Energy-Aware Resource Management for Heterogeneous Systems
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CFD Analyses of a Notebook Computer Thermal Management
PREPRINT. 1 Ilker Tari and Fidan Seza Yalçin, "CFD Analyses of a Notebook Computer Thermal Management System and a Proposed Passive Cooling Alternative, IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 2, pp. 443-452 (2010). CFD Analyses of a Notebook Computer Thermal Management System and a Proposed Passive Cooling Alternative Ilker Tari, and Fidan Seza Yalcin H Fin height, mm. Abstract— A notebook computer thermal management system L Heat sink vertical length, mm. is analyzed using a commercial CFD software package (ANSYS Nu Nusselt Number. Fluent). The active and passive paths that are used for heat Pr Prandtl Number. dissipation are examined for different steady state operating Ra Rayleigh Number. conditions. For each case, average and hot-spot temperatures of Re Reynolds Number. the components are compared with the maximum allowable T Temperature, °C or K. operating temperatures. It is observed that when low heat W Heat sink width, mm. dissipation components are put on the same passive path, the 2 increased heat load of the path may cause unexpected hot spot g Gravitational acceleration, m/s . 2 temperatures. Especially, Hard Disk Drive (HDD) is susceptible h Convection heat transfer coefficient, W/(m ·K). to overheating and the keyboard surface may reach k Thermal conductivity, W/(m·K). ergonomically undesirable temperatures. Based on the analysis q Heat transfer rate, W. results and observations, a new component arrangement s Fin spacing, mm. considering passive paths and using the back side of the LCD screen is proposed and a simple correlation based thermal Greek Symbols analysis of the proposed system is presented. -
Real-Time Finite Element Method (FEM) and Tressfx
REAL-TIME FEM AND TRESSFX 4 ERIC LARSEN KARL HILLESLAND 1 FEBRUARY 2016 | CONFIDENTIAL FINITE ELEMENT METHOD (FEM) SIMULATION Simulates soft to nearly-rigid objects, with fracture Models object as mesh of tetrahedral elements Each element has material parameters: ‒ Young’s Modulus: How stiff the material is ‒ Poisson’s ratio: Effect of deformation on volume ‒ Yield strength: Deformation limit before permanent shape change ‒ Fracture strength: Stress limit before the material breaks 2 FEBRUARY 2016 | CONFIDENTIAL MOTIVATIONS FOR THIS METHOD Parameters give a lot of design control Can model many real-world materials ‒Rubber, metal, glass, wood, animal tissue Commonly used now for film effects ‒High-quality destruction Successful real-time use in Star Wars: The Force Unleashed 1 & 2 ‒DMM middleware [Parker and O’Brien] 3 FEBRUARY 2016 | CONFIDENTIAL OUR PROJECT New implementation of real-time FEM for games Planned CPU library release ‒Heavy use of multithreading ‒Open-source with GPUOpen license Some highlights ‒Practical method for continuous collision detection (CCD) ‒Mix of CCD and intersection contact constraints ‒Efficient integrals for intersection constraint 4 FEBRUARY 2016 | CONFIDENTIAL STATUS Proof-of-concept prototype First pass at optimization Offering an early look for feedback Several generic components 5 FEBRUARY 2016 | CONFIDENTIAL CCD Find time of impact between moving objects ‒Impulses can prevent intersections [Otaduy et al.] ‒Catches collisions with fast-moving objects Our approach ‒Conservative-advancement based ‒Geometric -
AMD Powerpoint- White Template
RDNA Architecture Forward-looking statement This presentation contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) including, but not limited to, the features, functionality, performance, availability, timing, pricing, expectations and expected benefits of AMD’s current and future products, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs, assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's Quarterly Report on Form 10-Q for the quarter ended March 30, 2019 2 Highlights of the RDNA Workgroup Processor (WGP) ▪ Designed for lower latency and higher -
