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Introduction to the Poulson (Intel 9500 Series) Processor Openvms Advanced Technical Boot Camp 2015 Keith Parris / September 29, 2015
Introduction to the Poulson (Intel 9500 Series) Processor OpenVMS Advanced Technical Boot Camp 2015 Keith Parris / September 29, 2015 © Copyright 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Information on Poulson from Intel’s ISSCC Paper © Copyright 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Poulson information from Intel’s ISSCC Paper http://www.intel.com/content/dam/www/public/us/en/documents/white-papers/itanium-poulson-isscc-paper.pdf 3 © Copyright 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Poulson information from Intel’s ISSCC Paper http://www.intel.com/content/dam/www/public/us/en/documents/white-papers/itanium-poulson-isscc-paper.pdf 4 © Copyright 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Poulson information from Intel’s ISSCC Paper http://www.intel.com/content/dam/www/public/us/en/documents/white-papers/itanium-poulson-isscc-paper.pdf 5 © Copyright 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. Poulson information from Intel’s ISSCC Paper • Intel presented a paper on Poulson at the International Solid-State Chips Conference (ISSCC) in July 2011. From this, we learned: • Poulson would be in a 32 nm process (2 process generations ahead from Tukwila, which was at 65 nm, skipping the 45 nm process) • The socket would be compatible with Tukwila • Poulson would have 8 cores, of a brand new core design • The front end (instruction fetch) would be decoupled from the back end (instruction execution) • Poulson could execute and retire as many as 12 instructions per cycle, double Tukwila’s 6 instructions http://www.intel.com/content/dam/www/public/us/en/documents/white-papers/itanium-poulson-isscc-paper.pdf 6 © Copyright 2015 Hewlett-Packard Development Company, L.P. -
Intel Lga 775 Ga
INDEX Heat Sink For: UNIVERSAL LGA 2011 LGA 1156/1155 LGA 1366/1155 LGA 775 Cooljag LGA 771 Cooljag is a renowned manufacturer of cooling devices specialized in the “skiving” technology. Since establishment in the year 2001, Cooljag has ventured and advanced in the field of skiving and has became a leader in mastering this technology. P-M However, Cooljag is not self-contented for its achievements in the technology alone, and has evolved to become a thermal total solution provider. Being customer oriented and focused on thermal solutions, Cooljag targets specific thermal problems of our PGA989/BGA989 customers and finds the best overall solution for heat transfer, airflow, noise and cost, with all kinds of technologies. From our very own skiving technology to extrusion and even stacked fins with heat Pipes, we can find and customize the best solution suited Socket 754/939/940/ to our customers needs. 1207eATX/C32 Company Profile • 1986 Company founded • 1995 Development of own brand-Jagwire 1207(long size) • 1996 Received ISO 9002 certificate 5th National award for small to medium enterprises AMD G34/AM2/AM3 • 1997 Honored with Excellence award • 1998 Honored with Rising Star award Retails • 2001 development of the other own brand-Cooljag(as thermal total solution provider) Received ISO 9001 certificate • 2002 Monthly capacity of heatsink : 1,000,000pcs Acessory • 2006 All products are RoHS compliant • 2007 Received TS16949 certificate • 2008 Received OASAS-18001 & ISO-14001 certificate • 2009 TPM activties Water Cooling • 2010 Received ISO13485 certificate Heatsink Cooljag in Skiving Cooljag has advanced in the skiving technology as not only we have achieved the thinnest of fins and thinnest of pitches, but also achieved in the highest of fin heights, widest of fin width, and the largest effective single block heat sink in the world. -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References ............................................. -
Extended Lifecycle Series
