15 лет доступности IOTG is extending the product availability for IOTG roadmap products from a minimum of 7 years to a minimum of 15 years when both processor and chipset are on 22nm and newer process technologies. - Xeon Scalable (w/ chipsets) - E3-12xx/15xx v5 and later (w/ chipsets) - 6th gen Core and later (w/ chipsets) - Bay Trail (E3800) and later products (Braswell, N3xxx) - Atom C2xxx (Rangeley) and later - Не включает в себя Xeon-D (7 лет) и E5-26xx v4 (7 лет) 2 IOTG Product Availability Life-Cycle 15 year product availability will start with the following products: Product Discontinuance • Intel® Xeon® Processor Scalable Family codenamed Skylake-SP and later with associated chipsets Notification (PDN)† • Intel® Xeon® E3-12xx/15xx v5 series (Skylake) and later with associated chipsets • 6th Gen Intel® Core™ processor family (Skylake) and later (includes Intel® Pentium® and Celeron® processors) with PDNs will typically be issued no later associated chipsets than 13.5 years after component • Intel Pentium processor N3700 (Braswell) and later and Intel Celeron processors N3xxx (Braswell) and J1900/N2xxx family introduction date. PDNs are (Bay Trail) and later published at https://qdms.intel.com/ • Intel® Atom® processor C2xxx (Rangeley) and E3800 family (Bay Trail) and late Last 7 year product availability Time Last Last Order Ship Last 15 year product availability Time Last Last Order Ship L-1 L L+1 L+2 L+3 L+4 L+5 L+6 L+7 L+8 L+9 L+10 L+11 L+12 L+13 L+14 L+15 Years Introduction of component family † Intel may support this extended manufacturing using reasonably Last Time Order/Ship Periods Component family introduction dates are feasible means deemed by Intel to be appropriate. Future business, Publication of the PDN will typically be available from your Intel Sales Representative. manufacturing, or market conditions may change, which may cause followed by: 12 month last time order Refresh SKU offerings launched after the Intel to revisit the EOL/PDN timing. Intel may make changes to period, followed by 6 month last time component family will follow the original dates and schedule at any time without notice ship period. component family introduction date. 3 Какие модели будут доступны 15 лет? https://ark.intel.com/ 4 Зачем использовать embedded parts? - Долгая доступность (15 лет) - Разные т.н. USE CONDITIONS: Use Conditions Temp Range Reliability DPM Automotive 15Y Reliability at 11.4% Active, • Advanced Driver Assistance Systems (ADAS) Automotive Grade 2, T = -40⁰ to 105⁰ C <10 la Tj-max = 110o - 125o C, • Software Defined Cockpit (SDC) 10Y Reliability at 100% active, CT – Commercial Temp: T = 0o to 70o C Industrial la Tj-max = 100o - 110o C <500 ET – Extended Temp: T = -40o to 85o C la Base Frequency only – No core or graphics turbo o o CT – Commercial Temp: Tla = 0 to 70 C 10Y Reliability at 100% active, Communications o o o o <500 ET – Extended Temp: Tla = -40 to 85 C Tj-max = 100 - 105 C 5Y Reliability at 80% Active, Embedded Broad Market CT – Commercial Temp: T = 0o to 70o C <500 la Tj-max = 100o - 105o C 5Y Reliability at 80% Active, Server/Enterprise CT – Commercial Temp: T = 0o to 70o C <500 la Tj-max sku dependent 5Y