DOCSLIB.ORG

Computer Organization and Assembly Language CSC-210 Laboratory

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Computer Organization and Assembly Language CSC-210 Laboratory Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Computer Organization and Assembly Language CSC-210 Laboratory Manual 3rd Edition 2017/2018 Name: Number: ٍ :Section Department: 1 Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Table of Contents Lab (1): Computer Anatomy ....................................................................................................... 4 Objectives ............................................................................................................................... 4 What is a Computer? ............................................................................................................... 4 System ..................................................................................................................................... 4 1. Motherboard ............................................................................................................. 5 2. Central Processing Unit (CPU) ...................................................................................... 6 3. Memory .................................................................................................................... 6 4. Video Adapter ............................................................................................................ 7 5. Operating System ....................................................................................................... 8 6. Connectivity .............................................................................................................. 8 Chassis .................................................................................................................................... 9 1. Full Tower ................................................................................................................. 9 2. Mid Tower ................................................................................................................. 9 3. Mini Tower ................................................................................................................ 9 4. Slim Line Case ............................................................................................................ 9 5. Small Form Factor (SFF) Case ....................................................................................... 9 Cooling System ..................................................................................................................... 10 Power Supply Unit ................................................................................................................ 10 Peripherals............................................................................................................................. 11 1. Input Devices ............................................................................................................ 11 2. Output Devices ......................................................................................................... 12 3. Input & Output Devices .............................................................................................. 13 Review Questions ................................................................................................................. 14 Lab (2): PC I/O Ports ................................................................................................................ 16 Objectives ............................................................................................................................. 16 Mini-DIN .............................................................................................................................. 16 PS/2 ....................................................................................................................................... 16 Separate Video (S-Video) ..................................................................................................... 16 Universal Serial Bus (USB) .................................................................................................. 17 Firewire (IEEE 1394) ............................................................................................................ 18 DB (D-subminiature, D-shell) Connectors ........................................................................... 19 Registered Jack (RJ) ............................................................................................................. 19 Audio..................................................................................................................................... 20 1 Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 1. Analog ..................................................................................................................... 20 2. Digital ...................................................................................................................... 20 Digital Visual Interface (DVI) .............................................................................................. 20 HDMI (High-Definition Multimedia Interface) .................................................................... 21 DisplayPort ............................................................................................................................ 21 eSata ...................................................................................................................................... 22 Summary of Some Bus Speeds ............................................................................................. 22 Summary of External Connector .......................................................................................... 