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Broadwell Skylake Next Gen* NEW Intel NEW Intel NEW Intel Microarchitecture Microarchitecture Microarchitecture
15 лет доступности IOTG is extending the product availability for IOTG roadmap products from a minimum of 7 years to a minimum of 15 years when both processor and chipset are on 22nm and newer process technologies. - Xeon Scalable (w/ chipsets) - E3-12xx/15xx v5 and later (w/ chipsets) - 6th gen Core and later (w/ chipsets) - Bay Trail (E3800) and later products (Braswell, N3xxx) - Atom C2xxx (Rangeley) and later - Не включает в себя Xeon-D (7 лет) и E5-26xx v4 (7 лет) 2 IOTG Product Availability Life-Cycle 15 year product availability will start with the following products: Product Discontinuance • Intel® Xeon® Processor Scalable Family codenamed Skylake-SP and later with associated chipsets Notification (PDN)† • Intel® Xeon® E3-12xx/15xx v5 series (Skylake) and later with associated chipsets • 6th Gen Intel® Core™ processor family (Skylake) and later (includes Intel® Pentium® and Celeron® processors) with PDNs will typically be issued no later associated chipsets than 13.5 years after component • Intel Pentium processor N3700 (Braswell) and later and Intel Celeron processors N3xxx (Braswell) and J1900/N2xxx family introduction date. PDNs are (Bay Trail) and later published at https://qdms.intel.com/ • Intel® Atom® processor C2xxx (Rangeley) and E3800 family (Bay Trail) and late Last 7 year product availability Time Last Last Order Ship Last 15 year product availability Time Last Last Order Ship L-1 L L+1 L+2 L+3 L+4 L+5 L+6 L+7 L+8 L+9 L+10 L+11 L+12 L+13 L+14 L+15 Years Introduction of component family † Intel may support this extended manufacturing using reasonably Last Time Order/Ship Periods Component family introduction dates are feasible means deemed by Intel to be appropriate. -
Progress in Particle Tracking and Vertexing Detectors Nicolas Fourches
Progress in particle tracking and vertexing detectors Nicolas Fourches (CEA/IRFU): 22nd March 2020, University Paris-Saclay Abstract: This is part of a document, which is devoted to the developments of pixel detectors in the context of the International Linear Collider. From the early developments of the MIMOSAs to the proposed DotPix I recall some of the major progresses. The need for very precise vertex reconstruction is the reason for the Research and Development of new pixel detectors, first derived from the CMOS sensors and in further steps with new semiconductors structures. The problem of radiation effects was investigated and this is the case for the noise level with emphasis of the benefits of downscaling. Specific semiconductor processing and characterisation techniques are also described, with the perspective of a new pixel structure. TABLE OF CONTENTS: 1. The trend towards 1-micron point-to-point resolution and below 1.1. Gaseous detectors : 1.2. Liquid based detectors : 1.3. Solid state detectors : 2. The solution: the monolithically integrated pixel detector: 2.1. Advantages and drawbacks 2.2. Spatial resolution : experimental physics requirements 2.2.1. Detection Physics at colliders 2.2.1.1. Track reconstruction 2.2.1.2. Constraints on detector design a) Multiple interaction points in the incident colliding particle bunches b) Multiple hits in single pixels even in the outer layers c) Large NIEL (Non Ionizing Energy Loss) in the pixels leading to displacement defects in the silicon layers d) Cumulative ionization in the solid state detectors leading to a total dose above 1 MGy in the operating time of the machine a) First reducing the bunch length and beam diameter would significantly limit the number of spurious interaction points. -
HP Z2 Tower G4 Workstation
