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Intel® Atom Processor 200 Series Mechanical, and Thermal Design

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Intel® Atom Processor 200 Series Mechanical, and Thermal Design Intel® Atom™ Processor 200 Series Thermal and Mechanical Design Guidelines — Supporting nettop platform for 2008 June 2008 Document Number: 319979-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document contains information on products in the design phase of development. All products, platforms, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. All dates specified are target dates, are provided for planning purposes only and are subject to change. This document contains information on products in the design phase of development. Do not finalize a design with this information. Revised information will be published when the product is available. Verify with your local sales office that you have the latest datasheet before finalizing a design. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details. Code names featured are used internally within Intel to identify products that are in development and not yet publicly announced for release. Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user. Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2008, Intel Corporation. All rights reserved. 2 Thermal and Mechanical Design Guidelines Contents 1 Introduction .....................................................................................................7 1.1 Document Goals and Scope .....................................................................7 1.1.1 Importance of Thermal Management ............................................7 1.1.2 Document Goals........................................................................7 1.1.3 Document Scope .......................................................................8 1.2 Definition of Terms .................................................................................8 2 Processor Thermal/Mechanical Information .........................................................11 2.1 Mechanical Requirements ......................................................................11 2.1.1 Processor Package...................................................................11 2.1.2 Heatsink Attach ......................................................................14 2.1.2.1 General Guidelines....................................................14 2.1.2.2 Heatsink Clip Load Requirement..................................14 2.1.2.3 Heatsink Attach Mechanism Design Considerations ........15 2.2 Thermal Requirements ..........................................................................17 2.2.1 Processor Case Temperature.....................................................17 2.3 Heatsink Design Considerations..............................................................18 2.3.1 Heatsink Size..........................................................................19 2.3.2 Heatsink Mass ........................................................................19 2.3.3 Thermal Interface Material........................................................20 2.4 System Thermal Solution Considerations .................................................20 2.4.1 Chassis Thermal Design Capabilities...........................................20 2.4.2 Improving Chassis Thermal Performance ....................................21 2.4.3 Summary...............................................................................22 3 Thermal Metrology ..........................................................................................23 3.1 Characterizing Cooling Performance Requirements (TS-TOP-MAX Methodology) ..23 3.1.1 Example ................................................................................25 3.2 Case Temperature Measurement (TCASE-MAX Methodology) ...........................26 3.3 Thermocouple Attach Methodology..........................................................26 3.4 Local Ambient Temperature Measurement Guidelines.................................28 4 System Thermal/Mechanical Design Information..................................................31 4.1 Overview of the Reference Design...........................................................31 4.1.1 Altitude..................................................................................31 4.1.2 Heatsink Thermal Validation .....................................................32 4.2 Environmental Reliability Testing ............................................................32 4.2.1 Structural Reliability Testing .....................................................32 4.2.1.1 Random Vibration Test Procedure................................32 4.2.1.2 Shock Test Procedure................................................33 4.2.2 Recommended BIOS/CPU/Memory Test Procedures ......................34 4.3 Material and Recycling Requirements ......................................................35 4.4 Safety Requirements ............................................................................35 4.5 Reference Attach Mechanism..................................................................35 4.5.1 Structural Design Strategy .......................................................35 4.5.2 Mechanical Interface to the Reference Attach Mechanism ..............35 Thermal and Mechanical Design Guidelines 3 Appendix A Mechanical Drawings .......................................................................................37 Appendix B Heatsink Clip Load Metrology............................................................................55 B.1 Overview ............................................................................................55 B.2 Test Preparation...................................................................................55 B.2.1 Heatsink Preparation ...............................................................55 B.2.2 Typical Test Equipment ............................................................55 B.3 Test Procedure Examples.......................................................................56 Appendix C Intel® Enabled Boxed Processor Thermal Solution Information...............................59 Figures Figure 1. FCBGA Processor Package Drawing.......................................................13 Figure 2. Side Indentation Alignment Feature......................................................16 Figure 3. Various Types of Solder Crack .............................................................16 Figure 4. Processor Thermal Characterization Parameter Relationships....................25 Figure 5 0° Angle Attach Methodology (top view, not to scale)...............................27 Figure 6 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale) .........................................................27 Figure 7. Locations for Measuring Local Ambient Temperature, Active Heatsink........29 Figure 8. Locations for Measuring Local Ambient Temperature, Passive Heatsink ......29 Figure 9. Random Vibration PSD .......................................................................32 Figure 10. Shock Acceleration Curve..................................................................33 Figure 11. Intel® Atom™ Processor 200 Series Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components...................39 Figure 12. SiS671 GMCH Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components on Intel® Atom™ Processor 200 Series / SiS Chipset Platform ...........................................................40
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