vista® 64-bit downgrade to Genuine Microsoft® Windows® XP Professional 64-bit** Genuine Windows Vista® 32-bit downgrade to Genuine Microsoft® Windows® XP Professional 32-bit** Red Hat Enterprise Linux® WS 5 64-bit HP Linux Installer Kit for Linux (includes drivers for both 32-bit & 64-bit OS versions of Red Hat Enterprise Linux WS4 and WS5 see: http://www.hp.com/workstations/software/linux) For detailed OS/hardware support information for Linux, see: http://www.hp.com/support/linux_hardware_matrix * Certain Windows Vista product features require advanced or additional hardware. See http://www.microsoft.com/windowsvista/getready/hardwarereqs.mspx and http://www.microsoft.com/windowsvista/getready/capable.mspx for details.
    [Show full text]
  • Evolution of the Pentium
    Chapter 7B – The Evolution of the Intel Pentium This chapter attempts to trace the evolution of the modern Intel Pentium from the earliest CPU chip, the Intel 4004. The real evolution begins with the Intel 8080, which is an 8–bit design having features that permeate the entire line. Our discussion focuses on three organizations. IA–16 The 16–bit architecture found in the Intel 8086 and Intel 80286. IA–32 The 32–bit architecture found in the Intel 80386, Intel 80486, and most variants of the Pentium design. IA–64 The 64–bit architecture found in some high–end later model Pentiums. The IA–32 has evolved from an early 4–bit design (the Intel 4004) that was first announced in November 1971. At that time, memory came in chips no larger than 64 kilobits (8 KB) and cost about $1,600 per megabyte. Before moving on with the timeline, it is worth recalling the early history of Intel. Here, we quote extensively from Tanenbaum [R002]. “In 1968, Robert Noyce, inventor of the silicon integrated circuit, Gordon Moore, of Moore’s law fame, and Arthur Rock, a San Francisco venture capitalist, formed the Intel Corporation to make memory chips. In the first year of operation, Intel sold only $3,000 worth of chips, but business has picked up since then.” “In September 1969, a Japanese company, Busicom, approached Intel with a request for it to manufacture twelve custom chips for a proposed electronic calculator. The Intel engineer assigned to this project, Ted Hoff, looked at the plan and realized that he could put a 4–bit general–purpose CPU on a single chip that would do the same thing and be simpler and cheaper as well.
    [Show full text]
  • Dual-Core Intel® Xeon® Processor 5100 Series
    Product Brief Dual-Core Intel® Xeon® Processor 5100 Series Dual-Core Intel® Xeon® Processor 5100 Series Driving Energy-efficient Performance in New Dual-Processor Platforms Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing. The 64-bit Dual-Core Intel® Xeon® processor 51001 series enables next-generation platforms that can drive energy-efficient infrastructures to optimize data center density, reduce total cost of ownership (TCO), and improve business continuity, redefining what DP servers and workstations should deliver to help businesses be more efficient, dependable, and agile. The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel® 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and over 3 times the performance/watt of previous- generation single-core Intel® Xeon® processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2 times the performance and over 2 times the performance/watt of previous-generation dual-core Intel Xeon processors.2 Confidently deliver more services with hardware-assisted virtualization and enhanced reliability in a 64-bit, dual-core platform The Dual-Core Intel Xeon processor 5100 Intel® Core™ microarchitecture series matched with Intel advanced server delivers industry-leading performance and helps build energy-efficient technologies help IT operations deliver more infrastructures with Dual-Core services in the same power envelope and work Intel® Xeon® Processor 5100 series more efficiently.
    [Show full text]
  • Quad-Core Intel® Xeon® Processor 5400 Series
    Quad-Core Intel® Xeon® Processor 5400 Series Datasheet August 2008 318589-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Quad-Core Intel® Xeon® Processor 5400 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. 64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information.
