Dynamic Management of Turbomode in Modern Multi-Core Chips David Lo and Christos Kozyrakis Stanford University {Davidlo, Kozyraki}@Stanford.Edu
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CFD Analyses of a Notebook Computer Thermal Management
PREPRINT. 1 Ilker Tari and Fidan Seza Yalçin, "CFD Analyses of a Notebook Computer Thermal Management System and a Proposed Passive Cooling Alternative, IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 2, pp. 443-452 (2010). CFD Analyses of a Notebook Computer Thermal Management System and a Proposed Passive Cooling Alternative Ilker Tari, and Fidan Seza Yalcin H Fin height, mm. Abstract— A notebook computer thermal management system L Heat sink vertical length, mm. is analyzed using a commercial CFD software package (ANSYS Nu Nusselt Number. Fluent). The active and passive paths that are used for heat Pr Prandtl Number. dissipation are examined for different steady state operating Ra Rayleigh Number. conditions. For each case, average and hot-spot temperatures of Re Reynolds Number. the components are compared with the maximum allowable T Temperature, °C or K. operating temperatures. It is observed that when low heat W Heat sink width, mm. dissipation components are put on the same passive path, the 2 increased heat load of the path may cause unexpected hot spot g Gravitational acceleration, m/s . 2 temperatures. Especially, Hard Disk Drive (HDD) is susceptible h Convection heat transfer coefficient, W/(m ·K). to overheating and the keyboard surface may reach k Thermal conductivity, W/(m·K). ergonomically undesirable temperatures. Based on the analysis q Heat transfer rate, W. results and observations, a new component arrangement s Fin spacing, mm. considering passive paths and using the back side of the LCD screen is proposed and a simple correlation based thermal Greek Symbols analysis of the proposed system is presented. -
Analysis and Optimization of Dynamic Voltage and Frequency Scaling for AVX Workloads Using a Software-Based Reimplementation
Analysis and Optimization of Dynamic Voltage and Frequency Scaling for AVX Workloads Using a Software-Based Reimplementation Bachelor’s Thesis submitted by cand. inform. Yussuf Khalil to the KIT Department of Informatics Reviewer: Prof. Dr. Frank Bellosa Second Reviewer: Prof. Dr. Wolfgang Karl Advisor: Mathias Gottschlag, M.Sc. May 03 – September 02, 2019 KIT – The Research University in the Helmholtz Association www.kit.edu I hereby declare that the work presented in this thesis is entirely my own and that I did not use any source or auxiliary means other than these referenced. This thesis was carried out in accordance with the Rules for Safeguarding Good Scientic Practice at Karlsruhe Institute of Technology (KIT). Karlsruhe, September 2, 2019 Abstract While using the Advanced Vector Extensions (AVX) on current Intel x86 pro- cessors allows for great performance improvements in programs that can be parallelized by using vectorization, many heterogeneous workloads that use both vector and scalar instructions expose degraded throughput when mak- ing use of AVX2 or AVX-512. This eect is caused by processor frequency reductions that are required to maintain system stability while executing AVX code. Due to the delays incurred by frequency switches, reduced clock speeds are attained for some additional time after the last demanding instruction has retired, causing code in scalar phases directly following AVX phases to be executed at a slower rate than theoretically possible. We present an analysis of the precise frequency switching behavior of an Intel Syklake (Server) CPU when AVX instructions are used. Based on the obtained results, we propose avxfreq, a software reimplementation of the AVX frequency selection mechanism. -
Desktop 3Rd Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket
Desktop 3rd Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket Thermal Mechanical Specifications and Design Guidelines (TMSDG) January 2013 Document Number: 326767-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A “Mission Critical Application” is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined”. -
Drmos King of Power-Saving
