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Copper interconnects
Process Integration Issues of Low-Permittivity Dielectrics with Copper for High-Performance Interconnects
UNIVERSITY of CALIFORNIA, SAN DIEGO Optimization of the BEOL
Preliminary Reliability Evaluation of Copper-Interconnect Metallization Technology
3-D Multilayer Copper Interconnects for High-Performance Monolithic Devices and Passives Ayad Ghannam, David Bourrier, Lamine Ourak, Christophe Viallon, Thierry Parra
Chapter 2 Fundamentals of Electromigration
Electrochemical Atomic Layer Deposition of Metals for Applications in Semiconductor Interconnect Metallization
"Process Integration Issues of Low-Permittivity Dielectrics with Copper for High-Performance Interconnects", Chapter
Exploration of Carbon Nanotube and Copper-Carbon Nanotube Composite for Next Generation On-Chip Energy Efficient Interconnect Applications Jie Liang
Interconnect Scaling.Pdf
Copper–Titanium Thin Film Interaction
The Metal Resistivity Increase Is an Emerging Concern As the ITRS Projected Metal Widths Can Be Smaller Than the Mean Free Path
Advanced Copper Interconnects Application As an Adhesion
Copper Interconnects
Copper Interconnects: Surface State Engineering to Facilitate Specular Electron Scattering
Recent Advances in Barrier Layer of Cu Interconnects
Investigating the Electromigration Reliability of Copper Interconnects
On-Chip Interconnect Conductor Materials for End-Of-Roadmap Technology Nodes Anshul A
RF and Crosstalk Analysis of Copper and MLGNR Interconnects Using Different Repeaters in Sub-10 Nm Regime
Top View
Comparison Between SWCNT Interconnects and Copper Interconnects for GSI and TSI Integrated Circuits
Interconnects for Future Technology Generations
Damascene Process and Chemical Mechanical Planarization
6 2015-ITRS-2.0 Interconnect.Pdf
Selective Atomic Layer Capping of Copper Interconnects
Electromigration Phenomena in 0.13 Micron Copper Interconnects
Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects
Copper Interconnect Technology for the 32 Nm Node and Beyond Jeff Gambino, Fen Chen, John He IBM Microelectronics 1000 River Street Essex Junction, VT, 05452
Copper-Encapsulated Silicon Micromachined Structures J.-L
Selective Atomic Layer Deposition of Hfo2 on Copper Patterned Silicon
Technical Briefing
Copper Interconnect Technology Tapan Gupta
Growth Monitoring of Ultrathin Copper and Copper Oxide Films Deposited
A Comparative Analysis of Copper and Carbon Nanotubes Based Global Interconnects
Carbon Nano Tube Interconnects for Hardware Architectures and Inter-Chip Connections -A Simulation Based Analysis Jaisimha Manipatruni, Sohana Domathoty
Technology and Reliability Constrained Future Copper Interconnects-Part II
The Impact of Electromigration in Copper Interconnects on Power Grid Integrity
On Impacts of ESD Protection Structure on Circuit Performance in Aluminum and Copper Interconnects
Interconnect
Interconnect Roadmap 2011