Reliability up to 30% Active, PC/Client/Tablet CT – Commercial Temp: T = 0o to 70o C <500 la Tj-max sku dependent, 5 АНАЛИТИКА, ОБЛАКА НОВЫЕ СЕТИ СУПЕРКОМПЬЮТЕРЫ, УМНЫЕ ДАННЫЕ 18% CAGR from SDN/NFV spend up to AI is the fastest growing 2017-20201 $157B through 20202 datacenter workload3 1. Source: IDC Q4’16 Cloud Infrastructure Tracker 2. Source: Technology Business Research, Sept 2015 3. Source: Amalgamation of Intel financials, analyst data and Intel analysis, Intel revenue includes FPGAs. 6 «Строительные блоки» для решения текущих задач Analytics & Technical Intel Scalable Machine Learning Intel / Cloudera Computing System Framework Software Intel® Data Intel® Cache Intel® Parallel Intel® Media Management, Center Manager Accelration SW Software Studio XE Server Studio Orchestration Intel® Virtual Development Intel® Intel® Intel® Intel® RSTe & Storage Gateway Tools Inspector VTune CoFluent™ Wind River Intel ® AES-NI Intel® SHA Intel® MKL Library Intel® DPDK Intel® MPI Library Instructions Extensions SW & OpenGL/DX on Intel® Data Analytics Instructions … Intel® HD Graphics Acceleration Library (DAAL) … Intel ® AVX Intel ® TSX Libraries Instructions Instructions Intel ® TXT Intel® SPDK Intel® ISA-L Embree Intel® QAT Intel® DLIA Intel® VCA Intel® Network Silicon Processors Chipsets Ethernet Omni-Path ASICs Photonics FPGAs SSDs Fabric Accelerators 7 Intel® Xeon® Scalable Processors ФУНДАМЕНТ ДАТАЦЕНТРА БУДУЩЕГО: ГИБКАЯ И НАДЕЖНАЯ АРХИТЕКТУРА Производительность Оптимизировано под все нагрузки: ПРОСТОТА Там, где надо Compute, storage, Network ВНЕДРЕНИЯ В среднемувеличение производительности в 1.6x раза против e5/e7 v4 6 * New features in bold ПРОИЗВОДИТЕЛЬНОСТЬ ЯДРА ПРОИЗВОДИТЕЛЬНОСТЬ СОКЕТА Faster application response time Increased multi-tenancy & VM density for cloud More choices to optimize software license costs Application performance for parallelizable workloads ▪ New core micro-architecture ▪ More cores ▪ New lower latency cache memory hierarchy design ▪ New High-speed Interconnects = much greater inter-CPU bandwidth ПАМЯТЬ И ШИНА PCI-E УСКОРЕНИЕ СПЕЦ ВЫЧИСЛЕНИЙ High bandwidth connections for networking Application specific instructions and accelerators and memory performance ▪ Intel® AVX-512 (2X FLOPs/clock) for HPC, Analytics, Database, & ▪ More memory bandwidth via added memory channels Security ▪ Int. Intel® QuickAssist Technology: faster crypto & data compression ▪ Significantly more PCIe IO bandwidth versus prior gen ▪ Intel® FPGA: Big speedups on server/storage/networking algorithms ▪ Richer chipset & IO support options БЕЗОПАСНОСТЬ ГИБКОСТЬ Built in performant security for trusted infrastructure Optimized architecture for Hybrid-Cloud world ▪ Up to 2X security algorithm performance improvements ▪ Enhanced Intel® RunSure Technology ▪ Root of trust with Intel® TXT-OTA, Intel® PTT and Intel® Boot Guard ▪ Enhanced Intel® Virtualization Technology (VT-x): MBE & TSC ▪ New Key Protection Technology (w/ integrated Intel® QAT & Intel PTT) ▪ New Intel® VMD for improved management of NVMe SSD drives • Mode-based Execute Control (MBE): • Timestamp Counter Scaling (TSC): 99 «СЕТЕВАЯ» архитектура: ▪ Максимальная производительность ▪ Гарантированно