MAINBOARD D2778-D Issue April 2010 ATX Extended Lifecycle Series Pages 2 ® Intel X58 Express Chipset for DDR3 - 1333 SDRAM Memory (ECC Support) ® TM and Intel Xeon® (“Nehalem” and “Westmere”) and Core i7 Processors Chipset: Memory: Intel® X58 Express Chipset DDR3 800 SDRAM (Tylersburg-36S / ICH10-R) DDR3 1066 SDRAM DDR3 1333 SDRAM Processors: with ECC Support (depends on processor) ® ® Intel Xeon Processor 5500 / 5600 series ® ® Product Features: Intel Xeon Processor 3500 / 3600 series Intel® CoreTM i7 Processor series Dual PCIe x16 (Gen2) onboard 5.1 multichannel audio onboard Compatible with Intel® processors LGA1366 (up to ® LSI FW322 FireWire™ onboard 130W TDP) supporting Intel QuickPath USB 2.0 onboard Interconnect GbE LAN onboard supporting ASF 2.0 Serial ATA II RAID onboard Trusted Platform Modul V1.2 onboard Intel® QuickPath technology Data Sheet Issue: April 2010 Datasheet D2778-D Page 2 / 2 Audio Realtek ALC663, 5.1 Multichannel, High Definition Audio Board Size ATX: 12“ x 9.6“ (304.8 x 243.8 mm) ® LAN Chipset Intel “Tylersburg” X58 Express Chipset / ICH10-R Realtek 8111DP Ethernet Controller with 10/100/1000 MBit/s, DASH 1.1, Memory Wake-on-LAN (WoL) by interesting Packets, Link Status Change and Magic 6 DIMM Sockets DDR3, max. 24GB, Single / Dual / Triple Channel Packet™, PXE Support, BIOS MAC Address Display 800/1066/1333MHz, single rank / dual rank unbuffered, ECC / no n-ECC Drives support (depends on processor) - 6 Serial ATA II 300 Interfaces (up to 3GBit/s, NCQ); RAID 0, 1, 10, 5 Processors Intel® Xeon® Processor 5500 / 5600 series (Nehalem-EP / Westmere) Features D2778-D Intel® Xeon® Processor 3500 /3600 series (Nehalem-WS / Westmere) Chipset Intel X58 / ICH10R Intel® Core™ i7 Processor series Board Size ATX Socket B (LGA1366), max. -
Replace Nine Older Servers with One Dell Emc Poweredge Vrtx
COMPARING PERFORMANCE AND COST: DELL EMC POWEREDGE VRTX WITH ONE DELL EMC POWEREDGE M830 SERVER VS. A LEGACY SOLUTION Businesses using multiple outdated server0 sSERVER for email, database, NODES and fileVS. and A LEGACY SOLUTION print workloads stand to benefit greatly by consolidating these workloads onto a single new server and running them in virtual machines. In tests in the Principled Technologies datacenter, the Dell EMC PowerEdge VRTX with a Dell EMC PowerEdge M830 blade server, powered by the Intel Xeon processor E5-4650 v3, was able to simultaneously run email, database, and simulated file and print workloads in a VMware® vSphere® virtual environment. The VRTX performed the work of nine older servers—four database servers, four file and print servers, and one Exchange server. It achieved similar or even better performance while requiring less space and power than a legacy disparate hardware solution,1 which translates to a lower five-year TCO. Combining servers, networking, and shared storage into an all-in-one solution, the PowerEdge VRTX can deliver big performance and savings. 1 In June 2013, Principled Technologies conducted testing comparing the performance of (1) the Dell PowerEdge VRTX with a Dell PowerEdge M620 server and (2) a legacy hardware solution. The results for the legacy solution that we cite in this report are from that earlier study. For more details, see the report for that study, available at www.principledtechnologies.com/Dell/VRTX_performance_TCO_0713.pdf. JULY 2015 (Revised January 2017) A PRINCIPLED -
User Guide XFX X58i Motherboard
User Guide XFX X58i Motherboard Table of Contents Chapter 1 Introduction .............................................................................................3 1.1 Package Checklist .................................................................................................3 1.2 Specifi cations .......................................................................................................4 1.3 Mainboard Layout .................................................................................................5 1.4 Connecting Rear Panel I/O Devices ........................................................................6 Chapter 2 Hardware Setup .......................................................................................7 2.1 Choosing a Computer Chassis ................................................................................7 2.2 Installing the Mainboard .......................................................................................7 2.3 Installation of the CPU and CPU Cooler ..................................................................8 2.3.1 Installation of the CPU ....................................................................................8 2.3.2 Installation of the CPU Cooler .........................................................................9 2.4 Installation of Memory Modules .............................................................................9 2.5 Connecting Peripheral Devices .............................................................................10 2.5.1 -
