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Coming Back Home After the Sun Rises: Returnee Entrepreneurs and Growth of High Tech Industries
G Model RESPOL-2772; No. of Pages 17 ARTICLE IN PRESS Research Policy xxx (2012) xxx–xxx Contents lists available at SciVerse ScienceDirect Research Policy jou rnal homepage: www.elsevier.com/locate/respol Coming back home after the sun rises: Returnee entrepreneurs and growth of high tech industries a,b c,∗ d Martin Kenney , Dan Breznitz , Michael Murphree a Department of Human and Community Development, University of California, Davis, United States b Berkeley Roundtable on the International Economy, United States c The Scheller College of Business, Georgia Institute of Technology, United States d Sam Nunn School of International Affairs, Georgia Institute of Technology, United States a r t i c l e i n f o a b s t r a c t Article history: Recently, the role of returnees in the economic development of various East Asian nations has received Received 6 November 2011 much attention. The early literature on the relocation of the most highly trained individuals from a devel- Received in revised form 30 July 2012 oping nation to a developed nation viewed the phenomena as a “brain drain.” Since the 1990s, a new Accepted 4 August 2012 strand of thinking has suggested that for developing nations this was actually a positive phenomenon; as Available online xxx these expatriates studied and then worked abroad, they absorbed technical expertise, managerial, and entrepreneurial skills. These theories stipulated that these expatriates then returned home, and ignited Keywords: a virtuous circle of technological entrepreneurship leading to rapid economic development. Much of this High skilled immigrants Innovation literature gives returnees a critical role in the home country’s take-off period of the local information and communications technology (ICT) industry. -
H1 2015-2016 Results
H1 2015-2016 Results November 2015 Safe Harbour Statement This presentation contains forward-looking statements made pursuant to the safe harbour provisions of the Private Securities litigation reform Act of 1995. By nature, forward looking statement represent the judgment regarding future events and are based on currently available information. Although the Company cannot guarantee their accuracy, actual results may differ materially from those the company anticipated due to a number of uncertainties, many of which the Company is not aware. For additional information concerning these and other important factors that may cause the Company’s actual results to differ materially from expectations and underlying assumptions, please refer to the reports filed by the Company with the Autorité des Marchés Financiers (AMF). Soitec – H1 2015-2016 Results – November 2015 2 Agenda 1 Highlights 2 H1 2015-2016 Financial results 3 Outlook 4 Q&A Appendix: Electronics core business Soitec – H1 2015-2016 Results – November 2015 3 H1 2015-2016 - Core Business highlights Communication and Power – Demand remains robust for RF-SOI products in mobile applications; SOI content continues to grow within smartphones due to increased complexity (number of bands and performance) – Bernin 200mm-diameter wafer capacity is almost sold out for CY 2016 – Simgui (Chinese foundry) produced its first 200mm wafers in October 2015 and is now starting customers qualifications – Customers developing successfully 300mm wafers for RF - at least one major fabless and one foundry -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References ............................................. -
HEP Computing Trends
HEP Computing Trends Andrew Washbrook University of Edinburgh ATLAS Software & Computing Tutorials 19th January 2015 UTFSM, Chile Introduction • I will cover future computing trends for High Energy Physics with a leaning towards the ATLAS experiment • Some examples of non-LHC experiments where appropriate • This is a broad subject area (distributed computing, storage, I/O) so here I will focus on the readiness of HEP experiments to changing trends in computing architectures • Also some shameless promotion of work I have been involved in.. Many thanks to all the people providing me with material for this talk! LHC Context Run 2 • Increase in centre of mass energy 13TeV • Increase in pile up from ~20 to ~50 • Increase in Trigger rate up to 1 KHz RAW to ESD • More computing resources required to Reconstruction reconstruct events Time High Luminosity LHC • HL-LHC starts after LS3 (~2022) • Aim to provide 300[-1 per year • Pileup of 150 expected • 200 PB/year of extra storage HL-LHC Timeline CPU Evolution • Die shrink getting smaller • Research down to 5nm depending on lithography and materials • Clock speed improvement has slowed • More cores per socket • Server at the Grid computing centre has at least 16 cores, typically more • Extrapolation from 2013 predicts 25% server performance improvement per year Processor scaling trends 1e+06 Transistors ● Clock Power ● Performance ● Performance/W ● ● ● ● ● ● ●●● ● ● ● ●●● ● ● ●●● ●● ●●●●● ● ● ●●●●● ●●●●●●●●● ●●●● ● ● ●●●● ●●●●●●●● ●●●●●● ● ●● ● ● ●● ● ●●●● ●●●●●●●●●●●● ● ● ● ●● ●●●● ●●●●●●●●●●●●●●●●● -
When Drivers Are Not Going to Drive