Insist on DrMOS King of Power-saving Confidential Eric van Beurden / Feb 2009 /Page v1.0 1 EU MSI King of Power-saving What are the power-saving components and technologies from MSI? 1. DrMOS 2. APS 3. GreenPower design 4. Hi-c CAP Why should I care about power-saving? 1. Better earth (Think about it! You can be a hero saving it !) 2. Save $$ on the electricity bill 3. Cool running boards 4. Better overclocking Confidential Page 2 MSI King of Power-saving Is DrMOS the name of a MSI heatpipe? No! DrMOS is the cool secret below the heatpipe, not the heatpipe itself. Part of the heatpipe covers the PWM where the DrMOS chips are located. (PWM? That is technical stuff, right ? Now you really lost me ) Tell me, should I write DRMOS, Dr. MOS or Doctor Mos? The name comes from Driver MOSFET. There is only one correct way to write it; “DrMOS”. Confidential Page 3 MSI King of Power-saving So DrMOS is a chip below the heatpipe? Yes, DrMOS is the 2nd generation 3-in-1 integrated Driver MOSFET. It combines 3 PWM components in one. (Like triple core…) 1. Driver IC 2. Bottom-MOSFET 3. Top-MOSFET Confidential Page 4 MSI King of Power-saving Is MSI the first to use DrMOS on it’s products? DrMOS is an integrated MOSFET design proposed by Intel in 2004. The first to use a 1st generation Driver Mosfet on a 8-Phase was Asus Blitz Extreme. This 1st generation had some problems and disadvantages. These are all solved in the 2nd generation DrMOS which we use exclusive on MSI products. -
Thermal Guide: Intel® Xeon® Processor E5 V4 Product Family
Intel® Xeon® Processor E5 v4 Product Family Thermal Mechanical Specification and Design Guide June 2016 Document Number: 333812-002 IntelLegal Lines and Disclaimerstechnologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppal or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548- 4725 or by visiting www.intel.com/design/literature.htm. -
Website Designing, Overclocking
Computer System Management - Website Designing, Overclocking Amarjeet Singh November 8, 2011 Partially adopted from slides from student projects, SM 2010 and student blogs from SM 2011 Logistics Hypo explanation Those of you who selected a course module after last Thursday and before Sunday – Apologies for I could not assign the course module Bonus deadline for these students is extended till Monday 5 pm (If it applies to you, I will mention it in the email) Final Lab Exam 2 weeks from now - Week of Nov 19 Topics will be given by early next week No class on Monday (Nov 19) – Will send out relevant slides and videos to watch Concerns with Videos/Slides created by the students Mini project Demos: Finish by today Revision System Cloning What is it and Why is it useful? What are different ways of cloning the system? Data Recovery Why is it generally possible to recover data that is soft formatted or mistakenly deleted? Why is it advised not to install any new software if data is to be recovered? Topics For Today Optimizing Systems Performance (including Overclocking) Video by Vaibhav, Shubhankar and Mukul - http://www.youtube.com/watch?v=FEaORH5YP0Y&feature=youtu.be Creating a basic website A method of pushing the basic hardware components beyond the default limits Companies equip their products with such bottle-necks because operating the hardware at higher clock rates can damage or reduce its life span OCing has always been surrounded by many baseless myths. We are going to bust some of those. J Slides from Vinayak, Jatin and Ashrut (2011) The primary benefit is enhanced computer performance without the increased cost A common myth is that CPU OC helps in improving game play. -
Summarizing CPU and GPU Design Trends with Product Data
Summarizing CPU and GPU Design Trends with Product Data Yifan Sun, Nicolas Bohm Agostini, Shi Dong, and David Kaeli Northeastern University Email: fyifansun, agostini, shidong, [email protected] Abstract—Moore’s Law and Dennard Scaling have guided the products. Equipped with this data, we answer the following semiconductor industry for the past few decades. Recently, both questions: laws have faced validity challenges as transistor sizes approach • Are Moore’s Law and Dennard Scaling still valid? If so, the practical limits of physics. We are interested in testing the validity of these laws and reflect on the reasons responsible. In what are the factors that keep the laws valid? this work, we collect data of more than 4000 publicly-available • Do GPUs still have computing power advantages over CPU and GPU products. We find that transistor scaling remains CPUs? Is the computing capability gap between CPUs critical in keeping the laws valid. However, architectural solutions and GPUs getting larger? have become increasingly important and will play a larger role • What factors drive performance improvements in GPUs? in the future. We observe that GPUs consistently deliver higher performance than CPUs. GPU performance continues to rise II. METHODOLOGY because of increases in GPU frequency, improvements in the thermal design power (TDP), and growth in die size. But we We have collected data for all CPU and GPU products (to also see the ratio of GPU to CPU performance moving closer to our best knowledge) that have been released by Intel, AMD parity, thanks to new SIMD extensions on CPUs and increased (including the former ATI GPUs)1, and NVIDIA since January CPU core counts. -