23 Review Questions ................................................................................................................. 24 Lab (3): Motherboard ................................................................................................................ 27 Objectives ............................................................................................................................. 27 Motherboard Form Factor ................................................................................................... 27 Processors Sockets .............................................................................................................. 28 Chipset .................................................................................................................................. 31 Figure 3-3. Intel Z97 Chipset Block diagram ...................................................................... 31 Buses and Expansion slots .................................................................................................... 31 On-Board Ports and Connectors ........................................................................................... 33 Review Questions ................................................................................................................. 35 Lab (4): Numbering systems ..................................................................................................... 37 Objectives ............................................................................................................................. 37 Review Questions ................................................................................................................. 37 Lab (5): Introduction to Assembly ............................................................................................ 39 Objectives ............................................................................................................................. 39 What is assembly language? ................................................................................................. 39 Inside the CPU ...................................................................................................................... 39 1. General purpose registers .......................................................................................... 39 2. Segment registers ..................................................................................................... 40 3. Special purpose registers ........................................................................................... 41 Variables ............................................................................................................................... 41 Arrays ............................................................................................................................. 41 Constants ............................................................................................................................... 42 Review Question: .................................................................................................................. 43 Lab (6): EMU8086 .................................................................................................................... 44 Objectives ............................................................................................................................. 44 Using the emulator ................................................................................................................ 45 2 Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory
Load more

Recommended publications
  • Intel Lga 775 Ga
    INDEX Heat Sink For: UNIVERSAL LGA 2011 LGA 1156/1155 LGA 1366/1155 LGA 775 Cooljag LGA 771 Cooljag is a renowned manufacturer of cooling devices specialized in the “skiving” technology. Since establishment in the year 2001, Cooljag has ventured and advanced in the field of skiving and has became a leader in mastering this technology. P-M However, Cooljag is not self-contented for its achievements in the technology alone, and has evolved to become a thermal total solution provider. Being customer oriented and focused on thermal solutions, Cooljag targets specific thermal problems of our PGA989/BGA989 customers and finds the best overall solution for heat transfer, airflow, noise and cost, with all kinds of technologies. From our very own skiving technology to extrusion and even stacked fins with heat Pipes, we can find and customize the best solution suited Socket 754/939/940/ to our customers needs. 1207eATX/C32 Company Profile • 1986 Company founded • 1995 Development of own brand-Jagwire 1207(long size) • 1996 Received ISO 9002 certificate 5th National award for small to medium enterprises AMD G34/AM2/AM3 • 1997 Honored with Excellence award • 1998 Honored with Rising Star award Retails • 2001 development of the other own brand-Cooljag(as thermal total solution provider) Received ISO 9001 certificate • 2002 Monthly capacity of heatsink : 1,000,000pcs Acessory • 2006 All products are RoHS compliant • 2007 Received TS16949 certificate • 2008 Received OASAS-18001 & ISO-14001 certificate • 2009 TPM activties Water Cooling • 2010 Received ISO13485 certificate Heatsink Cooljag in Skiving Cooljag has advanced in the skiving technology as not only we have achieved the thinnest of fins and thinnest of pitches, but also achieved in the highest of fin heights, widest of fin width, and the largest effective single block heat sink in the world.
    [Show full text]
  • System Builder's Guide for D-Series