HP Xw6600 Workstation Overview
QuickSpecs HP xw6600 Workstation Overview HP recommends Windows Vista® Business 1. Monitor (sold separately) 8. 2 PCI, 2 PCI Express x8 mechanical/x4 electrical 2. Mouse (USB or PS/2) 9. 2 PCI Express x16 Gen2 Graphics Bus 3. Standard Keyboard (USB or PS/2) 10. 5 USB 2.0 (rear), 1 USB 2.0 (internal), 1 standard serial port 4. Front IO: 2 USB 2.0, IEEE-1394 (optional), headphone out (only available via internal header with optional module), 2 and microphone in PS/2, 1 RJ-45, audio line in, audio line out, and microphone in. 5. 3.5" external bay for optional floppy drive 6. 2 external 5.25" bays 11. Dual-Core or Quad-Core Intel® Xeon® Processors 7. 2 internal 3.5" bays (convertible to 3 internal 2.5" bays) 12. 650 watt 80 PLUS high efficiency power supply Form Factor Minitower Compatible Operating Genuine Windows Vista® Business 64-bit* Systems Genuine Windows Vista® Business 32-bit* Genuine Windows Vista® 64-bit downgrade to Genuine Microsoft® Windows® XP Professional 64-bit** Genuine Windows Vista® 32-bit downgrade to Genuine Microsoft® Windows® XP Professional 32-bit** Red Hat Enterprise Linux® WS 5 64-bit HP Linux Installer Kit for Linux (includes drivers for both 32-bit & 64-bit OS versions of Red Hat Enterprise Linux WS4 and WS5 see: http://www.hp.com/workstations/software/linux) For detailed OS/hardware support information for Linux, see: http://www.hp.com/support/linux_hardware_matrix * Certain Windows Vista product features require advanced or additional hardware. See http://www.microsoft.com/windowsvista/getready/hardwarereqs.mspx and http://www.microsoft.com/windowsvista/getready/capable.mspx for details. -
A 65 Nm 2-Billion Transistor Quad-Core Itanium Processor
18 IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 44, NO. 1, JANUARY 2009 A 65 nm 2-Billion Transistor Quad-Core Itanium Processor Blaine Stackhouse, Sal Bhimji, Chris Bostak, Dave Bradley, Brian Cherkauer, Jayen Desai, Erin Francom, Mike Gowan, Paul Gronowski, Dan Krueger, Charles Morganti, and Steve Troyer Abstract—This paper describes an Itanium processor imple- mented in 65 nm process with 8 layers of Cu interconnect. The 21.5 mm by 32.5 mm die has 2.05B transistors. The processor has four dual-threaded cores, 30 MB of cache, and a system interface that operates at 2.4 GHz at 105 C. High speed serial interconnects allow for peak processor-to-processor bandwidth of 96 GB/s and peak memory bandwidth of 34 GB/s. Index Terms—65-nm process technology, circuit design, clock distribution, computer architecture, microprocessor, on-die cache, voltage domains. I. OVERVIEW Fig. 1. Die photo. HE next generation in the Intel Itanium processor family T code named Tukwila is described. The 21.5 mm by 32.5 mm die contains 2.05 billion transistors, making it the first two billion transistor microprocessor ever reported. Tukwila combines four ported Itanium cores with a new system interface and high speed serial interconnects to deliver greater than 2X performance relative to the Montecito and Montvale family of processors [1], [2]. Tukwila is manufactured in a 65 nm process with 8 layers of copper interconnect as shown in the die photo in Fig. 1. The Tukwila die is enclosed in a 66 mm 66 mm FR4 laminate package with 1248 total landed pins as shown in Fig. -
Fuzhouxiang Import/Export (Shunxiang) Co., Ltd
Fuzhouxiang Import/Export (Shunxiang) Co., Ltd. We always insist on the principle “Quality of product & benefit for customer at first forever”, assure that all products which we supply are quality goods absolutely. We have built good relationships with our customers with 100% quality guarantee, most competitive price, prompt delivery & best service for the past several years. Please join us, you will feel our sincerity, fairy & conscience. Apple'Mac-Book Pro MGXA2LL/A 15-Inch Laptop Notebook Computer with Retina Display (2.2 GHz Intel Core i7 Processor, 16 GB RAM, 256 GB HDD) Mac-Book Pro MGXA2LL/A 15- Inch Laptop with Retina Display (2.2 GHz Intel Core i7 Processor, 16 GB RAM, 256 GB HDD) 2.2 GHz Quad-Core Intel Core i7 Processor (Turbo Boost up to 3.4 GHz, 6 MB shared L3 