DOCSLIB.ORG

Broadwell Skylake Next Gen* NEW Intel NEW Intel NEW Intel Microarchitecture Microarchitecture Microarchitecture

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Broadwell Skylake Next Gen* NEW Intel NEW Intel NEW Intel Microarchitecture Microarchitecture Microarchitecture 15 лет доступности IOTG is extending the product availability for IOTG roadmap products from a minimum of 7 years to a minimum of 15 years when both processor and chipset are on 22nm and newer process technologies. - Xeon Scalable (w/ chipsets) - E3-12xx/15xx v5 and later (w/ chipsets) - 6th gen Core and later (w/ chipsets) - Bay Trail (E3800) and later products (Braswell, N3xxx) - Atom C2xxx (Rangeley) and later - Не включает в себя Xeon-D (7 лет) и E5-26xx v4 (7 лет) 2 IOTG Product Availability Life-Cycle 15 year product availability will start with the following products: Product Discontinuance • Intel® Xeon® Processor Scalable Family codenamed Skylake-SP and later with associated chipsets Notification (PDN)† • Intel® Xeon® E3-12xx/15xx v5 series (Skylake) and later with associated chipsets • 6th Gen Intel® Core™ processor family (Skylake) and later (includes Intel® Pentium® and Celeron® processors) with PDNs will typically be issued no later associated chipsets than 13.5 years after component • Intel Pentium processor N3700 (Braswell) and later and Intel Celeron processors N3xxx (Braswell) and J1900/N2xxx family introduction date. PDNs are (Bay Trail) and later published at https://qdms.intel.com/ • Intel® Atom® processor C2xxx (Rangeley) and E3800 family (Bay Trail) and late Last 7 year product availability Time Last Last Order Ship Last 15 year product availability Time Last Last Order Ship L-1 L L+1 L+2 L+3 L+4 L+5 L+6 L+7 L+8 L+9 L+10 L+11 L+12 L+13 L+14 L+15 Years Introduction of component family † Intel may support this extended manufacturing using reasonably Last Time Order/Ship Periods Component family introduction dates are feasible means deemed by Intel to be appropriate. Future business, Publication of the PDN will typically be available from your Intel Sales Representative. manufacturing, or market conditions may change, which may cause followed by: 12 month last time order Refresh SKU offerings launched after the Intel to revisit the EOL/PDN timing. Intel may make changes to period, followed by 6 month last time component family will follow the original dates and schedule at any time without notice ship period. component family introduction date. 3 Какие модели будут доступны 15 лет? https://ark.intel.com/ 4 Зачем использовать embedded parts? - Долгая доступность (15 лет) - Разные т.н. USE CONDITIONS: Use Conditions Temp Range Reliability DPM Automotive 15Y Reliability at 11.4% Active, • Advanced Driver Assistance Systems (ADAS) Automotive Grade 2, T = -40⁰ to 105⁰ C <10 la Tj-max = 110o - 125o C, • Software Defined Cockpit (SDC) 10Y Reliability at 100% active, CT – Commercial Temp: T = 0o to 70o C Industrial la Tj-max = 100o - 110o C <500 ET – Extended Temp: T = -40o to 85o C la Base Frequency only – No core or graphics turbo o o CT – Commercial Temp: Tla = 0 to 70 C 10Y Reliability at 100% active, Communications o o o o <500 ET – Extended Temp: Tla = -40 to 85 C Tj-max = 100 - 105 C 5Y Reliability at 80% Active, Embedded Broad Market CT – Commercial Temp: T = 0o to 70o C <500 la Tj-max = 100o - 105o C 5Y Reliability at 80% Active, Server/Enterprise CT – Commercial Temp: T = 0o to 70o C <500 la Tj-max sku dependent 5Y Reliability up to 30% Active, PC/Client/Tablet CT – Commercial Temp: T = 0o to 70o C <500 la Tj-max sku dependent, 5 АНАЛИТИКА, ОБЛАКА НОВЫЕ СЕТИ СУПЕРКОМПЬЮТЕРЫ, УМНЫЕ ДАННЫЕ 18% CAGR from SDN/NFV spend up to AI is the fastest growing 2017-20201 $157B through 20202 datacenter workload3 1. Source: IDC Q4’16 Cloud Infrastructure Tracker 2. Source: Technology Business Research, Sept 2015 3. Source: Amalgamation of Intel financials, analyst data and Intel analysis, Intel revenue includes FPGAs. 