QuickSpecs HP Z2 Tower G4 Workstation Overview HP Z2 Tower G4 Workstation 1. Power Button 6. Optional SD Card Reader 2. Headphone/Microphone 7. External 5.25’’ bay 3. 1 USB 3.0 port 4. 1 USB 3.0 Battery Charging Port 5. (Optional) 1 USB 3.1 Gen2 Type-C™ Battery Charging Port c05987463 —DA 16215 – Worldwide — Version 23 — January 5, 2021 Page 1 QuickSpecs HP Z2 Tower G4 Workstation Overview 1. 1 Audio Line In, 1 Audio Line Out, 2. 2 DisplayPortTM (DP 1.2) output from Intel® UHD graphics (available on selected processors only) 3. Optional Serial Port 4. 1 flex IO module for 2nd LAN/VGA/HDMI/DP/ USB-C 3.1 Gen2 Charging Port with Alt mode /Thunderbolt™ 3.0 (Thunderbolt™ requires x4 PCIe Add in card) 5. RJ-45 to integrated GBe 6. 2 USB 2.0 7. 4 USB 3.0 8. Optional WLAN/BT Antenna c05987463 —DA 16215 – Worldwide — Version 23 — January 5, 2021 Page 2 QuickSpecs HP Z2 Tower G4 Workstation Overview Form Factor Minitower Operating Systems Preinstalled: • Windows 10 Home* • Windows 10 Pro* • Windows 10 Pro (National Academic License)* • Windows 10 Pro for Workstations – HP recommends Windows 10 Pro * • HP Linux®-ready Supported: • Red Hat® Enterprise Linux® Workstation (1 year paper license available; Preinstall not available) * Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for updates. -
Presentazione Di Powerpoint
Noise measurements on 65 nm CMOS transistors at very high total ionizing dose V. Rea,c, L. Gaionia,c, L. Rattib,c, E. Riceputia,c, M. Manghisonia,c, G. Traversia,c c aUniversità di Bergamo bUniversità di Pavia INFN Sezione di Pavia Dipartimento di Ingegneria e Scienze Applicate Dipartimento di Ingegneria Industriale e dell’Informazione V. Re – 10th International Meeting on Front-End Electronics, Krakow, May 30 – June 3, 2016 1 Motivation 65 nm CMOS technology is a candidate for mixed-signal readout of high granularity silicon pixel sensors, with potential to meet the requirements of diverse applications such as particle tracking in the innermost layers of ATLAS and CMS at HL-LHC and photon imaging at very high brilliance and high rate light sources Tolerance to extremely high levels of ionizing radiation is a key requirement for both application fields, up to 1 Grad Total Ionizing Dose (TID) during chip lifetime. RD53 collaboration has carried out an extensive study of the behavior under irradiation of a 65 nm CMOS technology, with which a first generation of demonstrator chips is being designed The goal of this paper is to find out if 65 nm CMOS analog front- end circuits can still provide an adequate noise performance even at extremely high total doses. Study of radiation effects on noise can give very important hints about damage mechanisms. V. Re – 10th International Meeting on Front-End Electronics, Krakow, May 30 – June 3, 2016 2 Test devices and irradiation procedure A test chip was submitted and fabricated with the TSMC 65 nm -
HP Probook 440 G8 Notebook PC
Проконсультироваться и купить данное оборудование вы можете в компании «АНД-Системс» адрес: 125480, г.Москва, ул.Туристская, д.33/1; site: https://andpro.ru тел: +7 (495) 545-4870 email: [email protected] QuickSpecs При обращении используйте промокод AND-PDF и получитеHP ProBook скидку. 440 G8 Notebook PC Overview HP ProBook 440 G8 Notebook PC Left 1. Internal Microphones (2) 6. Clickpad 2. Webcam LED (Optional) 7. USB 3.1 Gen 1 Powered Port 3. HD and IR Camera (Optional) 8. Ethernet Port (RJ-45) 4. Camera Shutter (Only available with webcam) 9. Nano Security Lock Slot (Lock sold separately) 5. IR Camera LED (Optional) Not all configuration components are available in all regions/countries. Page 1 c06907851 — DA16755 — Worldwide — Version 1 — October 28, 2020 HP ProBook 440 G8 Notebook PC QuickSpecs Overview Right 1. Power Button Key 6. HDMI Port (Cable not included) 2. Power Connector 7. Audio Combo Jack 3. USB Type-C® 3.1 Gen 2 (Alt Mode) 8. Micro SD Card Reader 4. USB 3.1 Gen 1 Charging Port 9. Touch Fingerprint Sensor (select models) 5. USB 3.1 Gen 1 Port Not all configuration components are available in all regions/countries. Page 2 c06907851 — DA16755 — Worldwide — Version 1 — October 28, 2020 HP ProBook 440 G8 Notebook PC QuickSpecs Overview At a Glance • A new compact design with lift-anywhere edge • Choice of 11th generation Intel® Core™ i7, i5 and i3 processors • Preinstalled with Windows 10 versions or FreeDOS • Optional NVIDIA GeForce MX450 discrete graphics with 2 GB GDDR5 video memory • Fast and upgradeable dual channel DDR4 -
