'Find a Zero: Which Billion Dollar Company Will Be Bankrupt by 2020'
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CFD Analyses of a Notebook Computer Thermal Management
PREPRINT. 1 Ilker Tari and Fidan Seza Yalçin, "CFD Analyses of a Notebook Computer Thermal Management System and a Proposed Passive Cooling Alternative, IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 2, pp. 443-452 (2010). CFD Analyses of a Notebook Computer Thermal Management System and a Proposed Passive Cooling Alternative Ilker Tari, and Fidan Seza Yalcin H Fin height, mm. Abstract— A notebook computer thermal management system L Heat sink vertical length, mm. is analyzed using a commercial CFD software package (ANSYS Nu Nusselt Number. Fluent). The active and passive paths that are used for heat Pr Prandtl Number. dissipation are examined for different steady state operating Ra Rayleigh Number. conditions. For each case, average and hot-spot temperatures of Re Reynolds Number. the components are compared with the maximum allowable T Temperature, °C or K. operating temperatures. It is observed that when low heat W Heat sink width, mm. dissipation components are put on the same passive path, the 2 increased heat load of the path may cause unexpected hot spot g Gravitational acceleration, m/s . 2 temperatures. Especially, Hard Disk Drive (HDD) is susceptible h Convection heat transfer coefficient, W/(m ·K). to overheating and the keyboard surface may reach k Thermal conductivity, W/(m·K). ergonomically undesirable temperatures. Based on the analysis q Heat transfer rate, W. results and observations, a new component arrangement s Fin spacing, mm. considering passive paths and using the back side of the LCD screen is proposed and a simple correlation based thermal Greek Symbols analysis of the proposed system is presented. -
Intel Corporation
US RESEARCH | PUBLISHED BY RAYMOND JAMES & ASSOCIATES INTEL CORPORATION (INTC-NASDAQ) JULY 26, 2021 | 8:27 PM EDT Semiconductors COMPANY BRIEF Chris Caso | (212) 856-4893 | [email protected] Melissa Fairbanks | (727) 567-1081 | [email protected] Underperform 4 New Names, Same Problems Suitability M/ACC Intel hosted its "Intel Accelerated" manufacturing roadmap update Monday evening, detailing their process roadmap through 2025. The presentation laid a path through which Intel hopes to MARKET DATA Current Price (Jul-26-21) $54.31 have achieved parity with TSMC (and by extension, AMD) by 2024, and a goal of process leadership Market Cap (mln) $221,802 by 2025. This is no different from the goals laid out by Intel’s new CEO when he came on board Current Net Debt (mln) $10,552 a quarter ago, but the company did provide more details about how they intend to achieve that Enterprise Value (mln) $232,354 Shares Outstanding (mln) 4,084.0 goal. Attaining leadership by 2025 requires Intel to introduce a full process node improvement 30-Day Avg. Daily Value (mln) $1,362.7 each year for the next 4 years – an aggressive assumption given the production missteps from Dividend $1.39 the past several years. What Intel didn’t disclose were the costs of this roadmap, which we Dividend Yield 2.6% 52-Week Range $43.61 - $68.49 expect them to discuss during the November analyst day. And while there is great uncertainty BVPS $14.76 about Intel’s ability to achieve these targets, what’s less uncertain is a requirement for higher Long-Term Debt (mln) $24,632 capital intensity. -
Going Vertical: a New Integration Era in the Semiconductor Industry Table of Contents
Going vertical: A new integration era in the semiconductor industry Table of contents 01 Executive overview Integration in the 02 semiconductor industry Strategic options for 03 semiconductor companies Moving forward: what semiconductor 04 companies must consider today Going vertical: A new integration era in the semiconductor industry 2 Executive overview Like many industries, the semiconductor industry is not immune to waves of diversification and consolidation through inorganic and organic growth. While inflection points with large-scale systemic changes in the value chain are relatively rare, our perspective is that there is a systemic change currently trending in the industry. Since the inception of the industry, semiconductor companies have recognized the value of technology. Accordingly, the market has rewarded semiconductor companies for specializing in distinct parts of the value chain by developing technological advantages by investing in R&D and by scaling technology through horizontal integration. This way of working transformed an industry that was initially vertically integrated (semiconductor design, semiconductor manufacturing, and