Intel® Xeon® Processor E5 V3 Family Thermal Guide

Intel ® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide

October 2015

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Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 2 Order No.: 330786-003 Revision History—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

Revision History

Revision Description Date Number

001 Initial release September 2014

002 Added Intel® Xeon® processor E5-4600 v3 product families. June 2015

003 Updated a socket part number on Table 25. October 2015

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Contents

Revision History...... 3

1.0 Introduction...... 10 1.1 Definition of Terms...... 10 2.0 LGA2011-3 Socket Overview...... 12 2.1 Socket Components...... 13 2.2 Socket Land Pattern Guidance...... 17 2.3 Socket Loading Requirements...... 20 2.3.1 Socket Loading Specifications...... 21 2.4 Socket Maximum temperature...... 21 2.5 Strain Guidance for Socket...... 22 3.0 Independent Loading Mechanism (ILM) Specifications...... 23 3.1 ILM Load Specifications...... 24 3.2 ILM Keepout Zones (KOZ)...... 25 3.3 Independent Loading Mechanism (ILM)...... 25 3.4 ILM Mechanical Design Considerations and Recommendations...... 25 3.5 ILM Features...... 26 3.6 Intel® ILM Reference Designs...... 28 3.6.1 Square ILM...... 28 3.6.2 Narrow ILM...... 30 3.7 ILM Cover...... 32 3.8 ILM Allowable Board Thickness...... 33 4.0 Processor Thermal Specifications and Features...... 34

4.1 Tcase and DTS-Based Thermal Specification Implementation...... 34 4.1.1 Margin to Thermal Specification (M)...... 34 4.2 Processor Thermal Features...... 36 4.2.1 Absolute Processor Temperature...... 36 4.2.2 Short Duration TCC Activation ...... 36 4.3 Processor Thermal Specifications...... 36 4.3.1 Thermal Specifications...... 37 4.3.2 TCASE and DTS Based Thermal Specifications...... 37 4.3.3 Server Processor Thermal Profiles and Form Factors...... 38 4.3.4 Server 4S Processor Thermal Profiles and Form Factors...... 40 4.3.5 Workstation Processor Thermal Profiles and Form Factors...... 41 4.3.6 Embedded Server Processor Thermal Profiles...... 42 4.3.7 Thermal Metrology...... 44 5.0 Processor Thermal Solutions...... 47 5.1 Processor Boundary Conditions for Shadowed and Spread Core Layouts...... 47 5.2 Heatsink Design Considerations...... 49 5.3 Thermal Design Guidelines...... 50 5.3.1 Intel® Turbo Boost Technology...... 50 5.3.2 Thermal Excursion Power...... 50 5.3.3 Thermal Characterization Parameters...... 51 5.4 Thermal Interface Material (TIM) Considerations...... 52 5.5 Mechanical Recommendations and Targets...... 53

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5.5.1 Processor / Socket Stackup Height...... 53 5.5.2 Processor Heatsink Mechanical Targets...... 54 5.6 Heatsink Mechanical and Structural Considerations...... 55 5.7 Intel Reference Design Heat Sink...... 55 5.7.1 2U Square Heatsink Performance...... 57 5.7.2 1U Square Heatsink Performance...... 58 5.7.3 1U Narrow Heatsink Performance...... 59 5.7.4 Workstation Tower Active Heatsink Performance...... 60 5.7.5 Mechanical Load Range...... 61 5.7.6 Thermal Interface Material (TIM)...... 61 6.0 Processor Mechanical Specifications...... 62 6.1 Package Size...... 62 6.2 Package Loading Specifications...... 63 6.3 Processor Mass Specification...... 64 6.4 Processor Materials...... 64 6.5 Processor Markings...... 64 6.6 Package Handling Guidelines...... 66 7.0 Boxed Processor Specifications...... 67 7.1 Boxed Processor Thermal Solutions...... 67 7.1.1 Available Boxed Thermal Solution Configurations...... 67 7.1.2 Intel® Thermal Solution STS200C (Passive/Active Combination Heat Sink Solution)...... 67 7.1.3 Intel® Thermal Solution STS200P and STS200PNRW (Boxed 25.5 mm Tall Passive Heat Sink Solutions)...... 68 7.1.4 Thermal Interface Material (TIM)...... 68 7.2 Boxed Processor Cooling Requirements...... 69 7.3 Mechanical Specifications...... 69 7.4 Fan Power Supply [STS200C]...... 70 7.5 Boxed Processor Contents...... 71 8.0 Quality Reliability and Ecological Requirements...... 72 8.1 Use Conditions...... 72 8.2 Intel® Reference Component Validation...... 73 8.2.1 Board Functional Test Sequence...... 73 8.2.2 Post-Test Pass Criteria Examples...... 73 8.2.3 Recommended BIOS/Processor/Memory Test Procedures...... 74 8.3 Material and Recycling Requirements...... 74 Appendix A Component Suppliers...... 76

Appendix B Mechanical Drawings...... 78 B.1 Large Package Mechanical Drawing Page 1...... 79 B.2 Large Package Mechanical Drawing Page 2...... 80 B.3 Package Mechanical Drawing Page 1...... 81 B.4 Package Mechanical Drawing Page 2...... 82 B.5 ILM Backplate Keep Out Zone...... 83 B.6 ILM Mounting Hole Keep Out Zone...... 84 B.7 Narrow ILM Keep Out Zone...... 85 B.8 Narrow ILM 3D Keep Out Zone...... 86 B.9 ILM Keep Out Zone...... 87 B.10 3D Keep Out Zone...... 88

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B.11 Heat Sink Retaining Ring...... 89 B.12 Heat Sink Spring...... 90 B.13 Heat Sink Spring Cup...... 91 B.14 1U Narrow Heat Sink Geometry (Page 1)...... 92 B.15 1U Narrow Heat Sink Geometry (Page 2)...... 93 B.16 1U Narrow Heat Sink Assembly (Page 1)...... 94 B.17 1U Narrow Heat Sink Assembly (Page 2)...... 95 B.18 1U Square Heat Sink Geometry (Page 1)...... 96 B.19 1U Square Heat Sink Geometry (Page 2)...... 97 B.20 1U Square Heat Sink Assembly (Page 1)...... 98 B.21 1U Square Heat Sink Assembly (Page 2)...... 99 B.22 2U Square Heat Sink Geometry (Page 1)...... 100 B.23 2U Square Heat Sink Geometry (Page 2)...... 101 B.24 2U Square Heat Sink Assembly (Page 1)...... 102 B.25 2U Square Heat Sink Assembly (Page 2)...... 103

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Figures 1 Hexagonal Array in LGA2011-3...... 12 2 Socket with Labeled Features...... 13 3 Contact Wiping Direction...... 14 4 Contact Tip Offset with Respect to Solder Ball...... 15 5 Processor Socket Stack Up...... 16 6 Pick and Place Cover with Labeled Features...... 16 7 PnP Cover and Socket Assembly...... 17 8 Socket 2011-3 Land Pattern...... 18 9 Socket 2011-3 Pad Types and Locations...... 20 10 Socket Temperature Measurement ...... 22 11 Processor Stack...... 23 12 ILM Load Plate...... 27 13 ILM Backplate...... 28 14 Exploded Square ILM...... 29 15 Assembled Square ILM...... 30 16 Exploded Narrow ILM...... 31 17 Assembled Narrow ILM...... 32 18 ILM cover...... 33 19 Margin to Thermal Spec (M)...... 35 20 Typical Thermal Profile Graph (Illustration Only)...... 38 21 Case Temperature (TCASE) Measurement Location for Large Package ...... 45 22 Case Temperature (TCASE) Measurement Location for Small Package...... 46 23 Typical Shadowed Layout...... 47 24 Typical Spread Core Layout...... 48 25 Thermal Characterization Parameters...... 52 26 Integrated Stack Up Height...... 53 27 Available Cooling Area for Top of Large and Small IHS...... 54 28 1U Form Factor Heat Sinks...... 56 29 2U Form Factor Heat Sinks...... 56 30 Workstation Form Factor Heat Sink...... 57 31 Processor Package Assembly Sketch...... 62 32 Rendering of Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Small Form Factor...... 63 33 Rendering of Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Large Form Factor...... 63 34 Small Package Labeling...... 65 35 Large Package Labeling...... 66 36 STS200C Active / Passive Combination Heat Sink (with Removable Fan) ...... 68 37 STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks ...... 68 38 Fan Cable Connector Pin Out for 4-Pin Active Thermal Solution...... 71 39 Intel® Xeon® Processor v3 Product Families Large Package Mechanical Drawing Page 1.... 79 40 Intel® Xeon® Processor v3 Product Families Large Package Mechanical Drawing Page 2.... 80 41 Intel® Xeon® Processor v3 Product Families Small Package Mechanical Drawing Page 1.... 81 42 Intel® Xeon® Processor v3 Product Families Small Package Mechanical Drawing Page 2.... 82 43 ILM Backplate Keep Out Zone...... 83 44 ILM Mounting Hole Keep Out Zone...... 84 45 Narrow ILM Keep Out Zone...... 85 46 Narrow ILM 3D Keep Out Zone...... 86 47 Square ILM Keep Out Zone...... 87 48 Square 3D Keep Out Zone...... 88 49 Heat Sink Retaining Ring...... 89 50 Heat Sink Spring...... 90 51 Heat Sink Spring Cup...... 91 52 1U Narrow Heat Sink Geometry (Page 1)...... 92

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53 1U Narrow Heat Sink Geometry (Page 2)...... 93 54 1U Narrow Heat Sink Assembly (Page 1)...... 94 55 1U Narrow Heat Sink Assembly (Page 2)...... 95 56 1U Square Heat Sink Geometry (Page 1)...... 96 57 1U Square Heat Sink Geometry (Page 2)...... 97 58 1U Square Heat Sink Assembly (Page 1)...... 98 59 1U Square Heat Sink Assembly (Page 2)...... 99 60 2U Square Heat Sink Geometry (Page 1)...... 100 61 2U Square Heat Sink Geometry (Page 2)...... 101 62 2U Square Heat Sink Assembly (Page 1)...... 102 63 2U Square Heat Sink Assembly (Page 2)...... 103

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Tables 1 Terms and Descriptions...... 10 2 LGA2011-3 Socket Attributes...... 12 3 PIN Count By Pad Definition...... 19 4 Socket Load Values...... 21 5 LGA 2011-3 Maximum Allowable Loads...... 24 6 LGA 2011-3 Minimum Allowable Loads...... 24 7 LGA 2011-3 Minimum End of Life Loads...... 25 8 LGA 2011-3 ILM General Keepout Dimensions ...... 25 9 Square ILM Component Thickness and materials...... 30 10 Narrow ILM Component Thickness and materials...... 32 11 DTS 2.0 Margin From PECI...... 35 12 DTS 2.0 Margin From Processor Register: CSR for PACKAGE_THERM_MARGIN ...... 36 ® ® 13 Intel Xeon Processor E5-1600 and E5-2600 v3 Product Families Stack Tcase and DTS Thermal Profiles and Correction Factors...... 38 ® ® 14 Intel Xeon Processor E5-4600 v3 Product Families Stack Product Family Tcase and DTS Thermal Profiles and Correction Factors...... 40 15 Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families 1S Workstation Stack Tcase and DTS Thermal Profiles and Correction Factors...... 41 16 Embedded Server Processor Thermal Profiles...... 43 17 Processor Boundary Conditions for Shadowed and Spread Core Layouts...... 48 18 Target Stackup Heights From Top of Board to Top of IHS...... 53 19 Available Cooling Area for Large and Small IHS...... 54 20 Heatsink Mechanical Targets...... 54 21 Processor Loading Specifications...... 64 22 Processor Materials...... 64 23 Load Limits for Package Handling...... 66 24 Intel® Reference or Collaboration Thermal Solutions...... 76 25 LGA2011-3 Socket and ILM Components ...... 76 26 List of Mechanical Drawings...... 78

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1.0 Introduction

This document provides specifications and guidelines for the design of thermal and mechanical solutions for the Intel® Xeon® processor E5-1600, E5-2600, and E5-4600 v3 product families.

The components and information described in this document include: • Thermal profiles and other processor specifications and recommendations • Processor Mechanical load limits

The goals of this document are: • To assist board and system thermal mechanical designers • To assist designers and suppliers of processor heatsinks

1.1 Definition of Terms

Table 1. Terms and Descriptions

Term Description

Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.

DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.

FSC Fan Speed Control

IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

Square ILM Independent Loading Mechanism provides the force needed to seat the 2011-LGA package onto the socket contacts and has 56 × 94mm heatsink mounting hole pattern

Narrow ILM Independent Loading Mechanism provides the force needed to seat the 2011-LGA package onto the socket contacts and has 56 × 94mm heatsink mounting hole pattern

LGA2011-3 Socket The processor mates with the system board through this surface mount, 2011-contact socket.

PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. continued...

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Term Description

ΨCA Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (TCASE – TLA) / Total Package Power. Heat source should always be specified for Ψ measurements.

ΨCS Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (TCASE – TS) / Total Package Power.

ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS – TLA) / Total Package Power.

Tcase The case temperature of the processor measured at the geometric center of the topside of the IHS.

Tcase-Max The maximum case temperature as specified in a component specification.

TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.

TCONTROL TCONTROL is a static value below TCC activation used as a trigger point for fan speed control. When DTS > TCONTROL, the processor must comply to the thermal profile.

TDP Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate.

Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature.

Thermal Profile Line that defines case temperature specification of a processor at a given power level.

TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.

TLA The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.

TSA The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.

U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, and so forth.

LCC Low Core Count, refers to silicon die size

MCC Mid Core Count, refers to silicon die size

HCC High Core Count, refers to silicon die size

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2.0 LGA2011-3 Socket Overview

This section describes a surface mount, LGA (Land Grid Array) socket intended for the Intel® Xeon® processor E5-1600 and E5-2600 v3 product families processor-based platform. The socket provides I/O, power and ground contacts for processor operation. The socket contains 2011 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

The LGA2011-3 uses a hexagonal area array ball-out which provides many benefits: • Socket contact density increased by 12% while maintaining 40 mil minimum via pitch requirements. as compared to a linear array • Corresponding square pitch array’s would require a 38mil via pitch for the same package size.

LGA2011-3 has 1.016 mm (40 mil) hexagonal pitch in a 58x43 grid array with 24x16 grid depopulation in the center of the array and selective depopulation elsewhere.

Figure 1. Hexagonal Array in LGA2011-3

Table 2. LGA2011-3 Socket Attributes

LGA2011-3 Socket Attributes

Component Size 58.5 mm (L) X 51 mm (W)

Pitch 1.016 mm (Hex Array)

Ball Count 2011

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The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). Internal keying posts ensure socket processor compatibility. An external socket key ensures ILM and socket compatibility. The ILM reference design includes a back plate; an integral feature for uniform loading on the socket solder joints and contacts.

2.1 Socket Components

The socket has two main components, the socket body: composed of a housing solder balls, and processor contacts, and Pick and Place (PnP) cover. The socket is delivered as a single integral assembly. Below are descriptions of the integral parts of the socket.

Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260°C for 40 seconds (typical reflow/rework). The socket coefficient of thermal expansion (in the XY plane), and creep properties, are such that the integrity of the socket is maintained for the environmental conditions listed in the TMSDG.

The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems. A labeled representation of the socket can be seen in the figure below.

Figure 2. Socket with Labeled Features

Solder Balls

A total of 2011 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard.

The socket has the following solder ball material:

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• Lead free SAC305 (SnAgCu) solder alloy with a silver (Ag) content 3%, copper (Cu) 0.5%, tin (Sn) 96.5% and a melting temperature of approximately 217°C. The immersion silver (ImAg) motherboard surface finish and solder paste alloy must be compatible with the SAC305 alloy solder paste.

Contacts

The base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 mm [0.015 inches] minimum gold plating over 1.27 mm [0.05 inches] minimum nickel underplate. No contamination by solder in the contact area is allowed during solder reflow. All socket contacts are designed such that the contact tip lands within the substrate pad boundary before any actuation load is applied and remain within the pad boundary at final installation, after actuation load is applied.

The contacts are laid out in two L-shaped arrays as shown in the figure below. The detailed view of the contacts indicate the wiping orientation of the contacts in the two regions to be 29.6°.

Figure 3. Contact Wiping Direction

The contact between substrate land and socket contact are offset. The following diagram shows contact offset from solder ball location and orientation of contact tip.

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Figure 4. Contact Tip Offset with Respect to Solder Ball

Socket Standoffs

Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow. The following diagram highlights each feature of the socket-processor stack up.

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Figure 5. Processor Socket Stack Up

Pick and Place Cover

The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The proceeding diagram labels key features of the Pick and Place cover.

Figure 6. Pick and Place Cover with Labeled Features

The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260°C for 40 seconds (typical reflow/rework profile) and the environmental conditions listed in the TMSDG.

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The following figure diagrams the PnP and socket assembly. To reduce risk of damage to socket contacts the pick and place (PnP) cover remains on the socket during ILM installation.

Figure 7. PnP Cover and Socket Assembly

Once the ILM with its cover is installed Intel is recommending the PnP cover be removed to help prevent damage to the socket contacts. To reduce the risk of bent contacts the PnP Cover and ILM Cover were designed to not be compatible. Covers can be removed without tools.

The pick and place covers are designed to be interchangeable between socket suppliers.

2.2 Socket Land Pattern Guidance

The land pattern guidance provided in this section applies to printed circuit board design. Recommendation for Printed Circuit Board (PCB) Land Patterns is to ensure solder joint reliability during dynamic stresses, often encountered during shipping and handling and hence to increase socket reliability.

LGA 2011-3 Land Pattern

The land pattern for the LGA2011-3 socket is 40 mils hexagonal array see the following figure for detailed location and land pattern type.

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Note: There is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent.

Figure 8. Socket 2011-3 Land Pattern

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Table 3. PIN Count By Pad Definition

Pad Definition / Padstack Color Quantity

20 X 17 Oblong Partially SMD / O17X20 RED Pins 43

20 X 17 Oblong Partially SMD / O17X20 LIGHT BLUE Pins 123

17 mil Ø MD / C17 GREY Pins 1845

Notes: 1. RED Pins: Corner nCTF pads (43 total) are all designed as 20 X 17 mil oblong partially soldermask defined pads with an SRO of 17 ±1 mil Ø (shown below). The long axis of the pad is oriented at 45° from the center of the socket. All nCTF pads require thick traces ideally oriented at 45° toward the package corner. 2. LIGHT BLUE Pins: Edge CTF pads (total) are all designed as 20 X 17 mil oblong partially soldermask defined pads with an SRO of 17 ±1 mil Ø (shown below). The long axis of the pad is oriented at 90° to the socket edge. 3. GREY Pins: Critical to function pins are all designed as 17 mil circular MD (Metal Defined) pads.

Pad Type Recommendations

Intel defines two types of pad types based on how they are constructed. A metal defined (MD) pad is one where a pad is individually etched into the PCB with a minimum width trace exiting it. The solder mask defined (SMD) pad is typically a pad in a flood plane where the solder mask opening defines the pad size for soldering to the component. In thermal cycling a MD pad is more robust than a SMD pad type. The solder mask that defines the SMD pad can create a sharp edge on the solder joint as the solder ball / paste conforms to the window created by the solder mask. For certain failure modes the MD pad may not be as robust in shock and vibration (S&V). During S&V, the predominant failure mode for a MD pad in the corner of the BGA layout is pad craters and solder joint cracks. A corner MD pad can be made more robust and behave like a SMD pad by having a wide trace enter the pad. This trace should be 10 mil minimum wide but not to exceed the pad diameter and exit the pad at a 45 degree angle (parallel to the diagonal of the socket). During board flexure that results from shock & vibration, a SMD pad is less susceptible to a crack initiating due to the larger surface area. Intel has defined selected solder joints of the socket as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality.