6 «Строительные блоки» для решения текущих задач Analytics & Technical Intel Scalable Machine Learning Intel / Cloudera Computing System Framework Software Intel® Data Intel® Cache Intel® Parallel Intel® Media Management, Center Manager Accelration SW Software Studio XE Server Studio Orchestration Intel® Virtual Development Intel® Intel® Intel® Intel® RSTe & Storage Gateway Tools Inspector VTune CoFluent™ Wind River Intel ® AES-NI Intel® SHA Intel® MKL Library Intel® DPDK Intel® MPI Library Instructions Extensions SW & OpenGL/DX on Intel® Data Analytics Instructions … Intel® HD Graphics Acceleration Library (DAAL) … Intel ® AVX Intel ® TSX Libraries Instructions Instructions Intel ® TXT Intel® SPDK Intel® ISA-L Embree Intel® QAT Intel® DLIA Intel® VCA Intel® Network Silicon Processors Chipsets Ethernet Omni-Path ASICs Photonics FPGAs SSDs Fabric Accelerators 7 Intel® Xeon® Scalable Processors ФУНДАМЕНТ ДАТАЦЕНТРА БУДУЩЕГО: ГИБКАЯ И НАДЕЖНАЯ АРХИТЕКТУРА Производительность Оптимизировано под все нагрузки: ПРОСТОТА Там, где надо Compute, storage, Network ВНЕДРЕНИЯ В среднемувеличение производительности в 1.6x раза против e5/e7 v4 6 * New features in bold ПРОИЗВОДИТЕЛЬНОСТЬ ЯДРА ПРОИЗВОДИТЕЛЬНОСТЬ СОКЕТА Faster application response time Increased multi-tenancy & VM density for cloud More choices to optimize software license costs Application performance for parallelizable workloads ▪ New core micro-architecture ▪ More cores ▪ New lower latency cache memory hierarchy design ▪ New High-speed Interconnects = much greater inter-CPU bandwidth ПАМЯТЬ И ШИНА PCI-E УСКОРЕНИЕ СПЕЦ ВЫЧИСЛЕНИЙ High bandwidth connections for networking Application specific instructions and accelerators and memory performance ▪ Intel® AVX-512 (2X FLOPs/clock) for HPC, Analytics, Database, & ▪ More memory bandwidth via added memory channels Security ▪ Int. Intel® QuickAssist Technology: faster crypto & data compression ▪ Significantly more PCIe IO bandwidth versus prior gen ▪ Intel® FPGA: Big speedups on server/storage/networking algorithms ▪ Richer chipset & IO support options БЕЗОПАСНОСТЬ ГИБКОСТЬ Built in performant security for trusted infrastructure Optimized architecture for Hybrid-Cloud world ▪ Up to 2X security algorithm performance improvements ▪ Enhanced Intel® RunSure Technology ▪ Root of trust with Intel® TXT-OTA, Intel® PTT and Intel® Boot Guard ▪ Enhanced Intel® Virtualization Technology (VT-x): MBE & TSC ▪ New Key Protection Technology (w/ integrated Intel® QAT & Intel PTT) ▪ New Intel® VMD for improved management of NVMe SSD drives • Mode-based Execute Control (MBE): • Timestamp Counter Scaling (TSC): 99 «СЕТЕВАЯ» архитектура: ▪ Максимальная производительность ▪ Гарантированно низкие задержки при передачи данных ▪ Оптимизировано для работы с общей памятью ▪ Масшабируется эффективно для 2, 4, & 8+ сокет конфигур МОНОЛИТНОЕ ЯДРО МОНОЛИТНОЕ Enhanced PCIe Note: Not representative of top bin die Много вычислительных ядер, быстрая память, малые задержки 10 2016 2017 2018 Intel® Xeon® Processor E7 Brickland Platform Purley Platform High-end сервера с Skylake Cascade Lake масшабированием по сокетам и E7 v3 E7 v4 поддержкой RAS Intel® Xeon® PLATINUM Intel Xeon GOLD Intel® Xeon® Processor E5 Grantley-EP