Small Form Factor 3D Graphics for Your Pc
VisionTek Part# 900701 PRODUCTIVITY SERIES: SMALL FORM FACTOR 3D GRAPHICS FOR YOUR PC The VisionTek Radeon R7 240SFF graphics card offers a perfect balance of performance, features, and affordability for the gamer seeking a complete solution. It offers support for the DIRECTX® 11.2 graphics standard and 4K Ultra HD for stunning 3D visual effects, realistic lighting, and lifelike imagery. Its Short Form Factor design enables it to fit into the latest Low Profile desktops and workstations, yet the R7 240SFF can be converted to a standard ATX design with the included tall bracket. With 2GB of DDR3 memory and award-winning Graphics Core Next (GCN) architecture, and DVI-D/HDMI outputs, the VisionTek Radeon R7 240SFF is big on features and light on your wallet. RADEON R7 240 SPECS • Graphics Engine: RADEON R7 240 • Video Memory: 2GB DDR3 • Memory Interface: 128bit • DirectX® Support: 11.2 • Bus Standard: PCI Express 3.0 • Core Speed: 780MHz • Memory Speed: 800MHz x2 • VGA Output: VGA* • DVI Output: SL DVI-D • HDMI Output: HDMI (Video/Audio) • UEFI Ready: Support SYSTEM REQUIREMENTS • PCI Express® based PC is required with one X16 lane graphics slot available on the motherboard. • 400W (or greater) power supply GCN Architecture: A new design for AMD’s unified graphics processing and compute cores that allows recommended. 500 Watt for AMD them to achieve higher utilization for improved performance and efficiency. CrossFire™ technology in dual mode. • Minimum 1GB of system memory. 4K Ultra HD Support: Experience what you’ve been missing even at 1080P! With support for 3840 x • Installation software requires CD-ROM 2160 output via the HDMI port, textures and other detail normally compressed for lower resolutions drive. -
Amd Filed: February 24, 2009 (Period: December 27, 2008)
FORM 10-K ADVANCED MICRO DEVICES INC - amd Filed: February 24, 2009 (period: December 27, 2008) Annual report which provides a comprehensive overview of the company for the past year Table of Contents 10-K - FORM 10-K PART I ITEM 1. 1 PART I ITEM 1. BUSINESS ITEM 1A. RISK FACTORS ITEM 1B. UNRESOLVED STAFF COMMENTS ITEM 2. PROPERTIES ITEM 3. LEGAL PROCEEDINGS ITEM 4. SUBMISSION OF MATTERS TO A VOTE OF SECURITY HOLDERS PART II ITEM 5. MARKET FOR REGISTRANT S COMMON EQUITY, RELATED STOCKHOLDER MATTERS AND ISSUER PURCHASES OF EQUITY SECURITIES ITEM 6. SELECTED FINANCIAL DATA ITEM 7. MANAGEMENT S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS ITEM 7A. QUANTITATIVE AND QUALITATIVE DISCLOSURE ABOUT MARKET RISK ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA ITEM 9. CHANGES IN AND DISAGREEMENTS WITH ACCOUNTANTS ON ACCOUNTING AND FINANCIAL DISCLOSURE ITEM 9A. CONTROLS AND PROCEDURES ITEM 9B. OTHER INFORMATION PART III ITEM 10. DIRECTORS, EXECUTIVE OFFICERS AND CORPORATE GOVERNANCE ITEM 11. EXECUTIVE COMPENSATION ITEM 12. SECURITY OWNERSHIP OF CERTAIN BENEFICIAL OWNERS AND MANAGEMENT AND RELATED STOCKHOLDER MATTERS ITEM 13. CERTAIN RELATIONSHIPS AND RELATED TRANSACTIONS AND DIRECTOR INDEPENDENCE ITEM 14. PRINCIPAL ACCOUNTANT FEES AND SERVICES PART IV ITEM 15. EXHIBITS, FINANCIAL STATEMENT SCHEDULES SIGNATURES EX-10.5(A) (OUTSIDE DIRECTOR EQUITY COMPENSATION POLICY) EX-10.19 (SEPARATION AGREEMENT AND GENERAL RELEASE) EX-21 (LIST OF AMD SUBSIDIARIES) EX-23.A (CONSENT OF ERNST YOUNG LLP - ADVANCED MICRO DEVICES) EX-23.B -
AMD Firepro™Professional Graphics for CAD & Engineering and Media