The following figure diagrams shape and location of solder pad types for socket 2011-3.

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Figure 9. Socket 2011-3 Pad Types and Locations

Notes: 1. When ordering PCBs with the Socket R (LGA2011) footprint, it is important to specify the following verbiage on the FAB drawing as well as within the purchase requisition: All BGA pads, Soldermask or Metal defined, min/max size tolerance, should comply with Intel PCB specification, current revision. Nominal BGA pad size, Soldermask or Metal defined, is Ø +/- 1 mil. This pad size is critical to function on socket locations. 2. The solder paste stencil aperture recommendation for Socket R (LGA2011) is: 24 mil Ø circular aperture opening with a stencil thickness of 5 mils.

2.3 Socket Loading Requirements

The socket must meet the mechanical loading and strain requirements outlined in the table below. All dynamic requirements are under room temperature conditions while all static requirements are under product use condition temperature. Specifically, ILM and HS load range may vary for different LGA 2011 derivatives (e.g. 2011-0, 2011-1) due to the package form factor, and the design of loading mechanism and thermal solution (e.g., HS mass).

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2.3.1 Socket Loading Specifications

The table below provides load specifications for the socket. These mechanical limits should not be exceeded during component assembly, mechanical stress testing, or standard drop and shipping conditions. All dynamic requirements are under room temperature conditions while all static requirements are under 100 °C conditions.

Table 4. Socket Load Values

Parameter Load Limits, Load Limits, Definition SI Units Imperial Units

Min Max Min Max

Static Compressive 15 (gf) 38 (gf) 0.53 1.34 (ozf) The compressive load applied by the package on the per Contact (ozf) LGA contacts to meet electrical performance. This condition must be satisfied throughout the life of the product

Static Compressive 445 (N) 712 (N) 100 (lbf) 160 (lbf) The total load applied by the enabling mechanism onto (ILM) the socket as transferred through the package, contacts and socket seating plane.

Static Compressive 222 (N) 400 (N) 50 (lbf) 90 (lbf) The total load applied by the heatsink mechanism onto Beginning of Life the socket as transferred through the package, contacts and socket seating plane. Measured at Beginning of Life (HS)

Static Compressive 178 (N) 400 (N) 40 (lbf) 90 (lbf) The total load applied by the heatsink mechanism onto End of Life the socket as transferred through the package, contacts and socket seating plane. Measured at End of Life (HS)

Static Total 667 (N) 1068 (N ) 150 (lbf) 240 (lbf) The total load applied by enabling mechanism and heat Compressive sink onto the socket as transferred through the package, contacts and socket seating plane.

Dynamic NA 588 (N) NA 132 (lbf) Quasi-static equivalent compressive load applied during Compressive the mechanical shock from heatsink, calculated using a reference 600g heatsink with a 25G shock input and an amplification factor of 3 (600g x 25G x 3 =441N=99 lbf). This specification can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this value. Intel reference system shock requirement for this product family is 25G input as measured at the chassis mounting location.

Board Transient NA 500 (ue) NA 500 (ue) This is the strain on boards near to socket BGA corners Bend Strain for 62 for 62 during transient loading events through manufacturing (mil); (mil); flow or testing. The test guidance can be found in Board 400 (ue) 400 (ue) Flexure Initiative (BFI) strain guidance from your local for 100 for 100 CQE. (mil) (mil)

2.4 Socket Maximum temperature

The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the temperature guidance may result in socket body deformation, or increases in thermal and electrical resistance which can cause a thermal runaway and eventual electrical failure. The guidance for socket maximum temperature is listed below: • Via temperature under socket <78 °C

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• The specific via used for temperature measurement is located on the bottom of the motherboard between pins BC1 and BE1. • The socket maximum temperature is defined at Thermal Design Current (TDC). In addition, the heatsink performance targets and boundary conditions must be met to limit power dissipation through the socket.

To measure via temperature: 1. Drill a hole through the back plate corresponding to the location of pins BC1 and BE1. 2. Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into the specific measurement via on the underside of the motherboard. 3. Once the glue dries, reinstall the back plate and measure the temperature

Figure 10. Socket Temperature Measurement

2.5 Strain Guidance for Socket

Intel provides manufacturing strain guidance commonly referred to as Board Flexure Initiative or BFI Strain Guidance. The BFI strain guidance apply only to transient bend conditions seen in board manufacturing assembly environment with no ILM, for example during In Circuit Test. BFI strain guidance limits do not apply once ILM is installed. It should be noted that any strain metrology is sensitive to boundary conditions. Intel recommends the use of BFI to prevent solder joint defects from occurring in the test process. For additional guidance on BFI, see Manufacturing With Intel® Components - Strain Measurement for Circuit Board Assembly, also referred as BFI MAS ( Manufacturing Advantage Services) and BFI STRAIN GUIDANCE SHEET (LGA2011-3 socket). Consult your Intel Customer Quality Engineer for additional guidance in setting up a BFI program in your factory.

Note: When the ILM is attached to the board, the boundary conditions change and the BFI strain limits are not applicable. The ILM, by design, increases stiffness in and around the socket and places the solder joints in compression. Intel does not support strain metrology with the ILM assembled.

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3.0 Independent Loading Mechanism (ILM) Specifications

The Independent Loading Mechanism (ILM) provides the force needed to seat the land LGA package onto the socket contacts. See image below for total processor stack consisting of all relevant mechanical components.

Figure 11. Processor Stack

The ILM is physically separate from the socket body. The assembly of the ILM is expected to occur after attaching the socket to the board. The exact assembly location is dependent on manufacturing preference and test flow.

The mechanical design of the ILM is a key contributor to the overall functionality of the socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be "built to print" from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters.

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The ILM has two critical functions: evenly deliver and distribute the force to seat the processor onto the socket contacts and ultimately through the socket solder joints. Another purpose of ILM is to ensure electrical integrity/performance of the socket and package.

Socket LGA2011-3 has two POR (Plan of Record) ILMs: 1. Square ILM - This ILM has 80x80mm heatsink mounting hole pattern. 2. Narrow ILM - This ILM has 56x94mm heatsink mounting hole pattern.

3.1 ILM Load Specifications

The Independent Loading Mechanism (ILM) provides the force needed to seat the package onto the socket contacts.

Maximum Allowable Loads The table below provides load specifications for the processor package. These maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure or other damage to the system. The processor substrate should not be used as a mechanical reference or load bearing surface for thermal solutions.

Table 5. LGA 2011-3 Maximum Allowable Loads

Item Maximum

Static Pre-Load Compressive (ILM load) 712N (160 lbf)

Static Pre-Load Compressive (HS load) 400N (90 lbf)

Total Socket Static Compressive (ILM+HS=Socket) 1068N (240 lbf)

Minimum Allowable Loads The ILM is designed to achieve the minimum Socket Static Pre-Load Compressive load specification. The thermal solution (heatsink) should apply additional load. The combination of an ILM and HS will be used to achieve the load targets shown in the table below.

Table 6. LGA 2011-3 Minimum Allowable Loads

Item Minimum

Static Pre-Load Compressive (ILM load) 445N (100 lbf)

Static Pre-Load Compressive (HS load) 222N (50 lbf)

Total Socket Static Compressive (ILM+HS=Socket) 667N (150 lbf)

End of Life Load Targets The ILM is designed to achieve the minimum end of life loads for the socket. The thermal solution (heatsink) should apply a portion of the end of life load. The combination of an ILM and HS will be used to achieve the load targets shown in the table below.

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Table 7. LGA 2011-3 Minimum End of Life Loads

Item End of Life Minimum

Static Pre-Load Compressive (ILM load) 311N (70 lbf)

Static Pre-Load Compressive (HS load) 178N (40 lbf)

Total Socket Static Compressive (ILM+HS=Socket) 490N (110 lbf)

3.2 ILM Keepout Zones (KOZ)

The table below lists envelope dimensions for ILM KOZ , both topside and backplate. For detailed views, refer to dimensioned drawings in Mechanical Drawings on page 78.

Table 8. LGA 2011-3 ILM General Keepout Dimensions

Keepout Type Square ILM Narrow ILM

Topside envelope 93x93 mm (3.6x3.7in) 80x107.5 mm (3.15x4.2in)

ILM Hole Location 46x69.2 mm (1.8x2.7 in)

Backplate Envelope 78x84 mm (3.1x3.3 in)

3.3 Independent Loading Mechanism (ILM)

The Independent Loading Mechanism (ILM) provides the force needed to seat the package onto the socket contacts. The ILM is a mechanical assembly that is physically separate from the socket body. The assembly of the ILM to the motherboard is expected to occur after attaching the socket to the board. The exact assembly location is dependent on manufacturing preference and test flow.

The ILM has two critical functions: deliver the force to seat the processor onto the socket contacts resulting in even load transfer through the socket solder joints. Another purpose of ILM is to ensure electrical integrity/performance of the socket and package.

3.4 ILM Mechanical Design Considerations and Recommendations

An retention/loading mechanism must be designed to support the processor heatsink and to ensure processor interface with the socket contact is maintained since there are no features on the socket for direct attachment of the heatsink or retaining the processor. In addition to supporting the processor heatsink over the processor, this mechanism plays a significant role in the robustness of the system in which it is implemented, in particular:

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• Ensuring that thermal performance of the TIM applied between the IHS and the heatsink is achievable. TIMs, especially those based on phase change materials, are very sensitive to applied pressure: the higher the pressure, the better the initial performance. TIMs such as thermal greases are not as sensitive to applied pressure. Designs should consider the impact of shock and vibration events on TIM performance as well as possible decrease in applied pressure over time due to potential structural relaxation in enabled components. • Ensuring that system electrical, thermal, and structural integrity is maintained under shock and vibration events. The mechanical requirements of the attach mechanism depend on the weight of the heatsink, as well as the level of shock and vibration that the system must support. The overall structural design of the baseboard and system must be considered when designing the heatsink and ILM attach mechanism. Their design should provide a means for protecting the socket solder joints as well as preventing package pullout from the socket. • The load applied by the attachment mechanism and the heatsink must comply with the package specifications, along with the dynamic load added by the mechanical shock and vibration requirements of the package and socket. • Load induced onto the package and socket by the ILM may be influenced with heatsink installed. Determining the performance for any thermal/mechanical solution is the responsibility of the customer.

A potential mechanical solution for heavy heatsink is the use of a supporting mechanism such as a backer plate or the utilization of a direct attachment of the heatsink to the chassis pan. In these cases, the strength of the supporting component can be utilized rather than solely relying on the baseboard strength. In addition to the general guidelines given above, contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard.

Placement of board-to-chassis mounting holes also impacts board deflection and resultant socket solder ball stress. Customers need to assess the shock for their designs as heatsink retention (back plate), heatsink mass and chassis mounting holes may vary.

3.5 ILM Features

The ILM is defined by four basic features 1. ILM Loadplate: Formed sheet metal that when closed applies four point loads onto the IHS seating the processor into the socket 2. ILM Frame: Single piece or assembly that mounts to PCB board and provides the hinge locations for the levers the ILM frame also contains captive mounts for heatsink attach. An insulator is pre applied by the vendor to the bottom side of the ILM frame. 3. ILM Actuation levers: Formed loading levers designed to place equal force on both ends of the ILM load plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints 4. ILM Backplate: A flat steel back plate with threaded studs to attach to the ILM frame. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors. Two additional cut-outs on the backplate provide clearance for backside voltage regulator components. An insulator is pre applied by the vendor to the side with the threaded studs.

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Heatsink mounting studs on ILM frame allow for topside thermal solution attach to a rigid structure. This eliminates the motherboard thickness dependency from the heatsink mechanical stackup. ILM assembly provides a clamping force between the ILM frame, backplate and board, resulting in reduced board bending leading to higher solder joint reliability. ILM lever design provides an interlocking mechanism to ensure proper opening or closing sequence for the operator. This has been implemented in both square and narrow ILM.

ILM Load Plate Design

Four point loading contributes to minimizing package and socket warpage under non uniformly distributed load. The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints. The load plate design is common between the two POR ILMS and is shown in the figure below.

Figure 12. ILM Load Plate

Lever Actuation/Release Forces

Maximum allowable force to actuate the levers not to exceed 4.7 lbf (21 N) at the point of typical finger placement.

ILM Back Plate Design

The backplate assembly consists of a supporting plate and captive standoffs. It provides rigidity to the system to ensure minimal board and socket deflection. Four externally threaded (male) inserts which are press fit into the back plate are for ILM attachment. Three cavities are located at the center of the plate to allow access to the baseboard test points and backside capacitors. An insulator is pre-applied to prevent shorting the board.

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Figure 13. ILM Backplate

3.6 Intel® ILM Reference Designs

Intel has designed and validated two ILMs compatible with Socket LGA2011-3 : 1. Square ILM - 80x80 mm heat sink mounting hole pattern. 2. Narrow ILM - 56x94 mm heat sink mounting hole pattern.

The two POR ILMs share most components, only the top plate and active lever differ between the two assemblies.

3.6.1 Square ILM

The square ILM consists of two sub assemblies that will be procured as a set from the enabled vendors. These two components are the ILM assembly and back plate. The square ILM assembly consists of several pieces as shown and labeled in the following diagram. The hinge lever, active lever, load plate, top plate,clevises, and the captive fasteners. For clarity the ILM cover is not shown in this view.

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Figure 14. Exploded Square ILM

An assembled view is shown in the following figure.

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Figure 15. Assembled Square ILM

Table 9. Square ILM Component Thickness and materials

Component Thickness Material

ILM Frame 1.20 mm 310 Stainless Steel

ILM Load Plate 1.50 mm 310 Stainless Steel

ILM Back Plate 2.20 mm S50C low Carbon Steel

The square ILM supports the legacy 80x80 mm heat sink mounting patterns used in some form factors.

3.6.2 Narrow ILM

The narrow ILM consists of two sub assemblies that will be procured as a set from the enabled vendors. These two components are the ILM assembly and back plate. The ILM assembly is shown in the following figure.

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Figure 16. Exploded Narrow ILM

The narrow ILM assembly consists of several pieces as shown and labeled above. The hinge lever, active lever, load plate, top plate, clevises, ILM cover, and the captive fasteners. For clarity the ILM cover is not shown in this view. An assembled view is shown in the following figure. The Narrow ILM maintains the structure and function of the square ILM but utilizes separate clevises riveted onto the ILM frame.

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Figure 17. Assembled Narrow ILM

Table 10. Narrow ILM Component Thickness and materials

Component Thickness Material

ILM Frame 1.50 mm 310 Stainless Steel

ILM Clevis 0.80 mm 301 Stainless Steel

ILM Load Plate 1.50 mm 310 Stainless Steel

ILM Back Plate 2.20 mm S50C low Carbon Steel

The narrow ILM supports a smaller east west dimension constraint conducive for use in space constrained form factors.

3.7 ILM Cover

Intel has developed a cover that will snap on to the ILM for the LGA2011 socket family.

The ILM cover is intended to reduce the potential for socket contact damage from the operator / customer fingers being close to the socket contacts to remove or install the pick and place cover. By design the ILM cover and pick and place covers can not be installed simultaneously. This cover is intended to be used in place of the pick and place cover once the ILM is assembled to the board. The ILM will be offered with the ILM cover pre assembled as well as a discrete part.

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Figure 18. ILM cover

• Pre-assembled by the ILM vendors to the ILM load plate. It will also be offered as a discrete component. • The ILM cover will pop off if a processor is installed in the socket. • Maintain inter-changeability between validated ILM vendors for LGA2011-3 socket. • The ILM cover for the LGA2011-3 socket will have a flammability rating of V-0 per UL 60950-1.

Note: Intel recommends removing the Pick and Place cover (PnP) of the socket body in manufacturing as soon as possible at the time when ILM is being installed.

ILM Cover Attach/Removal Force

The required force to remove the ILM cover shall not exceed 7.6 N when the load is applied by finger at the center of cover.

3.8 ILM Allowable Board Thickness

The ILM components described in this document will support board thickness in the range of 1.5748 - 2.54 mm (0.062" - 0.100"). Boards (PCBs) not within this range may require modifications to the back plate or other ILM components retention. Contact the component suppliers (Component Suppliers on page 76) for modifications.

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4.0 Processor Thermal Specifications and Features

4.1 Tcase and DTS-Based Thermal Specification Implementation

Thermal solutions should be sized such that the processor complies to the TCASE thermal profile all the way up to TDP, because, when all cores are active, a thermal solution sized as such will have the capacity to meet the DTS thermal profile, by design. When all cores are not active or when Intel Turbo Boost Technology is active, attempting to comply with the DTS thermal profile may drive system fans to speeds higher than the fan speed required to comply with the TCASE thermal profile at TDP.

In cases where thermal solutions are undersized, and the processor does not comply with the TCASE thermal profile at TDP, compliance can occur when the processor power is kept lower than TDP, AND the actual TCASE is below the TCASE thermal profile at that lower power.

In most situations, implementation of DTS thermal profile can reduce average fan power and improve acoustics, as compared to TCONTROL-based fan speed control. When DTS < TCONTROL, the processor is compliant, and TCASE and DTS thermal profiles can be ignored.

4.1.1 Margin to Thermal Specification (M)

To simplify processor thermal specification compliance, the processor calculates and reports margin to DTS thermal profile (M) using the following method.

Processor reads firmware programmable values: 1. TCC_OFFSET: In-band: TEMPERATURE_TARGET[27:24]. BIOS must write in a value before CPL3.

Processor gathers information about itself:

1. Processor stores the intercept and slope terms (TLA and ΨPA) from the DTS Thermal Profile for that particular SKU (one-time read only) 2. Processor reads its own energy consumption and calculates power, P 3. Processor reads its own temperature, DTS

Finally, processor calculates the margin value (M) to the specification (solid black line in the graph below). The PECI command for reading margin (M) is RdPkgConfig(), Index 10.

M < 0 indicates gap to spec, processor needs more cooling (for example, increase fan speed)

M > 0 this indicates margin to spec, processor is sufficiently cooled

Graphically, this is represented below. TCONTROL_OFFSET is not writable to a register.

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Figure 19. Margin to Thermal Spec (M)

DTS 2.0 processor Margin values can be obtained via PECI or Processor register see documentation below as well as Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 2 of 2, Registers Datasheet and Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet

Table 11. DTS 2.0 Margin From PECI

Service Index Parameter RdPkgConfig() WrPkgConfi Description Value Value Data g() (IV) (word) (dword) Data (decimal) (dword)

Thermal Margin 10 0x0000 15:0--Package N/A Package temperature Temperature margin with regards to margin in 8.8 DTS Thermal Profile. format, 32:16-- Positive indicates Reserved thermal margin, and package is less than DTS thermal profile

Note: Refer to Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 2 of 2, Registers Datasheet and Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet for further details

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Table 12. DTS 2.0 Margin From Processor Register: CSR for PACKAGE_THERM_MARGIN

Bus:1 Device:30 Function:0 Offset:E0

Bit Attr Default Description

31:16 RSVD-P 0000h Reserved--Protected

15:0 R0-V 0000h THERM_MARGIN--This field provides Platform Firmware with running average of the instantaneous temperature margin above Tspec in 2's complement 8.8 format. This is the recommended field for Platform firmware to use for fan control. When this value is negative, it indicates a firmware must increase the fan speed. With a positive value, firmware may decrease the speed of the fan

Note: • Refer to Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 2 of 2, Registers Datasheet and Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet for full documentation of registers and field descriptions

4.2 Processor Thermal Features

4.2.1 Absolute Processor Temperature

The processor has a software readable field in the TEMPERATURE_TARGET register that contains the minimum temperature at which the Thermal Control Circuit (TCC) will be activated and PROCHOT_N will be asserted.