System Builder's Guide for D-Series
Matrox® Display Wall Mura™ IPX Series • D-Series™ System Builder’s Guide 20315-101-0110 2021.07.28 www.matrox.com/video Contents Product overview .....................................................................................................................................................4 Hardware summary – Mura IPX Series.....................................................................................................................................................................4 MURAIPXI-E4SF/MURAIPXI-E4SHF ...............................................................................................................................................4 MURAIPXI-E2MF/MURAIPXI-E2MHF ...........................................................................................................................................5 MURAIPXI-D2MF/MURAIPXI-D2MHF..................................................................................................................................................6 MURAIPXI-E4JF/MURAIPXI-E4JHF ................................................................................................................................................7 MURAIPXI-D4JF/MURAIPXI-D4JHF ..............................................................................................................................................8 Hardware summary – Matrox D-Series ....................................................................................................................................................................9 -
Circuit Optimisation Using Device Layout Motifs
Circuit Optimisation using Device Layout Motifs Yang Xiao Ph.D. University of York Electronics July 2015 Abstract Circuit designers face great challenges as CMOS devices continue to scale to nano dimensions, in particular, stochastic variability caused by the physical properties of transistors. Stochas- tic variability is an undesired and uncertain component caused by fundamental phenomena associated with device structure evolution, which cannot be avoided during the manufac- turing process. In order to examine the problem of variability at atomic levels, the `Motif ' concept, defined as a set of repeating patterns of fundamental geometrical forms used as design units, is proposed to capture the presence of statistical variability and improve the device/circuit layout regularity. A set of 3D motifs with stochastic variability are investigated and performed by technology computer aided design simulations. The statistical motifs compact model is used to bridge between device technology and circuit design. The statistical variability information is transferred into motifs' compact model in order to facilitate variation-aware circuit designs. The uniform motif compact model extraction is performed by a novel two-step evolutionary algorithm. The proposed extraction method overcomes the drawbacks of conventional extraction methods of poor convergence without good initial conditions and the difficulty of simulating multi-objective optimisations. After uniform motif compact models are obtained, the statistical variability information is injected into these compact models to generate the final motif statistical variability model. The thesis also considers the influence of different choices of motif for each device on cir- cuit performance and its statistical variability characteristics. A set of basic logic gates is constructed using different motif choices. -
Dh370 Slim Pc