    Matrox® Display Wall Mura™ IPX Series • D-Series™ System Builder’s Guide 20315-101-0110 2021.07.28 www.matrox.com/video Contents Product overview .....................................................................................................................................................4 Hardware summary – Mura IPX Series.....................................................................................................................................................................4 MURAIPXI-E4SF/MURAIPXI-E4SHF ...............................................................................................................................................4 MURAIPXI-E2MF/MURAIPXI-E2MHF ...........................................................................................................................................5 MURAIPXI-D2MF/MURAIPXI-D2MHF..................................................................................................................................................6 MURAIPXI-E4JF/MURAIPXI-E4JHF ................................................................................................................................................7 MURAIPXI-D4JF/MURAIPXI-D4JHF ..............................................................................................................................................8 Hardware summary – Matrox D-Series ....................................................................................................................................................................9
    [Show full text]
  • Lista Sockets.Xlsx
    Data de Processadores Socket Número de pinos lançamento compatíveis Socket 0 168 1989 486 DX 486 DX 486 DX2 Socket 1 169 ND 486 SX 486 SX2 486 DX 486 DX2 486 SX Socket 2 238 ND 486 SX2 Pentium Overdrive 486 DX 486 DX2 486 DX4 486 SX Socket 3 237 ND 486 SX2 Pentium Overdrive 5x86 Socket 4 273 março de 1993 Pentium-60 e Pentium-66 Pentium-75 até o Pentium- Socket 5 320 março de 1994 120 486 DX 486 DX2 486 DX4 Socket 6 235 nunca lançado 486 SX 486 SX2 Pentium Overdrive 5x86 Socket 463 463 1994 Nx586 Pentium-75 até o Pentium- 200 Pentium MMX K5 Socket 7 321 junho de 1995 K6 6x86 6x86MX MII Slot 1 Pentium II SC242 Pentium III (Cartucho) 242 maio de 1997 Celeron SEPP (Cartucho) K6-2 Socket Super 7 321 maio de 1998 K6-III Celeron (Socket 370) Pentium III FC-PGA Socket 370 370 agosto de 1998 Cyrix III C3 Slot A 242 junho de 1999 Athlon (Cartucho) Socket 462 Athlon (Socket 462) Socket A Athlon XP 453 junho de 2000 Athlon MP Duron Sempron (Socket 462) Socket 423 423 novembro de 2000 Pentium 4 (Socket 423) PGA423 Socket 478 Pentium 4 (Socket 478) mPGA478B Celeron (Socket 478) 478 agosto de 2001 Celeron D (Socket 478) Pentium 4 Extreme Edition (Socket 478) Athlon 64 (Socket 754) Socket 754 754 setembro de 2003 Sempron (Socket 754) Socket 940 940 setembro de 2003 Athlon 64 FX (Socket 940) Athlon 64 (Socket 939) Athlon 64 FX (Socket 939) Socket 939 939 junho de 2004 Athlon 64 X2 (Socket 939) Sempron (Socket 939) LGA775 Pentium 4 (LGA775) Pentium 4 Extreme Edition Socket T (LGA775) Pentium D Pentium Extreme Edition Celeron D (LGA 775) 775 agosto de
    [Show full text]
  • IMB-170-V Mini-ITX Motherboard Spotlight Features
    Industrial Motherboards IMB-170-V Mini-ITX Motherboard Spotlight Features ‧Socket G2 (rPGA988B) for Intel Core i7/i5/i3/Celeron (Ivy Bridge and Sandy Bridge) ‧Intel® QM77 Chipset ‧Integrated Intel® HD Graphics Built-in Visuals ‧Supports DDR3 1600MHz, 2 x SO-DIMM, up to 16GB system memory ‧2 x COM (RS-232/422/485), 4 x COM (RS-232) ‧D-Sub, 1 x HDMI, 1 x DisplayPort, 1 x Dual Channel 24-bit LVDS ‧4 x USB 3.0, 8 x USB 2.0, 2 x SATA3, 2 x SATA2 ‧1 x PCIe 2.0 x16, 1 x mini-PCIe ‧Gigabit LAN : 1 x Intel 82579LM, 1 x Intel 82583V Specifications Processor System Rear I/O Dimension Mini-ITX (6.7-in x 6.7-in) VGA 1 Socket G2 (rPGA988B) for Intel Core i7/i5/i3/Celeron CPU HDMI 1 (Sandy Bridge and Ivy Bridge) DVI-I/D 0 Core Number (By CPU, Max 4) Display Port 1 Max Speed (By CPU) Ethernet 2 L3 Cache (By CPU) USB 6 (4 x USB 2.0 compliant, 2 x USB 3.0 compliant) Chipset QM77 Audio 3 (Mic-in, Line-out, Line-in) BIOS UEFI Serial 2 (RS-232/422/485) Expansion Slot PS/2 1 (Combo) PCI 0 Internal Connector Mini-PCIe 1 (Full size) USB 6 (4 x USB 2.0 compliant, 2 x USB 3.0 compliant) mSATA 0 LVDS/Inverter 1/1 PCIe 1 (IVY Bridge: Gen3; Sandy Bridge: Gen2) VGA 0 CFast Card Socket 0 Serial 4 (RS-232) Memory SATA 2 x SATA2 (3.0Gb/s) + 2 x SATA3 (6.0Gb/s), Support Technology Dual Channel DDR3 1066/1333/1600 MHz SDRAM RAID 0/1/5/10 m-SATA Max.
    [Show full text]
  • Embedded Board Product Selection Guide
    Embedded Board Product Selection Guide ECX SBCs Pico-ITX SBCs Mini-ITX Motherboards ATX Motherboards COM Express Modules Qseven Modules Embedded Boards | Contents Table of Contents About Quanmax .............................................................. 02 Overview Product Overview (Embedded Boards) .......................... 04 Qseven™ Module Product Matrix .................................... 06 KEEX-200T .................................................................................. 07 COM Express® Mini Module Product Matrix .................... 08 Computer-on-Modules COMM-E380 Series ................................................................. 09 COM Express® Compact Module Product Matrix ............ 10 COMC-E380 Series .................................................................. 11 Pico-ITX SBC Product Matrix .................................... 12 PITX-MX60 Series ..................................................................... 13 ECX SBC Intel® CPU Support Matrix ............................... 14 ECX SBC Product Matrix .................................................. 16 KEEX-5100 Series ..................................................................... 18 KEEX-8100 Series ..................................................................... 19 Single Board Computers KEEX-7101 Series ..................................................................... 20 KEEX-6100 Series ..................................................................... 21 KEEX-6150 Series ....................................................................