Intel does not test any third party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature could be misleading.

4.2.2 Short Duration TCC Activation

Systems designed to meet thermal capacity may encounter short durations of throttling, also known as TCC activation, especially when running nonsteady processor stress applications. This is acceptable and is functionally within the intended temperature control parameters of the processor. Such short duration TCC activation is not expected to provide noticeable reductions in application performance, and is typically within the normal range of processor to processor performance variation.

4.3 Processor Thermal Specifications

The processor requires a thermal solution to maintain temperatures within operating limits. Any attempt to operate the processor outside these limits may result in permanent damage to the processor and potentially other components within the system. Maintaining the proper thermal environment is key to reliable, long-term system operation.

A complete solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor integrated heat spreader (IHS). Typical system level thermal solutions may consist of system fans combined with ducting and venting.

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For more information on designing a component level thermal solution, refer to Processor Thermal Solutions on page 47.

4.3.1 Thermal Specifications

To allow optimal operation and long-term reliability of Intel processor-based systems, the processor must remain between the minimum and maximum case temperature (TCASE) specifications as defined in the tables in the following sub-sections. Thermal solutions that do not provide sufficient thermal cooling may affect the long-term reliability of the processor and system.

Thermal profiles ensure adherence to Intel reliability requirements.

Intel assumes specific system boundary conditions (system ambient, airflow, heatsink performance / pressure drop, preheat, etc.) for each processor SKU to develop Tcase and DTS thermal specifications. For servers each processor will be aligned to either 1U or 2U system boundary conditions. Customers can use other boundary conditions (for example a better thermal solution with higher ambient) providing they are compliant to those specifications. Furthermore, implementing a thermal solution that violates the thermal profile for extended periods of time may result in permanent damage to the processor or reduced life. The upper point of the thermal profile consists of the Thermal Design Power (TDP) and the corresponding TCASE_MAX value (x = TDP and y = TCASE_MAX) represents a thermal solution design point.

For embedded servers, communications and storage markets, Intel has SKUs that support thermal profiles with nominal and short-term conditions designed to meet NEBS level 3 compliance. For these SKUs, operation at either the nominal or short- term thermal profiles should result in virtually no TCC activation. Thermal profiles for these SKUs are found in this chapter as well.

Intel recommends that thermal solution designs target the Thermal Design Power (TDP). The Adaptive Thermal Monitor feature is intended to help protect the processor in the event that an application exceeds the TDP recommendation for a sustained time period. The Adaptive Thermal Monitor feature must be enabled for the processor to remain within its specifications.

4.3.2 TCASE and DTS Based Thermal Specifications

To simplify compliance to thermal specifications at processor run time, the processor has a Digital Thermal Sensor (DTS) based thermal specification. Digital Thermal Sensor outputs a relative die temperature from TCC activation temperature. TCASE- based specifications are used for heatsink sizing while DTS-based specs are used for acoustic and fan speed optimizations while the server is operating. Some SKUs may share the same TCASE thermal profiles but have distinct DTS thermal profiles.

All thermal profiles, whether based on TCASE or DTS, follow the straight-line equation format namely, y = mx + b. Where,

y = temperature (T) in °C

m = slope (Ψ)

x = power (P) in Watts

b = y-intercept (TLA) (LA = local ambient)

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Figure 20. Typical Thermal Profile Graph (Illustration Only)

4.3.3 Server Processor Thermal Profiles and Form Factors

® ® Table 13. Intel Xeon Processor E5-1600 and E5-2600 v3 Product Families Stack Tcase and DTS Thermal Profiles and Correction Factors

Thermal Profiles C1E

control T CASE DTS DTS max T

Number at TDP

TDP (W) (°C) (°C) Category Processor Note: 5 Core Count Factor (die) Form Factor Package Form Assumed Heatsink Disable Offset (°C)

E5-2690 v3 Small 135 12 1U 0 18 TC=[0.235*P] TDTS=[0.299 99 (MCC) Square +58.2 *P]+58.2

E5-2680 v3 Small 120 12 1U 0 10 T =[0.235*P] T =[0.311 95 Advanced C DTS (MCC) Square +56.3 *P]+56.3

E5-2670 v3 Small 120 12 1U 0 10 TC=[0.235*P] TDTS=[0.310 95 (MCC) Square +56.3 *P]+56.3

E5-2660 v3 Small 105 10 1U 0 10 TC=[0.236*P] TDTS=[0.329 90 (MCC) Square +54.2 *P]+54.2

E5-2650 v3 Small 105 10 1U 0 10 TC=[0.235*P] TDTS=[0.324 90 (MCC) Square +54.2 *P]+54.2

E5-2640 v3 Small 90 8 1U 0 10 TC=[0.246*P] TDTS=[0.363 86 (LCC) Square +52.2 *P]+52.2

Standard E5-2630 v3 Small 85 8 1U 0 10 TC=[0.243*P] TDTS=[0.392 86 (LCC) Square +51.4 *P]+51.4

E5-2620 v3 Small 85 6 1U 0 10 TC=[0.248*P] TDTS=[0.371 85 (LCC) Square +51.5 *P]+51.5 continued...

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Thermal Profiles C1E

control T CASE DTS DTS max T

Number at TDP

TDP (W) (°C) (°C) Category Processor Note: 5 Core Count Factor (die) Form Factor Package Form Assumed Heatsink Disable Offset (°C)

E5-2609 v3 Small 85 6 1U 2 10 TC=[0.231*P] TDTS=[0.325 80 (MCC) Square +51.3 *P]+51.3 Basic

E5-2603 v3 Small 85 6 1U 0 10 TC=[0.250*P] TDTS=[0.353 83 (LCC) Square +51.5 *P]+51.5

E5-2699 v3 Large 145 18 2U 0 18 TC=[0.175*P ] TDTS=[0.243 88 (HCC) Square +51.0 *P]+51.0

E5-2698 v3 Large 135 16 1U 4 18 TC=[0.221*P]+ TDTS=[0.277 97 (HCC) Square 58.2 *P]+58.2

E5-2697 v3 Large 145 14 2U 0 18 TC=[0.177*P] TDTS=[0.276 93 +51.0 *P]+51.0 Segment Optimized (HCC) Square

E5-2695 v3 Large 120 14 1U 0 10 TC=[0.221*P]+ TDTS=[0.314 95 (HCC) Square 56.1 *P]+56.1

E5-2683 v3 Large 120 14 1U 0 10 TC=[0.220*P] TDTS=[0.285 92 (HCC) Square +56.1 *P]+56.1

E5-2685 v3 Small 120 12 1U 0 10 TC=[0.235*P] TDTS=[0.304 94 (MCC) Square +56.3 *P]+56.3

E5-2667 v3 Small 135 8 2U 3 18 TC=[0.202*P] TDTS=[0.336 97 (LCC) Square +50.5 *P]+50.5

E5-2643 v3 Small 135 6 2U 2 18 TC=[0.205*P] TDTS=[0.369 97 (LCC) Square +49.6 *P]+49.6

E5-2637 v3 Small 135 4 2U 2 18 TC=[0.205*P] TDTS=[0.402 97 (LCC) Square +48.9 *P]+48.9 Frequency Optimized

E5-2623 v3 Small 105 4 1U Square 0 10 TC=[0.250*P] TDTS=[0.433 101 (LCC) +53.9 *P]+53.9

E5-2687W Small 160 10 WS 0 10 TC=[0.190*P] TDTS= 94 v3 (MCC) Passive +44.3 [0.299*P] +44.3 Note: 3 Tower Workstation Only

E5-2650L Small 65 12 1U Square 0 10 TC=[0.232*P] TDTS=[0.320 71 v3 (MCC) +48.5 *P]+48.5

E5-2630L Small 55 8 1U Square 0 10 TC=[0.240*P] TDTS=[0.372 69 Low Power v3 +47.2 *P]+47.2 continued...

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Thermal Profiles C1E

control T CASE DTS DTS max T

Number at TDP

TDP (W) (°C) (°C) Category Processor Note: 5 Core Count Factor (die) Form Factor Package Form Assumed Heatsink Disable Offset (°C)

(LCC)

Notes: 1. These values are specified at VccIN_MAX for all processor frequencies. Systems must be designed to ensure the processor is not subjected to any static Vcc and Icc combination wherein VccIN exceeds VccIN_MAX at a specified Icc. Please refer to the electrical loadline specifications. 2. Thermal Design Power (TDP) should be used as a target for processor thermal solution design. Processor power may exceed TDP for short durations. Please see Intel® Turbo Boost Technology on page 50 3. This SKU is intended for dual processor workstations only and uses workstation specific use conditions for reliability assumptions. 4. Disabling C1E will result in an automatic reduction of DTSmax so that reliability is still protected. DTSmax will be reduced by the value shown 'C1E Disable Offset’. If thermal design has not been optimized to the reduced DTSmax value, throttling may result. Tcontrol is already an offset to DTSmax, therefore the absolute temp at which the Tcontrol threshold is reached will shift by the same amount. 5. DTS max at TDP is 2°C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal design power and is installed in a system using microcode update 0x25 or later. 6. Tcase Minimum is 0°C

4.3.4 Server 4S Processor Thermal Profiles and Form Factors

Table 14. Intel® Xeon® Processor E5-4600 v3 Product Families Stack Product Family Tcase and DTS Thermal Profiles and Correction Factors

Thermal Profiles DTS Correction max at Factors

control TDP T

Number T CASE DTS TDP (W)

Category Note: 5 Processor TTV (°C) (°C) TTV Offset (°C) Core Count C1E Disable Form Factor Factor (Die) Package Form Lukeville Looneyville Assumed Heatsink

E5-4669 Large 135 18 1U 0 10 TC=[0.219*P TDTS=[0.280 97 -0.007 -0.014 v3 (HCC) Square ]+58.1 *P]+58.1

E5-4667 Large 135 16 1U 0 10 TC=[0.219*P TDTS=[0.276 97 -0.007 -0.014 v3 (HCC) Square ]+58.1 *P]+58.1 4S Glueless High Performance Dense

E5-4655 Small 135 6 1U 0 10 TC=[0.233*P TDTS=[0.352 100 0.009 0.002 v3 (MCC Square ] + 56.3 *P] + 56.3 )

E5-4627 Small 135 10 1U 0 10 TC=[0.237*P TDTS=[0.332 100 0.013 0.006 v3 (MCC Square ] + 56.9 *P] + 56.9 ) 4S Glueless Frequency Optimized Dense continued...

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Thermal Profiles DTS Correction max at Factors

control TDP T

Number T CASE DTS TDP (W)

Category Note: 5 Processor TTV (°C) (°C) TTV Offset (°C) Core Count C1E Disable Form Factor Factor (Die) Package Form Lukeville Looneyville Assumed Heatsink

E5-4660 Large 120 14 1U 0 10 TC=[0.221*P TDTS=[0.312 95 -0.005 -0.012 v3 (HCC) Square ]+56.1 *P]+56.1

E5-4650 Large 105 12 1U 0 10 T =[0.224*P T =[0.288 86 -0.001 -0.008 Advanced C DTS v3 (HCC) Square ]+54.0 *P]+54.0

E5-4640 Large 105 12 1U 0 10 TC=[0.224*P TDTS=[0.280 85 -0.001 -0.008 v3 (HCC) Square ]+54.0 *P]+54.0

Standard E5-4620 Large 105 10 1U 0 10 TC=[0.225*P TDTS=[0.289 86 0.000 -0.007 v3 (HCC) Square ]+54.0 *P]+54.0

E5-4610 Large 105 10 1U 0 10 TC=[0.224*P TDTS=[0.283 85 0.000 -0.007 v3 (HCC) Square ]+54.0 *P]+54.0 8 Basic

4. Minimum T case Specification is 0°C 5. DTS max at TDP is 2°C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal design power and is installed in a system using microcode update 0x25 or later. See doc 550666 for further details

4.3.5 Workstation Processor Thermal Profiles and Form Factors

Table 15. Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families 1S Workstation Stack Tcase and DTS Thermal Profiles and Correction Factors

Thermal Profiles DTS max at

control TCASE DTS TDP T

TDP (W) (°C) (°C)

Category Note: 5 Core Count Form Factor Package Form Factor (Die SIze) Processor Number Assumed Heatsink C1E Disable Offset (°C)

E5-1680 v3 Small 140 8 WS Active 3 10 T C=[0.175*P]+ TDTS = [0.321*P] 88 (LCC) Tower 41.7 + 41.7

E5-1660 v3 Small 140 8 WS Active 0 10 TC=[0.173*P]+ TDTS = [0.352*P] 92 (LCC) Tower 41.7 + 41.7 1S Workstation E5-1650 v3 Small 140 6 WS Active 2 10 TC=[0.178*P]+ TDTS = [0.364*P] 94 (LCC) Tower 41.8 + 41.8

E5-1630 v3 Small 140 4 WS Active 5 10 TC=[0.177*P]+ TDTS = [0.428*P] 103 (LCC) Tower 41.4 + 41.4 continued...

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Thermal Profiles DTS max at

control TCASE DTS TDP T

TDP (W) (°C) (°C)

Category Note: 5 Core Count Form Factor Package Form Factor (Die SIze) Processor Number Assumed Heatsink C1E Disable Offset (°C)

E5-1620 v3 Small 140 4 WS Active 5 10 TC=[0.177*P]+ TDTS = [0.428*P] 103 (LCC) Tower 41.4 + 41.4

E5-1607 v3 Small 140 4 WS Active 2 10 TC=[0.176*P] TDTS=[0.423*P] 102 (LCC) Tower +41.4 +41.4

E5-1603 v3 Small 140 4 WS Active 0 10 TC=[0.181*P] TDTS=[0.336*P] 90 (LCC) Tower +41.8 +41.8

4. Minimum Tcase Specification is 0°C 5. DTS max at TDP is 2°C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal design power and is installed in a system using microcode update 0x25 or later.

4.3.6 Embedded Server Processor Thermal Profiles

Embedded Server processor SKUs target higher case temperatures and/or Network Equipment Building System (NEBS) thermal profiles for embedded communications server and storage form factors. The following thermal profiles pertain only to those specific SKUs. Network Equipment Building System is the most common set of environmental design guidelines applied to telecommunications equipment in the United States.

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Table 16. Embedded Server Processor Thermal Profiles

TCASE DTS Thermal Thermal Profile (°C) control

T Profile TDP (W) CASE Category Offset (°C) Core Count TCASE TCASE TDTS DTS TDTS (°C) DTS C1E Disable (°C) (°C) (°C) max (Short max at at (Nominal) (Short (Nominal Term) TDP TDP

Processor Number ) Term) (nomi (Short Maximum T Package Form Factor nal) Term) Note: 7 Note: 7

105 12 0 18 91 TC=[0.228 TC=[0.22 TDTS=[0.2 85 TDTS=[0.2 100 *P] + 52.0 8 *P] + 96 *P] + 96 *P] + Small 67.0 52.0 67.0 Advanced E5-2658A v3

105 12 0 18 87 TC =[0.190 TC TDTS = 81 TDTS = 96 * P] + 52.0 =[0.190 * [0.258 * [0.258 * Small P] + 67.0 P] + 52.0 P] + 67.0 E5-2658 v3

75 12 0 18 87 TC = [0.267 TC = TDTS = 80 TDTS = 95 * P] + 52.0 [0.267 * [0.350 * [0.350 * Small P] + 67.0 P] + 52.0 P] + 67.0 E5-2648L v3

75 10 0 18 87 TC = [0.267 TC = TDTS = 80 TDTS 95 * P] + 52.0 [0.267 * [0.352 * =[0.352 * Small P] + 67.0 P] + 52.0 P] + 67.0 Standard E5-2628L v3 continued...

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TCASE DTS Thermal Thermal Profile (°C) control

T Profile TDP (W) CASE Category Offset (°C) Core Count TCASE TCASE TDTS DTS TDTS (°C) DTS C1E Disable (°C) (°C) (°C) max (Short max at at (Nominal) (Short (Nominal Term) TDP TDP

Processor Number ) Term) (nomi (Short Maximum T Package Form Factor nal) Term) Note: 7 Note: 7

75 8 0 18 87 TC = [0.267 TC = TDTS = 82 TDTS = 97 * P] + 52.0 [0.267 * [0.378 * [0.378 * Small P] + 67.0 P] + 52.0 P] + 67.0 E5-2618L v3

52 6 0 18 88 TC = [0.404 TC = TDTS 81 TDTS 96 * P] + 52.0 [0.404 * =[0.509 * =[0.509 * Basic Small P] + 67.0 P] + 52.0 P] + 67.0 E5-2608L v3

2. Thermal Design Power (TDP) should be used as a target for processor thermal solution design at maximum TCASE. Processor power may exceed TDP for short durations. Please see Intel® Turbo Boost Technology on page 50. 3. Power specifications are defined at all VIDs found in the Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 2 of 2, Registers Datasheet and Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet . Processors may be delivered under multiple VIDs for each frequency. 4. The Nominal Thermal Profile must be used for all normal operating conditions or for products that do not require NEBS Level 3 compliance. 5. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances per year, as compliant with NEBS Level 3. Operation at the Short-Term Thermal Profile for durations exceeding 360 hours per year violate the processor thermal specifications and may result in permanent damage to the processor.

6. Minimum T case Specification is 0°C 7. DTS max at TDP is 2°C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal design power and is installed in a system using microcode update 0x25 or later.

4.3.7 Thermal Metrology

The minimum and maximum case temperatures (TCASE) specified are measured at the geometric top center of the processor integrated heat spreader (IHS). The following figures illustrate the location where TCASE temperature measurements should be made. The figures also include geometry guidance for modifying the IHS to accept a thermocouple probe.

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Figure 21. Case Temperature (TCASE) Measurement Location for Large Package

Grantley Large Package Units are mm B

0.790 ±0.150 0.380 ±0.030 1.020 ±0.250

Package Center DETAIL A 26.250

0.381 ±0.038 SECTION B 0.510 ±0.080 B

Pin 1 Indicator 25.500

Note: Figure is not to scale and is for reference only.

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Figure 22. Case Temperature (TCASE) Measurement Location for Small Package

Grantley Small Package Units are mm B

0.790 ±0.150 0.380 ±0.030 1.020 ±0.250

PACKAGE CENTER

DETAIL A 25.230 0.381 ±0.038 0.510 ±0.080 SECTION B

PIN 1 INDICATOR B 22.500

Note: Figure is not to scale and is for reference only.

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5.0 Processor Thermal Solutions

5.1 Processor Boundary Conditions for Shadowed and Spread Core Layouts

Intel's processors go into a variety of board layouts and form factors. Boundary conditions for the SSI EEB layout (sometimes referred to as "shadowed layout") are included in the table below for 1U, 2U and Workstation systems. A typical shadowed layout with a 1U heat sink is shown below.

Figure 23. Typical Shadowed Layout

Airflow Direction

Another approach is the "spread core" layout, where neither processor is "shadowed" by the other, as shown below.