system integration) into an ecosystem focused on specific areas of design, manufacturing, and/or systems. In the past five years, business value in some segments has moved from underlying technology to specific use cases to better monetize end-customer data and experience. • 5G, automotive, AI, cloud, system integration and hardware-software integration System integrators and software and cloud platform companies are no longer just important customers for the semiconductor industry—they are directly expanding into multiple upstream areas. • Taking advantage of silicon and system design • Control more of the technology stack • Optimize system performance • Improve the customer experience This vertical integration trend is distinctly different from the vertical integration which occurred at the inception of the semiconductor and integrated device manufacturing industry more than 50 years ago. -
NXP Semiconductors NV
SECURITIES AND EXCHANGE COMMISSION FORM SC 14D9/A Tender offer solicitation / recommendation statements filed under Rule 14d-9 [amend] Filing Date: 2017-12-13 SEC Accession No. 0000914121-17-001815 (HTML Version on secdatabase.com) SUBJECT COMPANY NXP Semiconductors N.V. Mailing Address Business Address HIGH TECH CAMPUS 60 31 40 27 43704 CIK:1413447| IRS No.: 000000000 EINDHOVEN P7 5656AG Type: SC 14D9/A | Act: 34 | File No.: 005-85657 | Film No.: 171253046 SIC: 3674 Semiconductors & related devices FILED BY ELLIOTT ASSOCIATES, L.P. Mailing Address Business Address 40 WEST 57TH STREET 40 WEST 57TH STREET CIK:904495| IRS No.: 222140975 | State of Incorp.:DE | Fiscal Year End: 1231 30TH FLOOR 30TH FLOOR Type: SC 14D9/A NEW YORK NY 10019 NEW YORK NY 10019 2125062999 Copyright © 2017 www.secdatabase.com. All Rights Reserved. Please Consider the Environment Before Printing This Document UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, DC 20549 AMENDMENT NO. 1 to SCHEDULE 14D-9 (RULE 14d-101) SOLICITATION/RECOMMENDATION STATEMENT UNDER SECTION 14(D)(4) OF THE SECURITIES EXCHANGE ACT OF 1934 NXP Semiconductors N.V. (Name of Subject Company) Elliott Associates, L.P. Elliott International, L.P. Paul E. Singer Elliott Capital Advisors, L.P. Elliott Special GP, LLC Braxton Associates, Inc. Elliott Asset Management LLC Elliott International Capital Advisors Inc. Hambledon, Inc. Elliott Management Corporation The Liverpool Limited Partnership Liverpool Associates Ltd. Elliott Advisors (UK) Limited Manchester Securities Corp. (Name of Person(s) Filing Statement) Common Shares, par value EUR 0.20 per share (Title of Class of Securities) N6596X109 (CUSIP Number of Class of Securities) Richard M. -
DONALD J. ROSENBERG Executive Vice President, General Counsel and Corporate Secretary Qualcomm Incorporated
Qualcomm Incorporated 5775 Morehouse Drive (858) 587-1121 San Diego, CA 92121-1714 www.qualcomm.com DONALD J. ROSENBERG Executive Vice President, General Counsel and Corporate Secretary Qualcomm Incorporated Donald J. Rosenberg is executive vice president, general counsel and corporate secretary of Qualcomm Incorporated. Mr. Rosenberg reports directly to CEO Steve Mollenkopf and is a member of the company's Executive Committee. In his role as chief legal officer, he is responsible for overseeing Qualcomm's worldwide legal affairs including litigation, intellectual property and corporate matters. Qualcomm's Government Affairs, Strategic Intellectual Property, Internal Audit and Compliance organizations also report to him. Prior to joining Qualcomm, Mr. Rosenberg served as senior vice president, general counsel and corporate secretary of Apple Inc. Prior to that, he was senior vice president and general counsel of IBM Corporation where he had also held numerous positions including vice president and assistant general counsel for litigation and counsel to IBM's mainframe division. Mr. Rosenberg has had extensive experience in corporate governance, compliance, law department management, litigation, securities regulation, intellectual property and competition issues. He has served as an adjunct professor of law at New York's Pace University School of Law, where he taught courses in intellectual property and antitrust law. Mr. Rosenberg is Co-Chair of the Lawyers’ Committee for Civil Rights under Law and a board member of the Corporate Directors Forum as well as the La Jolla Playhouse. Mr. Rosenberg received a Bachelor of Science degree in mathematics from the State University of New York at Stony Brook and his juris doctor from St. -
Ipox® Portfolio Holding Analysis 02/24/2021
