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Microphonics, Moisture, Etc Mbius Microsystems MEMS and CMOS Approaches to Monolithic Timing and Frequency Synthesis University of Utah March 28, 2005 Michael S. McCorquodale, Ph.D. Chief Executive and Technology Officer Mobius Microsystems, Inc. Detroit, MI M. S. McCorquodale Mbius Microsystems Overview • An Overview of Timing and Frequency Synthesis • Critical Metrics • Entrenched Technologies • Emerging MEMS Approaches • CMOS Approaches • RF Clock Synthesis for the UMICH-WIMS µsystem • Mobius’ Clock Synthesis Technology • Future Work and Summary of Results 2of 79 M. S. McCorquodale Mbius Microsystems An Overview of Timing and Frequency Synthesis 3of 79 M. S. McCorquodale Mbius An Overview of Microsystems Timing and Frequency Synthesis Timing Every synchronous semiconductor component requires a clock to operate Frequency synthesis RF systems require precision frequency references for carrier frequency synthesis Bluetooth/LAN USB Print Server • USB XTAL clock reference • Ethernet XTAL clock reference • Processor XTAL clock reference • Bluetooth radio XTAL reference (on flip side) 4of 79 M. S. McCorquodale Mbius Frequency Synthesis Microsystems Approaches • The phase, delay, or injection locked “bottom-up” approach – Resonator (of some type) serves as a frequency reference – Sustaining oscillator provides a low frequency reference signal – PLL/DLL/ILL multiplies frequency by 2-4096x • Drawbacks with this approach – External components (1 resonator + 2 capacitors) • Expensive, large, pin interface – Reference oscillator required • Either included in PLL or design required – PLL dissipates substantial power to multiply frequency • Particularly true for large multiplication factors – Performance degrades as frequency increases • For multiplication factor N, noise increases by N2 (to be shown) – Lock and start-up time can be long (e.g. >10,000 cycles) 5of 79 M. S. McCorquodale Mbius Frequency Synthesis Microsystems Approaches • The free-running “direct” approach – RC (phase shift), ring, relaxation oscillators – Designed on-chip for the desired frequency – No external components required (monolithic); No reference • Drawbacks with this approach – Very inaccurate: frequency ±20% untrimmed, ±2% trimmed – Very unstable over power supply & temperature variation: ±2% – High jitter – Typically found in 4-bit microcontrollers 6of 79 M. S. McCorquodale Mbius Frequency Synthesis Microsystems Approaches and Implementations Phase-locked Free-running fref PFD CP LPF Nfref fo ÷N Discrete Hybrid Monolithic crystal µC clock 7of 79 M. S. McCorquodale Mbius Microsystems Critical Metrics 8of 79 M. S. McCorquodale Mbius Summary of Microsystems Critical Metrics • Frequency and time domain metrics – Short-term frequency stability: Jitter and phase noise – Total frequency accuracy: Drift over process, voltage, temperature (PVT), and aging – Rise/fall times – Duty cycle – Start-up time • Environmental conditions – Sensitivity to microphonics, moisture, etc. • Cost – Fabrication process technology – Production trimming requirements – Packaging requirements 9of 79 M. S. McCorquodale Mbius Short-Term Microsystems Frequency Stability = ω Ideal Oscillator Output vo (t) Vo cos ot = + ε ω +φ vn (t) (Vo (t))cos( ot (t)) Noisy Oscillator Output Timing Jitter Phase Noise Time domain uncertainty in period Power at frequency offset from fundamental P v Ideal Period t f P fo vn t t1 t2 t3 4 t T T T f 1 2 3 fo 10 of 79 M. S. McCorquodale Mbius Short-Term Microsystems Frequency Stability v Ideal Period Short-Term Timing Jitter Expressions t • n-cycle = − J n (k) var(tk +n tk ) • Period (1-cycle) v n t t t t = − = = 1 2 3 4 J 1 (k ) var( t k +1 t k ) var( Tk ) J • Cycle-to-cycle t = − J cc (k ) var( Tk +1 Tk ) T1 T2 T3 P Phase Noise Power Spectral Density (PSD) Power relative to fundamental at offset fm from fo fo+fm ⎛ ⎞ + No = Sv ( fo fm ) ⎜ ⎟ Po Po f ⎝ ⎠ fm fo 11 of 79 M. S. McCorquodale Mbius Frequency Accuracy Microsystems and Precision Nominal frequency acc./prec. • Accuracy is how close the actual f − f A = actual ref frequency is to the desired (fref) f fref • Precision is how much the maximum frequency deviates from the mean − = fmax f ( f ), an issue that must be addressed Pf in production f • Will frequency trimming be required? If so, what will it cost (test time) 12 of 79 M. S. McCorquodale Mbius Frequency Microsystems Sensitivities or Drift V ∂f • Power supply S f = DD V DD ∂ f V DD 1 ∂f TC = • Temperature f f ∂T G ∂f S f = • Microphonic G f ∂G All expressions can be determined by analysis 13 of 79 M. S. McCorquodale Mbius Long-Term Microsystems Frequency Stability Long-term frequency stability • A measure of frequency variation over a long period of time • Commonly called aging ∆f f Long-term instability Short-term instability t 14 of 79 M. S. McCorquodale