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Figure 24. Typical Spread Core Layout

Table 17. Processor Boundary Conditions for Shadowed and Spread Core Layouts 4 2 1 3 4 5 6 TLA for each TDP SKU (°C) 0) 2 ΔP Form CA_TTV Board Factor (in H Ψ Airflow System Layout (°C/W) 70W 80W 85W Heatsink Heatsink 105W 120W 135W 140W 145W 160W Description (CFM) / RPM

1U Spread 70 x 106 x Copper 10.2 0.233 0.256 41.5 41.5 41.5 41.5 41.5 41.5 N/A N/A N/A core, 25.5mm base 24 (Narrow) Aluminum DIMMs [STS200PNR] fin (Passive)

1U SSI 91.5 x 91.5 x Copper 15.2 0.382 0.250 47.4 48.6 49.1 51.4 53.1 54.8 N/A N/A N/A EEB, 25.5mm base 16 (Square) Aluminum DIMMs [STS200P] fin (Passive)

2U SSI 91.5 x 91.5 x Copper 26.0 0.138 0.201 42.8 43.5 43.9 45.3 46.4 47.5 47.9 48.2 N/A EEB, 64mm base 16 (Square) Aluminum DIMMs [STS200C] fin with Heatpipe (Passive)

WS SSI 100 x 70 x Copper 2600 Not 0.197 38.2 38.5 38.7 39.3 39.7 40.1 40.3 40.5 40.9 EEB, 123.2mm base RPM meaningful 16 (Tower) Aluminum for Active DIMMs fin with Heatsink Heatpipe (Active)

Note: 1. 1U = 1.75" which is the outside-to-outside dimension of the server enclosure. 2. SSI Specification is found at https://ssiforum.org/. continued...

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3. Refer to Intel Reference Design Heat Sink on page 55. Dimensions of heat sink do not include socket or processor.

4. Airflow through the heat sink fins with zero bypass. Max target for pressure drop (ΔP) measured in inches H2O. 5. Mean + 3σ performance for a heat sink on top of the Thermal Test Vehicle (TTV). These estimates are not necessarily the thermal performance targets needed to meet processor thermal specifications. Includes thermal performance of Honeywell* PCM45F.

6. System ambient TSA = 35°C. Increase in air temperature inside the chassis (from the front grill to the downstream, or shadowed, processor heatsink). Includes preheat from hard drives, VRs, front processor, etc. as shown below.

5.2 Heatsink Design Considerations

To remove the heat from the processor, three basic parameters should be considered:

• The area of the surface on which the heat transfer takes place - Without any enhancements, this is the surface of the processor package IHS. One method used to improve thermal performance is to attach a heatsink to the IHS. A heatsink can increase the effective heat transfer surface area by conducting heat out of the IHS and into the surrounding air through fins attached to the heatsink base.

• The conduction path from the heat source to the heatsink fins - Providing a direct conduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance. The length, thickness, and conductivity of the conduction path from the heat source to the fins directly impact the thermal performance of the heatsink. In particular, the quality of the contact between the package IHS and the heatsink base has a higher impact on the overall thermal solution performance as processor cooling requirements become strict. Thermal interface material (TIM) is used to fill in the gap between the IHS and the bottom surface of the heatsink, and thereby improves the overall performance of the thermal stackup (IHS-TIM-Heatsink). With extremely poor heatsink interface flatness or roughness, TIM may not adequately fill the gap. The TIM thermal performance depends on its thermal conductivity as well as the pressure load applied to it.

• The heat transfer conditions on the surface upon which heat transfer takes place - Convective heat transfer occurs between the airflow and the surface exposed to the flow. It is characterized by the local ambient temperature of the air, TLA, and the local air velocity over the surface. The higher the air velocity over the surface, the more efficient the resulting cooling. The nature of the airflow can also enhance heat transfer via convection. Turbulent flow can provide improvement over laminar flow. In the case of a heatsink, the surface exposed to the flow includes the fin faces and the heatsink base.

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An active heatsink typically incorporates a fan that helps manage the airflow through the heatsink.

Passive heatsink solutions require in-depth knowledge of the airflow in the chassis. Typically, passive heatsinks see slower air speed. Therefore, these heatsinks are typically larger (and heavier) than active heatsinks due to the increase in fin surface necessary to meet a required performance. As the heatsink fin density (the number of fins in a given cross-section) increases, the resistance to the airflow increases; it is more likely that the air will travel around the heatsink instead of through it, unless air bypass is carefully managed. Using air-ducting techniques to manage bypass area is an effective method for maximizing airflow through the heatsink fins.

5.3 Thermal Design Guidelines

5.3.1 Intel® Turbo Boost Technology

Intel® Turbo Boost Technology is a feature available on certain Intel® Xeon® processor E5-1600 and E5-2600 v3 product families SKUs that opportunistically, and automatically allows the processor to run faster than the marked frequency if the part is operating below certain power and temperature limits. With Turbo Boost enabled, the instantaneous processor power can exceed TDP for short durations resulting in increased performance.

System thermal design should consider the following important parameters (set via BIOS): • POWER_LIMIT_1 (PL1) = average processor power over a long time window (default setting is TDP) • POWER_LIMIT_2 (PL2) = average processor power over a short time window above TDP (short excursions). Maximum allowed by the processor is 20% above TDP for all SKUs (1.2 * TDP). Note that actual power will include IMON inaccuracy. • POWER_LIMIT_1_TIME (Tau) = time constant for the exponential weighted moving average (EWMA) which optimizes performance while reducing thermal risk. (dictates how quickly power decays from its peak)

Please note that although the processor can exceed PL1 (default TDP) for a certain amount of time, the exponential weighted moving average (EWMA) power will never exceed PL1.

A properly designed processor thermal solution is important to maximizing Turbo Boost performance. However, heatsink performance (thermal resistance, Ψ CA) is only one of several factors that can impact the amount of benefit. Other factors are operating environment, workload and system design. With Turbo Mode enabled, the processor may run more consistently at higher power levels, and be more likely to operate above TCONTROL, as compared to when Turbo Mode is disabled. This may result in higher acoustics.

5.3.2 Thermal Excursion Power

Under fan failure or other anomalous thermal excursions, processor temperature (either TCASE or DTS) may exceed the thermal profile for a duration totaling less than 360 hours per year without affecting long term reliability (life) of the processor. For

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more typical thermal excursions, Thermal Monitor is expected to control the processor power level as long as conditions do not allow the processor to exceed the temperature at which Thermal Control Circuit (TCC) activation initially occurred.

Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below thermal profile by TCC activation, then data integrity is not assured. At some higher thresholds, THERMTRIP_N will enable a shut down in an attempt to prevent permanent damage to the processor.

A designer can check anomalous power ratio of an individual part by reading register PWR_LIMIT_MISC_INFO and dividing the value of PN_POWER_OF_SKU by the sku TDP. Please refer to Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 2 of 2, Registers Datasheet and Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet

5.3.3 Thermal Characterization Parameters

The case-to-local ambient Thermal Characterization Parameter ( Ψ CA ) is defined by:

Ψ CA = (Tcase - TLA) / TDP

Where:

T CASE = Processor case temperature (°C)

T LA = Local ambient temperature before the air enters the processor heatsink (°C)

TDP = TDP (W) assumes all power dissipates through the integrated heat spreader. This inexact assumption is convenient for heatsink design.

Ψ CA = Ψ CS + Ψ SA

Where:

Ψ CS = Thermal characterization parameter of the TIM (°C/W) is dependent on the thermal conductivity and thickness of the TIM.

Ψ SA = Thermal characterization parameter from heatsink-to-local ambient (°C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins.

The following figure illustrates the thermal characterization parameters.

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Figure 25. Thermal Characterization Parameters

5.4 Thermal Interface Material (TIM) Considerations

Thermal Interface Material between the processor IHS and the heatsink base is necessary to improve thermal conduction from the IHS to the heatsink. Many thermal interface materials can be pre-applied to the heatsink base prior to shipment from the heatsink supplier without the need for a separate TIM dispense or attachment process in the final assembly factory.

All thermal interface materials should be sized and positioned on the heatsink base in a way that ensures that the entire area is covered. It is important to compensate for heatsink-to-processor positional alignment when selecting the proper TIM size.

When pre-applied material is used, it is recommended to have a protective cover. Protective tape is not recommended as the TIM could be damaged during its removal step.

Thermal performance usually degrades over the life of the assembly and this degradation needs to be accounted for in the thermal performance. Degradation can be caused by shipping and handling, environmental temperature, humidity conditions, load relaxation over time, temperature cycling or material changes (most notably in the TIM) over time. For this reason, the measured TCASE value of a given processor may increase over time, depending on the type of TIM material.

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5.5 Mechanical Recommendations and Targets

Thermal solutions should be designed to meet the mechanical requirements described in this section.

Keep in mind that the heatsink retention will need to apply additional load in order to achieve the minimum Socket Static Total Compressive load. This load should be distributed over the IHS (Integrated Heat Spreader). The dual-loading approach is represented by the following equation.

FILM + FHEATSINK = FSOCKET

5.5.1 Processor / Socket Stackup Height

The table below provides the stackup height of a processor and LGA2011-3 socket with processor fully seated. This value is the root sum of squares summation of: (a) the height of the socket seating plane above the motherboard after reflow, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances given in the processor, socket and ILM drawings

Table 18. Target Stackup Heights From Top of Board to Top of IHS

Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families1,2,4

Integrated Stackup Height From Top of Board to Top of ILM 4.678 (+0.367)/(-0.231mm ) Stud (Dimension A)

Integrated Stackup Height From Top of Board to Top of IHS 6.581±0.289 Load Lip (Dimension B)

Integrated Stackup Height From Top of Board to Top of IHS 8.481±0.279 (Dimension C)

Notes: 1. Tolerance Stackus are a Root Sum of Squares (RSS) of all components in stack calculation using mother board surface as the reference point 2. Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Stackup targets are inclusive of all package sizes (large and small) 3. All packages are compatible with reference retention solutions and will meet mechanical specifications

Figure 26. Integrated Stack Up Height

Note: ILM components removed for clarity

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The table below provides the available surface dimensions for cooling the processor when fully seated in LGA2011-3 socket. This value is the X and Y dimensions for the flat top of the IHS.

Table 19. Available Cooling Area for Large and Small IHS

Available Area Large package 45.5 mm x 36.74 mm (1.791 in x 1.446 in)

Small package 40.5 mm x 36.74 mm (1.594 in x 1.446 in)

Figure 27. Available Cooling Area for Top of Large and Small IHS

5.5.2 Processor Heatsink Mechanical Targets

Table 20. Heatsink Mechanical Targets

Parameter Min Max Notes

Heatsink Mass (includes 600 g (1.32 lbm) 3 retention)

Heatsink Applied Static 222 N (50 lbf) 400 N (90 lbf) 1,2 Compressive Load

Heatsink Applied Dynamic only 445 N (100 lbf) 1,4,5 Compressive load

Notes: 1. These specifications apply to uniform compressive loading in a direction perpendicular to the processor top surface (IHS). 2. This is the minimum and maximum static force that can be applied by the heatsink retention to the processor top surface (IHS). 3. This specification prevents excessive baseboard deflection during dynamic events. 4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement. 5. An experimentally validated test condition used a heatsink mass of 1.32 lbm (600g) with 25 G acceleration measured on a shock table with a dynamic amplification factor of 3. This specification can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this validated dynamic load (1.32 lbm x 25 G x 3= 100 lbf).

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5.6 Heatsink Mechanical and Structural Considerations

An attachment mechanism must be designed to support the heatsink because there are no features on the socket on which to directly attach a heatsink. In addition to holding the heatsink in place on top of the IHS, this mechanism plays a significant role in the performance of the system, in particular:

• Ensuring thermal performance of the TIM applied between the IHS and the heatsink. TIMs, especially those based on phase change materials, are very sensitive to applied pressure: the higher the pressure, the better the initial performance. TIMs such as thermal greases are not as sensitive to applied pressure. Designs should consider the possible decrease in applied pressure over time due to potential structural relaxation in enabled components. • Ensuring system electrical, thermal, and structural integrity under shock and vibration events, particularly the socket solder joints. The mechanical requirements of the attachment mechanism depend on the weight of the heatsink and the level of shock and vibration that the system must support. The overall structural design of the baseboard and system must be considered when designing the heatsink attachment mechanism. Their design should provide a means for protecting socket solder joints, as well as preventing package pullout from the socket.

Please note that the load applied by the attachment mechanism must comply with the processor mechanical specifications, along with the dynamic load added by the mechanical shock and vibration requirements, as discussed in Package Loading Specifications on page 63.

A potential mechanical solution for heavy heatsinks is the use of a supporting mechanism such as a backer plate or the utilization of a direct attachment of the heatsink to the chassis pan. In these cases, the strength of the supporting component can be utilized rather than solely relying on the baseboard strength. In addition to the general guidelines given above, contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard.

5.7 Intel Reference Design Heat Sink

Intel has several reference heat sinks for the Grantley platform. This section details the design targets and performance of each. These heat sinks are also productized as part of Intel's Boxed Processors retail program (product codes shown in parentheses). For more information please goto Boxed Processor Specifications on page 67.

Below are the 1U Square and 1U Narrow heatsinks (STS200P and STS200PNRW respectively).

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Figure 28. 1U Form Factor Heat Sinks

Below are the 2U Square active and passive heatsinks (STS200C).

Figure 29. 2U Form Factor Heat Sinks

Below is the Tower Active heatsink.

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Figure 30. Workstation Form Factor Heat Sink

Heat Sink Performance

The graphs below show mean thermal resistance (ΨCA) and pressure drop (ΔP) as a function of airflow. Best-fit equations are also provided. The sample calculations match the boundary conditions given in the Processor Boundary Conditions for Shadowed and Spread Core Layouts on page 47.

5.7.1 2U Square Heatsink Performance

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-0.9862 •ΨCA(mean), µ = 0.127 + (1.3901)*(CFM) (°C/W). This is based on Lukeville TTV -0.9862 •ΨCA(mean), µ = 0.134 + (1.3901)*(CFM) (°C/W). This is based on Looneyville TTV

•ΨCA(variance), σ = 0.0062 (°C/W) 2 • ΔP = (6.91E-05)*(CFM) + (3.50E-3)*(CFM) (in. H2O)

Sample calculation when airflow = 26 CFM

• ΨCA Based on Lukeville TTV -0.9862 —ΨCA(µ) = 0.127 + (1.3901)*(26) = 0.183 (°C/W)

—ΨCA(µ + 3σ) = 0.183 + 3 * (0.0062) = 0.202 (°C/W)

• ΨCA Based on Looneyville TTV -0.9862 —ΨCA(µ) = 0.134 + (1.3901)*(26) = 0.190 (°C/W)

—ΨCA(µ + 3σ) = 0.190 + 3 * (0.0062) = 0.209 (°C/W) 2 • ΔP = (6.91E-05)*(26) + (3.50E-3)*(26) = 0.138 (in. H2O)

5.7.2 1U Square Heatsink Performance

The following performance curves are based on the Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Lukeville and Looneyville thermal test vehicle (TTV). Refer to Lukeville FCLGA12 Package Thermal/Mechanical Test Vehicle Application Note for details. -1.03664 •ΨCA(mean), µ = 0.147 + (1.60914)*(CFM) (°C/W). This is based on Lukeville TTV -1.03664 •ΨCA(mean), µ = 0.154 + (1.60914)*(CFM) (°C/W). This is based on Looneyville TTV

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•ΨCA(variance), σ = 0.0024 (°C/W) 2 • ΔP = (2.41E-04)*(CFM) + (2.15E-02)*(CFM) (in. H2O)

Sample calculation when airflow = 15.2 CFM.

• ΨCA Based on Lukeville TTV -1.03664 —ΨCA(µ) = 0.147 + (1.60914)*(15.2) = 0.243 (°C/W)

—ΨCA(µ + 3σ) = 0.243 + 3 (0.0024) = 0.250 (°C/W)

• ΨCA Based on Looneyville TTV -1.03664 —ΨCA(µ) = 0.154 + (1.60914)*(15.2) = 0.250 (°C/W)

—ΨCA(µ + 3σ) = 0.250 + 3 (0.0024) = 0.257 (°C/W) 2 • ΔP = (2.41E-04)*(15.2) + (2.15E-02)*(15.2) = 0.382 (in. H2O)

5.7.3 1U Narrow Heatsink Performance

The following performance curves are based on the Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Lukeville and Looneyville thermal test vehicle (TTV). Refer to Lukeville FCLGA12 Package Thermal/Mechanical Test Vehicle Application Note for details. -0.874 •ΨCA(mean), µ = 0.151 + (1.254)*(CFM) (°C/W). This is based on Lukeville TTV -0.874 •ΨCA(mean), µ = 0.158 + (1.254)*(CFM) (°C/W). This is based on Looneyville TTV

•ΨCA(variance), σ = 0.0056 (°C/W) 2 • ΔP = (5.12E-04)*(CFM) + (1.76E-02)*(CFM) (in. H2O)

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Sample calculation when airflow = 10.2 CFM.

• ΨCA Based on Lukeville TTV -0.874 —ΨCA(µ) =0.151 + (1.254)*(10.2) = 0.316 (°C/W)

—ΨCA(µ + 3σ) = 0.316 + 3 (0.0056) = 0.333 (°C/W)

• ΨCA Based on Looneyville TTV -0.874 —ΨCA(µ) =0.158 + (1.254)*(10.2) = 0.323 (°C/W)

—ΨCA(µ + 3σ) = 0.323 + 3 (0.0056) = 0.340 (°C/W) 2 • ΔP = (5.12E-04)*(10.2) + (1.76E-02)*(10.2) = 0.233 (in. H2O)

5.7.4 Workstation Tower Active Heatsink Performance

The following performance curves are based on the Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Lukeville and Looneyville thermal test vehicle (TTV). Refer to Lukeville FCLGA12 Package Thermal/Mechanical Test Vehicle Application Note for details. -1.011 •ΨCA(mean), µ = 0.102 + (1.559)*(CFM) (°C/W). This is based on Lukeville TTV -1.011 •ΨCA(mean), µ = 0.109 + (1.559)*(CFM) (°C/W). This is based on Looneyville TTV

•ΨCA(variance), σ = 0.0101 (°C/W)

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Sample calculation when airflow = 23.2 CFM.

• ΨCA Based on Lukeville TTV -1.011 —ΨCA(µ) =0.102 + (1.559)*(23.2) = 0.167 (°C/W)

—ΨCA(µ + 3σ) = 0.167 + 3 (0.0101) = 0.197 (°C/W)

• ΨCA Based on Looneyville TTV -0.874 —ΨCA(µ) =0.109 + (1.254)*(23.2 = 0.174 (°C/W)

—ΨCA(µ + 3σ) = 0.174 + 3 (0.0101) = 0.204 (°C/W)

5.7.5 Mechanical Load Range

Intel's reference heat sinks are thermally validated for the load range described in the Processor Heatsink Mechanical Targets on page 54.

5.7.6 Thermal Interface Material (TIM)

Honeywell PCM45F material was chosen as the interface material for analyzing boundary conditions and processor specifications. The recommended minimum activation load for PCM45F is ~15 PSI [103 kPA]. Meeting the minimum heat sink load targets described in Processor Heatsink Mechanical Targets on page 54 ensures that this is accomplished. The largest package has a usable area of ~ 2.6 in2 which translates to a pressure of 19 PSI [131 kPA] at minimum load of 50 lbf [222 N].