IPOX® PORTFOLIO HOLDING ANALYSIS 02/24/2021 To learn more, visit www.ipox.com; Email: [email protected] MARVELL TECHNOLOGY GROUP LTD (MRVL US) | AQUANTIA CORP (AQ US) Office: +1 (312) 526-3634 COMPANY DESCRIPTION Support +1 (312) 339-4114 ACQUIRER Founded in 1995, Marvell Technology Group is semiconductor company headquartered in Santa Clara, CA. Marvell provides data infrastructure semiconductor solutions for data storage, processing, networking, security and connectivity. TARGET Founded in 2004, Aquantia Corp is a fabless semiconductor company that designs, develops and markets advanced high-speed communications integrated circuits (ICs) for Ethernet connectivity. TARGET IPO HISTORY Aquantia began trading on the NYSE on 11/3/2017 led by Morgan Stanley. The ICs developer sold 6,818,000 shares at $9.00 per share, below its expected price range ($10 to $12). With the 15% greenshoe options fully exercised, Aquantia was valued at ca. $300.09 million. The shares opened at $9.31/share and closed the first day higher at $9.51 (▲5.67%). Aquantia Corp entered the IPOX® Universe on the 7th day of trading. M&A HISTORY Marvell Technology Group announced to buy Aquantia for $452 million on 5/9/2019 at $13.25 per share in cash, which represented a 38.60% premium to Aquantia’s previous close. The acquisition of the Multi-Gig Ethernet company was completed on 9/19/2019. Marvell Technology Group was included in the IPOX® 100 U.S. Portfolio (ETF: FPX) on 3/23/2020 and currently weights approximately 4.90% of the portfolio. *Marvell Technology Group was added to the Nasdaq-100 Index® on December 21, 2020. -
AMD Socket AM2 with AMD M690T Chipset Reference Schematic D D
5 4 3 2 1 AMD Socket AM2 with AMD M690T Chipset Reference Schematic D D NOTES: Page Index Page Index ------- -------------------------------------------- ------- -------------------------------------------- 1) This schematic supports the AMD Socket AM2 CPU devices. 1 Cover Page 17 SB600 PCIe, PCI, LPC, Straps, & CPU Control 2) These are "Reference Schematics" and as such they have 2 Revision History 18 SB600 ACPI, GPIO, USB, and Audio Interfaces not been verified by an actual board build. 3 Block Diagram 19 SB SATA, IDE, SPI, and HW Management Interfaces 3) This reference schematic supports AMD M960T revision 4 Clock Structure 20 SB600 Power A12 or later. If A12 or later revision is not used, please 5 Power Configuration (1) 21 CRT Connector see your customer support representative for the 6 Power Configuration (2) 22 Broadcom Ethernet Controller necessary application notes for workarounds. 7 Reset & Voltage Sequence 23 Realtek Audio Codec C 4) This reference schematic supports SB600 revision 8 Socket AM2 HT Interface 24 LPC BIOS C A21 or later. If A21 or later revision is not used, please 9 Socket AM2 DDRII Memory Interface 25 USB Power and Connectors see your customer support representative for the 10 Socket AM2 Control & Debug 26 Power Main System, SB600 PCIe, & Other necessary application notes for workarounds. 11 Socket AM2 Power & Ground 27 Standby Power & Powergood 5) Unless otherwise specified, resistors have 5% tolerance. 12 SODIMM DDR2 28 Power for CPU Core 13 M690T HT, PCI, PCIe(R), PCIe Graphics Port 29 Power for DDR2 Memory and Interface 6) Unless otherwise specified, capacitors have 20% tolerance. 14 M690T PLL and Video Interface 30 Power M690T Core, PCIe Interface 15 M690T Power and Side Port Memory Interface 31 Unused Interfaces 16 Clock Generator IMPORTANT NOTICE: B 1. -
A Study of the Foundry Industry Dynamics
A Study of the Foundry Industry Dynamics by Sang Jin Oh B.S. Industrial Engineering Seoul National University, 2003 SUBMITTED TO THE MIT SLOAN SCHOOL OF MANAGEMENT IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF MASTER OF SCIENCE IN MANAGEMENT STUDIES AT THE MASSACHUSETTS INSTITUTE OF TECHNOLOGY ARCHVES JUNE 2010 MASSACHUSETTS INSTiUTE OF TECHNOLOGY © 2010 Sang Jin Oh. All Rights Reserved. The author hereby grants MIT permission to reproduce JUN 082010 and to distribute publicly paper and electronic LIBRARIES copies of this thesis document in whole or in part in any medium now known and hereafter created. Signature of Author Sang Jin Oh Master of Science in Management Studies May 7, 2010 Certified by (7 Michael A. Cusumano SMR Distinguished Professor of Management Thesis Supervisor Accepted by (I Michael A. Cusumano Faculty Director, M.S. in Management Studies Program MIT Sloan School of Management A Study of the Foundry Industry Dynamics By Sang Jin Oh Submitted to the MIT Sloan School of Management On May 7, 2010 In Partial Fulfillment of the Requirements for the Degree of Master of Science in Management Studies Abstract In the process of industrial evolution, it is a general tendency that companies which specialize in a specific value chain have emerged. These companies should construct a business eco-system based on their own platform to compete successfully with vertically integrated companies and other specialized companies. They continue to sustain their competitive advantage only when they share their ability to create value with other eco-system partners. The thesis analyzes the dynamics of the foundry industry. -