AMD FirePro™Professional Graphics for CAD & Engineering and Media & Entertainment Performance at every price point. AMD FirePro professional graphics offer breakthrough capabilities that can help maximize productivity and help lower cost and complexity — giving you the edge you need in your business. Outstanding graphics performance, compute power and ultrahigh-resolution multidisplay capabilities allows broadcast, design and engineering professionals to work at a whole new level of detail, speed, responsiveness and creativity. AMD FireProTM W9100 AMD FireProTM W8100 With 16GB GDDR5 memory and the ability to support up to six 4K The new AMD FirePro W8100 workstation graphics card is based on displays via six Mini DisplayPort outputs,1 the AMD FirePro W9100 the AMD Graphics Core Next (GCN) GPU architecture and packs up graphics card is the ideal single-GPU solution for the next generation to 4.2 TFLOPS of compute power to accelerate your projects beyond of ultrahigh-resolution visualization environments. just graphics. AMD FireProTM W7100 AMD FireProTM W5100 The new AMD FirePro W7100 graphics card delivers 8GB The new AMD FirePro™ W5100 graphics card delivers optimized of memory, application performance and special features application and multidisplay performance for midrange users. that media and entertainment and design and engineering With 4GB of ultra-fast GDDR5 memory, users can tackle moderately professionals need to take their projects to the next level. complex models, assemblies, data sets or advanced visual effects with ease. AMD FireProTM W4100 AMD FireProTM W2100 In a class of its own, the AMD FirePro Professional graphics starts with AMD W4100 graphics card is the best choice FirePro W2100 graphics, delivering for entry-level users who need a boost in optimized and certified professional graphics performance to better address application performance that similarly- their evolving workflows. -
AMD Accelerated Parallel Processing Opencl Programming Guide
AMD Accelerated Parallel Processing OpenCL Programming Guide November 2013 rev2.7 © 2013 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, AMD Accelerated Parallel Processing, the AMD Accelerated Parallel Processing logo, ATI, the ATI logo, Radeon, FireStream, FirePro, Catalyst, and combinations thereof are trade- marks of Advanced Micro Devices, Inc. Microsoft, Visual Studio, Windows, and Windows Vista are registered trademarks of Microsoft Corporation in the U.S. and/or other jurisdic- tions. Other names are for informational purposes only and may be trademarks of their respective owners. OpenCL and the OpenCL logo are trademarks of Apple Inc. used by permission by Khronos. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. The information contained herein may be of a preliminary or advance nature and is subject to change without notice. No license, whether express, implied, arising by estoppel or other- wise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as compo- nents in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or envi- ronmental damage may occur. -
AMD Firepro™ W5000
AMD FirePro™ W5000 Be Limitless, When Every Detail Counts. Powerful mid-range workstation graphics. This powerful product, designed for delivering superior performance for CAD/CAE and Media workflows, can process Key Features: up to 1.65 billion triangles per second. This means during > Utilizes Graphics Core Next (GCN) to the design process you can easily interact and render efficiently balance compute tasks with your 3D models, while the competition can only process 3D workloads, enabling multi-tasking that is designed to optimize utilization up to 0.41 billion triangles per second (up to four times and maximize performance. less performance). It also offers double the memory > Unmatched application of competing products (2GB vs. 1GB) and 2.5x responsiveness in your workflow, the memory bandwidth. It’s the ideal solution whether in advanced visualization, for professionals working with a broad range of complex models, large data sets or applications, moderately complex models and datasets, video editing. and advanced visual effects. > AMD ZeroCore Power Technology enables your GPU to power down when your monitor