Please refer to Thermal Interface Material (TIM) on page 68 which outlines the TIM for Boxed Heat Sinks which may be different.

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6.0 Processor Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array (FCLGA10) package that interfaces with the baseboard via an LGA2011-3 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor component thermal solutions, such as a heatsink. Diagram below shows a sketch of the processor package components and how they are assembled together.

The package components shown below include the following: 1. Integrated Heat Spreader (IHS) 2. Thermal Interface Material (TIM) 3. Processor core (die) 4. Package substrate 5. Capacitors

Figure 31. Processor Package Assembly Sketch

Notes: • Socket and baseboard are included for reference and are not part of processor package. • Processor package land count may be greater than socket contact count

6.1 Package Size

The processor has two different form factors Small and Large. Both form factors are compatible with socket 2011-3 (R3) and the reference ILMs. Size of IHS and dimensions of package substrate vary between the two form factors. For detailed drawings see Mechanical Drawings on page 78. For Sku specific identification of package for factors see Processor Thermal Specifications on page 36. All Low Core Count (LCC) and Mid Core Count (MCC) SKUs are Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Small form factor. All High Core Count (HCC) SKUs are Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Large form factor.

Substrate X-Y geometries for each package are:

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• Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Small: 52.5mm x 45mm • Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Large: 52.5mm x 51mm

Figure 32. Rendering of Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Small Form Factor

Figure 33. Rendering of Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Large Form Factor

6.2 Package Loading Specifications

The following table provides load specifications for the processor package. These maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The processor substrate should not be used as a mechanical reference or load bearing surface for thermal solutions.

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Table 21. Processor Loading Specifications

Parameter Maximum Notes

Static Compressive Load 1068 N (240 lbf) This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism (ILM).

Dynamic Load 540 N (121 lbf) Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement. This load will be a function of the geometry and mass of the enabling components used.

Note: • These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

6.3 Processor Mass Specification

The typical mass of the processor is currently 45 grams. This mass [weight] includes all the components that are included in the package.

6.4 Processor Materials

The table below lists some of the package components and associated materials.

Table 22. Processor Materials

Component Material

Integrated heat Spreader Nickel Plated Copper

Substrate Halogen Free, Fiber Reinforced Resin

Substrate lands Gold Plated Copper

6.5 Processor Markings

Labeling locations and information are shown for Intel® Xeon® processor v3 product families Small and Large packages in the diagrams below.

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Figure 34. Small Package Labeling

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Figure 35. Large Package Labeling

6.6 Package Handling Guidelines

The processor can be inserted into and removed from a socket 15 times. The following table includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.

Table 23. Load Limits for Package Handling

Parameter Maximum Recommended

Shear 356 N (80 lbf)

Tensile 156 N (35 lbf)

Torque 3.6 N-m (31.5 in-lbf)

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7.0 Boxed Processor Specifications

Intel boxed processors are intended for system integrators who build systems from components available through distribution channels. The Intel®Xeon® processor E5-1600 and E5-2600 v3 product families will be offered as Intel boxed processors. Thermal solutions, however, will be sold separately.

7.1 Boxed Processor Thermal Solutions

7.1.1 Available Boxed Thermal Solution Configurations

Intel will offer three different Boxed Heat Sink solutions to support LGA2011-3 Boxed Processors 1. Boxed Intel Thermal Solution STS200C (Order Code BXSTS200C): A Passive / Active Combination Heat Sink Solution that is intended for processors with a 160W TDP or lower in a pedestal or 145W in 2U+ chassis with appropriate ducting. 2. Boxed Intel Thermal Solution STS200P (Order Code BXSTS100P): A 25.5 mm Tall Passive Heat Sink Solution that is intended for processors with a 135W TDP or lower in 1U, or 2U chassis with appropriate ducting. This heat sink is compatible with the square integrated load mechanism (Square ILM). Check with Blade manufacturer for compatibility. 3. Boxed Intel Thermal Solution STS200PNRW (Order Code BXSTS200PNRW): A 25.5 mm Tall Passive Heat Sink Solution that is intended for processors with a 135W TDP or lower in 1U, or 2U chassis with appropriate ducting. This heat sink is compatible with the narrow integrated load mechanism (Narrow ILM). Check with Blade manufacturer for compatibility.

7.1.2 Intel® Thermal Solution STS200C (Passive/Active Combination Heat Sink Solution)

The STS200C, based on a 2U passive heat sink with a removable fan, is intended for a 160W TDP or lower in active configuration and 145W TDP in passive configuration. This heat pipe-based solution is intended to be used as either a passive heat sink in a 2U or larger chassis, or as an active heat sink for pedestal chassis. Although the active combination solution with the fan installed mechanically fits into a 2U keepout, its use has not been validated in that configuration. The active fan configuration is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present. The STS200C with the fan removed, as with any passive thermal solution, will require the use of chassis ducting and is targeted for use in rack mount or ducted-pedestal servers. The recommended retention for these heat sinks is the Square ILM. Refer to Intel® ILM Reference Designs on page 28 for more info.

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Figure 36. STS200C Active / Passive Combination Heat Sink (with Removable Fan)

7.1.3 Intel® Thermal Solution STS200P and STS200PNRW (Boxed 25.5 mm Tall Passive Heat Sink Solutions)

The STS200P and STS200PNRW are available for use with boxed processors that have a 135W TDP and lower. These 25.5 mm tall passive solutions are designed to be used in SSI Blades, 1U, and 2U chassis where ducting is present. The use of a 25.5 mm tall heatsink in a 2U chassis is recommended to achieve a lower heatsink TLA and more flexibility in system design optimization. The recommended retention for the STS200P is the Square ILM. The recommended retention for the STS200PNRW is the Narrow ILM. Refer to Intel® ILM Reference Designs on page 28 for more info.

Figure 37. STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks

7.1.4 Thermal Interface Material (TIM)

These heat sinks will come pre-applied with Dow Corning TC-1996. Please consult your Intel representative or Dow Corning for more information.

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7.2 Boxed Processor Cooling Requirements

Meeting the processor's temperature specifications is a function of the thermal design of the entire system. The processor temperature specifications are found in Processor Thermal Specifications on page 36 of this document. Meeting the processor's temperature specification is the responsibility of the system integrator.

STS200C (Passive/Active Combination Heat Sink Solution)

The active configuration should help meet the thermal processor requirements particularly for pedestal chassis designs. Some form of ducting is recommended to meet memory cooling and processor TLA temperature requirements. Use of the active configuration in a 2U rack mount chassis is not recommended, however.

In the passive configuration a chassis duct should be implemented.

The active solution can be used with a 160W TDP or lower. The passive solution can be used with a 145W TDP or lower.

STS200P and STS200PNRW (25.5 mm Tall Passive Heat Sink Solution)

These passive solutions are intended for use in SSI Blade, 1U or 2U rack configurations. It is assumed that a chassis duct will be implemented in all configurations.

These thermal solutions should be used with a 135W TDP or lower.

For a list of processor and thermal solution boundary conditions for common layouts, such as Ψca, TLA, airflow, flow impedance, please refer to the section on Processor Boundary Conditions for Shadowed and Spread Core Layouts on page 47.

7.3 Mechanical Specifications

Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones

The boxed heat sink (thermal solution) is sold separately from the boxed processor. Clearance is required around the thermal solution to ensure unimpeded airflow for proper cooling. Baseboard keepout zones are shown in Mechanical Drawings on page 78 which detail the physical space requirements for each of the boxed heat sinks.

None of the heat sink solutions exceed a mass of 550 grams. See Package Loading Specifications on page 63 for processor loading specifications.

Boxed Heat Sink Support with ILM

Baseboards designed for Intel® Xeon® processor E5-1600 and E5-2600 v3 product families processors should include holes that are aligned with the ILM. Please refer to Independent Loading Mechanism (ILM) Specifications on page 23 chapter for more information.

Boxed heat sinks will require a #2 Phillips screwdriver to attach to the ILM. The screws should be tightened until they no longer turn easily. This is approximately 8 inch-pounds [0.90 N-m]. Exceeding this recommendation may damage the screw or other components.

Please refer the Grantley Manufacturing Advantage Service Document.

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7.4 Fan Power Supply [STS200C]

The 4-pin PWM controlled thermal solution is offered to help provide better control over pedestal chassis acoustics. Fan RPM is modulated through the use of an ASIC located on the baseboard that sends out a PWM control signal to the 4th pin of the connector labeled as Control. This thermal solution requires a constant +12 V supplied to pin 2 of the active thermal solution and does not support variable voltage control or 3‑pin PWM control. The fan power header on the baseboard must be positioned to allow the fan heat sink power cable to reach it. The fan power header identification and location must be documented in the suppliers platform documentation, or on the baseboard itself. The baseboard fan power header should be positioned within 7 in. [177.8 mm ] from the center of the processor socket.

Description Min Nominal Max Unit Frequency Frequency Frequency

PWM Control Frequency Range 21,000 25,000 28,000 Hz

Description Min Typical Max Max Unit Steady Steady Startup

+12 V: 12 volt fan power supply 10.8 12 12 13.2 V

IC: Fan Current Draw N/A 1.25 1.5 2.2 A

SENSE: SENSE frequency 2 2 2 2 Pulses per fan revolution

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Figure 38. Fan Cable Connector Pin Out for 4-Pin Active Thermal Solution

Pin Number Signal Color

1 Ground Black

2 Power: (+12 V) Yellow

3 SENSE: 2 pulses per revolution Green

4 Control: 21 - 28 KHz Blue

7.5 Boxed Processor Contents

The Boxed Processor and Boxed Thermal Solution contents are outlined below.

Boxed Processor • Intel®Xeon® processor E5-1600 and E5-2600 v3 product families • Installation and warranty manual • Intel Inside® Logo

Boxed Thermal Solution • Thermal solution assembly • Thermal interface material (pre-applied) • Installation and warranty manual

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8.0 Quality Reliability and Ecological Requirements

8.1 Use Conditions

Intel evaluates reliability performance based on the use conditions (operating environment) of the end product by using acceleration models.

The use condition environment definitions provided in the tables below are based on speculative use condition assumptions, and are provided as examples only.

Based on the system enabling boundary condition, the solder ball temperature can vary and needs to be comprehended for reliability assessment.

Use Speculative Example Example Example Environment Stress Use 7 yr. 10 yr. Condition Condition Stress Stress Equivalent Equivalent

Slow small internal gradient changes due to Temperature D T = 35 - 44°C 550-930 cycles 780-1345 cycles external ambient (temperature cycle or Cycle (solder joint) Temp Cycle Temp Cycle externally heated) Fast, large gradient on/off to (-25°C to 100°C) (-25°C to 100°C) max operating temp. (power cycle or internally heated including power save features)

High ambient moisture during low-power state THB/HAST T = 25 -30°C 85%RH 110-220 hrs 145-240 hrs (operating voltage) (ambient) at 110°C 85%RH at 110°C 85%RH

High Operating temperature and short duration Bake T = 95 - 105°C 700 - 2500 hrs 800 - 3300 hrs high temperature exposures (contact) at 125°C at 125°C

Use Speculative Stress Condition Example Use Environment Condition

Shipping Mechanical Shock Total of 12 drops and • System-level per system: Handling • Unpackaged • 2 drops per axis • Trapezoidal • ± direction • 25 g • velocity change is based on packaged weight

Product Weight (lbs) Non-palletized Product Velocity < 20 lbs Change (in/sec) 20 to > 40 250 40 to > 80 225 80 to < 100 205 100 to < 120 175 ≥120 145 125

Change in velocity is based upon a 0.5 coefficient of restitution.

Shipping Random Vibration Total per system: and • System Level • 10 minutes per axis continued...

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Use Speculative Stress Condition Example Use Environment Condition

Handling • Unpackaged • 3 axes • 5 Hz to 500 Hz • 2.20 g RMS random • 5 Hz @ 0.001 g2/Hz to 20 Hz @ 0.01 g2/Hz (slope up) • 20 Hz to 500 Hz @ 0.01 g2/Hz (flat) • Random control limit tolerance is ± 3 dB

8.2 Intel® Reference Component Validation

Intel tests reference components individually and as an assembly on mechanical test boards and assesses performance to the envelopes specified in previous sections by varying boundary conditions.

While component validation shows a reference design is tenable for a limited range of conditions, customers need to assess their specific boundary conditions and perform reliability testing based on their use conditions.

Intel reference components are also used in board functional tests to assess performance for specific conditions.

8.2.1 Board Functional Test Sequence

Each test sequence should start with components (baseboard, heatsink assembly, and so on) that have not previously endured any reliability testing.

Prior to the mechanical shock and vibration test, the units under test should be preconditioned for 72 hours at 45°C. The purpose is to account for load relaxation during burn-in stage.

The test sequence should always start with a visual inspection after assembly, and BIOS/processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/processor/memory test.

8.2.2 Post-Test Pass Criteria Examples

The post-test pass criteria examples are:

1. No significant physical damage to the heatsink and retention hardware. 2. Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. 3. No signs of physical damage on baseboard surface due to impact of heatsink. 4. No visible physical damage to the processor package. 5. Successful BIOS/Processor/memory test of post-test samples. 6. Thermal compliance testing to demonstrate that the case temperature specification can be met.

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8.2.3 Recommended BIOS/Processor/Memory Test Procedures

This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.

Testing setup should include the following components, properly assembled and/or connected:

• Appropriate system baseboard. • Processor and memory. • All enabling components, including socket and thermal solution parts.

The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test.

8.3 Material and Recycling Requirements

Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (for example, polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL- STD-810E, Method 508.4 must be performed to determine material performance. Cadmium shall not be used in the painting or plating of the socket. CFCs and HFCs shall not be used in manufacturing the socket.

Any plastic component exceeding 25 gm should be recyclable per the European Blue Angel recycling standards.

Supplier is responsible for complying with industry standards regarding environmental care as well as with the specific standards required per supplier's region. More specifically, supplier is responsible for compliance with the European regulations related to restrictions on the use of Lead and Bromine containing flame-retardants. Legislation varies by geography, European Union (RoHS/WEEE), China, California, and so forth.

The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS compliant.

Halogen flame retardant free (HFR-Free) PCB: Current guidance for the socket pad layout supports FR4 and HFR-Free designs. In future revisions of this document, Intel will be providing guidance on the mechanical impact to using a HFR-free laminate in the PCB. This will be limited to workstations.

Lead-free and Pb-free: Lead has not been intentionally added, but lead may still exist as an impurity below 1000 ppm.

RoHS compliant: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/ pending exemption applies.

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 74 Order No.: 330786-003 Quality Reliability and Ecological Requirements—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

Note: RoHS implementation details are not fully defined and may change.

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 75 Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Component Suppliers

Appendix A Component Suppliers

Customers can purchase the Intel reference or collaboration thermal solutions from the suppliers listed in the following table.

Table 24. Intel® Reference or Collaboration Thermal Solutions

Item Intel Part Number Supplier PN Delta Supplier Foxconn Supplier Contact Info Contact Info

1U Square Heatsink E89205-001 contact supplier Jason Tsai Cary Huang 黃寬裕 Assy with TIM Delta Products Corp Foxconn Technology (91.5x91.5x25.5) Portland, Oregon Co, Inc. 2525 Brockton Dr., 1U Narrow Heatsink G16539-001 contact supplier [email protected] Suite 300 Assy with TIM 971-205-7074 (70x106x25.5) Austin, TX 78758 Phone: 512-670-2638 2U Active/Combo E62452-004 contact supplier [email protected] Heatsink Assy w/TIM, om Fan Guard

Delrin eRing retainer G13624-001 FT1008-A ITW Electronics Chak Chakir Business Asia Co., Ltd. [email protected] m 512-989-7771

Thermal Interface N/A PCM45F Honeywell Judy Oles Material (TIM) [email protected] om +1-509-252-8605

TC-5022 Dow Corning Ed Benson e.benson@dowcorning. com +1-617-803-6174

Customers can purchase the Intel LGA2011-3 sockets and reference LGA2011-3 ILMs from the suppliers listed in the following table.

Table 25. LGA2011-3 Socket and ILM Components

Item Intel PN Foxconn (Hon Tyco Lotes Amtek Molex Hai)

LGA 2011-3 G64443-001 PE201127-435 2201838-1 AZIF0001- NA NA Socket POR 5-01H P004C

LGA 2011-3 G63449-005 PT44L11-4711 2229339-2 AZIF0018- ITLG63449001 105274-2000 Square ILM P001C

LGA 2011-3 G43051-006 PT44L12-4711 2229339-1 AZIF0019- ITLG43051002 105274-1000 Narrow ILM P001C

LGA 2011-3 E91834-001 PT44P41-4401 2134440-1 DCA-HSK-182- ITLE91834001 105142-7000 Backplate T02

Supplier Eric Ling Alex Yeh Cathy Yang Alvin Yap Edmund Poh Contact Info continued...

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 76 Order No.: 330786-003 Component Suppliers—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

Item Intel PN Foxconn (Hon Tyco Lotes Amtek Molex Hai)

eric.ling@foxco [email protected] [email protected] alvinyap@amte edmund.poh@mol nn.com m m.cn k.com.cn ex.com 503-693-3509 Tel: Tel: Tel Tel x225 +886-2-21715 +1-86-20-8468 +(86)752-2634 +1-630-718-5416 280 6519 x219 562 Cathy Yu cathy_yu@amt ek.com.cn Tel +(86)752-2616 809

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 77 Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings

Appendix B Mechanical Drawings

The following sections contain mechanical drawings of reference retention designs, processor package geometry and reference heat sink designs.