    [Show full text]
  • Building the Digital Infrastructure PEAK 8920VL2 User Manual
    Building the Digital Infrastructure PEAK 8920VL2 User Manual Version 1.01 Nov 29, 2006 Preface Packing Materials Checklist Copyright Notice Item Description Q’ty Copyright © 2006 NEXCOM All rights reserved. No part of this manual may be reproduced, trans- 1 PEAK8920VL2 BOARD SET 1 mitted, transcribed, stored in a retrieval system, or translated into any 2 CPU COOLER 2 language or computer language, in any form or by any means (elec- 3 PS/2 KB/Mouse Y CABLE 1 tronic, mechanical, photocopying, recording, or otherwise), without 4 CABLE SET (SIO+PIO P2.00)/(SIO P2.00)/IDE66 1 the express written permission of NEXCOM Information provided in this manual is intended to be accurate and reliable. However, the 5 QUICK REFERENCE GUIDE 1 original manufacturer assumes no responsibility for its use, nor for 6 CD DRIVER 1 any infringements upon the rights of third parties that may result from such use. Acknowledgements Intel and Pentium are trademarks of Intel Corporation. Microsoft Windows® is a registered trademark of Microsoft Corp. All other product names or trademarks are properties of their respec- tive owners. Copyright © 2006 NEXCOM International Co., LTD. All rights reserved PEAK 8920VL2 User Manual PEAK 8920VL2 User Manual Declaration of Conformity Installation Suggestions CE Ensure you have a stable, clean working environment. Dust and dirt This product has passed the CE test for environmental specifications can get into components and cause a malfunction. Use containers to when shielded cables are used for external wiring. We recommend keep small components separated. the use of shielded cables. Please contact your local supplier for Adequate lighting and proper tools can prevent you from acciden- ordering information.
    [Show full text]
  • Typy Gniazd I Procesorów
    TYPY GNIAZD I PROCESORÓW AMD Socket • Socket 5 - AMD K5. • Socket 7 - AMD K6. • Super Socket 7 - AMD K6-2, AMD K6-III. • Socket 462 (zwany tak Ŝe Socket A) - AMD Athlon, Duron, Athlon XP, Athlon XP-M, Athlon MP, i Sempron. • Socket 463 (zwany tak Ŝe Socket NexGen) - NexGen Nx586. • Socket 563 - AMD Athlon XP-M (µ-PGA Socket). • Socket 754 - AMD Athlon 64, Sempron, Turion 64. Obsługa pojedynczego kanału pami ęci DDR-SDRAM, tzw. single-channel. • Socket 939 - AMD Athlon 64, Athlon 64 FX, Athlon 64 X2, Sempron, Turion 64, Opteron (seria 100). Obsługa podwójnego kanału pami ęci DDR-SDRAM, tzw. dual-channel. • Socket 940 - AMD Opteron (seria 100, 200, 800), Athlon 64 FX. Obsługa podwójnego kanału pami ęci DDR-SDRAM, tzw. dual- channel. • Socket 1207 (zwane tak Ŝe Socket F) - Supports AMD Opteron (seria 200, 800). Zast ąpił Socket 940. Obsługa dual-channel DDR2- SDRAM. • Socket AM2 - AMD Athlon 64 FX, Athlon 64 X2, Sempron, Turion 64, Opteron (seria 100). Obsługa dual-channel DDR2-SDRAM. Posiada 940 pinów. • Socket AM2+ - AMD Athlon X2, Athlon X3, Athlon X4, Phenom X2, Phenom X3, Phenom X4, Sempron, Phenom II. Obsługa dual- channel DDR2-SDRAM, oraz Obsługa dual-channel DDR3-SDRAM i HyperTransport 3 z mniejszym zapotrzebowaniem na energi ę. Posiada 940 pinów. • Socket AM3 - gniazdo pod procesor AMD, charakteryzuj ący si ę obsług ą dual-channel DDR3-SDRAM, oraz HyperTransport 3. Phenom II X2, Phenom X3, Phenom X4, Phenom X6, Athlon II X2, Athlon X3, Athlon X4, Sempron. • Socket FM1 - gniazdo pod procesor AMD Vision z nowej serii APU, wykonany w w 32 nanometrowym procesie produkcyjnym.