PRODUCT SPECIFICATIONS DH370 SLIM PC PROCESSOR Supports Intel® Coffee Lake Core® i3/i5/i7/i9 series, Pentium, and Celeron® LGA 1151v2 65W processors 2 x 260 pin DDR4 2400/2666 MHz (PC4-19200/21300) SDRAM at 1.2V MEMORY Supports dual channel up to 64GB (32GB x 2) VIDEO GRAPHICS Intel HD Graphics VIDEO OUTPUT HDMI 2.0 + DisplayPort 1.2, Supports three independent displays, Supports 4K Ultra HD AUDIO Realtek ALC662 5.1 channel HD audio ETHERNET Intel i211 x 2 Dual LAN Supports Wake on LAN function 10/100/1000 MB/s operation Supports Teaming mode STORAGE INTERFACE SATA 6 GB/s ONBOARD CONNECTORS (1) 4 pin fan connector (1) analog VGA graphics output (2 x 1 pin) [5]* (2) serial interface (COM) (1) jumper for power on after power fail [8]* (1) connector for CMOS battery (1) USB 2.0 (4 pin) FRONT PANEL (1) Power Button (2) USB 3.1 Gen 2 (1) Power LED (1) External microphone jack 1/8" (1) HDD LED (1) External headphone jack 1/8" (2) USB 3.1 Gen 1 (1) SD Card Reader BACK PANEL (1) HDMI 2.0 [1]* (2) RS232 (5/12V, 1 x RS422/RS485) [3]* (2) DisplayPort 1.2 [2]* (1) Clear CMOS button (2) USB 3.1 Gen 1 (2) Wireless Antenna holes (2) USB 3.1 Gen 2 (1) VGA connector (optional PVG01) (2) Gigabit LAN ports (1) DC-in (2) Kensington Lock DRIVE BAYS (1) 2.5" HDD/SSD bay DIMENSIONS 7.5(L) x 6.5(W) x 1.7(H) inches POWER Input: 100 - 240V AC 90W power supply Output: 19V/4.74A DC ACCESSORIES Quick Guide VESA mount Screw package VESA mount quick guide Power cord Thermal grease Driver DVD HDD screw pack SATA cable OPTIONAL ACCESSORIES Optional VGA output (PVG01) Adapter cable for external power button (CXP01) WLAN module (WLN-M) 2U rack mount front plate for two slim PCs (PRM01) Vertical stand (PS02) EXPANSION SLOT (1) M2. -
Lista Sockets.Xlsx
Data de Processadores Socket Número de pinos lançamento compatíveis Socket 0 168 1989 486 DX 486 DX 486 DX2 Socket 1 169 ND 486 SX 486 SX2 486 DX 486 DX2 486 SX Socket 2 238 ND 486 SX2 Pentium Overdrive 486 DX 486 DX2 486 DX4 486 SX Socket 3 237 ND 486 SX2 Pentium Overdrive 5x86 Socket 4 273 março de 1993 Pentium-60 e Pentium-66 Pentium-75 até o Pentium- Socket 5 320 março de 1994 120 486 DX 486 DX2 486 DX4 Socket 6 235 nunca lançado 486 SX 486 SX2 Pentium Overdrive 5x86 Socket 463 463 1994 Nx586 Pentium-75 até o Pentium- 200 Pentium MMX K5 Socket 7 321 junho de 1995 K6 6x86 6x86MX MII Slot 1 Pentium II SC242 Pentium III (Cartucho) 242 maio de 1997 Celeron SEPP (Cartucho) K6-2 Socket Super 7 321 maio de 1998 K6-III Celeron (Socket 370) Pentium III FC-PGA Socket 370 370 agosto de 1998 Cyrix III C3 Slot A 242 junho de 1999 Athlon (Cartucho) Socket 462 Athlon (Socket 462) Socket A Athlon XP 453 junho de 2000 Athlon MP Duron Sempron (Socket 462) Socket 423 423 novembro de 2000 Pentium 4 (Socket 423) PGA423 Socket 478 Pentium 4 (Socket 478) mPGA478B Celeron (Socket 478) 478 agosto de 2001 Celeron D (Socket 478) Pentium 4 Extreme Edition (Socket 478) Athlon 64 (Socket 754) Socket 754 754 setembro de 2003 Sempron (Socket 754) Socket 940 940 setembro de 2003 Athlon 64 FX (Socket 940) Athlon 64 (Socket 939) Athlon 64 FX (Socket 939) Socket 939 939 junho de 2004 Athlon 64 X2 (Socket 939) Sempron (Socket 939) LGA775 Pentium 4 (LGA775) Pentium 4 Extreme Edition Socket T (LGA775) Pentium D Pentium Extreme Edition Celeron D (LGA 775) 775 agosto de -
Exploring the Ultimate Limits of Adiabatic Circuits
Special Session: Exploring the Ultimate Limits of Adiabatic Circuits Michael P. Frank Robert W. Brocato Thomas M. Conte Alexander H. Hsia Cognitive & Emerging RF Microsystems Dept. Schools of Computer Science and Sandia National Laboratories Computing Dept. Sandia National Laboratories Electrical & Computer Eng. Albuquerque, NM, USA Sandia National Laboratories Albuquerque, NM, USA Georgia Institute of Technology Albuquerque, NM, USA orcid:0000-0001-9751-1234 Atlanta, GA, USA Requiescat in pace [email protected] [email protected] Anirudh Jain Nancy A. Missert Karpur Shukla Brian D. Tierney School of Computer Science Nanoscale Sciences Department Laboratory for Emerging Radiation Hard CMOS Georgia Institute of Technology Sandia National Laboratories Technologies Technology Dept. Atlanta, GA, USA Albuquerque, NM, USA Brown University Sandia National Laboratories [email protected] orcid:0000-0003-2082-2282 Providence, RI, USA Albuquerque, NM, USA orcid:0000-0002-7775-6979 [email protected] Abstract—The field of adiabatic circuits is rooted in electronics I. INTRODUCTION know-how stretching all the way back to the 1960s and has poten- tial applications in vastly increasing the energy efficiency of far- In 1961, Rolf Landauer of IBM observed that there is a fun- future computing. But now, the field is experiencing an increased damental physical limit to the energy efficiency of logically ir- level of attention in part due to its potential to reduce the vulnera- reversible computational operations, meaning, those that lose bility of systems -
