6Th Gen Intel® Core™ Desktop Processor Product Brief
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems. -
ENDURO Urban N3 NR.R18EC.002
ENDURO Urban N3 NR.R18EC.002 SPECIFICATIONS ENDURO Urban N3 EUN314-51W / EUN314-51WG 1 2 10 11 12 3 4 5 6 7 8 9 13 14 TM Product views 1. Camera 5. USB 3.2 Gen 1 port with power- 8. SD card slot 12. 1Power4 button 2. 14.0" display off charging 9. Headset jack 13. USB 3.2 Gen 1 port 3. DC-in jack 6. USB 3.2 Gen 1 port 10. Keyboard 14. Kensington lock slot 4. HDMI® port 7. USB Type-C /Thunderbolt 4 port 11. Touchpad Operating system1, 2 Windows 10 Home 64-bit CPU and chipset1 Intel® Core™ i3-1115G4 processor Memory1, 3, 4, 5 Dual-channel DDR4 SDRAM support: 8 GB of DDR4 system memory, upgradable to 32 GB using two soDIMM modules Display6 14.0" display with IPS (In-Plane Switching) technology, Full HD 1920 x 1080, high-brightness (450 nits) Acer ComfyViewTM LED-backlit TFT LCD 16:9 aspect ratio Wide viewing angle up to 170 degrees Mercury free, environment friendly Graphics1, 7 Intel Iris® Xe Graphics (EUN314-51W only) Audio Acer Purified.Voice technology with two built-in microphones. Features include far-field pickup, keystroke suppression, voice tracking, adaptive beam forming, voice recognition enhancement, three pre-defined modes: voice recognition, personal call, conference call Acer TrueHarmony technology for lower distortion, wider frequency range, headphone-like audio and powerful sound Compatible with Cortana with Voice Two built-in stereo speakerse Storage1, 8 Solid state drive: 512 GB, PCIe Gen3 8 Gb/s up to 4 lanes, NVMe Webcam1 HD webcam with 1280 x 720 resolution and 720p HD audio/video recording Wireless and WLAN: -
Data Sampling on MDS-Resistant 10Th Generation Intel Core (Ice Lake) 1
Data Sampling on MDS-resistant 10th Generation Intel Core (Ice Lake) Daniel Moghimi Worcester Polytechnic Institute, Worcester, MA, USA Abstract the store buffer. MSBDS has been shown in attacks on the kernel space as well as on SGX [1]. In addition to the leakage Microarchitectural Data Sampling (MDS) is a set of hardware component, MSBDS can also be turned around easily to tran- vulnerabilities in Intel CPUs that allows an attacker to leak siently inject values into a victim, an attack technique known bytes of data from memory loads and stores across various as Load Value Injection (LVI) [14]. security boundaries. On affected CPUs, some of these vulner- abilities were patched via microcode updates. Additionally, To mitigate these vulnerabilities, Intel released software Intel announced that the newest microarchitectures, namely workarounds and microcode updates for affected CPUs [4]. Cascade Lake and Ice Lake, were not affected by MDS. While One of the most recent microarchitectures, Ice Lake, is re- Cascade Lake turned out to be vulnerable to the ZombieLoad ported to be unaffected by MDS attacks [6,8]. Intel has also v2 MDS attack (also known as TAA), Ice Lake was not af- explicitly listed Ice Lake processors as not being vulnera- fected by this attack. ble to LVI-SB [14], which exploits MSBDS for Load Value Injection [7]. In this technical report, we show a variant of MSBDS (CVE- 2018-12126), an MDS attack, also known as Fallout, that To better analyze the MDS vulnerabilities, and potentially works on Ice Lake CPUs. This variant was automatically find new variants, Moghimi et al. -
8Th Generation Intel® Core™ Processors Product Brief
PRODUCT BRIEF 8TH GENERATION INTEL® CORE™ PROCESSORS Mobile U-Series: Peak Performance on the Go The new 8th generation Intel® Core™ Processor U-series—for sleek notebooks and 2 in 1s elevates your computing experience with an astounding 40 percent leap in productivity performance over 7th Gen PCs,1 brilliant 4K Ultra HD entertainment, and easier, more convenient ways to interact with your PC. With 10 hour battery life2 and robust I/O support, Intel’s first quad-core U-series processors enable portable, powerhouse thin and light PCs, so you can accomplish more on the go. Extraordinary Performance and Responsiveness With Intel’s latest power-efficient microarchitecture, advanced process technology, and silicon optimizations, the 8th generation Intel Core processor (U-series) is Intel’s fastest 15W processor3 with up to 40 percent greater productivity than 7th Gen processors and 2X more productivity vs. comparable 5-year-old processors.4 • Get fast and responsive web browsing with Intel® Speed Shift Technology. • Intel® Turbo Boost Technology 2.0 lets you work more productively by dynamically controlling power and speed—across cores and graphics— boosting performance precisely when it is needed, while saving energy when it counts. • With up to four cores, 8th generation Intel Core Processor U-series with Intel® Hyper-Threading Technology (Intel® HT Technology) supports up to eight threads, making every day content creation a compelling experience on 2 in 1s and ultra-thin clamshells. • For those on the go, PCs enabled with Microsoft Windows* Modern Standby wake instantly at the push of a button, so you don’t have to wait for your system to start up. -
Introducing the New 11Th Gen Intel® Core™ Desktop Processors