Platform Intel Xeon SILVER Сбалансированные 2х сокет E5 v3 E5-4600 v4 (4S) системы с лучшим соотнош Intel Xeon BRONZE performance/watt/$ E5 v3 E5-2600 v4 Общая платформа для построения E5 и e7 –class решений 11 INTEL® XEON® SCALABLE PROCESSOR The Foundation for Agile, Secure Workload-Optimized Hybrid Cloud INTEL® XEON® PLATINUM 81xxPROCESSORS • Most cores (28C, 56T) • Highest frequency (up to 3.6 GHz, 4C) • Most Socket flexibility (2, 4, 8+) • Elite IO/memory (48 PCIe 3.0 lanes, 6 memory channels) • UP TO Most/fastest 3SCALABLE UPI (Ultra PERFORMANCE Path Interconnects, 10.4SCALABLE GT/s) PERFORMANCE SCALABLE PERFORMANCE 28 CORES • Fastest MemoryMEMORY (DDR4 PERFORMANCE-2666 MHz) BETTER AT LOW POWER HARDWARE-ENHANCED SECURITY •GREATHighest Intel®ADVANCED AVX-512 RAS with 2 FMA per core STANDARD RAS ENTRY STANDARD RAS • Intel® Turbo Boost and Intel® Hyper-Threading Technology UP SOCKET WITH UPI • New Advanced RAS TO 2, 4 & UP TO 8 SUPPORT 3 LINKS • NodeWORKLOAD Controller-OPTIMIZED Support to assist in scaled node management MODERATE TASKS DEDICATED TASKS M TOPLINE MEMORY DDR4 H WITH RESULT: TASKS 2666 Z UP TO 1.5 TB CHANNEL BANDWIDTH • Best workload-optimized performance for general purpose compute across virtualized environmentsPERFORMANCE FOR GENERAL and hybrid-PURPOSE cloud deploymentsINTEL® TURBO BOOST TECHNOLOGY AND AFFORDABLE, ENTRY PERFORMANCE • INTEL® HYPER-THREADING TECHNOLOGY ACCELERATOR BestCOMPUTE, choice STORAGE for AND mission NETWORKING-critical, traditional DC apps, real-time analytics,FOR and LIGHT AI/deep-RANGE WORKLOADS HIGHEST THROUGHPUT learning inference workloads; smart pathFOR for MODERATE DL training WORKLOADS • Best performance for the most demanding storage and networking workloads MAINSTREAM RAS: Reliability, Availability, and Serviceability 12 INTEL® XEON® SCALABLE PROCESSOR The Foundation for Agile, Secure Workload-Optimized Hybrid Cloud INTEL® XEON® GOLD 61xxPROCESSORS • 22C (44 threads w/ HT) • 2 and 4S • Up to 3.4 GHz, (6C) • 3 UPI links (10.4GT/s) • DDR4-2666 MHz • Intel® AVX-512 with 2 FMA • Node ControllerSCALABLE Support PERFORMANCE UP TO • Enhanced scalability and workload optimized performanceSCALABLE PERFORMANCE for UP TO 28 CORES 22 CORES AT LOW POWER HARDWARE-ENHANCED SECURITY BETTERgeneral purpose/virtualized computeENTRY & hybrid cloud • Improved performanceSTANDARD RAS for demanding storageSTANDARD and networking RAS UP SOCKET WITH UPI SOCKET TO 2, 4 & 8 SUPPORT UP TO 3 LINKS 2 & 4 SUPPORT INTEL® XEON® GOLD 51XXPROCESSORS DEDICATED TASKS • UpMODERATE to 14C (28T) TASKS M WITH TOPLINE MEMORY DDR4 H UP TO UPI LINKS • 2 UPI links - 2666 Z UP TO 1.5 TB CHANNEL BANDWIDTH 3 • DDR4-2400 MHz
Load more

Recommended publications
  • Intel® Architecture Instruction Set Extensions and Future Features Programming Reference
    Intel® Architecture Instruction Set Extensions and Future Features Programming Reference 319433-037 MAY 2019 Intel technologies features and benefits depend on system configuration and may require enabled hardware, software, or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifica- tions. Current characterized errata are available on request. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Intel does not guarantee the availability of these interfaces in any future product. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1- 800-548-4725, or by visiting http://www.intel.com/design/literature.htm. Intel, the Intel logo, Intel Deep Learning Boost, Intel DL Boost, Intel Atom, Intel Core, Intel SpeedStep, MMX, Pentium, VTune, and Xeon are trademarks of Intel Corporation in the U.S.