Table 26. List of Mechanical Drawings

Package Mechanical Drawing Page 1 on page 81

Large Package Mechanical Drawing Page 2 on page 80

Package Mechanical Drawing Page 1 on page 81

Package Mechanical Drawing Page 2 on page 82

ILM Backplate Keep Out Zone on page 83

ILM Mounting Hole Keep Out Zone on page 84

Narrow ILM Keep Out Zone on page 85

Narrow ILM 3D Keep Out Zone on page 86

ILM Keep Out Zone on page 87

3D Keep Out Zone on page 88

Heat Sink Retaining Ring on page 89

Heat Sink Spring on page 90

1U Narrow Heat Sink Geometry (Page 1) on page 92

1U Narrow Heat Sink Geometry (Page 2) on page 93

1U Narrow Heat Sink Assembly (Page 1) on page 94

1U Narrow Heat Sink Assembly (Page 2) on page 95

1U Square Heat Sink Geometry (Page 1) on page 96

1U Square Heat Sink Geometry (Page 2) on page 97

1U Square Heat Sink Assembly (Page 1) on page 98

1U Square Heat Sink Assembly (Page 2) on page 99

2U Square Heat Sink Geometry (Page 1) on page 100

2U Square Heat Sink Geometry (Page 2) on page 101

2U Square Heat Sink Assembly (Page 1) on page 102

2U Square Heat Sink Assembly (Page 2) on page 103

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 78 Order No.: 330786-003 Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

B.1 Large Package Mechanical Drawing Page 1

Figure 39. Intel® Xeon® Processor v3 Product Families Large Package Mechanical Drawing Page 1

DWG. NO SHT. REV 8 7 6 5 4 3 2 G57902 1 3

THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. H H NOTES:

1 SUBSTRATE MARK AREA.

2 COMPONENT ALLOWABLE AREA.

B (B ) 1 (B ) 3 G 1 C SEE DETAIL B G SYMBOL MILLIMETERS COMMENTS B 1 52.5 0.07 B 2 51 0.07 B 3 45 0.3 B 4 45 0.1 FIDUCIAL C 1 47.5 0.1 j 1 C B

C 2 38.14 0.1 j 1 C A C F 3 49.2 0.1 F C 5 49.9 F 2 3.181 0.202 F G 4 5.081 0.208 2 G 1 50.24 (B ) (B ) (C ) 4 2 1 G 2 43.18 H (C ) 1 25.12 5 H 2 21.59 J E 1 0.881 E J 2 1.016 H j 0.2 C B-A 2 J 3 0.508 J M j 0.15 C G-B 2 1 0.231 M J 2 0.553 3 M 3 0.104 M 4 0.13 M 5 0.875 0.04 M A 6 0.574 0.04 D M D PIN 1 7 60$ G J FIDUCIAL 1 (C ) PIN 1 H 2 SECTION B-B 1 (C ) G 3 1 2X M 3 0.203 C 0.125 2X M 0.245 C 1 0.125 2X M 2 SEE DETAIL A IHS LID C M 7 C

IHS SEALANT

M PACKAGE SUBSTRATE F 5 6X RM 4 4 F 2 M C 6 TBD C SECTION A-A ALL LGA LANDS C DETAIL B 0.021 SOLDER RESIST DETAIL A 2011X B SCALE 8 SCALE 60 B

UNLESS OTHERWISE SPECIFIED DESIGNED BY DATE DEPARTMENT R 2200 MISSION COLLEGE BLVD. INTERPRET DIMENSIONS AND TOLERANCES P.O. BOX 58119 IN ACCORDANCE WITH ASME Y14.5M-1994 SANTA CLARA, CA 95052-8119 DIMENSIONS ARE IN MILLIMETERS DRAWN BY DATE TITLE ALL UNTOLERANCED LINEAR DIMENSIONS ±0 ANGLES ±0.5 CHECKED BY DATE

THIRD ANGLE PROJECTION PACKAGE MECHANICAL DRAWING APPROVED BY DATE A SIZE DRAWING NUMBER REV A

MATERIAL FINISH A1 G57902 3 SCALE: 4 DO NOT SCALE DRAWING SHEET 1 OF 3 8 7 6 5 4 3 2 1

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 79 Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings

B.2 Large Package Mechanical Drawing Page 2

Figure 40. Intel® Xeon® Processor v3 Product Families Large Package Mechanical Drawing Page 2

DWG. NO SHT. REV 8 7 6 5 4 3 2 G57902 2 3

K R G 1 G

18.2 0.23 C E A J 9.1 2

F F

V 1 T 2 E 12.8 DETAIL C E SCALE 8 6.4 E

T 1

R 2 N D 0.23 C E A D M

E SEE DETAIL C SEE DETAIL D D C 1.5 MAX ALLOWABLE COMPONENT HEIGHT

C SYMBOL MILLIMETERS COMMENTS C R 1 1.09 R 2 1.09 V T 2 1 13 T D 2 0.2 V DETAIL D 1 14 SCALE 8 V 2 0.2

B B

A DEPARTMENT SIZE DRAWING NUMBER REV A R 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 A1 G57902 3 SCALE: 4 DO NOT SCALE DRAWING SHEET 2 OF 3 8 7 6 5 4 3 2 1

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 80 Order No.: 330786-003 Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

B.3 Package Mechanical Drawing Page 1

Figure 41. Intel® Xeon® Processor v3 Product Families Small Package Mechanical Drawing Page 1

DWG. NO SHT. REV 8 7 6 5 4 3 2 G63360 1 2

1 COMPONENT ALLOWABLE AREA. 1.5 mm MAX ALLOWABLE COMPONENT HEIGHT.

B D 1 C 1 2X C 3 G E 1 G SEE DETAIL B G

DF DE DD DC DB DA CY CW CV CU CT CR CP CN CM CL CK CJ CH CG CF CE CD CC CB CA BY BW BV C BU BT 2 BR F BP F BN BM BL BK BJ BH BG B BF G 2 BE 2 BD BC BB C BA AY 4 AW AV AU AT AR AP AN AM AL AK H AJ 2 AH 42X AG AF AE AD J AC AB 3 AA Y W E V E 85X U T R P J N M 2 L K J H G F E D C B A 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 FIDUCIAL X3 TOP VIEW PIN 1 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 (SOME DRAWING GEOMETRY PIN 1 REMOVED FOR VISUAL CLARITY) C 1 57X J FIDUCIAL X2 1 D H D 1 SYMBOL MILLIMETERS COMMENTS SEE DETAIL A BOTTOM VIEW B 1 52.5 0.07 B 2 45 0.07 2X (M ) 3 C 49.2 0.1 1 SYMBOL MILLIMETERS COMMENTS C 2 42.5 0.1 1 C E 2X (M ) M 1 1 0.231 C 2X (M ) C 3 38.14 0.1 1 C D 2 M C SECTION A-A 2 0.553 C C 28.5 0.1 4 M 0.104 M 3 G 7 1 50.24 M 4 0.13 G 2 43.18 M 0.245 C 0.203 C 5 0.875 0.04 H 0.15 C E D 0.125 0.125 1 25.12 M 6X R(M ) 6 0.574 0.04 H M 4 IHS SEALANT IHS LID 2 21.59 0.15 C E D 5 M 7 60$ J 1 0.881 M PACKAGE SUBSTRATE 6 J B 2 0.508 B J 3 1.016 DETAIL B SCALE 60 F 4 UNLESS OTHERWISE SPECIFIED DESIGNED BY DATE DEPARTMENT R 2200 MISSION COLLEGE BLVD. F MILLIMETERS INTERPRET DIMENSIONS AND TOLERANCES - - P.O. BOX 58119 2 IN ACCORDANCE WITH ASME Y14.5M-1994 - SANTA CLARA, CA 95052-8119 SYMBOL DIMENSIONS ARE IN MILLIMETERS DRAWN BY DATE TITLE PACKAGE A PACKAGE B ALL UNTOLERANCED LINEAR DIMENSIONS ±0 - - CHECKED BY DATE F ANGLES ±0.5 2 3.181 0.202 3.101#0.186 - - THIRD ANGLE PROJECTION PACKAGE MECHANICAL DRAWING DETAIL A C F 5.081 0.194 5.001#0.177 - - 4 APPROVED BY DATE A SCALE 12 SIZE DRAWING NUMBER REV A - - MATERIAL FINISH A1 G63360 2 SEE NOTES SEE NOTES SCALE: 4 DO NOT SCALE DRAWING SHEET 1 OF 3 8 7 6 5 4 3 2 1

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B.4 Package Mechanical Drawing Page 2

Figure 42. Intel® Xeon® Processor v3 Product Families Small Package Mechanical Drawing Page 2

DWG. NO SHT. REV 8 7 6 5 4 3 2 G63360 2 2

(18.2) 2X V (9.1) 2 G G

DF DE DD DC DB DA CY CW CV CU CT CR CP CN CM CL CK CJ CH CG CF CE CD CC CB CA BY BW BV 2X V BU 1 BT BR F BP F BN BM BL BK BJ BH BG BF BE BD BC (12.8) BB BA AY AW AV AU (6.4) AT AR AP AN AM AL 2X T AK 1 AJ AH AG AF AE AD AC AB AA Y W E V U E T R P N M L K J H G F E D C B A 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 PIN #1 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 F 1.5 MAX ALLOWABLE COMPONENT HEIGHT 2X T SEE DETAIL C SEE DETAIL D 2 C D G D

K N R 1 R SYMBOL MILLIMETERS COMMENTS 2 MbN C R C JbK 1 1.09 R 2 1.09 M T 13 J 1 T 2 0.2 V 1 14 V 2 0.2 B B

G DETAIL D DETAIL C 2X 2X SCALE 8 SCALE 8

A DEPARTMENT SIZE DRAWING NUMBER REV A R 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 - SANTA CLARA, CA 95052-8119 A1 G63360 2 SCALE: 4 DO NOT SCALE DRAWING SHEET 2 OF 3 8 7 6 5 4 3 2 1

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B.5 ILM Backplate Keep Out Zone

Figure 43. ILM Backplate Keep Out Zone A B C D MAY NOT BE DISCLOSED, REPRODUCED, DI THIS DRAWING CONTAINS INTEL CORPORAT 8 8 SPLAYED OR MODIFIED, WITHOUT THE PRI ION CONFIDENTIAL INFORMATION. IT IS 7 7 [ .196 4.98 ] OR WRITTEN CONSENT OF INTEL CORPORAT DISCLOSED IN CONFIDENCE AND ITS CONT 6 6 [ .550 [ .920 [ 2.854 13.98 23.38 72.5 ] ] ] FOR DETAILS SEE DOCUMENT G63999 LOCATIONS SHOWN FOR REFERENCE ONLY ILM RETENTION HOLES [ .880 ION. ENTS 22.35 5 5 ] [ 3.248 82.5 ] 4 4 QTY AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES. UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. HEIGHT DEFINED BY THAT ZONE. SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN ILM AND SOCKET FUNCTION. 3. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN WITH THEM. 2. DIMENSIONS STATED IN INCHES (MILLIMETERS) AND DEFINE ZONES, THEY HAVE NO TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. 1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL NOTES: 4 INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 THIRD ANGLE PROJECTION ITEM NO A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON TOP DIMENSIONS ARE IN INCHES (MM) UNLESS OTHERWISE SPECIFIED 3 3 KOZ_G63998_SKT-R3_BACKPLATE

PART NUMBER MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY E. BUDDRIUS - T. AULAKH E.BUDDRIUS E.BUDDRIUS STIFFENING PLATE CONTACT ZONE 0.0 MM MAX COMPONENT HEIGHT, NO PLACEMENT, ZONE 1: ZONE C6 6B 2C SEE NOTES - - DWG. NO KOZ_G63998_SKT-R3_BACKPLATE REV E D C B A REDUCED KOZ WIDTH BY 5MM ADDED PART # TO FILE NAME UPDATED KOZ UPDATED NOTES PRELIMINARY RELEASE LEGEND FINISH 9/30/11 DATE - 9-27-11 DATE 9-27-11 DATE 9-27-11 DATE SEE NOTES KOZ, SKT-R3 ILM, BACKPLATE PARTS LIST 2 SCALE: SIZE TITLE D DEPARTMENT REVISION HISTORY KOZ_G63998_SKT-R3_BACKPLATE DRAWING NUMBER PMCI DESCRIPTION KOZ, SKT-R3 ILM, BACKPLATE SHT. 2:1 1 DO NOT SCALE DRAWING REV DESCRIPTION RESTRICTIONS ARE E R SOLDER BUMPS. THE MOTHERBOARD TOLERANCES ASSOCIATED SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. HEIGHT FOR PROPER DIMENSIONS AND THE SHEET 3/27/12 10/8/11 9/30/11 5/1/13 2/2/12 DATE 1 1 1 OF 1 E.B. E.B. E.B. E.B. E.B. APPR REV E A B C D

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B.6 ILM Mounting Hole Keep Out Zone

Figure 44. ILM Mounting Hole Keep Out Zone A B C D MAY NOT BE DISCLOSED, REPRODUCED, DI THIS DRAWING CONTAINS INTEL CORPORAT 8 8 FOR REFERENCE ONLY SOCKET OUTLINE SPLAYED OR MODIFIED, WITHOUT THE PRI ION CONFIDENTIAL INFORMATION. IT IS 7 7 [ .504 [ 1.811 12.8 46 ] ] OR WRITTEN CONSENT OF INTEL CORPORAT DISCLOSED IN CONFIDENCE AND ITS CONT 6 6 [ .717 18.2 SEE DETAIL ] TOP SIDE HOLE DETAIL [ 2.724 4 PLACES SCALE 69.2 ] A 15:1 A ION. ENTS 5 5 [ .150 3.81 ] [ .276 NPTH ID COPPER WEAR PAD THROUGH ALL ROUTE KEEPOUT 0.0" HEIGHT PACKAGE KEEPOUT OD COPPER WEAR PAD: NON-GROUNDED, SOLDER MASKED 7.01 [ .180 [ .256 4.57 6.5 ] ROUTE KEEPOUT, TOP LAYER ] ] 4 4 TOLERANCES: DIMENSIONS ARE IN INCHES (MM) IN ACCORDANCE WITH ASME Y14.5M-1994 INTERPRET DIMENSIONS AND TOLERANCES UNLESS OTHERWISE SPECIFIED QTY - COMPONENT MAX MATERIAL CONDITION HEIGHT NOT TO EXCEED 1.50MM. - CAP NOMINAL HEIGHT = 1.25MM (0.049") DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED MAXIMUM COMPONENT - SOLDER REFLOW THICKNESS - COMPONENT PLACEMENT TILT - COMPONENT TOLERANCES - COMPONENT NOMINAL HEIGHT CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE MUST INCLUDE: SEE NOTE AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES. UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. HEIGHT DEFINED BY THAT ZONE AFTER REFLOW. SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN ILM AND SOCKET FUNCTION. 3. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN WITH THEM. 2. DIMENSIONS STATED IN INCHES (MILLIMETERS) AND DEFINE ZONES, THEY HAVE NO TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. 1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL NOTES: THIRD ANGLE PROJECTION 6 5 4 ITEM NO TOP ASSUMES PLACEMENT OF A 0805 CAPACITOR WITH DIMENSIONS: ASSUMING A GENERIC MAXIMUM COMPONENT HEIGHT ZONE. A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON 3 3 KOZ_G63999_SKT-R3_MTG-HOLES 5 FOR ADDITIONAL DETAILS. PART NUMBER 1.50 MM MAX (MMC) COMPONENT HEIGHT BEFORE REFLOW 1.67 MM MAX COMPONENT HEIGHT AFTER REFLOW ZONE 2: 0.0 MM MAX COMPONENT HEIGHT, NO PLACEMENT ZONE 1: NO ROUTE ZONE ZONE 4: NO ROUTE ZONE THROUGH ALL LAYERS ZONE 3: C7,A5 MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY E. BUDDRIUS - T. AULAKH E.BUDDRIUS E.BUDDRIUS ZONE B6 B4 A5 SEE NOTES - DWG. NO KOZ_G63999_SKT-R3_MTG-HOLES REV E D C B A CORRECTED SOCKET KEYING, NO KOZ CHANGES ADDED "TOP LAYER" TO RKO DIMENSION ADDED PART # TO FILE NAME UPDATED HOLE PATTERN AND KEEP-OUT AREAS MODIFIED KOZ HOLE SIZES PRELIMINARY RELEASE LEGEND FINISH 9/30/11 DATE - 9-27-11 DATE 9-27-11 DATE 9-27-11 DATE SEE NOTES KOZ, SKT-R3 ILM, MTG HOLES PARTS LIST 2 SCALE: SIZE TITLE D DEPARTMENT REVISION HISTORY KOZ_G63999_SKT-R3_MTG-HOLES DRAWING NUMBER PMCI KOZ, SKT-R3 ILM, MTG HOLES DESCRIPTION SHT. 3:1 1 DO NOT SCALE DRAWING REV DESCRIPTION 4 RESTRICTIONS ARE

E 5 R 4 SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. SOLDER BUMPS. THE MOTHERBOARD TOLERANCES ASSOCIATED

HEIGHT FOR PROPER DIMENSIONS AND 6 HEIGHT. THE SHEET 3/28/12 10/7/11 9/27/11 8/6/12 2/2/12 DATE 1 1 1 OF 1 E.B. E.B. E.B. E.B. E.B. APPR REV E A B C D

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B.7 Narrow ILM Keep Out Zone

Figure 45. Narrow ILM Keep Out Zone A B C D MAY NOT BE DISCLOSED, REPRODUCED, DI THIS DRAWING CONTAINS INTEL CORPORAT 8 8 ( [ 4.169 105.9 ] ) [ 3.701 94 ] SPLAYED OR MODIFIED, WITHOUT THE PRI ION CONFIDENTIAL INFORMATION. IT IS [ 1.299 33 ] 7 7 7 4X NO THROUGH HOLES ARE REQUIRED IN PCB LOCATIONS SHOWN FOR REFERENCE ONLY, THERMAL RETENTION MOUNTING HOLE SEE DOCUMENT G63999 COMPONENT DETAILS FOR SOCKET CAVITY REFERENCE ONLY SOCKET OUTLINE FOR R ILM RETENTION HOLES [ .234 5.95 OR WRITTEN CONSENT OF INTEL CORPORAT DISCLOSED IN CONFIDENCE AND ITS CONT ( [ 1.542 DOCUMENT G63999 FOR DETAILS SEE [ 3.091 39.16 [ 2.205 [ 3.150 78.5 ] 56 80 6 6 ] ] ] ] ) 4X 115.8 7 4X ION. ENTS 18.6 5 5 [ .984 25 ] [ 3.346 85 ] [ 3.406 86.5 ] 4 4 TOLERANCES: DIMENSIONS ARE IN INCHES (MM) IN ACCORDANCE WITH ASME Y14.5M-1994 INTERPRET DIMENSIONS AND TOLERANCES UNLESS OTHERWISE SPECIFIED DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED MAXIMUM COMPONENT - SOLDER REFLOW THICKNESS - COMPONENT PLACEMENT TILT - COMPONENT TOLERANCES - COMPONENT NOMINAL HEIGHT ILM AND SOCKET FUNCTION. 3. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN WITH THEM. 2. DIMENSIONS STATED IN INCHES (MILLIMETERS) AND DEFINE ZONES, THEY HAVE NO TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. 1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL NOTES: OR ASSEMBLY TOOL ACCESS IS TO BE DETERMINED BY SYSTEM/BOARD ARCHITECT. CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE MUST INCLUDE: SEE NOTE AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES. UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. HEIGHT DEFINED BY THAT ZONE. SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN 7 6 4 5 THIRD ANGLE PROJECTION ASSEMBLY AND SERVICEABILITY ZONE SHOWN FOR REFERENCE. SIZE, SHAPE HEIGHT THIS DRAWING DEFINES THE ILM COMPONENT MECHANICAL CLEARANCE REQUIREMENT ONLY. A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON ASSUMING A GENERIC MAXIMUM COMPONENT HEIGHT ZONE. 3 3 5 FOR ADDITIONAL DETAILS. 1.40MM MAX COMPONENT HEIGHT ZONE 2: SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE 0.0 MM MAX COMPONENT HEIGHT, NO PLACEMENT, ZONE 1: 1.60MM MAX COMPONENT HEIGHT ZONE 3: MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY E. BUDDRIUS - T. AULAKH E.BUDDRIUS E.BUDDRIUS ZONE B6 B6 SEE NOTES - - - - DWG. NO KOZ_G64001_SKT-R3_ILM-NARROW REV F E D C B A REDUCED DIMENSIONS, UPDATED SOCKET KEYING REDEFINED DIMENSIONS, NO GEOMETRY CHANGED ADDED PART # TO FILE NAME UPDATED KOZ ADDED ASSEMBLY ZONE PRELIMINARY RELEASE LEGEND FINISH 9/30/11 DATE - 9-27-11 DATE 9-27-11 DATE 9-27-11 DATE SEE NOTES 2 SCALE: SIZE TITLE KOZ, SKT-R3 ILM, TOPSIDE, NARROW D DEPARTMENT REVISION HISTORY 4 4 DRAWING NUMBER PMCI KOZ_G64001_SKT-R3_ILM-NARROW