Product Brief 11th Gen Intel® Core™ Desktop Processors Introducing the New 11th Gen Intel® Core™ Desktop Processors The 11th Gen Intel® Core™ desktop processor family puts you in control of your compute experience. It features an innovative new architecture for reimag- ined performance, immersive display and graphics for incredible visuals, and a range of options and technologies for enhanced tuning. When these advances come together, you have everything you need for fast-paced professional work, elite gaming, inspired creativity, and extreme tuning. The 11th Gen Intel® Core™ desktop processor family gives you the power to perform, compete, excel, and power your greatest contributions. Product Brief 11th Gen Intel® Core™ Desktop Processors PERFORMANCE Reimagined Performance 11th Gen Intel® Core™ desktop processors are intelligently engineered to push the boundaries of performance. The new processor core architecture transforms hardware and software efficiency and takes advantage of Intel® Deep Learning Boost to accelerate AI performance. Key platform improvements include memory support up to DDR4-3200, up to 20 CPU PCIe 4.0 lanes,1 integrated USB 3.2 Gen 2x2 (20G), and Intel® Optane™ memory H20 with SSD support.2 Together, these technologies bring the power and the intelligence you need to supercharge productivity, stay in the creative flow, and game at the highest level. Product Brief 11th Gen Intel® Core™ Desktop Processors Experience rich, stunning, seamless visuals with the high-performance graphics on 11th Gen Intel® Core™ desktop -
Intel® Communications Chipset 8900 to 8920 Series Software Programmer's Guide
Intel® Communications Chipset 8900 to 8920 Series Software Programmer's Guide March 2015 Order No.: 330753-003 You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725 or visit http:// www.intel.com/design/literature.htm. Any software source code reprinted in this document is furnished for informational purposes only and may only be used or copied and no license, express or implied, by estoppel or otherwise, to any of the reprinted source code is granted by this document. Basis, Basis Peak, BlueMoon, BunnyPeople, Celeron, Centrino, Cilk, Curie, Flexpipe, Intel, the Intel logo, the Intel Anti-Theft technology logo, Intel AppUp, the Intel AppUp logo, Intel Atom, Intel CoFluent, Intel Core, Intel Inside, the Intel Inside logo, Intel Insider, Intel RealSense, Intel SingleDriver, Intel SpeedStep, Intel vPro, Intel Xeon Phi, Intel XScale, InTru, the InTru logo, the InTru Inside logo, InTru soundmark, Iris, Itanium, Kno, Look Inside., the Look Inside. -
HP 250 Notebook PC
HP 250 Notebook PC Our value-priced notebook PC with powerful essentials ideal for everyday computing on the go. HP recommends Windows. Built for mobile use Designed for productivity For professionals on the move, the HP 250 features a Connect with colleagues online and email from the durable chassis that helps protect against the rigors of office or from your favorite hotspots with Wi-Fi the day. CERTIFIED™ WLAN.5 Carry the HP 250 from meeting to meeting. Enjoy great From trainings to sales presentations, view high-quality views on the 15.6-inch diagonal HD2 display, without multimedia and audio right from your notebook with sacrificing portability. preinstalled software and the built-in Altec Lansing speaker. Powered for business Tackle projects with the power of the Intel® third Make an impact with presentations when you connect 2 6 7 generation Core™ i3 or i5 dual-core processors.3 to larger HD displays through the HDMI port. Develop stunning visuals without slowing down your notebook, thanks to Intel’s integrated graphics. 4 HP, a world leader in PCs brings you Windows 8 Pro designed to fit the needs of business. HP 250 Notebook PC HP recommends Windows. SPECIFICATIONS Operating system Preinstalled: Windows 8 644 Windows 8 Pro 644 Ubuntu Linux FreeDOS Processor 3rd Generation Intel® Core™ i5 & i33; 2nd Generation Intel® Core™ i33; Intel® Pentium® 3; Intel® Celeron® 3 Chipset Mobile Intel® HM70 Express (Intel® Pentium® and Celeron® processors) Mobile Intel® HM75 Express (Intel® Core™ i3 and i5 processor) Memory DDR3 SDRAM (1600 MHz) -
Intel® Communications Chipset 89Xx Series Software for Linux* — Getting Started Guide
Intel® Communications Chipset 89xx Series Software for Linux* Getting Started Guide July 2014 Order No.: 330750-001 By using this document, in addition to any agreements you have with Intel, you accept the terms set forth below. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. -
Boosting Shared-Memory Supercomputing