    [Show full text]
  • 1 in the United States District Court
    Case 6:20-cv-00779 Document 1 Filed 08/25/20 Page 1 of 33 IN THE UNITED STATES DISTRICT COURT WESTERN DISTRICT OF TEXAS AUSTIN DIVISION AURIGA INNOVATIONS, INC. C.A. No. 6:20-cv-779 Plaintiff, v. JURY TRIAL DEMANDED INTEL CORPORATION, HP INC., and HEWLETT PACKARD ENTERPRISE COMPANY, Defendants COMPLAINT Plaintiff Auriga Innovations, Inc. (“Auriga” or “Plaintiff”) files this complaint for patent infringeMent against Defendants Intel Corporation (“Intel”), HP Inc. (“HPI”), and Hewlett Packard Enterprise Company (“HPE”) (collectively, “Defendants”) under 35 U.S.C. § 217 et seq. as a result of Defendants’ unauthorized use of Auriga’s patents and alleges as follows: THE PARTIES 1. Auriga is a corporation organized and existing under the laws of the state of Delaware with its principal place of business at 1891 Robertson Road, Suite 100, Ottawa, ON K2H 5B7 Canada. 2. On information and belief, Intel is a Delaware corporation with a place of business at 2200 Mission College Boulevard, Santa Clara, California 95054. 3. On information and belief, since April 1989, Intel has been registered to do business in the State of Texas under Texas Taxpayer Number 19416727436 and has places of business at 1 Case 6:20-cv-00779 Document 1 Filed 08/25/20 Page 2 of 33 1300 S Mopac Expressway, Austin, Texas 78746; 6500 River Place Blvd, Bldg 7, Austin, Texas 78730; and 5113 Southwest Parkway, Austin, Texas 78735 (collectively, “Intel Austin Offices”). https://www.intel.com/content/www/us/en/location/usa.htMl. 4. On information and belief, HPI is a Delaware corporation with a principal place of business at 1501 Page Mill Road, Palo Alto, CA 94304.
    [Show full text]
  • Horizontal PDF Slides
    1 2 Speed, speed, speed $1000 TCR hashing competition D. J. Bernstein Crowley: “I have a problem where I need to make some University of Illinois at Chicago; cryptography faster, and I’m Ruhr University Bochum setting up a $1000 competition funded from my own pocket for Reporting some recent work towards the solution.” symmetric-speed discussions, Not fast enough: Signing H(M), especially from RWC 2020. where M is a long message. Not included in this talk: “[On a] 900MHz Cortex-A7 NISTLWC. • [SHA-256] takes 28.86 cpb ::: Short inputs. • BLAKE2b is nearly twice as FHE/MPC ciphers. • fast ::: However, this is still a lot slower than I’m happy with.” 1 2 3 Speed, speed, speed $1000 TCR hashing competition Instead choose random R and sign (R; H(R; M)). D. J. Bernstein Crowley: “I have a problem where I need to make some Note that H needs only “TCR”, University of Illinois at Chicago; cryptography faster, and I’m not full collision resistance. Ruhr University Bochum setting up a $1000 competition Does this allow faster H design? funded from my own pocket for TCR breaks how many rounds? Reporting some recent work towards the solution.” symmetric-speed discussions, Not fast enough: Signing H(M), especially from RWC 2020. where M is a long message. Not included in this talk: “[On a] 900MHz Cortex-A7 NISTLWC. • [SHA-256] takes 28.86 cpb ::: Short inputs. • BLAKE2b is nearly twice as FHE/MPC ciphers. • fast ::: However, this is still a lot slower than I’m happy with.” 1 2 3 Speed, speed, speed $1000 TCR hashing competition Instead choose random R and sign (R; H(R; M)).
    [Show full text]
  • Microcode Revision Guidance August 31, 2019 MCU Recommendations
    microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment.