cache) 16 GB 1600 MHz DDR3L RAM; 256 GB PCIe-based Flash Storage 15.4- inch IPS Retina Display, 2880-by-1800 resolution Intel Iris Pro Graphics OS X Mavericks, Up to 8 Hours of Battery Life Apple'Mac-Book Pro 15" with Apple'Care+ Z0SH0000N CTO with Touch Bar: 2.9GHz quad-core Intel Core i7, 2TB - Space Gray Mac-Book Pro with Touch Bar 2.9GHz quad-core Intel Core i7, Turbo Boost up to 3.8GHz, with 6MB shared L3 cache (Configurable to 2.9GHz quad-core Intel Core i7, Turbo Boost up to 3.8GHz, with 8MB shared L3 cache) 2TB PCIe-based onboard SSD 16GB of 2133MHz LPDDR3 onboard memory 15.4-inch (diagonal) LED-backlit display with IPS technology; 2880-by- 1800 native resolution at 220 pixels per inch with support for millions of colors 500 nits brightness Radeon Pro 460 with -
Poulson: an 8 Core 32 Nm Next Generation Intel* Itanium* Processor
Poulson: An 8 Core 32 nm Next Generation Intel® Itanium® Processor Steve Undy Intel® 1 I NTEL CONFIDENTIAL This slide MUST be used with any slides removed from this presentation Legal Disclaimer • INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLI ED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR I MPLI ED WARRANTY, RELATING TO SALE AND/ OR USE OF INTEL® PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTI CULAR PURPOSE, MERCHANTABI LI TY, OR I NFRI NGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RI GHT. I NTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. • Intel may make changes to specifications and product descriptions at any time, without notice. • Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. • Configurations: [describe config + what test used + who did testing]. For more information go to http://www.intel.com/performance • Intel does not control or audit the design or implementation of third party benchmarks or Web sites referenced in this document. -
Intel® Desktop Board DX58SO Technical Product Specification
Взято с сайта www.wit.ru Intel® Desktop Board DX58SO Technical Product Specification October 2008 Order Number: E51290-001US The Intel® Desktop Board DX58SO may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DX58SO Specification Update. Revision History Revision Revision History Date -001 First release of the Intel® Desktop Board DX58SO Technical Product October 2008 Specification This product specification applies to only the standard Intel® Desktop Board DX58SO with BIOS identifier SOX5810J.86A. Changes to this specification will be published in the Intel Desktop Board DX58SO Specification Update before being incorporated into a revision of this document. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. All Intel® desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. -
Evolution of the Pentium
Chapter 7B – The Evolution of the Intel Pentium This chapter attempts to trace the evolution of the modern Intel Pentium from the earliest CPU chip, the Intel 4004. The real evolution begins with the Intel 8080, which is an 8–bit design having features that permeate the entire line. Our discussion focuses on three organizations. IA–16 The 16–bit architecture found in the Intel 8086 and Intel 80286. IA–32 The 32–bit architecture found in the Intel 80386, Intel 80486, and most variants of the Pentium design. IA–64 The 64–bit architecture found in some high–end later model Pentiums. The IA–32 has evolved from an early 4–bit design (the Intel 4004) that was first announced in November 1971. At that time, memory came in chips no larger than 64 kilobits (8 KB) and cost about $1,600 per megabyte. Before moving on with the timeline, it is worth recalling the early history of Intel. Here, we quote extensively from Tanenbaum [R002]. “In 1968, Robert Noyce, inventor of the silicon integrated circuit, Gordon Moore, of Moore’s law fame, and Arthur Rock, a San Francisco venture capitalist, formed the Intel Corporation to make memory chips. In the first year of operation, Intel sold only $3,000 worth of chips, but business has picked up since then.” “In September 1969, a Japanese company, Busicom, approached Intel with a request for it to manufacture twelve custom chips for a proposed electronic calculator. The Intel engineer assigned to this project, Ted Hoff, looked at the plan and realized that he could put a 4–bit general–purpose CPU on a single chip that would do the same thing and be simpler and cheaper as well.