NOVATEK Microelectronics Co., LTD (3034 TT) When Drivers Are Not Going To Drive National Chengchi University, Taiwan CFA Institute Research Challenge Anna Cheng | Yowen Chang | Jackson Chen | Brian Chien | Yensheng Lee National Chengchi University 1 RECOMMENDATION: SELL 18% 200 (Mar. 31, 2016) 150 NT$ 129.5 TP 100 NT$ 106 50 2015/1/5 2015/4/5 2015/7/5 2015/10/5 2016/1/5 2016/12/31 TV Market Share Erosion Fail to Catch Up with the TDDI Takeoff Limited Contribution from SoC Business National Chengchi University 2 Business & Industry Overview Investment Thesis Financial Analysis & Valuation Investment Risks National Chengchi University 3 Novatek, a Fabless Chip Design Company IC Design Panel End Market Foundry Test Assembly Driver IC SoC Source: AUO, Asus, Sony, Huawei National Chengchi University 4 Display Driver IC, Main Product Line Revenue Breakdown by Product Portfolio 2015 SoC 28% DDIC 72% Source: Company Data National Chengchi University 5 Panel Makers Utilize Novatek’s Products IC Design Panel End Market Foundry Test Assembly Driver IC SoC Source: AUO, Asus, Sony, Huawei National Chengchi University 6 Taiwanese Panel Makers Are Main Customers Revenue Breakdown by Geography, 2015 Japan Taiwan 44% China Korea Source: Company Data National Chengchi University 7 Panels Are Applied to Electronic Products IC Design Panel End Market Foundry Test Assembly Driver IC SoC Source: AUO, Asus, Sony, Huawei National Chengchi University 8 TVs & Smartphones Are Primary Applications Revenue Breakdown by Product, 2015 Tablet Other PC TV 40% Smartphone -
2018, but We Are Not Done by Any Means
Dear Shareholders, Today, we are pleased to review a year which includes numerous positive fundamental developments. At Himax Technologies, we pride ourselves not only on defending our position as the market leader in our sector, in terms of quality, reliability, and execution, but also on our ability to pair aggressive development aspirations with creating long-term shareholder value. In this regard, we believe we have accomplished a great deal in 2018, but we are not done by any means. 2018 was a year of new developments in our technology sector and our markets. At Himax Technologies, we have successfully leveraged our strengths to navigate both market dynamics as well as company specific opportunities to deliver a solid year of growth for shareholders. Further, we proactively initiated and executed several strategic initiatives to strengthen our operation and streamline R&D investments. We believe these proactive strategies reinforced our status in the marketplace and further strengthened our ability to defend our position as a market leader. Additionally, our execution in 2018 positions us for future growth well beyond 2018. Despite a challenging global economic environment, we are more optimistic about the opportunities ahead as several of our industry-leading technologies are at or nearing key inflection points. As a result, we expect to enter a period of substantial growth in the near future. Now, let me briefly go through each of our major business segments. Being a global leader in the display driver IC (DDIC) segment, we have been benefiting from China’s continued capacity expansion of its panel manufacturing as well as the Chinese smartphone makers’ rapid overseas expansion. -
20-F Job: DP17787 20F Date: 6/3/2010 8:54 AM
DPW Company: HIMAX TECHNOLOGIES INC Submission Type: 20-F Job: DP17787_20F Date: 6/3/2010 8:54 AM Submission Data File Submission Information Field Name Data Form Type* 20-F Filer CIK* 0001342338 Filer CCC* ******** Filer File Number* Filer is Shell Company* No Filer is Voluntary Filer* No Filer is Well Known Seasoned Issuer* No Filer Accelerated Status* Accelerated Filer Period of Report* 12-31-09 Return Copy off Confirming Copy off Contact Name Harold Tin Contact Number 011-852-2533-3369 SROS NASD Notify via Website only off (End Submission Information) Documents Field Name Data Enclosed Document Count 11 Document Name dp17787_20f.htm Document Type* 20-F Document Description FORM 20F Document Name 1 p36.jpg Document Type* 1 GRAPHIC Document Description 1 Document Name 2 p45.jpg Document Type* 2 GRAPHIC Document Description 2 Document Name 3 p49.jpg Document Type* 3 GRAPHIC Document Description 3 Document Name 4 dp17787_ex0101.htm Document Type* 4 EX-1.1 Document Description 4 EXHIBIT 1.1 Document Name 5 dp17787_ex0402.htm Document Type* 5 EX-4.2 Document Description 5 EXHIBIT 4.2 Document Name 6 dp17787_ex0801.htm Document Type* 6 EX-8.1 Document Description 6 EXHIBIT 8.1 Document Name 7 dp17787_ex1201.htm Document Type* 7 EX-12.1 Document Description 7 EXHIBIT 12.1 Document Name 8 dp17787_ex1202.htm Document Type* 8 EX-12.2 Document Description 8 EXHIBIT 12.2 Document Name 9 dp17787_ex1301.htm Document Type* 9 EX-13.1 Document Description 9 EXHIBIT 13.1 Document Name 10 dp17787_ex1501.htm Document Type* 10 EX-15.1 Document Description 10 EXHIBIT 15.1 (End Documents) Notifications Field Name Data Email Address [email protected] Email Address 1 [email protected] Email Address 2 [email protected] (End Notifications) Generated by DPW Name : dp17787_20f.htm Type : 20-F Page : Description : FORM 20F Job : DP17787_20F Date : 6/3/2010 8:54 AM UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. -