    [Show full text]
  • Single Board Computer
    Single Board Computer SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) SBC-C66 and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs High-performing, flexible solution for intelligence at the edge HIGHLIGHTS CONNECTIVITY CPU 2x USB 3.1; 4x USB 2.0; NVMe SSD Slot; PCI-e x8 Intel® 8th gen. Core™ / Xeon® and 9th gen. Core™ / port (PCI-e x16 mechanical slot); VPU High Speed Xeon® / Pentium® / Celeron® CPUs Connector with 4xUSB3.1 + 2x PCI-ex4 GRAPHICS MEMORY Intel® UHD Graphics 630/P630 architecture, up to 128GB DDR4 memory on 4x SO-DIMM Slots supports up to 3 independent displays (ECC supported) Available in Industrial Temperature Range MAIN FIELDS OF APPLICATION Biomedical/ Gaming Industrial Industrial Surveillance Medical devices Automation and Internet of Control Things FEATURES ® ™ ® Intel 8th generation Core /Xeon (formerly Coffee Lake H) CPUs: Max Cores 6 • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Max Thread 12 HyperThreading • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Intel® QM370, HM370 or CM246 Platform Controller Hub Chipset Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), (PCH) with HyperThreading • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB 2x DDR4-2666 or 4x DDR4-2444 ECC SODIMM Slots, up to 128GB total (only with 4 SODIMM modules). Cache, 45W TDP (35W cTDP) Memory ® ™ ® ® ECC DDR4 memory modules supported only with Xeon Core Information subject to change. Please visit www.seco.com to find the latest version of this datasheet Information subject to change.
    [Show full text]
  • Attacking X86 Processor Integrity from Software
    V0LTpwn: Attacking x86 Processor Integrity from Software Zijo Kenjar and Tommaso Frassetto, Technische Universität Darmstadt; David Gens and Michael Franz, University of California, Irvine; Ahmad-Reza Sadeghi, Technische Universität Darmstadt https://www.usenix.org/conference/usenixsecurity20/presentation/kenjar This paper is included in the Proceedings of the 29th USENIX Security Symposium. August 12–14, 2020 978-1-939133-17-5 Open access to the Proceedings of the 29th USENIX Security Symposium is sponsored by USENIX. V0LTpwn: Attacking x86 Processor Integrity from Software Zijo Kenjar1, Tommaso Frassetto1, David Gens2, Michael Franz2, and Ahmad-Reza Sadeghi1 1Technical University of Darmstadt, Germany {zijo.kenjar,tommaso.frassetto,ahmad.sadeghi}@trust.tu-darmstadt.de 2University of California, Irvine {dgens,franz}@uci.edu Abstract complex, and far from flawless. In the recent past, we Fault-injection attacks have been proven in the past to have seen how seemingly minor implementation bugs at be a reliable way of bypassing hardware-based security the hardware level can have a severe impact on secu- measures, such as cryptographic hashes, privilege and rity [14]. Attacks such as Meltdown [36], Spectre [33], access permission enforcement, and trusted execution Foreshadow [58], and RIDL [62] demonstrate that at- environments. However, traditional fault-injection at- tackers can exploit these bugs from software to bypass tacks require physical presence, and hence, were often access permissions and extract secret data. considered out of scope in many real-world adversary Furthermore, we have seen that the adverse effects settings. of hardware vulnerabilities are not limited to confiden- In this paper we show this assumption may no longer tiality, but can also compromise integrity in principle: be justified on x86.
    [Show full text]
  • Introduction to Intel Xeon Phi Programming Models
    Introduction to Intel Xeon Phi programming models F.Affinito F. Salvadore SCAI - CINECA Part I Introduction to the Intel Xeon Phi architecture Trends: transistors Trends: clock rates Trends: cores and threads Trends: summarizing... The number of transistors increases The power consumption must not increase The density cannot increase on a single chip Solution : Increase the number of cores GP-GPU and Intel Xeon Phi.. Coupled to the CPU To accelerate highly parallel kernels, facing with the Amdahl Law What is Intel Xeon Phi? 7100 / 5100 / 3100 Series available 5110P: Intel Xeon Phi clock: 1053 MHz 60 cores in-order ~ 1 TFlops/s DP peak performance (2 Tflops SP) 4 hardware threads per core 8 GB DDR5 memory 512-bit SIMD vectors (32 registers) Fully-coherent L1 and L2 caches PCIe bus (rev. 2.0) Max Memory bandwidth (theoretical) 320 GB/s Max TDP: 225 W MIC vs GPU naïve comparison The comparison is naïve System K20s 5110P # cores 2496 60 (*4) Memory size 5 GB 8 GB Peak performance 3.52 TFlops 2 TFlops (SP) Peak performance 1.17 TFlops 1 TFlops (DP) Clock rate 0.706 GHz 1.053 GHz Memory bandwidth 208 GB/s (ECC off) 320 GB/s Terminology MIC = Many Integrated Cores is the name of the architecture Xeon Phi = Commercial name of the Intel product based on the MIC architecture Knight's corner, Knight's landing, Knight's ferry are development names of MIC architectures We will often refer to the CPU as HOST and Xeon Phi as DEVICE Is it an accelerator? YES: It can be used to “accelerate” hot-spots of the code that are highly parallel and computationally extensive In this sense, it works alongside the CPU It can be used as an accelerator using the “offload” programming model An important bottleneck is represented by the communication between host and device (through PCIe) Under this respect, it is very similar to a GPU Is it an accelerator? / 2 NOT ONLY: the Intel Xeon Phi can behave as a many-core X86 node.