    [Show full text]
  • NF9G-QM77 Intel Mobile Core I3/I5/I7 Mini-ITX Features2gigabit LAN / Daughter Board Gen2
    NF9G-QM77 Intel Mobile Core i3/i5/i7 Mini-ITX Features2Gigabit LAN / Daughter Board Gen2 1. Intel QM77 Express Chipset 2. Supports 3rd Generation Intel Core i3, i5, i7 Mobile Processors, Socket G2, Ivy Bridge and Sandy Bridge 3. Integrated Intel HD Graphics in CPU 4. Supports up to 3 independent Displays 5. DisplayPort, HDMI, VGA, 24bit LVDS Video Outputs 6. 2 * DDR3-1333 SO-DIMM up to 16GB 7. 2 * SATA3 6Gb/s, 4 * SATA2 3Gb/s RAID 0, 1, 5, 10 8. Dual Intel Gigabit LAN, iAMT 8.0, HD Audio, 4 * Serial Ports 9. PCI Express 3.0 x16, Watchdog Timer, GPIO, USB 3.0 10. 1 * PCI Express Mini Card Slot (mSATA/mini-PCIE selectable) 11. 1 * PCI Express Mini Card Slot (half-size) 12. Supports Jetway Daughter Boards Gen2 13. Mini-ITX Form Factor (170mm x 170mm) DAUGHTER BOARD JADE4RTLANGEN2G 4-port Realtek Gigabit LAN JADE4INLANG 4-port Intel Gigabit LAN JADE4COMCB 2 * Internal RS232 2 * external RS232/422/485 TPM 1.2 Header Sold Separately rd CPU Supports 3 -Generation Intel Core i3, i5, i7 Mobile Processors, Socket G2 (Ivy Bridge & Sandy Bridge) Chipset Intel QM77 Express Chipset Video Integrated Intel HD Graphics in CPU (See CPU specs for details) Memory 2 * 204-pin DDR3-1333 Dual Channel SO-DIMM up to 16GB rd Expansion Slots 1 * PCI Express 3.0 x16 Slot (requires 3 -Gen CPU to run at 3.0) 1 * PCI Express Mini Card Slot (mSATA/mini-PCIE function selectable) 1 * PCI Express Mini Card Slot (half-size) Storage 4 * SATA2 3Gb/s ports supporting RAID 0, 1, 5.
    [Show full text]
  • Introduction Aux Systèmes Informatiques Introduction Générale
    Introduction aux systèmes informatiques Introduction générale Michel Salomon IUT de Belfort-Montbéliard Département d’informatique Michel Salomon Intro. aux sys. info. 1 / 53 Objectifs et organisation Objectifs 1 Savoir utiliser un (des) système(s) informatique(s) ; 2 en appréhender le fonctionnement Organisation Module en deux parties 1 Système d’exploitation (7 sem. - M. Fouzi) 2 Fonctionnement interne d’un ordinateur (6 sem. - M. Salomon) Modalités de Contrôle des Connaissances Chaque partie comptera pour 50% de la note du module Au moins 2 contrôles dans cette partie Michel Salomon Intro. aux sys. info. 2 / 53 L’informatique : un domaine complexe en constante évolution Décrire ce qu’est un ordinateur n’est pas aisé Grande variété d’ordinateurs Netbook Tablette tactile etc. Super-ordinateur Rapidité des évolutions technologiques Illustration par la Loi de Moore (1975) Postulait initialement le doublement du nombre de transistors des microprocesseurs tous les 2 ans ; entre 1971 et 2001 doublement tous les 1,96 années ; “relativement” exacte jusqu’en 2012, depuis ralentissement (phénomène quantique : effet tunnel → limite de miniaturisation) ; version plus commune : doublement d’une grandeur (puissance, capacité, etc.) tous les 18 à 24 mois Michel Salomon Intro. aux sys. info. 3 / 53 L’informatique : un domaine complexe en constante évolution On approche des limites de la technologie actuelle des semi-conducteurs Michel Salomon Intro. aux sys. info. 4 / 53 L’informatique : un domaine complexe en constante évolution Pourquoi réduire la finesse de gravure ? Une gravure plus fine permet d’augmenter la densité des transistors Une même micro-architecture (même nombre de transistors) → implémentée par un “Die” (support physique) plus petit Une même taille de “Die” (plus de transistors disponibles) → implémenter une micro-architecture plus performante Michel Salomon Intro.