DESCRIPTION SHT. 5 5 2:1 1 DO NOT SCALE DRAWING REV RESTRICTIONS ARE F R SOLDER BUMPS. TOLERANCES ASSOCIATED THE MOTHERBOARD SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. FOR PROPER DIMENSIONS AND HEIGHT HEIGHT. OF FINGER THE SHEET 8/28/12 4/12/12 3/28/12 10/7/11 9/30/11 2/2/12 DATE 1 1 1 OF 1 E.B. E.B. E.B. E.B. E.B. E.B. APPR REV F A B C D

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B.8 Narrow ILM 3D Keep Out Zone

Figure 46. Narrow ILM 3D Keep Out Zone A B C D MAY NOT BE DISCLOSED, REPRODUCED, DI THIS DRAWING CONTAINS INTEL CORPORAT 8 8 [ .159 4.03 ] SPLAYED OR MODIFIED, WITHOUT THE PRI ION CONFIDENTIAL INFORMATION. IT IS 7 7 [ 2.362 [ 3.150 [ 2.520 60 80 64 ] ] ] MB-TOP OR WRITTEN CONSENT OF INTEL CORPORAT DISCLOSED IN CONFIDENCE AND ITS CONT 6 6 KOZ'S NOT SHOWN FOR CLARITY 3D HEIGHT RESTRICTIVE KEEP-OUT-VOLUME ONLY ION. ENTS 5 5 60.0 125.0 R [ 3.016 76.6 R [ 3.715 ] 94.35 ] [ 1.565 4 4 39.75 ] [ 1.565 39.75 A ] DURING OPENING AND CLOSING VOLUMETRIC SWEEPS FOR LOADPLATE AND LEVERS R [ 3.119 DEPARTMENT 79.23 PMCI 3 3 MB-TOP ] 125.0 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. DWG. NO 2 G66105 SCALE: SIZE D DRAWING NUMBER SHT. 1.000 4 DO NOT SCALE DRAWING REV C G66105 SHEET 1 1 4 OF 4 REV C A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 86 Order No.: 330786-003 Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

B.9 ILM Keep Out Zone

Figure 47. Square ILM Keep Out Zone A B C D MAY NOT BE DISCLOSED, REPRODUCED, DI THIS DRAWING CONTAINS INTEL CORPORAT 8 8 ( [ 3.622 92 ] ) [ 3.150 80 ] SPLAYED OR MODIFIED, WITHOUT THE PRI ION CONFIDENTIAL INFORMATION. IT IS 7 7 4X 2X 7 154.3 140.0 NO THROUGH HOLES ARE REQUIRED IN PCB LOCATIONS SHOWN FOR REFERENCE ONLY, THERMAL RETENTION MOUNTING HOLE 4X 168.2 SEE DOCUMENT G63999 COMPONENT DETAILS FOR SOCKET CAVITY REFERENCE ONLY SOCKET OUTLINE FOR DOCUMENT G63999 OR WRITTEN CONSENT OF INTEL CORPORAT DISCLOSED IN CONFIDENCE AND ITS CONT ILM RETENTION ( [ 3.091 DETAILS SEE [ 3.622 [ 3.150 6 6 78.5 HOLES, FOR 92 80 ] ] ] ) ION. ENTS 5 5 7 4X 2X R [ .236 6 [ 1.406 ] 35.72 ] [ 3.346 85 ] [ 3.394 86.2 ] 4 4 DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED MAXIMUM COMPONENT - SOLDER REFLOW THICKNESS - COMPONENT PLACEMENT TILT - COMPONENT TOLERANCES - COMPONENT NOMINAL HEIGHT CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE MUST INCLUDE: SEE NOTE AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES. UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. HEIGHT DEFINED BY THAT ZONE. SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN ILM AND SOCKET FUNCTION. 3. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN WITH THEM. 2. DIMENSIONS STATED IN INCHES (MILLIMETERS) AND DEFINE ZONES, THEY HAVE NO TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. 1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL NOTES: OR ASSEMBLY TOOL ACCESS IS TO BE DETERMINED BY SYSTEM/BOARD ARCHITECT. 7 6 5 4 THIS DRAWING DEFINES THE ILM COMPONENT MECHANICAL CLEARANCE REQUIREMENT ONLY. ASSUMING A GENERIC MAXIMUM COMPONENT HEIGHT ZONE. A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON ASSEMBLY AND SERVICEABILITY ZONE SHOWN FOR REFERENCE. SIZE, SHAPE HEIGHT INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 THIRD ANGLE PROJECTION DIMENSIONS ARE IN INCHES (MM) UNLESS OTHERWISE SPECIFIED 3 3 5 FOR ADDITIONAL DETAILS. 1.40MM MAX COMPONENT HEIGHT ZONE 2: SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE 0.0 MM MAX COMPONENT HEIGHT, NO PLACEMENT, ZONE 1: 1.60MM MAX COMPONENT HEIGHT ZONE 3: MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY E. BUDDRIUS - - E.BUDDRIUS E.BUDDRIUS ZONE B6 B6 SEE NOTES - - DWG. NO KOZ_G64000_SKT-R3_ILM-SQUARE LEGEND REV D C B A UPDATED SOCKET KEYING, ADDED 1.6MM ZONE REDEFINED DIMENSIONS, NO GEOMETRY CHANGED SIZE OF ZONE 2, ADDED PART # TO FILE NAME REDUCED KOZ SIZE IN THE Y-DIRECTION, INCREASED PRELIMINARY RELEASE FINISH 12/29/11 DATE - - DATE 12/29/11 DATE 12/29/11 DATE SEE NOTES 2 4 4

5 5 SCALE: SIZE TITLE KOZ, SKT-R3 ILM, TOPSIDE, SQUARE D DEPARTMENT REVISION HISTORY DRAWING NUMBER PMCI KOZ_G64000_SKT-R3_ILM-SQUARE DESCRIPTION SHT. 2:1 1 DO NOT SCALE DRAWING REV RESTRICTIONS ARE D SOLDER BUMPS. R THE MOTHERBOARD TOLERANCES ASSOCIATED HEIGHT FOR PROPER DIMENSIONS AND SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. HEIGHT. THE OF FINGER SHEET 12/29/11 8/29/12 4/12/12 3/28/12 DATE 1 1 1 OF 1 E.B. E.B. E.B. E.B. APPR REV D A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 87 Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings

B.10 3D Keep Out Zone

Figure 48. Square 3D Keep Out Zone A B C D MAY NOT BE DISCLOSED, REPRODUCED, DI THIS DRAWING CONTAINS INTEL CORPORAT 8 8 [ .159 4.03 ] SPLAYED OR MODIFIED, WITHOUT THE PRI ION CONFIDENTIAL INFORMATION. IT IS 7 7 [ .630 16 [ 3.622 [ 2.520 92 64 ] ] ] MB_TOP OR WRITTEN CONSENT OF INTEL CORPORAT DISCLOSED IN CONFIDENCE AND ITS CONT 6 6 KOZ'S NOT SHOWN FOR CLARITY 60.0 3D HEIGHT RESTRICTIVE KEEP-OUT-VOLUME ONLY 125.0 ION. ENTS 5 5 R [ 3.011 76.47 ] 125.0 R [ 3.024 76.82 [ 1.565 ] 39.75 ] [ 1.565 39.75 4 4 A ] R [ 3.124 79.36 MB_TOP ] DURING OPENING AND CLOSING VOLUMETRIC SWPPES FOR LOADPLATE AND LEVERS DEPARTMENT PMCI 3 3 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. DWG. NO 2 G66106 SCALE: SIZE D DRAWING NUMBER SHT. 1.000 4 DO NOT SCALE DRAWING REV C G66106 SHEET 1 1 4 OF 4 REV C A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 88 Order No.: 330786-003 Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

B.11 Heat Sink Retaining Ring

Figure 49. Heat Sink Retaining Ring A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 7 7 4X R0.50 [0.020] MIN. 3.20 [ 0.126 -0.12 0 5 -0.004 +0.000 6 6 ] 7.00 [ 0.276 [ 5.20 0.20 0.205 0.007 0.10 0.003 ]

5 5 5 ] MAX. 4 4 0.60 [ 0.0236 0.04 0.0015 ]

5 .XXX .XX .X TOLERANCES: DIMENSIONS ARE IN MILLIMETERS IN ACCORDANCE WITH ASME Y14.5-1994 INTERPRET DIMENSIONS AND TOLERANCES UNLESS OTHERWISE SPECIFIED THIRD ANGLE PROJECTION .5 Angles 0.25 0.127 3 3 1.0 4. FINISH: NI PLATED IF NOT STAINLESS MODULUS OF ELASTICITY >= 28000 KSI (193 GPA) YIELD STRENGTH >= 90000 PSI (620 MPA) 3. MATERIAL: SPRING STEEL OR STAINLESS [BRACKETED] DIMENSIONS STATED IN INCHES. 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS. DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE. 3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS 1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED NOTES: MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY C. HO N. ULEN N. ULEN 5 ZONE SEE NOTES C5 C5 B4 B6 CRITICAL TO FUNCTION DIMENSION - DWG. NO REV B A THICKNESS 0.64 +/-.05 TO 0.60 +/- .04 I.D. 5.18 TO 5.20 SNAP DIAMETER 3.175 TO 3.20, PLUS TOLS O.D. TOLERANCE +/-0.10 TO +/-0.20 RELEASE FOR THERMAL TARGET SPECIFICATION FINISH DATE 06/19/09 DATE 06/19/09 DATE 06/19/09 DATE SEE NOTES 2 ROMLEY/GRANTLEY HS RETAINING RING E75155 SCALE: 1 TITLE SIZE D DEPARTMENT DESCRIPTION EASD / PTMI REVISION HISTORY DRAWING NUMBER SHT. 1 DO NOT SCALE DRAWING REV B E75155 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. 5 07/07/09 06/19/09 DATE SHEET 1 OF 5 1 1 APPROVED - REV B A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 89 Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings

B.12 Heat Sink Spring

Figure 50. Heat Sink Spring A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 SOLID HEIGHT 7 7 [ 5.50 0.217 0 +0.30 -0.000 +0.011 4 ] A A 6 6 FREE HEIGHT FREE HEIGHT [0.500] 12.70 5 5 4 WIRE DIA. [0.0433] 1.100 SECTION A-A 4 4 I.D. 5.42 O.D. 7.62 [ [ 0.213 -0.13 +0.08 0.300 .XXX .XX .X TOLERANCES: DIMENSIONS ARE IN MILLIMETERS IN ACCORDANCE WITH ASME Y14.5-1994 INTERPRET DIMENSIONS AND TOLERANCES UNLESS OTHERWISE SPECIFIED -0.13 +0.08 -0.005 +0.003 THIRD ANGLE PROJECTION -0.005 +0.003 .5 Angles 4 0.25 0.127 3 3 ] 4 ] 1.0 OTHER GEOMETRY: PER THIS DRAWING FINISH: ZINC PLATED MATERIAL: MUSIC WIRE, ASTM A228 OR JIS-G-3522 TURN: LEFT HAND (AS SHOWN IN VIEWS) ENDS: GROUND & CLOSED ACTIVE COILS: 3.0 TOTAL COILS: 5.0 (ONLY COILS SHOWN IN THIS DRAWING) WIRE DIAMETER: 1.1 MM [0.043 IN] SOLID HEIGHT: 5.5 MM [0.217 IN] FREE HEIGHT: 12.7 MM [0.500 IN] 3. SPRING RATE: K=15.80 +/- 1.5 N/MM [K=90.2 9.0 LBF/IN] [BRACKETED] DIMENSIONS STATED IN INCHES. 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS. DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE. 3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS 1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED NOTES: MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY D. LLAPITAN N. ULEN N. ULEN NOTE 3 4 ZONE SEE NOTES CRITICAL TO FUNCTION DIMENSION - DWG. NO REV C B A UPDATED SPRING STIFFNESS AND COIL INFO ALL SPRING SPECIFICATIONS UPATED. SEE NOTE 3. SUPPLIER FEEDBACK FINISH DATE 11/16/09 DATE 11/15/09 DATE 11/15/09 DATE SEE NOTES 2 E86113 SCALE: 1 TITLE SIZE D DEPARTMENT DESCRIPTION EASD / PTMI SPRING, COMPRESSION, PRE-LOAD REVISION HISTORY DRAWING NUMBER SHT. 1 DO NOT SCALE DRAWING REV C E86113 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. 01/14/10 12/08/09 11/15/09 DATE SHEET 1 OF 1 1 4 APPROVED - REV C A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 90 Order No.: 330786-003 Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

B.13 Heat Sink Spring Cup

Figure 51. Heat Sink Spring Cup A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 4 [ 4.500 [ 0.000 [ 1.000 0.1772 0.0000 0.0394 ] ] ] A A 7 7 6 6 [ 5.50 [ 4.50 [ 0.000 0.217 0.177 0.000 5 5 ] ] ] 9.45 5.40 7.95 [ [ [ [ 10.45 SECTION A-A 0.411 0.372 0.213 0.313 0 +0.06 0 +0.13 0 +0.13 0 +0.06 4 4 4 -0.000 +0.002 -0.000 +0.005 -0.000 +0.005 -0.000 +0.002 4 4 ] ] ] ] .XXX .XX .X TOLERANCES: DIMENSIONS ARE IN MILLIMETERS IN ACCORDANCE WITH ASME Y14.5-1994 INTERPRET DIMENSIONS AND TOLERANCES UNLESS OTHERWISE SPECIFIED THIRD ANGLE PROJECTION .5 Angles 0.25 0.127 3 3 0.5 x 45 1.0 TYP. MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY D. LLAPITAN N. ULEN N. ULEN 3. MATERIAL: SUS301, 304, 430 [BRACKETED] DIMENSIONS STATED IN INCHES. 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS. DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE. 3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS 1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED NOTES: ZONE 4 SEE NOTES - CRITICAL TO FUNCTION DIMENSION DWG. NO REV B A REMOVED SKIRT AND MADE SHORTER ROLLED PART TO -002 INITIAL SUPPLIER RELEASE FINISH DATE 5/5/10 DATE 5/5/10 DATE 5/5/10 DATE SEE NOTES 2 E97837 SCALE: 1 TITLE SIZE D DEPARTMENT DESCRIPTION EASD / PTMI REVISION HISTORY DRAWING NUMBER SHT. CUP, SPRING RETENTION 1 DO NOT SCALE DRAWING REV B E97837 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. 8/12/10 5/5/10 DATE SHEET 1 OF 1 1 APPROVED - REV B A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 91 Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings

B.14 1U Narrow Heat Sink Geometry (Page 1)

Figure 52. 1U Narrow Heat Sink Geometry (Page 1) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 [ 106.00 SEE DETAIL A 4.173 -0.25 0 -0.009 +0.000 ] C 7 7 4X 13.66 [ 70.00 [ TOP VIEW 2.756 0.538 -0.25 0 0 +1.00 -0.009 +0.000 -0.000 +0.039 ] ] [1.00] 25.50 MAX. 4X 12.00 6 6 [ 0.472 AIRFLOW DIRECTION 0 +1.00 -0.000 +0.039 ] 5 5 47x 0.20 46x 1.32 47x 21.00 [0.008] [0.052] [0.827] SCALE 6.000 DETAIL A 4 4 .XXX .XX .X TOLERANCES: DIMENSIONS ARE IN MILLIMETERS IN ACCORDANCE WITH ASME Y14.5-1994 INTERPRET DIMENSIONS AND TOLERANCES UNLESS OTHERWISE SPECIFIED THIRD ANGLE PROJECTION .5 Angles 0.25 0.127 3 3 1.0 OVERALL FIN HEIGHT MUST STILL BE MAINTAINED. OF HEATSINK TO INCREASE FIN ARRAY STRUCTURAL STABILITY. 8. MECHANICAL STITCHING OR CONNECTION ALLOWED ON TOP SURFACE HEAT SINK BASE. 7. LOCAL FLATNESS ZONE .076 MM [0.003"] CENTERED ON SOLVENTS AFTER MACHINING AND FIN ASSEMBLY. 6. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR FINS: QTY 47X 0.2 MM, ALUMINUM, K=220 W/M-K MIN 4. BASE: COPPER, K=380 W/M-K MIN 3. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994. CRITICAL TO FUNCTION DIMENSION. [BRACKETED] DIMENSIONS STATED IN INCHES. 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS, ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES 1. THIS DRAWING TO BE USED IN CONJUNCTION WITH NOTES: 9 MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY - C. HO N. ULEN N. ULEN ZONE SEE NOTES CRITICAL TO FUNCTION DIMENSION. - DWG. NO REV A RELEASE FOR SUPPLIER FEEDBACK FINISH DATE - 03/23/10 DATE 03/23/10 DATE 03/23/10 DATE SEE NOTES 2 E95465 SCALE: 1 TITLE SIZE D DEPARTMENT DESCRIPTION EASD / PTMI REVISION HISTORY DRAWING NUMBER ROMLEY/GRANTLEY 1U NARROW SHT. 1 DO NOT SCALE DRAWING REV HS GEOMETRY A E95465 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. 03/23/10 DATE SHEET 1 OF 2 1 1 APPROVED - REV A A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 92 Order No.: 330786-003 Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

B.15 1U Narrow Heat Sink Geometry (Page 2)

Figure 53. 1U Narrow Heat Sink Geometry (Page 2) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 [2.205] 56.00 0.10 [0.003] 9 [ 9.35 9 0.368 [1.496±0.019] 38.00±0.50 -0.06 0 -0.002 +0.000 A B ] C A 7 7 SECTION A-A [1.496±0.019] 38.00±0.50 [3.701] 94.00 9 6 6 AIRFLOW DIRECTION AIRFLOW DIRECTION BOTTOM VIEW SEE NOTE 7 FLATNESS ZONE, A TOP VIEW 3.0 X 45 ALL FINS CHAMFER 0.077 [0.0030] SEE DETAIL B 5 5 4 4 DEPARTMENT PTMI 3 3 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. DWG. NO SCALE 6.000 DETAIL B 2 E95465 SCALE: 1.500 SIZE D DRAWING NUMBER SHT. 2 DO NOT SCALE DRAWING REV BASE THICKNESS 4.50 [ 9 0.177 A E95465 0.13 0.005 ] SHEET 2 OF 1 1 REV A A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 93 Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings

B.16 1U Narrow Heat Sink Assembly (Page 1)