    [Show full text]
  • HP Xw6400 Workstation Overview
    QuickSpecs HP xw6400 Workstation Overview HP recommends Windows Vista® Business 1. Monitor (sold separately) 7. 2 PCI, 1 PCI Express x16 mechanical/x4 electrical, 2 PCI Express x8 mechanical/x4 electrical 2. Standard Keyboard (USB or PS/2) 8. 1 PCI Express x16 Graphics Bus 3. Mouse (USB or PS/2) 9. 5 USB 2.0 (rear), 1 USB 2.0 (internal), 1 standard serial port, 1 parallel port, 2 PS/2, 1 RJ-45, audio in/out 4. Front IO: 2 USB 2.0, IEEE-1394 (optional), headphone and 10. Dual-Core or Quad-Core Intel® Xeon® Processors microphone 5. 3.5" external bay for optional diskette drive or other 11. 575 watt power supply 3.5" device Optional 575W 80 PLUS power supply also available. 6. 2 internal 3.5" bays, 2 external 5.25" bays DA - 12505 North America — Version 26 — January 7, 2008 Page 1 QuickSpecs HP xw6400 Workstation Overview At A Glance Choice of Operating Systems: Genuine Windows Vista Business 32 or 64 Genuine Microsoft Windows Vista™ Business 32-bit downgrade to Microsoft Windows XP Professional Genuine Microsoft Windows Vista™ Business 64-bit downgrade to Microsoft Windows XP Professional x64 Genuine Windows® XP Professional Genuine Windows XP Professional x64 Edition (see http://www.hp.com/workstations/pws/windowsxp64/ for details) Red Hat Enterprise Linux WS 3 (32- or 64-Bit version as an after market option) Red Hat Enterprise Linux WS 4 (32- or 64-Bit version) HP Linux Installer Kit (see http://www.hp.com/workstations/software/linux/ for details) 64-Bit Quad-Core Intel® Xeon® Processor 5300 Sequence (8 MB L2 cache) or Dual-Core Intel®
    [Show full text]
  • Level 2 CPU & Memory Connectors Product Offering Prepared By
    Memory and CPU Sockets © 2009 Tyco Electronics Corporation. All Rights Reserved. TE logo and Tyco Electronics are trademarks. Other products, logos, and company names herein may be trademarks of their respective owners. Market Environment CPU/Logic Sockets • Standards driven by Intel and AMD • Markets include server, desktop and notebook • Primarily designed in the US • Consumed in Asia/Pacific • Multiple competitors and commodity pricing • Custom ASICs drive lower volume and higher mix AMD is a trademark of Advanced Micro Devices, Inc. Intel is a trademark of Intel Corporation. TE Products for Intel Socket B – LGA 1366 • Server socket (replaces Socket J – LGA 771) • Tyco Electronics’ provides three components for LGA1366 socket system – Socket: 1981837-1(15au), 1981837-2(30au) – ILM: 1939738-1(U Lever), 1-1939738-2 (Straight Lever) – Stiffener plate: 1939739-1(DT); 1981467-1(SVR) System of LGA1366 socket Intel is a trademark of Intel Corporation. CPU Socket Roadmap for (Intel & AMD) 2008 2009 2010 2011 2012 2013 Socket TW (1248) Micro Contact Socket 700 Socket Socket 604 Socket LS (1567) Server Socket R (2011) Socket B1/B2 (1356) Socket J (771) Socket B (1366) Socket G34 Socket 1207 Desktop Socket 775 Socket H1 (1156) Socket H2 (1155) New AMD FM1 934 AM2 940 AM3 941 rPGA988B rPGA II μPGA 479 rPGA989, rPGA988A rPGA988C Notebook μPGA 638 Socket FS1 (722) AMD is a trademark of Advanced Micro Devices, Inc. Intel is a trademark of Intel Corporation. TE Products for Intel Socket H – LGA 1160 • Next generation Intel desktop CPU • Replaces Socket T LGA 775 • Tyco Electronics’ provides three components for LGA1366 socket system – Socket: 2040540-1 – ILM: 2013882-1 – Stiffener Plate: 2013883-1 Intel is a trademark of Intel Corporation.
    [Show full text]
  • Dual-Core Intel® Xeon® Processor 5000 Series
    Product Brief Dual-Core Intel® Xeon® Processor 5000 Series Dual-Core Intel® Xeon® Processor 5000 Series Enabling New Levels of Performance, Efficiency, and Reliability for Dual Processor Platforms Intel’s advanced dual-core processor for dual processor (DP) servers and workstations enhances virtual environments, builds in greater capabilities for security and availability, and incorporates new tools for efficient manageability. The Dual-Core Intel® Xeon® processor 50001 series enables next-generation platforms with the capabilities to get more done on fewer systems, optimize data center density, and improve business continuity, redefining what DP servers and workstations should deliver to help businesses be more efficient, dependable, and agile. The Dual-Core Intel Xeon processor 5000 series, with 64-bit, dual-core computing and greater power efficiency, is ideal for intense computing environments, business-critical applications, and high-end workstations. Powered by the Intel® 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, new Intel Xeon processor 5000 series-based platforms are expected to deliver up to 2 times the performance and up to 70% the performance/watt of previous single-core Intel® Xeon® processors. 2 With the Dual-Core Intel Xeon processor 5000 series, you know you’re getting the most advanced processor for your platforms. One that can help transform your operations and take you into the future. The Dual-Core Intel Xeon processor 5000 series helps IT and business operations Beyond balanced platforms: deliver more services and work more efficiently New technologies to help balance computing resources with a faster system bus, greater power and operating costs efficiency, and new capabilities that enhance virtual environments.
    [Show full text]