Large Cad Models
Great decisions in product engineering with NX CAE. Learn more on page 11 DtopEng_banner_NXCAE.indd 1 August 2012 / deskeng.com 7/12/12 9:28:46 AM Workstation Upgrades P. 16 Monitor Technology P. 18 Review: HP Z1 All-in-One Workstation P. 20 TECHNOLOGY FOR DESIGN ENGINEERING FOCUS ON: Test & SPEED UP Measurement LARGE CAD MODELS DIRECT DIGITAL MANUFACTURING P. 32 IMPLEMENT MECHATRONIC TESTING P. 38 HOW TO CALIBRATE TEST SENSORS P. 42 CREATE BREAKTHROUGH DESIGNS BLAZING-FAST GEOMETRY PERFORMANCE FOR COMPLEX DESIGNS - THE NEW AMD FIREPRO TM WORKSTATION GRAPHICS RANGE AMD FIREPRO V4900 AMD FIREPRO V5900 AMD FIREPRO V7900 Maximum Performance The Perfect Balance Create Breakthrough Designs For Your Budget ● 2GB GDDR5 memory (64 GB/s) ● 2GB GDDR5 memory (160 GB/s) ● 1GB GDDR5 memory (64 GB/s) ● 512 Stream Processors ● 1280 Stream Processors ● 480 Stream Processors ● 2 x DisplayPort 1.2, 1 x DVI outputs ● 4 x DisplayPort 1.2 ● 2 x DisplayPort 1.2,1 x DVI outputs ● Support up to 3 displays ● Support up to 4 displays ● Support up to 3 displays ● GeometryBoost ● GeometryBoost ● AMD PowerTune ● AMD PowerTune ● 3D Stereoscopic support ● Framelock, Genlock support AMD FEATURED TECHNOLOGIES “I have been using three and ● Certified and optimized: for all major 3D applications for high four-monitor configurations for a performance and reliability while now, and I can tell you that once you try it, you won’t want ● GeometryBoost Technology: Helps ensure smooth handling of to go back to just two.” complex, highly tessellated models Jason Lewis, CG Channel ● AMD PowerTune Technology: Optimizes power usage in real-time based on current workflow demands ● AMD Eyefinity Technology: Run up to 4 monitors from a single graphics card, boosting productivity by viewing entire workflows Find out more at amd.com/firepronextgen © 2011 Advanced Micro Devices, Inc. -
Intel® Atom Processor 200 Series Mechanical, and Thermal Design
Intel® Atom™ Processor 200 Series Thermal and Mechanical Design Guidelines — Supporting nettop platform for 2008 June 2008 Document Number: 319979-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. -
A+ Guide to Managing and Maintaining Your PC, 7E
A+ Guide to Managing and Maintaining Your PC, 7e Chapter 6 Supporting Processors Objectives • Learn about the characteristics and purposes of Intel and AMD processors used for personal computers • Learn about the methods and devices for keeping a system cool • Learn how to install and upgrade a processor • Learn how to solve problems with the processor, the motherboard, overheating, and booting the PC A+ Guide to Managing and Maintaining Your PC, 7e 2 Types and Characteristics of Processors • Processor – Installed on motherboard – Determines system computing power • Two major processor manufacturers – Intel and AMD Figure 6-1 An AMD Athlon 64 X2 installed in socket AM2+ with cooler not yet installed Courtesy: Course Technology/Cengage Learning A+ Guide to Managing and Maintaining Your PC, 7e 3 Types and Characteristics of Processors (cont’d.) • Features affecting processor performance and motherboards – System bus speeds the processor supports – Processor core frequency – Motherboard socket and chipset – Multiprocessing ability – Memory cache – Amount and type of DDR, DDR2, DDR3 memory – Computing technologies the processor can use – Voltage and power consumption A+ Guide to Managing and Maintaining Your PC, 7e 4 How a Processor Works • Three basic components – Input/output (I/O) unit • Manages data and instructions entering and leaving the processor – Control unit • Manages all activities inside the processor – One or more arithmetic logic units (ALUs) • Performs all logical comparisons, calculations A+ Guide to Managing and Maintaining -
Intel® Celeron™ P4000 and U3000 Mobile Processor Series
Intel® Celeron™ P4000 and U3000 Mobile Processor Series External Design Specification — Volume One This is volume 1 of 2. Refer to Document 416057 for Volume 2 Rev 1.5 March 2010 Intel Confidential Document Number:442690 INFORMATIONLegal Lines and Disclaimers IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. -
Intel® Celeron® D Processor for Embedded Applications Thermal Design Guide Contents
Intel® Celeron® D Processor for Embedded Applications Thermal Design Guide June 2004 Reference Number: 302647-001 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Celeron® D Processor for Embedded Applications may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling1-800-548- 4725, or by visiting Intel's website at http://www.intel.com.