Introduction Aux Systèmes Informatiques Introduction Générale
Introduction aux systèmes informatiques Introduction générale Michel Salomon IUT de Belfort-Montbéliard Département d’informatique Michel Salomon Intro. aux sys. info. 1 / 53 Objectifs et organisation Objectifs 1 Savoir utiliser un (des) système(s) informatique(s) ; 2 en appréhender le fonctionnement Organisation Module en deux parties 1 Système d’exploitation (7 sem. - M. Fouzi) 2 Fonctionnement interne d’un ordinateur (6 sem. - M. Salomon) Modalités de Contrôle des Connaissances Chaque partie comptera pour 50% de la note du module Au moins 2 contrôles dans cette partie Michel Salomon Intro. aux sys. info. 2 / 53 L’informatique : un domaine complexe en constante évolution Décrire ce qu’est un ordinateur n’est pas aisé Grande variété d’ordinateurs Netbook Tablette tactile etc. Super-ordinateur Rapidité des évolutions technologiques Illustration par la Loi de Moore (1975) Postulait initialement le doublement du nombre de transistors des microprocesseurs tous les 2 ans ; entre 1971 et 2001 doublement tous les 1,96 années ; “relativement” exacte jusqu’en 2012, depuis ralentissement (phénomène quantique : effet tunnel → limite de miniaturisation) ; version plus commune : doublement d’une grandeur (puissance, capacité, etc.) tous les 18 à 24 mois Michel Salomon Intro. aux sys. info. 3 / 53 L’informatique : un domaine complexe en constante évolution On approche des limites de la technologie actuelle des semi-conducteurs Michel Salomon Intro. aux sys. info. 4 / 53 L’informatique : un domaine complexe en constante évolution Pourquoi réduire la finesse de gravure ? Une gravure plus fine permet d’augmenter la densité des transistors Une même micro-architecture (même nombre de transistors) → implémentée par un “Die” (support physique) plus petit Une même taille de “Die” (plus de transistors disponibles) → implémenter une micro-architecture plus performante Michel Salomon Intro. -
Computer Organization and Assembly Language CSC-210 Laboratory
Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Computer Organization and Assembly Language CSC-210 Laboratory Manual 3rd Edition 2017/2018 Name: Number: ٍ :Section Department: 1 Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Table of Contents Lab (1): Computer Anatomy ....................................................................................................... 4 Objectives ............................................................................................................................... 4 What is a Computer? ............................................................................................................... 4 System ..................................................................................................................................... 4 1. Motherboard ............................................................................................................. 5 2. Central Processing Unit (CPU) ...................................................................................... 6 3. Memory .................................................................................................................... 6 4. Video Adapter ............................................................................................................ 7 5. Operating System ......................................................................................................