Mbius Microsystems Entrenched Technologies 15 of 79 M. S. McCorquodale Mbius Entrenched Microsystems Technologies • Quartz – Piezoelectric bulk acoustic wave (BAW) resonators – ±50 to ±250ppm total accuracy – kHz to 100MHz – Primary applications: frequency and clock synthesis • ZnO – Piezoelectric surface acoustic wave (SAW) resonators – ±100 to ±250ppm total accuracy – 100 to 900MHz – Primary application: IF filters • Ceramic – Ceramic material which is induced to be piezoelectric – ±0.25 to ±5% total accuracy – kHz to 50MHz – Primary application: clock synthesis 16 of 79 M. S. McCorquodale Mbius Microsystems Emerging MEMS Approaches 17 of 79 M. S. McCorquodale Mbius Two General Microsystems Approaches • Resonator replacements – Utilize micromachining to develop integrated mechanical resonators which can replace discrete resonators – Intended to enable the realization of an integrated time/frequency reference • Improve VCO performance with enhanced passive components – Develop high-Q varactors and inductors in order to realize low phase noise VCOs – Not intended to replace the reference, but related to improving the performance of frequency synthesis blocks (allows Q-factor of reference oscillator to be relaxed) 18 of 79 M. S. McCorquodale Mbius Emerging MEMS Microsystems Approaches • Capacitively-coupled microresonators – Surface micromachined poly-Si structures with capacitive actuation • Benefits Clamped-clamped beam poly-Si microresonator – Very high-Q (>10,000) demonstrated [Nguyen, McCorquodale, et al.] • Challenges – High motional resistance (>kΩ) – Nonlinear transduction causes flicker noise upconversion in oscillator circuits – Specialized packaging required – Process not CMOS-compatible – Frequency trimming required – Moderate temperature coefficient – Microphonic sensitivity may be high Disk poly-Si microresonator [Nguyen, et al.] 19 of 79 M. S. McCorquodale Mbius Emerging MEMS Microsystems Approaches Sense Electrode • Piezoelectrically-coupled ZnO Film microresonators – ZnO film couples actuation to surface Drive Electrode Tuning Capacitor Device Layer micromachined poly-Si beam Oxide – Remainder of device identical to Handle Layer previous microresonator Piezoelectric microresonator [Ayazi, et al.] • Benefits – Much lower motional resistance than previous microresonator (~100Ω) • Challenges – Same as remaining challenges for previous microresonators 20 of 79 M. S. McCorquodale Mbius Emerging MEMS Microsystems Approaches • Piezoelectric film bulk acoustic wave resonators (FBAR) – Similar to an integrated XTAL, but a film Drive • Benefits Electrode – High-Q – Low motional resistance – No specialized packaging required FBAR [Ruby, et al.] Thin • Challenges Piezoelectric – Not CMOS-compatible Film – Accuracy difficult to control • Actually in products Substrate Electrodes Sense • Best application: multiple Piezoelectric references/filters within one Reflectors Electrode package Substrate 21 of 79 M. S. McCorquodale Mbius Emerging MEMS Microsystems Approaches • Passive RF MEMS – Micromachined varactors and inductors of various topologies • Benefits – Higher Q than planar passive components and thus lower phase noise in VCOs – Often tunable via mechanical actuation Micromachined parallel plate varactor – Some devices CMOS-compatible [Young, Boser] • Challenges – Most devices not CMOS-compatible – Microphonic sensitivity high for large aspect ratio devices – Some devices not practical for high volume Micromachined suspended inductor production [Yoon] 22 of 79 M. S. McCorquodale Mbius Microsystems CMOS Approaches 23 of 79 M. S. McCorquodale Mbius General Microsystems Approach • Construct a reference oscillator at desired frequency with available CMOS components: resistors, capacitors, transistors, diodes, etc. • Use standard and well-known oscillator topologies • Design compensation circuitry for voltage and temperature drift • Trim frequency out of fabrication • Best accuracy achieved to date ~±1.5% over PVT 24 of 79 M. S. McCorquodale Mbius Phase Shift Microsystems Oscillator Basic operation C CC • Minimum of three RC pairs to -A form 180º phase shift R RR • Inverting amplifier creates final 180º phase shift • fo dependent on RC component values ω = 6 o RC Challenges • Poor temperature stability Notes • Poor short-term stability • Very common in MCUs • Moderate accuracy (trimmed) • All discrete Si clock components • Moderate Si area utilize phase shift topology 25 of 79 M. S. McCorquodale Mbius Relaxation Microsystems and Ring Relaxation: Basic operation Ring: Basic operation Characterized by one equivalent Odd number of inverters in a ring or an storage element as reference even number with wire inversion π ω = 2 ω = gm o o 2ntd 2RCCD RR 12… n M M 1 2 Challenges for both • Very inaccurate C • Poor short-term stability
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