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Intel® Celeron™ P4000 and U3000 Mobile Processor Series

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Intel® Celeron™ P4000 and U3000 Mobile Processor Series Intel® Celeron™ P4000 and U3000 Mobile Processor Series External Design Specification — Volume One This is volume 1 of 2. Refer to Document 416057 for Volume 2 Rev 1.5 March 2010 Intel Confidential Document Number:442690 INFORMATIONLegal Lines and Disclaimers IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel® Active Management Technology requires the platform to have an Intel® AMT-enabled chipset, network hardware and software, connection with a power source and a network connection. 64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Intel, Intel SpeedStep, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2009 – 2010, Intel Corporation. All rights reserved. 2 External Design Specification Features Summary Contents 1Features Summary............................................................................ 12 1.1 Introduction................................................................................ 12 1.2 Processor Feature Details ............................................................. 14 1.2.1 Supported Technologies .................................................... 14 1.3 Interfaces................................................................................... 14 1.3.1 System Memory Support ................................................... 14 1.3.2 PCI Express* ................................................................... 15 1.3.3 Direct Media Interface (DMI).............................................. 16 1.3.4 Platform Environment Control Interface (PECI) ..................... 17 1.3.5 Intel® HD Graphics Controller............................................ 17 1.3.6 Embedded DisplayPort* (eDP*) .......................................... 17 1.3.7 Intel® Flexible Display Interface (Intel® FDI) ...................... 18 1.4 Power Management Support ......................................................... 18 1.4.1 Processor Core................................................................. 18 1.4.2 System ........................................................................... 18 1.4.3 Memory Controller............................................................ 18 1.4.4 PCI Express* ................................................................... 18 1.4.5 DMI................................................................................ 18 1.4.6 Integrated Graphics Controller ........................................... 18 1.5 Thermal Management Support ...................................................... 19 1.6 Package ..................................................................................... 19 1.7 Terminology ............................................................................... 19 1.8 Related Documents...................................................................... 21 2Interfaces.......................................................................................... 23 2.1 System Memory Interface............................................................. 23 2.1.1 System Memory Technology Supported ............................... 23 2.1.2 System Memory Timing Support......................................... 24 2.1.3 System Memory Organization Modes................................... 24 2.1.3.1 Single-Channel Mode........................................... 24 2.1.3.2 Dual-Channel Mode - Intel® Flex Memory Technology Mode................................................................. 24 2.1.4 Rules for Populating Memory Slots ...................................... 26 2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA) .............................................................................. 26 2.1.5.1 Just-in-Time Command Scheduling........................ 26 2.1.5.2 Command Overlap .............................................. 27 2.1.5.3 Out-of-Order Scheduling ...................................... 27 2.1.6 DRAM Clock Generation..................................................... 27 2.1.7 System Memory Pre-Charge Power Down Support Details ...... 27 2.2 PCI Express Interface................................................................... 27 2.2.1 PCI Express Architecture ................................................... 27 2.2.1.1 Transaction Layer ............................................... 28 2.2.1.2 Data Link Layer .................................................. 28 2.2.1.3 Physical Layer .................................................... 29 2.2.2 PCI Express Configuration Mechanism ................................. 29 2.2.3 PCI Express* Ports and Bifurcation ..................................... 30 2.2.3.1 PCI Express Bifurcated Mode ................................ 30 2.2.3.2 Static Lane Numbering Reversal............................ 30 2.3 DMI........................................................................................... 30 2.3.1 DMI Error Flow................................................................. 30 External Design Specification Intel Confidential 3 Features Summary 2.3.2 Processor/PCH Compatibility Assumptions ............................30 2.3.3 DMI Link Down .................................................................31 2.4 Intel® HD Graphics Controller .......................................................31 2.4.1 3D and Video Engines for Graphics Processing ......................31 2.4.1.1 3D Engine Execution Units ....................................32 2.4.1.2 3D Pipeline .........................................................32 2.4.1.3 Video Engine.......................................................32 2.4.1.4 2D Engine ..........................................................33 2.4.2 Integrated Graphics Display Pipes .......................................33 2.4.2.1 Display Planes.....................................................34 2.4.2.2 Display Pipes ......................................................34 2.4.2.3 Display Ports ......................................................35 2.4.2.4 Embedded DisplayPort (eDP) ................................35 2.4.3 Intel Flexible Display Interface............................................36 2.5 Platform Environment Control Interface (PECI) ................................36 2.6 Interface Clocking........................................................................36 2.6.1 Internal Clocking Requirements ..........................................36 3 Technologies......................................................................................37 3.1 Intel® Virtualization Technology (Intel® VT) ...................................37 3.1.1 Intel® VT-x Objectives ......................................................37 3.1.2 Intel VT-x Features ...........................................................38 3.2 Intel® Graphics Dynamic Frequency...............................................38 3.2.1 Intel Graphics Dynamic Frequency ......................................38 4 Power Management ...........................................................................40 4.1 ACPI States Supported .................................................................40 4.1.1 System States..................................................................40 4.1.2 Processor Core/Package Idle States.....................................40 4.1.3 Integrated
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