casE STUDY Intel® Xeon® Processor 7500 Family Enterprise Server High-Performance Computing Performance for Data-Intensive Computing Boosting Shared-Memory Supercomputing NCSA doubles performance and nearly triples memory capacity with SGI Altix* UV system based on the Intel® Xeon® processor 7500 family As one of the premier high-performance computing (HPC) research institutions in the U.S., the National Center for Supercomputing Applications (NCSA) provides HPC resources for a wide range of scientific applications, including many whose performance needs require highly parallel shared-memory architectures. NCSA recently replaced its previous shared-memory system, an SGI Altix* supercomputer based on the Intel® Itanium® 2 processor, with an SGI Altix UV supercomputer powered by the Intel® Xeon® processor 7500 family. NCSA says the new system, which it calls Ember, consumes half the power while delivering double the performance and nearly triple the memory capacity. CHALLEngES • Rising demand, aging system. At nearly six years old, NCSA’s Intel Itanium 2 processor- based shared-memory supercomputer couldn’t keep up with rising demand. SOLUTIOns • Technologies to maximize data-intensive performance. NCSA chose an SGI Altix UV system with 256 six-core Intel Xeon processors 7500 family. The system has 8 TB of RAM and runs Red Hat Enterprise Linux*. IMPacT • More speed and capacity. The new supercomputer provides 16 teraflops (TF) of peak performance and 13.5 GB per second of I/O bandwidth, helping scientists accelerate progress on a variety of complex and important problems. • Cost and energy savings. The system consumes half as much power as the previous platform while delivering double the performance—the equivalent of four times more performance per watt. -
Fact Sheet: Intel® Joule™ Platform
Intel® Joule™ Platform Big Compute in a Small Package to Drive IoT Innovation Aug. 16, 2016 – Intel Corporation today announced the availability of the Intel® Joule™ platform, a high-end compute platform capable of delivering human-like senses to a new generation of smart devices Created for the Internet of Things (IoT), the Intel Joule platform enables developers and entrepreneurs to build out an embedded system or take a prototype to commercial product faster, while also minimizing development costs. The Intel Joule platform starts with a compute module featuring high-end compute, 4K video and large memory in a tiny, low-power package. The platform incorporates a vast software and hardware ecosystem, enabling developers to choose from multiple operating systems and take advantage of off-the-shelf libraries and sensors. The platform also includes support for Intel® RealSense™ technology, making it particularly well suited for products and industrial systems requiring advanced computer vision or high-end edge computing. The Intel Joule Advantage • Big compute in a small package: High-end computing and large memory in a tiny package and low power footprint, making it ideal for applications requiring abundant compute power but with limited space for compute hardware, like autonomous robots and drones. • Human-like senses: Support for Intel® RealSense cameras and libraries enables developers to build devices that capture rich depth of field (DOF) information, which can be processed to create a high level of computer intelligence about the environment and objects within it, making a “thing” capable of autonomous behavior. • Communications: Laptop-class wireless comms, with 802.11ac for extended range and bandwidth. -
Product Change Notification 109134
Product Change Notification 109134 - 00 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Should you have any issues with the timeline or content of this change, please contact the Intel Representative(s) for your geographic location listed below. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN. Americas Contact: [email protected] Asia Pacific Contact: [email protected] Europe Email: [email protected] Japan Email: [email protected] Copyright © Intel Corporation 2009. Other names and brands may be claimed as the property of others. Celeron, Centrino, Intel, the Intel logo, Intel Core, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel Viiv, Intel XScale, Itanium, MMX, Paragon, PDCharm, Pentium, and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. -
Intel Core I7-7700K Processor
Intel Core i7-7700K Processor Product Collection 7th Generation Intel® Core™ i7 Processors Code Name Products formerly Kaby Lake Vertical Segment Desktop Processor Number i7-7700K Status Launched Launch Date Q1'17 Lithography 14 nm Recommended Customer Price $339.00 - $350.00 Performance # of Cores 4 # of Threads 8 Processor Base Frequency 4.20 GHz Max Turbo Frequency 4.50 GHz Cache 8 MB SmartCache Bus Speed 8 GT/s DMI3 # of QPI Links 0 TDP 91 W Supplemental Information Embedded Options Available No Conflict Free Yes Datasheet View now Learn how Intel is pursuing conflict-free technology. Memory Specifications Max Memory Size (dependent on memory type) 64 GB Memory Types DDR4-2133/2400, DDR3L-1333/1600 @ 1.35V Max # of Memory Channels 2 ECC Memory Supported ‡ No Graphics Specifications Processor Graphics ‡ Intel® HD Graphics 630 Graphics Base Frequency 350 MHz Graphics Max Dynamic Frequency 1.15 GHz Graphics Video Max Memory 64 GB 4K Support Yes, at 60Hz Max Resolution (HDMI 1.4)‡ 4096x2304@24Hz Max Resolution (DP)‡ 4096x2304@60Hz Max Resolution (eDP - Integrated Flat Panel)‡ 4096x2304@60Hz DirectX* Support 12 OpenGL* Support 4.4 Intel® Quick Sync Video Yes Intel® InTru™ 3D Technology Yes Intel® Clear Video HD Technology Yes Intel® Clear Video Technology Yes # of Displays Supported ‡ 3 Device ID 0x5912 Expansion Options Scalability 1S Only PCI Express Revision 3.0 PCI Express Configurations ‡ Up to 1x16, 2x8, 1x8+2x4 Max # of PCI Express Lanes 16 Package Specifications Sockets Supported FCLGA1151