низкие задержки при передачи данных ▪ Оптимизировано для работы с общей памятью ▪ Масшабируется эффективно для 2, 4, & 8+ сокет конфигур МОНОЛИТНОЕ ЯДРО МОНОЛИТНОЕ Enhanced PCIe Note: Not representative of top bin die Много вычислительных ядер, быстрая память, малые задержки 10 2016 2017 2018 Intel® Xeon® Processor E7 Brickland Platform Purley Platform High-end сервера с Skylake Cascade Lake масшабированием по сокетам и E7 v3 E7 v4 поддержкой RAS Intel® Xeon® PLATINUM Intel Xeon GOLD Intel® Xeon® Processor E5 Grantley-EP Platform Intel Xeon SILVER Сбалансированные 2х сокет E5 v3 E5-4600 v4 (4S) системы с лучшим соотнош Intel Xeon BRONZE performance/watt/$ E5 v3 E5-2600 v4 Общая платформа для построения E5 и e7 –class решений 11 INTEL® XEON® SCALABLE PROCESSOR The Foundation for Agile, Secure Workload-Optimized Hybrid Cloud INTEL® XEON® PLATINUM 81xxPROCESSORS • Most cores (28C, 56T) • Highest frequency (up to 3.6 GHz, 4C) • Most Socket flexibility (2, 4, 8+) • Elite IO/memory (48 PCIe 3.0 lanes, 6 memory channels) • UP TO Most/fastest 3SCALABLE UPI (Ultra PERFORMANCE Path Interconnects, 10.4SCALABLE GT/s) PERFORMANCE SCALABLE PERFORMANCE 28 CORES • Fastest MemoryMEMORY (DDR4 PERFORMANCE-2666 MHz) BETTER AT LOW POWER HARDWARE-ENHANCED SECURITY •GREATHighest Intel®ADVANCED AVX-512 RAS with 2 FMA per core STANDARD RAS ENTRY STANDARD RAS • Intel® Turbo Boost and Intel® Hyper-Threading Technology UP SOCKET WITH UPI • New Advanced RAS TO 2, 4 & UP TO 8 SUPPORT 3 LINKS • NodeWORKLOAD Controller-OPTIMIZED Support to assist in scaled node management MODERATE TASKS DEDICATED TASKS M TOPLINE MEMORY DDR4 H WITH RESULT: TASKS 2666 Z UP TO 1.5 TB CHANNEL BANDWIDTH • Best workload-optimized performance for general purpose compute across virtualized environmentsPERFORMANCE FOR GENERAL and hybrid-PURPOSE cloud deploymentsINTEL® TURBO BOOST TECHNOLOGY AND AFFORDABLE, ENTRY PERFORMANCE • INTEL® HYPER-THREADING TECHNOLOGY ACCELERATOR BestCOMPUTE, choice STORAGE for AND mission NETWORKING-critical, traditional DC apps, real-time analytics,FOR and LIGHT AI/deep-RANGE WORKLOADS HIGHEST THROUGHPUT learning inference workloads; smart pathFOR for MODERATE DL training WORKLOADS • Best performance for the most demanding storage and networking workloads MAINSTREAM RAS: Reliability, Availability, and Serviceability 12 INTEL® XEON® SCALABLE PROCESSOR The Foundation for Agile, Secure Workload-Optimized Hybrid Cloud INTEL® XEON® GOLD 61xxPROCESSORS • 22C (44 threads w/ HT) • 2 and 4S • Up to 3.4 GHz, (6C) • 3 UPI links (10.4GT/s) • DDR4-2666 MHz • Intel® AVX-512 with 2 FMA • Node ControllerSCALABLE Support PERFORMANCE UP TO • Enhanced scalability and workload optimized performanceSCALABLE PERFORMANCE for UP TO 28 CORES 22 CORES AT LOW POWER HARDWARE-ENHANCED SECURITY BETTERgeneral purpose/virtualized computeENTRY & hybrid cloud • Improved performanceSTANDARD RAS for demanding storageSTANDARD and networking RAS UP SOCKET WITH UPI SOCKET TO 2, 4 & 8 SUPPORT UP TO 3 LINKS 2 & 4 SUPPORT INTEL® XEON® GOLD 51XXPROCESSORS DEDICATED TASKS • UpMODERATE to 14C (28T) TASKS M WITH TOPLINE MEMORY DDR4 H UP TO UPI LINKS • 2 UPI links - 2666 Z UP TO 1.5 TB CHANNEL BANDWIDTH 3 • DDR4-2400 MHz