    [Show full text]
  • Class-Action Lawsuit
    Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 1 of 279 Steve D. Larson, OSB No. 863540 Email: [email protected] Jennifer S. Wagner, OSB No. 024470 Email: [email protected] STOLL STOLL BERNE LOKTING & SHLACHTER P.C. 209 SW Oak Street, Suite 500 Portland, Oregon 97204 Telephone: (503) 227-1600 Attorneys for Plaintiffs [Additional Counsel Listed on Signature Page.] UNITED STATES DISTRICT COURT DISTRICT OF OREGON PORTLAND DIVISION BLUE PEAK HOSTING, LLC, PAMELA Case No. GREEN, TITI RICAFORT, MARGARITE SIMPSON, and MICHAEL NELSON, on behalf of CLASS ACTION ALLEGATION themselves and all others similarly situated, COMPLAINT Plaintiffs, DEMAND FOR JURY TRIAL v. INTEL CORPORATION, a Delaware corporation, Defendant. CLASS ACTION ALLEGATION COMPLAINT Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 2 of 279 Plaintiffs Blue Peak Hosting, LLC, Pamela Green, Titi Ricafort, Margarite Sampson, and Michael Nelson, individually and on behalf of the members of the Class defined below, allege the following against Defendant Intel Corporation (“Intel” or “the Company”), based upon personal knowledge with respect to themselves and on information and belief derived from, among other things, the investigation of counsel and review of public documents as to all other matters. INTRODUCTION 1. Despite Intel’s intentional concealment of specific design choices that it long knew rendered its central processing units (“CPUs” or “processors”) unsecure, it was only in January 2018 that it was first revealed to the public that Intel’s CPUs have significant security vulnerabilities that gave unauthorized program instructions access to protected data. 2. A CPU is the “brain” in every computer and mobile device and processes all of the essential applications, including the handling of confidential information such as passwords and encryption keys.
    [Show full text]
  • Accelerators for HP Proliant Servers Enable Scalable and Efficient High-Performance Computing
    Family data sheet Accelerators for HP ProLiant servers Enable scalable and efficient high-performance computing November 2014 Family data sheet | Accelerators for HP ProLiant servers HP high-performance computing has made it possible to accelerate innovation at any scale. But traditional CPU technology is no longer capable of sufficiently scaling performance to address the skyrocketing demand for compute resources. HP high-performance computing solutions are built on HP ProLiant servers using industry-leading accelerators to dramatically increase performance with lower power requirements. Innovation is the foundation for success What is hybrid computing? Accelerators are revolutionizing high performance computing A hybrid computing model is one where High-performance computing (HPC) is being used to address many of modern society’s biggest accelerators (known as GPUs or coprocessors) challenges, such as designing new vaccines and genetically engineering drugs to fight diseases, work together with CPUs to perform computing finding and extracting precious oil and gas resources, improving financial instruments, and tasks. designing more fuel efficient engines. As parallel processors, accelerators can split computations into hundreds or thousands of This rapid pace of innovation has created an insatiable demand for compute power. At the same pieces and calculate them simultaneously. time, multiple strict requirements are placed on system performance, power consumption, size, response, reliability, portability, and design time. Modern HPC systems are rapidly evolving, Offloading the most compute-intensive portions of already reaching petaflop and targeting exaflop performance. applications to accelerators dramatically increases both application performance and computational All of these challenges lead to a common set of requirements: a need for more computing efficiency.