is off. Product features: > AMD ZeroCore Power technology leverages > GeometryBoost—the GPU processes > Optimized and certified for major CAD and M&E AMD’s leadership in notebook power efficiency geometry data at a rate of twice per clock cycle, doubling the rate of primitive applications delivering 1 TFLOP of single precision and 80 to enable our desktop GPUs to power down and vertex processing. GFLOPs of double precision performance with when your monitor is off, also known as the > AMD Eyefinity Technology— outstanding reliability for the most demanding “long idle state.” Industry-leading multi-display professional tasks. -
Improving Resource Utilization in Heterogeneous CPU-GPU Systems
Improving Resource Utilization in Heterogeneous CPU-GPU Systems A Dissertation Presented to the Faculty of the School of Engineering and Applied Science University of Virginia In Partial Fulfillment of the requirements for the Degree Doctor of Philosophy (Computer Engineering) by Michael Boyer May 2013 c 2013 Michael Boyer Abstract Graphics processing units (GPUs) have attracted enormous interest over the past decade due to substantial increases in both performance and programmability. Programmers can potentially leverage GPUs for substantial performance gains, but at the cost of significant software engineering effort. In practice, most GPU applications do not effectively utilize all of the available resources in a system: they either fail to use use a resource at all or use a resource to less than its full potential. This underutilization can hurt both performance and energy efficiency. In this dissertation, we address the underutilization of resources in heterogeneous CPU-GPU systems in three different contexts. First, we address the underutilization of a single GPU by reducing CPU-GPU interaction to improve performance. We use as a case study a computationally-intensive video-tracking application from systems biology. Because of the high cost of CPU-GPU coordination, our initial, straightforward attempts to accelerate this application failed to effectively utilize the GPU. By leveraging some non-obvious optimization strategies, we significantly decreased the amount of CPU-GPU interaction and improved the performance of the GPU implementation by 26x relative to the best CPU implementation. Based on the lessons we learned, we present general guidelines for optimizing GPU applications as well as recommendations for system-level changes that would simplify the development of high-performance GPU applications. -
AMD Codexl 1.7 GA Release Notes
AMD CodeXL 1.7 GA Release Notes Thank you for using CodeXL. We appreciate any feedback you have! Please use the CodeXL Forum to provide your feedback. You can also check out the Getting Started guide on the CodeXL Web Page and the latest CodeXL blog at AMD Developer Central - Blogs This version contains: For 64-bit Windows platforms o CodeXL Standalone application o CodeXL Microsoft® Visual Studio® 2010 extension o CodeXL Microsoft® Visual Studio® 2012 extension o CodeXL Microsoft® Visual Studio® 2013 extension o CodeXL Remote Agent For 64-bit Linux platforms o CodeXL Standalone application o CodeXL Remote Agent Note about installing CodeAnalyst after installing CodeXL for Windows AMD CodeAnalyst has reached End-of-Life status and has been replaced by AMD CodeXL. CodeXL installer will refuse to install on a Windows station where AMD CodeAnalyst is already installed. Nevertheless, if you would like to install CodeAnalyst, do not install it on a Windows station already installed with CodeXL. Uninstall CodeXL first, and then install CodeAnalyst. System Requirements CodeXL contains a host of development features with varying system requirements: GPU Profiling and OpenCL Kernel Debugging o An AMD GPU (Radeon HD 5000 series or newer, desktop or mobile version) or APU is required. o The AMD Catalyst Driver must be installed, release 13.11 or later. Catalyst 14.12 (driver 14.501) is the recommended version. See "Getting the latest Catalyst release" section below. For GPU API-Level Debugging, a working OpenCL/OpenGL configuration is required (AMD or other). CPU Profiling o Time-Based Profiling can be performed on any x86 or AMD64 (x86-64) CPU/APU. -