Figure 54. 1U Narrow Heat Sink Assembly (Page 1) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 7 7 5 6 6 1 4 2 5 3 5 5 4 4 .XXX .XX .X TOLERANCES: DIMENSIONS ARE IN MILLIMETERS IN ACCORDANCE WITH ASME Y14.5-1994 INTERPRET DIMENSIONS AND TOLERANCES UNLESS OTHERWISE SPECIFIED QTY 1 4 4 4 4 THIRD ANGLE PROJECTION ITEM NO TOP 0.5 Angles 1 2 3 4 5 0.25 0.127 3 3 1.0 PART NUMBER E95474-001 E95465-001 E86334-001 E86113-001 E86111-001 E75155-001 MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY - C. HO N. ULEN N. ULEN IS AWAY FROM BASE CUP SURFACE MAGNIFICATION. OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X THE MARK CAN BE AN INK MARK, LASER PUNCH "RECOMMENDED SCREW TORQUE: 8 IN-LBF" CALLOUT, PLACE THE FOLLOWING TEXT: EITHER SIDE OF PART WHERE SHOWN. BELOW NUMBER PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA, SOLVENTS AFTER FINAL ASSEMBLY. 4. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR 3. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994. CRITICAL TO FUNCTION DIMENSION. [BRACKETED] DIMENSIONS STATED IN INCHES. 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS, ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES 1. THIS DRAWING TO BE USED IN CORRELATION WITH NOTES: ZONE 9 8 7 6 5 SEE NOTES - INSTALL E-RING SO THAT BURR/PUNCH DIRECTION/SHARP EDGE CRITICAL TO FUNCTION DIMENSION. MINIMUM PUSH OUT FORCE = 30 LBF PER CUP. PRESS FIT BOTTOM OF CUP LIP FLUSH TO TOP SURFACE HEAT SINK. PART NUMBER AND TORQUE SPEC MARK. CUP, SPRING RETENTION SPRING, COMPRESSION, PRELOADED ROMLEY/GRANTLEY HS SCREW, M4 X 0.7 ROMLEY/GRANTLEY HS RETAINING RING ROMLEY/GRANTLEY 1U NARROW HS ASSEMBLY ROMLEY/GRANTLEY 1U NARROW HS GEOMETRY DWG. NO REV A RELEASE FOR SUPPLIER FEEDBACK FINISH DATE - 03/23/10 DATE 03/23/10 DATE 03/23/10 DATE SEE NOTES PARTS LIST 2 E95474 SCALE: 1.500 TITLE SIZE D DEPARTMENT DESCRIPTION REVISION HISTORY DRAWING NUMBER ROMLEY/GRANTLEY 1U NARROW PTMI SHT. DESCRIPTION 1 DO NOT SCALE DRAWING REV HS ASSEMBLY A E95474 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. 03/23/10 DATE SHEET 1 OF 2 1 1 APPROVED - REV A A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 94 Order No.: 330786-003 Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

B.17 1U Narrow Heat Sink Assembly (Page 2)

Figure 55. 1U Narrow Heat Sink Assembly (Page 2) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 SEE DETAIL A A 7 7 SECTION A-A 6 6 SEE DETAIL B A 5 5 PRESS FIT DETAILS 4 4 ASSEMBLY HEIGHT SPRING PRELOAD (4X 8.06 1 [0.317] ) 3 5 DEPARTMENT 2 SCALE 6.000 DETAIL B 4 PTMI 3 3 SCALE 6.000 DETAIL A R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. DWG. NO 4X 2 1.50 [ AWAY FROM THIS SURFACE ASSEMBLY DETAILS 9 0.059 E-RING PUNCH DIRECTION -0.25 +0.20 -0.009 +0.007 2 ] E95474 SCALE: 1.500 SIZE 1 D 6

& 8 DRAWING NUMBER 7 SHT. [ 1.00 0.039 0 +0.13 2 DO NOT SCALE DRAWING REV -0.000 +0.005 A E95474 ] SHEET 2 OF 1 1 REV A A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 95 Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings

B.18 1U Square Heat Sink Geometry (Page 1)

Figure 56. 1U Square Heat Sink Geometry (Page 1) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 91.50 [ 3.602 -0.25 0 B -0.009 +0.000 ] C 7 7 91.50 [ TOP VIEW 4X 13.22 3.602 -0.25 0 [ -0.009 +0.000 0.520 0 +1.00 -0.000 +0.039 ] ] 6 6 A 4X 12.00 AIRFLOW DIRECTION [ 0.472 SEE DETAIL A 0 +1.00 -0.000 +0.039 ] [ 21.00 0.827 0.25 0.009 5 5 ] 71X 1.272

9 FIN PITCH [0.0501] SCALE 5.000 DETAIL A FIN GAP 71X 1.072 4 4 [0.0422] FIN THICKNESS 72X 0.200 [0.0079] BOTH SIDES OF HEATSINK END GAP 0.500 [ 0.0197 0.250 0.0098 ] .XXX .XX .X TOLERANCES: DIMENSIONS ARE IN MILLIMETERS IN ACCORDANCE WITH ASME Y14.5-1994 INTERPRET DIMENSIONS AND TOLERANCES UNLESS OTHERWISE SPECIFIED THIRD ANGLE PROJECTION 10 .5 Angles 0.25 0.127 3 3 1.0 OVERALL FIN HEIGHT MUST STILL BE MAINTAINED. OF HEATSINK TO INCREASE FIN ARRAY STRUCTURAL STABILITY, 8. MECHANICAL STITCHING OR CONNECTION ALLOWED ON TOP SURFACE HEAT SINK BASE. 7. LOCAL FLATNESS ZONE .077 MM [0.003"] CENTERED ON SOLVENTS AFTER MACHINING AND FIN ASSEMBLY. 6. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR 5. NA FINS: QTY 72X 0.2 MM, ALUMINUM, K=220 W/M-K MIN 4. BASE: COPPER, K=380 W/M-K MIN 3. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994. CRITICAL TO FUNCTION DIMENSION. [BRACKETED] DIMENSIONS STATED IN INCHES. 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS, ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES 1. THIS DRAWING TO BE USED IN CONJUNCTION WITH NOTES: SEE NOTE 8 10 9 MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY - D. LLAPITAN N. ULEN N. ULEN ZONE SEE NOTES CRITICAL TO FUNCTION DIMENSION. - CENTER FIN ARRAY ON HEAT SINK BASE. DWG. NO REV B A ADDED NOTE 10, CENTER FIN ARRAY INITIAL SUPPLIER RELEASE FINISH DATE - 5/5/10 DATE 5/5/10 DATE 5/5/10 DATE SEE NOTES 2 E97838 SCALE: 1 TITLE SIZE ROMLEY/GRANTLEY 1U HS GEOMETRY D DEPARTMENT DESCRIPTION EASD / PTMI REVISION HISTORY DRAWING NUMBER SHT. 1 DO NOT SCALE DRAWING REV B E97838 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. 8/12/10 5/5/10 DATE SHEET 1 OF 2 1 1 APPROVED - REV B A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 96 Order No.: 330786-003 Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

B.19 1U Square Heat Sink Geometry (Page 2)

Figure 57. 1U Square Heat Sink Geometry (Page 2) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 [3.150] 80.00 9 9 0.10 [0.003] [ 9.35 0.368 -0.06 0 [1.496] 38.00 -0.002 +0.000 A B A ] C 7 7 SECTION A-A [3.150] 80.00 [1.496] 38.00 9 6 6 AIRFLOW DIRECTION SEE DETAIL D A AIRFLOW DIRECTION BOTTOM VIEW SEE NOTE 7 FLATNESS ZONE, TOP VIEW 1.00 [0.039] 0.077 [0.0030] SEE DETAIL B 5 5 A B 4 4 DEPARTMENT PTMI 3 3 SCALE 6.000 DETAIL D SCALE 6.000 DETAIL B R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. DWG. NO ALL FINS 3.0 [0.118] X 45 2 BASE THICKNESS 4.50 [ E97838 SCALE: 1.500 SIZE 0.177 D DRAWING NUMBER 0.13 0.005 SHT. 2 ] DO NOT SCALE DRAWING REV 9 B E97838 SHEET 2 OF 1 1 REV B A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 97 Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings

B.20 1U Square Heat Sink Assembly (Page 1)

Figure 58. 1U Square Heat Sink Assembly (Page 1) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 7 7 9 5 6 6 6 4 1 2 5 3 5 5 4 4 .XXX .XX .X TOLERANCES: DIMENSIONS ARE IN MILLIMETERS IN ACCORDANCE WITH ASME Y14.5-1994 INTERPRET DIMENSIONS AND TOLERANCES UNLESS OTHERWISE SPECIFIED QTY 1 4 4 4 4 4 THIRD ANGLE PROJECTION ITEM NO TOP 0.5 Angles 1 2 3 4 5 6 0.25 0.127 3 3 1.0 PART NUMBER G13624-001 E97839-002 E97838-001 E97837-002 E86113-001 E91775-001 E75155-001 EDGE IS AWAY FROM BASE CUP SURFACE. MAGNIFICATION. OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X THE MARK CAN BE AN INK MARK, LASER PUNCH "RECOMMENDED SCREW TORQUE: 8 IN-LBF" CALLOUT, PLACE THE FOLLOWING TEXT: EITHER SIDE OF PART WHERE SHOWN. BELOW NUMBER PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA, SOLVENTS AFTER FINAL ASSEMBLY. 4. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR 3. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994. CRITICAL TO FUNCTION DIMENSION. [BRACKETED] DIMENSIONS STATED IN INCHES. 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS, ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES 1. THIS DRAWING TO BE USED IN CORRELATION WITH NOTES: MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY - D. LLAPITAN N. ULEN N. ULEN 10 9 8 7 6 5 ZONE SEE NOTES INSTALL E-RING SO BURR/PUNCH DIRECTION/SHARP CRITICAL TO FUNCTION DIMENSION. MINIMUM PUSH OUT FORCE = 30 LBF PER CUP. PRESS FIT BOTTOM OF CUP LIP FLUSH TO TOP SURFACE HEAT SINK. PART NUMBER AND TORQUE SPEC MARK. - ALLOWABLE PROTRUSION OF CUP FROM BASE. CUP, SPRING RETENTION, WITH SKIRT SPRING, COMPRESSION, PRELOADED ROMLEY/GRANTLEY HS SCREW, M4 X 0.7 ROMLEY/GRANTLEY HS RETAINING RING DELRIN RETAINER/SPACER ROMLEY/GRANTLEY 1U HS ASSEMBLY ROMLEY/GRANTLEY 1U HS GEOMETRY DWG. NO REV B A ADDED DELRIN SPACER TO ASSEMBLY UPDATED SCREW TO CLIENT VERSION UPDATED CUP TO -002 ROLLED ASSEMBLY TO -002 INITIAL SUPPLIER RELEASE FINISH DATE - 5/5/10 DATE 5/5/10 DATE 5/5/10 DATE SEE NOTES PARTS LIST 2 E97839 SCALE: 1.500 TITLE SIZE D ROMLEY/GRANTLEY 1U HS ASSEMBLY DEPARTMENT DESCRIPTION REVISION HISTORY DRAWING NUMBER PTMI SHT. DESCRIPTION 1 DO NOT SCALE DRAWING REV B E97839 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. 8/12/10 5/5/10 DATE SHEET 1 OF 2 1 1 APPROVED - REV B A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 98 Order No.: 330786-003 Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

B.21 1U Square Heat Sink Assembly (Page 2)

Figure 59. 1U Square Heat Sink Assembly (Page 2) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS SEE DETAIL A 8 8 A SECTION A-A 7 7 SEE DETAIL B 6 6 A ASSEMBLY HEIGHT SPRING PRELOAD (4X 9.36 [0.369] 5 5 ) 6 PRESS FIT DETAILS 3 5 4 SCALE 6.000 DETAIL B ASSEMBLY DETAILS 4 4 SEE DETAIL C 2 SCALE 6.000 DETAIL A DEPARTMENT 1 PTMI 3 3 0.00 [ 0.000 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. 0.35 0.013 DWG. NO ]

10 6 E-RING ORIENTATION DETAILS & 1.00 [ 0.039 7 0 +0.13 2 -0.000 +0.005 E97839 SCALE: 1.500 SIZE D DRAWING NUMBER ] SCALE 30.000 SHT.

DETAIL C 8 AWAY FROM THIS SURFACE 9 2 E-RING PUNCH DIRECTION DO NOT SCALE DRAWING REV B E97839 SHEET 2 OF 1 1 REV B A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 99 Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings

B.22 2U Square Heat Sink Geometry (Page 1)

Figure 60. 2U Square Heat Sink Geometry (Page 1) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 91.50 [ 3.602 -0.25 0 B -0.009 +0.000 ] C 7 7 91.50 [ TOP VIEW 3.602 4X 12.00 -0.25 0 -0.009 +0.000 [ 0.472 0 +1.00 ] -0.000 +0.039 ] 6 6 A 4X 12.00 AIRFLOW DIRECTION [ 0.472 [2.520] 64.00 MAX. 0 +1.00 -0.000 +0.039 ] 5 5 4 4 .XXX .XX .X TOLERANCES: DIMENSIONS ARE IN MILLIMETERS IN ACCORDANCE WITH ASME Y14.5-1994 INTERPRET DIMENSIONS AND TOLERANCES UNLESS OTHERWISE SPECIFIED QTY THIRD ANGLE PROJECTION ITEM NO TOP .5 Angles 0.25 0.127 3 3 SEE NOTE 4 1.0 PART NUMBER E95132-002 MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY - D. LLAPITAN N. ULEN N. ULEN SEE NOTE 8 ZONE EXPOSED FIN CORNERS TO THE VALUE SPECIFIED. 8. NO EXPOSED CORNER FINS ALLOWED. CHAMFER ALL HEAT SINK BASE. 7. LOCAL FLATNESS ZONE .076 MM [0.003"] CENTERED ON SOLVENTS AFTER MACHINING AND FIN ASSEMBLY. 6. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR MUST FIT WITHIN THE SPACE DEFINED BY THIS DRAWING.. 4. HEAT SINK VOLUMETRIC. ALL GEOMETRY 3. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994. CRITICAL TO FUNCTION DIMENSION. [BRACKETED] DIMENSIONS STATED IN INCHES. 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS, ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES 1. THIS DRAWING TO BE USED IN CONJUNCTION WITH NOTES: SEE NOTES 2B2 9 CRITICAL TO FUNCTION DIMENSION. ROMLEY 2U HS VOLUMETRIC DWG. NO REV B A CHANGED SPRING CUP GEOMETRY TO FIT DELRIN SPACER ROLLED PART TO -002 CAST GEOMETRY INTEGRATED SPRING/SCREW CUP FEATURE IN TO VOLUME FOR DIE CAST GEOMETRY FINISH DATE - 3/29/10 DATE 3/29/10 DATE 3/29/10 DATE SEE NOTES PARTS LIST 2 ROMLEY/GRANTLEY 2U HS VOLUMETRIC, E95132 SCALE: 1 TITLE SIZE D DEPARTMENT DESCRIPTION EASD / PTMI REVISION HISTORY DRAWING NUMBER SHT. DESCRIPTION DIE CAST BASES ONLY 1 DO NOT SCALE DRAWING REV B E95132 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. 7/21/10 3/29/10 DATE SHEET 1 OF 2 1 1 APPROVED - REV B A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 100 Order No.: 330786-003 Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

B.23 2U Square Heat Sink Geometry (Page 2)

Figure 61. 2U Square Heat Sink Geometry (Page 2) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 [3.150] 80.00 9 [1.496±0.019] 38.00±0.50 A 7 7 [1.496±0.019] 38.00±0.50 SECTION A-A [3.150] 80.00 9 6 6 AIRFLOW DIRECTION A AIRFLOW DIRECTION BOTTOM VIEW SEE NOTE 7 FLATNESS ZONE, TOP VIEW 0.077 [0.0030] SEE DETAIL B SEE DETAIL C 5 5 4 4 SCALE 10.000 DETAIL B DEPARTMENT PTMI 3 3 SCALE 6.000 DETAIL C 7.95 5.40 [ [ 0.313 0.213 0 +0.13 [0.4114] 10.450 0 +0.13 ALL AROUND 0.5 x 45 9 -0.000 +0.005 9 -0.000 +0.005 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. ] ] DWG. NO 0.1 [0.00] SEE NOTE 8 3.0 [0.118] X 45 A 2 TYP B C E95132 SCALE: 1.500 SIZE D DRAWING NUMBER SHT. 2 DO NOT SCALE DRAWING REV [ [ 5.50 [ 0.00 [ 1.00 BASE THICKNESS 4.50 0.000 B 0.177 0.217 0.039 E95132 ] ORDINATE BASELINE 0.13 ] ] 0.005 ] SHEET 2 OF 9 1 1 REV B A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 101 Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Mechanical Drawings

B.24 2U Square Heat Sink Assembly (Page 1)

Figure 62. 2U Square Heat Sink Assembly (Page 1) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 7 7 4

6 6 9 1 3 5 2 5 5 4 4 .XXX .XX .X TOLERANCES: DIMENSIONS ARE IN MILLIMETERS IN ACCORDANCE WITH ASME Y14.5-1994 INTERPRET DIMENSIONS AND TOLERANCES UNLESS OTHERWISE SPECIFIED QTY 1 4 4 4 THIRD ANGLE PROJECTION ITEM NO TOP 0.5 Angles 1 2 3 4 0.25 0.127 3 3 1.0 PART NUMBER E95133-001 E95132-001 E86113-001 E86111-001 E75155-001 MATERIAL APPROVED BY CHECKED BY DRAWN BY DESIGNED BY - D. LLAPITAN N. ULEN N. ULEN EDGE IS AWAY FROM BASE CUP SURFACE. MAGNIFICATION. OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X THE MARK CAN BE AN INK MARK, LASER PUNCH "RECOMMENDED SCREW TORQUE: 8 IN-LBF" CALLOUT, PLACE THE FOLLOWING TEXT: EITHER SIDE OF PART WHERE SHOWN. BELOW NUMBER PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA, SOLVENTS AFTER FINAL ASSEMBLY. 4. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR 3. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994. CRITICAL TO FUNCTION DIMENSION. [BRACKETED] DIMENSIONS STATED IN INCHES. 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS, ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE. SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES 1. THIS DRAWING TO BE USED IN CORRELATION WITH NOTES: ZONE 9 8 5 SEE NOTES - INSTALL E-RING SO BURR/PUNCH DIRECTION/SHARP CRITICAL TO FUNCTION DIMENSION. PART NUMBER AND TORQUE SPEC MARK. SPRING, COMPRESSION, PRELOADED ROMLEY/GRANTLEY HS SCREW, M4 X 0.7 ROMLEY/GRANTLEY HS RETAINING RING ROMLEY/GRANTLEY 2U HS ASSEMBLY ROMLEY/GRANTLEY 2U HS VOLUMETRIC DWG. NO REV A RELEASE FOR SUPPLIER FEEDBACK, DIE CAST VER ONLY FINISH DATE - 3/29/10 DATE 3/29/10 DATE 3/29/10 DATE SEE NOTES PARTS LIST 2 E95133 SCALE: 1.500 TITLE SIZE ROMLEY/GRANTLEY 2U HS ASSEMBLY, D DEPARTMENT DESCRIPTION REVISION HISTORY DRAWING NUMBER PTMI SHT. DESCRIPTION DIE CAST BASES ONLY 1 DO NOT SCALE DRAWING REV A E95133 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. 3/29/10 DATE SHEET 1 OF 2 1 1 APPROVED - REV A A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families Thermal Mechanical Specification and Design Guide October 2015 102 Order No.: 330786-003 Mechanical Drawings—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families

B.25 2U Square Heat Sink Assembly (Page 2)

Figure 63. 2U Square Heat Sink Assembly (Page 2) A B C D MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS 8 8 SEE DETAIL A A 7 7 SECTION A-A 6 6 A 5 5 ASSEMBLY HEIGHT SPRING PRELOAD (8.56 [0.337] ) 4 4 2 4 3 DEPARTMENT PTMI 3 3 R SANTA CLARA, CA 95052-8119 P.O. BOX 58119 2200 MISSION COLLEGE BLVD. ASSEMBLY DETAILS AWAY FROM THIS SURFACE DWG. NO 9 E-RING PUNCH DIRECTION 2 E95133 SCALE: 1.500 SIZE D DRAWING NUMBER SHT. 2 DO NOT SCALE DRAWING REV SCALE 10.000 DETAIL A 1 A E95133 SHEET 2 OF 1 1 REV A A B C D

Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families October 2015 Thermal Mechanical Specification and Design Guide Order No.: 330786-003 103