    [Show full text]
  • Quick-Reference Guide to Optimization with Intel® Compilers
    Quick Reference Guide to Optimization with Intel® C++ and Fortran Compilers v19.1 For IA-32 processors, Intel® 64 processors, Intel® Xeon Phi™ processors and compatible non-Intel processors. Contents Application Performance .............................................................................................................................. 2 General Optimization Options and Reports ** ............................................................................................. 3 Parallel Performance ** ................................................................................................................................ 4 Recommended Processor-Specific Optimization Options ** ....................................................................... 5 Optimizing for the Intel® Xeon Phi™ x200 product family ............................................................................ 6 Interprocedural Optimization (IPO) and Profile-Guided Optimization (PGO) Options ................................ 7 Fine-Tuning (All Processors) ** ..................................................................................................................... 8 Floating-Point Arithmetic Options .............................................................................................................. 10 Processor Code Name With Instruction Set Extension Name Synonym .................................................... 11 Frequently Used Processor Names in Compiler Options ...........................................................................
    [Show full text]
  • Intel® E7501 Chipset for Embedded Computing
    Product Brief Intel® E7501 Chipset for Embedded Computing Product Overview The Intel® E7501 chipset represents the next step in high-performance chipset technology, supporting single- and dual-processor platforms optimized for the Intel® Xeon™ processor and Low Voltage Intel® Xeon™ processor. It also supports uni-processor platforms optimized for the Intel® Pentium® M processor. The design delivers maximized system bus, memory, and I/O bandwidth to enhance performance, scalability, and end-user productivity while providing a smooth transition to next-generation technologies. Features that Maximize Performance of an Intel® E7501 Chipset-based Platform I Dual Intel Xeon processors and a 400/533 MHz I Single or dual DDR266 memory channels system bus provide up to 4.3 GB/s of available provide up to 4.3 GB/s of memory bandwidth bandwidth I Three hub interface 2.0 connections provide Intel in I Intel Pentium M processors and a 400 MHz multiple high-bandwidth I/O configuration Communications system bus provide up to 3.2 GB/s of available options, yielding up to 3.2 GB/s of I/O bandwidth bandwidth Features Benefits Supports one or two Intel® Xeon™ processors I Intel® NetBurst™ microarchitecture and the Hyper-Threading Technology of or Low Voltage Intel® Xeon™ processors the Intel Xeon processor combine to deliver world-class performance. Supports one Intel® Pentium® M processor I New microarchitecture supports low power and high performance. 400/533 MHz system bus capability I Up to 4.3 GB/s system bus bandwidth for increased memory and I/O throughput. Intel hub architecture 2.0 connection I Point-to-point connection between the MCH and up to three P64H2 hub to the Memory Controller Hub (MCH) devices provides up to 3.2 GB/s of bandwidth.
    [Show full text]
  • HP Z2 Tower G4 Workstation
    QuickSpecs HP Z2 Tower G4 Workstation Overview HP Z2 Tower G4 Workstation 1. Power Button 6. Optional SD Card Reader 2. Headphone/Microphone 7. External 5.25’’ bay 3. 1 USB 3.0 port 4. 1 USB 3.0 Battery Charging Port 5. (Optional) 1 USB 3.1 Gen2 Type-C™ Battery Charging Port c05987463 —DA 16215 – Worldwide — Version 23 — January 5, 2021 Page 1 QuickSpecs HP Z2 Tower G4 Workstation Overview 1. 1 Audio Line In, 1 Audio Line Out, 2. 2 DisplayPortTM (DP 1.2) output from Intel® UHD graphics (available on selected processors only) 3. Optional Serial Port 4. 1 flex IO module for 2nd LAN/VGA/HDMI/DP/ USB-C 3.1 Gen2 Charging Port with Alt mode /Thunderbolt™ 3.0 (Thunderbolt™ requires x4 PCIe Add in card) 5. RJ-45 to integrated GBe 6. 2 USB 2.0 7. 4 USB 3.0 8. Optional WLAN/BT Antenna c05987463 —DA 16215 – Worldwide — Version 23 — January 5, 2021 Page 2 QuickSpecs HP Z2 Tower G4 Workstation Overview Form Factor Minitower Operating Systems Preinstalled: • Windows 10 Home* • Windows 10 Pro* • Windows 10 Pro (National Academic License)* • Windows 10 Pro for Workstations – HP recommends Windows 10 Pro * • HP Linux®-ready Supported: • Red Hat® Enterprise Linux® Workstation (1 year paper license available; Preinstall not available) * Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for updates.
    [Show full text]