The Amd Linux Graphics Stack – 2018 Edition Nicolai Hähnle Fosdem 2018
THE AMD LINUX GRAPHICS STACK – 2018 EDITION NICOLAI HÄHNLE FOSDEM 2018 1FEBRUARY 2018 | CONFIDENTIAL GRAPHICS STACK: KERNEL / USER-SPACE / X SERVER Mesa OpenGL & Multimedia Vulkan Vulkan radv AMDVLK OpenGL X Server radeonsi Pro/ r600 Workstation radeon amdgpu LLVM SCPC libdrm radeon amdgpu FEBRUARY 2018 | AMD LINUX GRAPHICS STACK 2FEBRUARY 2018 | CONFIDENTIAL GRAPHICS STACK: OPEN-SOURCE / CLOSED-SOURCE Mesa OpenGL & Multimedia Vulkan Vulkan radv AMDVLK OpenGL X Server radeonsi Pro/ r600 Workstation radeon amdgpu LLVM SCPC libdrm radeon amdgpu FEBRUARY 2018 | AMD LINUX GRAPHICS STACK 3FEBRUARY 2018 | CONFIDENTIAL GRAPHICS STACK: SUPPORT FOR GCN / PRE-GCN HARDWARE ROUGHLY: GCN = NEW GPUS OF THE LAST 5 YEARS Mesa OpenGL & Multimedia Vulkan Vulkan radv AMDVLK OpenGL X Server radeonsi Pro/ r600 Workstation radeon amdgpu LLVM(*) SCPC libdrm radeon amdgpu (*) LLVM has pre-GCN support only for compute FEBRUARY 2018 | AMD LINUX GRAPHICS STACK 4FEBRUARY 2018 | CONFIDENTIAL GRAPHICS STACK: PHASING OUT “LEGACY” COMPONENTS Mesa OpenGL & Multimedia Vulkan Vulkan radv AMDVLK OpenGL X Server radeonsi Pro/ r600 Workstation radeon amdgpu LLVM SCPC libdrm radeon amdgpu FEBRUARY 2018 | AMD LINUX GRAPHICS STACK 5FEBRUARY 2018 | CONFIDENTIAL MAJOR MILESTONES OF 2017 . Upstreaming the DC display driver . Open-sourcing the AMDVLK Vulkan driver . Unified driver delivery . OpenGL 4.5 conformance in the open-source Mesa driver . Zero-day open-source support for new hardware FEBRUARY 2018 | AMD LINUX GRAPHICS STACK 6FEBRUARY 2018 | CONFIDENTIAL KERNEL: AMDGPU AND RADEON HARDWARE SUPPORT Pre-GCN radeon GCN 1st gen (Southern Islands, SI, gfx6) GCN 2nd gen (Sea Islands, CI(K), gfx7) GCN 3rd gen (Volcanic Islands, VI, gfx8) amdgpu GCN 4th gen (Polaris, RX 4xx, RX 5xx) GCN 5th gen (RX Vega, Ryzen Mobile, gfx9) FEBRUARY 2018 | AMD LINUX GRAPHICS STACK 7FEBRUARY 2018 | CONFIDENTIAL KERNEL: AMDGPU VS. -
AMD APP SDK Developer Release Notes
AMD APP SDK v3.0 Beta Developer Release Notes 1 What’s New in AMD APP SDK v3.0 Beta 1.1 New features in AMD APP SDK v3.0 Beta AMD APP SDK v3.0 Beta includes the following new features: OpenCL 2.0: There are 20 samples that demonstrate various features of OpenCL 2.0 such as Shared Virtual Memory, Platform Atomics, Device-side Enqueue, Pipes, New workgroup built-in functions, Program Scope Variables, Generic Address Space, and OpenCL 2.0 image features. For the complete list of the samples, see the AMD APP SDK Samples Release Notes (AMD_APP_SDK_Release_Notes_Samples.pdf) document. Support for Bolt 1.3 library. 6 additional samples that demonstrate various APIs in the Bolt C++ AMP library. One new sample that demonstrates the consumption of SPIR 1.2 binary. Enhancements and bug fixes in several samples. A lightweight installer that supports the following features: Customized online installation Ability to download the full installer for install and distribution 1.2 New features for AMD CodeXL version 1.6 The following new features in AMD CodeXL version 1.6 provide the following improvements to the developer experience: GPU Profiler support for OpenCL 2.0 API-level debugging for OpenCL 2.0 Power Profiling For information about CodeXL and about how to use CodeXL to gather performance data about your OpenCL application, such as application traces and timeline views, see the CodeXL home page. Developer Release Notes 1 of 4 2 Important Notes OpenCL 2.0 runtime support is limited to 64-bit applications running on 64-bit Windows and Linux operating systems only.