    [Show full text]
  • TUF X299 MARK 2 Specifications Summary
    TUF X299 MARK 2 Motherboard E12906 First Edition June 2017 Copyright© 2017 ASUSTeK COMPUTER INC. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). Product warranty or service will not be extended if: (1) the product is repaired, modified or altered, unless such repair, modification of alteration is authorized in writing by ASUS; or (2) the serial number of the product is defaced or missing. ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS, LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE), EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY DEFECT OR ERROR IN THIS MANUAL OR PRODUCT. SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR INFORMATIONAL USE ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE, AND SHOULD NOT BE CONSTRUED AS A COMMITMENT BY ASUS. ASUS ASSUMES NO RESPONSIBILITY OR LIABILITY FOR ANY ERRORS OR INACCURACIES THAT MAY APPEAR IN THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT.
    [Show full text]
  • Advantech SKY Series Industrial Server Solutions
    Regional Service & Customization Centers China Kunshan Taiwan Taipei Netherlands Eindhoven Poland Warsaw USA Milpitas, CA 86-512-5777-5666 886-2-2792-7818 31-40-267-7000 00800-2426-8080 1-408-519-3898 Worldwide Offices Asia Asia Europe Americas Advantech SKY Series Taiwan Japan Netherlands North America Toll Free 0800-777-111 Toll Free 0800-500-1055 Eindhoven 31-40-267-7000 Toll Free 1-888-576-9668 Taipei & IoT Campus 886-2-2792-7818 Tokyo 81-3-6802-1021 Breda 31-76-523-3100 Cincinnati 1-513-742-8895 Taichung 886-4-2372-5058 Osaka 81-6-6267-1887 Milpitas 1-408-519-3898 Industrial Server Solutions Kaohsiung 886-7-392-3600 Nagoya 81-0800-500-1055 Germany Irvine 1-949-420-2500 Nogata 81-949-22-2890 Toll Free 00800-2426-8080/81 Ottawa 1-815-433-5100 China Munich 49-89-12599-0 GPU Server Toll Free 800-810-0345 Korea Düsseldorf 49-2103-97-855-0 Brazil High-Performance, Reliable, and Flexible Beijing 86-10-6298-4346 080-363-9494/5 Toll Free Toll Free 0800-770-5355 IoT Server Shanghai 86-21-3632-1616 82-2-3660-9255 Seoul France São Paulo 55-11-5592-5367 Shenzhen 86-755-8212-4222 Paris 33-1-4119-4666 Carrier-grade Server with Product Longevity Support Chengdu 86-28-8545-0198 Singapore Hong Kong 852-2720-5118 Singapore 65-6442-1000 Mexico Italy Toll Free 1-800-467-2415 Multi-node Server Malaysia Milan 39-02-9544-961 Mexico City 52-55-6275-2727 Kuala Lumpur 60-3-7725-4188 Server Board Penang 60-4-537-9188 UK Newcastle 44-0-191-262-4844 Middle East and Africa Server Chassis London 44-0-870-493-1433 Thailand Israel 072-2410527 Bangkok 66-02-2488306-9 Turkey 90-212-222-0422 Application Case Spain Vietnam Madrid 34-91-668-86-76 Solution Ready Platform Hanoi 84-24-3399-1155 Sweden Indonesia Stockholm 46-0-864-60-500 Jakarta 62-21-751-1939 Poland Australia Warsaw 48-22-31-51-100 Toll Free 1300-308-531 Melbourne 61-3-9797-0100 Russia Moscow 8-800-555-01-50 India St.
