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Electrical Conductive Adhesives with Nanotechnologies Yi Li · Daniel Lu · C.P

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Electrical Conductive Adhesives with Nanotechnologies Yi Li · Daniel Lu · C.P Electrical Conductive Adhesives with Nanotechnologies Yi Li · Daniel Lu · C.P. Wong Electrical Conductive Adhesives with Nanotechnologies 123 Yi Li Daniel Lu School of Materials Science Henkel Loctite (China) Co. Ltd. and Engineering 5000 W. Chandler Blvd. Georgia Institute of Technology 264006 Chandler 771 Ferst Drive People’s Republic of China Atlanta, GA 30332-0245 [email protected] USA [email protected] C.P. Wong School of Materials Science and Engineering Georgia Institute of Technology 771 Ferst Drive Atlanta, GA 30332-0245 USA [email protected] ISBN 978-0-387-88782-1 e-ISBN 978-0-387-88783-8 DOI 10.1007/978-0-387-88783-8 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009933981 c Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Preface With the phasing out of lead-bearing solders, electrically conductive adhesives (ECAs) have been identified as one of the environmentally friendly alternatives to tin/lead (Sn/Pb) solders in electronics packaging applications. In particular, with the requirements for fine-pitch and high- performance interconnects in advanced packaging, ECAs with nano- materials or other nano-technology are becoming more and more important due to the special electrical, mechanical, optical, magnetic, and chemical properties that nano-sized materials can possess. There has been extensive research for the last few years on materials and process improvement of ECAs, as well as on the advances of nanoconductive adhesives that contain nano-filler, such as nano-particles, nanowires, or carbon nanotubes and nano monolayer graphenes. The objective of this book is to review the most recent advances of various types of electrically conductive adhesives with the particular emphasis on the emerging nanotechnology, including materials development and characterizations, processing optimization, reliability improvement, and future challenges/opportunities identification. This book consists of nine Chapters, each representing a specific field of interest. Chapter 1 discusses an overview of electronic packaging and the evolvement of different types of conductive adhesives. Chapter 2 describes the latest development of nano-materials, nanotechnology and their applications in microelectronics packaging. Chapter 3 reviews the key polymeric materials used in conductive adhesives and the analytic approaches for ECA characterizations. Chapter 4 deals with the recent advances in materials, processes, and applications of isotropically conductive adhesives (ICAs), particularly focusing on the fundamental understanding and improvement of materials properties for ICAs and nano-ICAs. Chapter 5 discusses the recent development and applications of anisotropically conductive adhesives (ACA) with the emphasis on the nano-materials implementation for improved performance. Chapter 6 describes the latest materials and processing development of non- conductive adhesives (NCA). Chapter 7 discusses the details of conductive nano-inks and their applications in transparent electrodes, printed electronics, and other packaging areas. Chapter 8 focuses on the recent research and development of materials and applications of intrinsically conducting polymers. And finally, Chapter 9 summarizes the recent advances of conductive adhesives with nanotechnology and discusses the challenges and opportunities for continuing the work on nanoconductive adhesives. vi Preface The field of electrically conductive adhesives and nanotechnology is quite broad and their development is dynamic, so it is impossible to cover every aspect of them. We have attempted to include most major areas with the latest references which should be useful to our audience who work in this vast growing discipline. With the advances of microelectronics packaging and nanotechnology, there is always a constant need of improved materials and technology. This is a challenge that requires the continuous and active collaborative efforts between materials scientists, chemists, physicists, device and package design engineers. We express our gratitude to many of our colleagues and friends in the field of microelectronics packaging, conductive adhesives and nanoscience and nanotechnology. Many of their published works have been cited in this book, including work published by many other experts in the fields. We would also like to thank Owen Hildreth and Angela Duan for proofreading some chapters and Steven Elliot and Andrew Leigh for editorial suggestions. Chandler, AZ Yi Li Yantai, China Daniel Lu Atlanta, GA C.P. Wong Contents 1 Introduction ..........................................................................................1 1.1 Electronics Packaging and Interconnect........................................1 1.2 Interconnection Materials............................................................11 1.2.1 Lead-Free Interconnect Materials....................................12 1.2.2 Electrically Conductive Adhesives..................................15 References ............................................................................................19 2 Nanotechnology...................................................................................25 2.1 Introduction to Nanotechnologies and Nanopackaging ..............25 2.2 Nanoparticles...............................................................................26 2.2.1 Introduction.....................................................................26 2.2.2 Nanoparticle Fabrication.................................................27 2.2.3 Nanoparticle Applications...............................................28 2.3 Nano Solder Particles ..................................................................30 2.4 Carbon Nanotubes (CNTs)..........................................................38 2.4.1 Carbon Nanotubes for Electrical Interconnect Applications ....................................................................39 2.5 Nanocomposites ..........................................................................48 2.5.1 Recent Advances in Nanocomposites .............................48 2.5.2 Areas of Application of Nanocomposites .......................51 2.6 Nano Interconnect .......................................................................53 2.6.1 Carbon Nanotube Transistors..........................................53 2.6.2 CNT Via..........................................................................54 2.6.3 CNT as Flip Chip Interconnect .......................................55 2.6.4 Nanoparticle Interlayer for Copper to Copper Bonding .......56 2.6.5 Interconnection Using Inkjet Printing of Nano-ink.........56 2.7 Nanowires and Nanobelts............................................................60 2.7.1 Introduction.....................................................................60 2.7.2 Applications of Nanowires..............................................60 References ............................................................................................65 3 Characterizations of Electrically Conductive Adhesives.....................81 3.1 Recent Advances in Polymeric Materials for Electronic Packaging ....................................................................................81 3.1.1 Silicones (Polyorganosiloxanes) .....................................81 3.1.2 Epoxies............................................................................83 3.1.3 Polyurethanes ..................................................................84 3.1.4 Polyimides.......................................................................85 viii Contents 3.1.5 Silicone-Polyimide (SPI).................................................86 3.1.6 Bismaleimide (BMI) Resins............................................88 3.1.7 Cyanate Ester Resins.......................................................89 3.2 Analytical Approaches for ECA..................................................91 3.2.1 Differential Scanning Calorimeter (DSC).......................91 3.2.2 Thermogravimetry Analyzer (TGA) ...............................95 3.2.3 Dynamic Mechanical Analyzer (DMA)..........................96 3.2.4 Thermo-mechanical Analysis (TMA) .............................98 3.2.5 Viscometer and Rheometer ...........................................100 3.2.6 Fourier Transform Infrared (FT-IR)..............................101 3.2.7 X-Ray Photoelectron Spectroscopy (XPS)....................103 3.2.8 X-Ray Diffraction (XRD) .............................................104 3.2.9 Transmission Electron Microscopy (TEM)...................105 3.2.10 Scanning Electron Microscopy (SEM).........................106 3.2.11 Raman Spectroscopy ....................................................107
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