Semiconductors: a Changing of the Guard
Semiconductors: A Changing of the Guard Richard Spalton MA, CFA Investment Manager Semiconductors: A Changing of the Guard “While an early chip from the 1970s could fit thousands of micrometre-sized transistors, today’s most advanced chips are a complex web of billions of transistors, the smallest of which are just 10nm. To get some idea of how small that is: your fingernails grew 10nm in the time it took to read the previous sentence.”1 Background One of the key enablers of technological progress has been the constantly shrinking size of the transistors on semiconductor chips. Smaller transistors mean that the same number of computations can be completed faster, more efficiently and at lower cost. This concept was famously outlined by Gordon Moore, co-founder of Intel, who in 1965 wrote what became known as Moore’s Law. The manufacturing process for a particular size of transistor is called a process node. Shifting to a new node is highly complex and involves significant capital expenditure. In July 2020 Intel announced that their transition to the 7 nanometre node was running a year behind schedule. This delay will have a significant impact on Intel and its competitors. This announcement marks a changing of the guard in the semiconductor market, with leadership shifting away from Intel towards Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics. Scale Matters Assessing the future prospects of a company requires an assessment of its industry. Manufacturing semiconductors is highly capital intensive – the industry spends USD 100bn per annum on capital expenditure. Companies also need to spend substantial amounts on R&D because each process node is more complex than the last. -
Desktop 3Rd Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket
Desktop 3rd Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket Thermal Mechanical Specifications and Design Guidelines (TMSDG) January 2013 Document Number: 326767-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A “Mission Critical Application” is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined”. -
Advanced Micro Devices, Inc. 2485 Augustine Drive Santa Clara, California 95054
ADVANCED MICRO DEVICES, INC. 2485 AUGUSTINE DRIVE SANTA CLARA, CALIFORNIA 95054 NOTICE OF ANNUAL MEETING OF STOCKHOLDERS You are cordially invited to attend our 2020 annual meeting of stockholders (our “Annual Meeting”) to be held on Thursday, May 7, 2020 at 9:00 a.m. Pacific Time. In light of the coronavirus/COVID-19 outbreak and governmental decrees that in-person gatherings be postponed or canceled, and in the best interests of public health and the health and safety of our Board of Directors, employees and stockholders, the Annual Meeting will be held virtually via the Internet at www.virtualshareholdermeeting.com/AMD2020. You will not be able to attend the Annual Meeting in person. We are holding our Annual Meeting to: • Elect the eight director nominees named in this proxy statement; • Ratify the appointment of Ernst & Young LLP as our independent registered public accounting firm for the current fiscal year; • Approve on a non-binding, advisory basis the compensation of our named executive officers, as disclosed in this proxy statement pursuant to the compensation disclosure rules of the U.S. Securities and Exchange Commission (the “SEC”); and • Transact any other business that properly comes before our Annual Meeting or any adjournment or postponement thereof. We are pleased to provide access to our proxy materials over the Internet under the SEC’s “notice and access” rules. As a result, we are mailing to our stockholders (other than those who previously requested printed or emailed materials on an ongoing basis) a Notice of Internet Availability of Proxy Materials (the “Notice”) instead of printed copies of our proxy materials. -
Thermal Guide: Intel® Xeon® Processor E5 V4 Product Family
Intel® Xeon® Processor E5 v4 Product Family Thermal Mechanical Specification and Design Guide June 2016 Document Number: 333812-002 IntelLegal Lines and Disclaimerstechnologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppal or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548- 4725 or by visiting www.intel.com/design/literature.htm.