    [Show full text]
  • PC-Technik Grundlagen
    PC-Technik Grundlagen (Stand 2020) Karsten Bratvogel 1. Ausgabe, Januar 2021 ISBN 978-3-86249-941-0 PCT_2020 I PC-Technik – Grundlagen 1 Informationen zu diesem Buch 4 7 Grafikkarten 71 7.1 Funktionsübersicht Grafikkarten 71 2 Hauptplatine, Netzteil und Gehäuse 5 7.2 Grafikstandards 71 2.1 Aufbau und Funktion eines minimalen 7.3 Aufbau von Grafikkarten 73 Computersystems 5 7.4 Grafikprozessor und Beschleunigung 74 2.2 Definition Bussysteme 7 7.5 Grafikspeicher 77 2.3 Die Hauptplatine (Mainboard/Motherboard) 8 7.6 Bustypen und Schnittstellen für Grafikkarten 79 2.4 Komponenten des Mainboards 9 7.7 Passende Grafikkarte auswählen 82 2.5 Chipsatz 11 7.8 Übung 83 2.6 Central Processing Unit – CPU 12 2.7 CPU Prozessorsockel 14 8 Erweiterungssteckkarten 84 2.8 Weitere Komponenten eines Motherboards 18 8.1 Aufgaben von Erweiterungssteckkarten 84 2.9 Steckplätze 19 8.2 Netzwerkkarten 84 2.10 Anschlüsse 21 8.3 Den PC mit dem Internet verbinden 86 2.11 Baugrößen von Mainboard und Gehäuse 23 8.4 Soundkarten 89 2.12 Netzteil 25 8.5 Controller 92 2.13 Unterbrechungsfreie Stromversorgung 28 8.6 Übung 93 2.14 Übung 30 9 Externe Schnittstellen 94 3 Prozessor (CPU) 31 9.1 Die Legacy-Schnittstellen 94 3.1 Fertigungstechniken 31 9.2 USB 94 3.2 Merkmale von Prozessoren 31 9.3 FireWire (IEEE 1394) 97 3.3 Leistungsfähigkeit der Prozessoren messen 38 9.4 Thunderbolt 98 3.4 Intel-Prozessoren 40 9.5 eSATA (External SATA) 99 3.5 AMD-Prozessoren 43 9.6 USB4 100 3.6 Prozessorkühlung 45 9.7 Übung 100 3.7 Betriebsmodi des Prozessors 47 3.8 Übung 47 10 Massenspeicher
    [Show full text]
  • Operaciones Auxiliares De Montaje De Componentes Informáticos
    AULAAULA CULTURALCULTURAL CURSOCURSO 2012/20132012/2013 CualificaciónCualificación ProfesionalProfesional PqpiPqpi OperacionesOperaciones AuxiliaresAuxiliares dede MontajeMontaje yy MantenimientoMantenimiento dede SistemasSistemas MicroinformáticosMicroinformáticos CUALIFICACIÓN PROFESIONAL: OPERACIONES AUXILIARES DE MONTAJE Y MANTENIMIENTO DE SISTEMAS MICROINFORMÁTICOS (IFC361_1) CONTENIDOS Modulo Formativo I: Operaciones auxiliares de montaje de equipos microinformáticos 1. Elementos básicos eléctricos y electrónicos. • Conceptos de electricidad: intensidad, tensión, resistencia. • Ley de Ohm. • Corriente continua y corriente alterna. • Magnitudes eléctricas. • Aparatos de medición de magnitudes eléctricas. • Pilas y baterías. • Pulsadores. • Interruptores. • Fuentes de alimentación. • Componentes electrónicos: resistencias, condensadores, diodos, transistores, leds. • Circuitos integrados. • Seguridad en el uso de herramientas y componentes eléctricos y electrónicos. • Seguridad eléctrica: medidas de prevención de riesgos eléctricos, daños producidos por descarga eléctrica. 2. Arquitectura del ordenador. • Unidades funcionales de un sistema informático. • La unidad central de proceso. • La memoria. • El sistema de Entrada/Salida: soportes y periféricos. Carcasas, tipos. 3. Componentes internos de los equipos microinformáticos. • Fuentes de alimentación, tipos. • Ventiladores y disipadores de calor. • La placa base, el chipset, la EPROM. • Microprocesadores, zócalos y tipos. • Memorias RAM, características y formatos. • Buses y conectores
    [Show full text]
  • 2Nd Generation Intel Core Processor Family with Intel 6 Series Chipset
    2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Kit User Guide March 2011 Document Number: 325208 About This Document INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel processor numbers are not a measure of performance.
    [Show full text]