Virtual & Augmented Reality
EXCERPTED FROM THE ORIGINAL: See inside cover for details. FINANCIAL BACKING GLOBAL INTEREST SHIPPING OUT SELLING OUT INTEREST IN THE PAST READY TO BUILD A WAVE OF CONTENT ON THE WAY RETAIL VALUE HOME REDESIGN, REIMAGINED EASIER TO IMAGINE YOURSELF AT HOME Video • Jaunt The Ecosystem • NextVR Virtual Reality / Augmented Reality • VRSE • Oculus Story Studio • GoPro • IG Port Processors Games • TI Applications • Sony • Qualcomm • Ubisoft 3D Audio • STMicro Graphics • CCP Games • Nvidia • TI • Realtek • Oculus Story Studio • AMD • Wolfson • Himax • Tammeka Games • Qualcomm • Realtek • MediaTek • Pixel Titans • Intel • Capcom Augmented Reality Virtual Reality Engineering • Microsoft HoloLens • Facebook Oculus Head–mounted devices • Autodesk • Google Glass • Samsung Gear VR • Dassault Systèmes • Magic Leap • Google Cardboard • IrisVR • Atheer • HTC Vive • Visidraft • Osterhout Design • Sony PSVR • MakeVR Memory Group • Vuzix iWear (DRAM/SSD) • VR Union Claire • Micron Healthcare • Samsung • Psious • SK Hynix • zSpace • Toshiba • Conquer Mobile • 3D Systems Social • Altspace VR • High Fidelity • Podrift Commerce • Sixense {shopping} • Matterport {real estate} Display • Samsung • JDI Cameras • Himax • 360Heros • Crystal • GoPro Odyssey 3D Lenses • Nokia OZO • Wearality • Jaunt NEO • Zeiss • Matterport Pro 3D Components • Canon • Nikon Haptics • Largan • Alps Position/ Room Tracker • AAC • Hon Hai • Nidec • Pegatron • Flex • Jabil • HTC Motion Sensors • Leap Motion • InvenSense • TI • STMicro • Honeywell The Ecosystem Virtual Reality / Augmented -
Since the Advent of Integrated Circuit Technology in 1958, the Integration Has Been Primarily Monolithic
Opening Keynote #1 Extending Moore’s Law with Advanced Packages Abstract: Since the advent of integrated circuit technology in 1958, the integration has been primarily monolithic. Unfortunately, due to physical and economic reasons, the vast majority of analog chips, digital chips, and memory chips are each built on separate technologies. Therefore, in order to deliver optimum system performance, power, and cost, it is desirable to integrate multiple different die, each using its own optimized technology, in a single package. Advanced packaging technologies, e.g. 3DIC, SSIT(stacked silicon Interconnect technology) etc., have been developed to extend scaling beyond the Moore’s Law to achieve higher transistor count, increased functionality and superior performance. Xilinx is the leading provider of all programmable FPGA (Field Programmable Gate Array) products. To achieve high performance, but low power and cost, Xilinx has developed an innovative SSIT technology that employs microbumps and through-silicon vias (TSVs) to integrate multiple FPGA die slices placed side-by-side on a passive silicon interposer, and successfully delivered the industry’s first 28nm homogeneous SSIT device. This technology is further developed for advanced technical nodes (20nm, 16nm and beyond) to allow integrating heterogeneous components such as Processor, FPGA, GPU, Memory, Serdes, etc. on the same interposer die enabling faster computing through reduced latency. The advance of packaging and assembly technology will be introduced, and the benefits of advanced packaging to the various products will be highlighted. Successful qualification of these products is driving the high growth in the applications e.g. cloud computing, embedded vision, industrial IOT, and 5G wireless etc. -
2020 Annual Report Dear Shareholders
2020 Annual Report Dear Shareholders, Looking back at 2020, it was a volatile year. The global economy and semiconductor industry were severely damaged by the outbreak of COVID-19 and overshadowed by the prolonged US-China trade tension. The market for electronics devices saw a strong turnaround in demand during the second half of 2020 fueled by new work-from-home and e-learning lifestyles. However, the demand surge also intensifed the ongoing capacity shortage in foundry, assembly and testing. Under these challenging conditions, Himax thrived, delivering strong business results with a much-improved product mix from our comprehensive product portfolio, diversifed customer base and long-term partnerships with suppliers. It was a fruitful year for Himax in 2020. We increased our market share and achieved record revenue and gross margin in the fourth quarter while maintaining our leadership positions in tablet and automotive. We also made signifcant progress in our promising ultralow power smart sensing solutions. For the longer term, we remain committed to investing across all our product segments to further solidify our leading position in the global marketplace. As we move forward, we are dedicated to high quality, strict reliability, and effcient execution to deliver shareholder value. Now let me review each of our major business segments in 2020. Starting with our driver business, despite the capacity shortage the overall display driver IC businesses demonstrated robust growth. Led by TDDI for tablet and smartphone, our small and medium-sized driver IC segment dominated this year’s strong growth. For our large display driver IC business, the prevailing work-from-home and distance education gave rise to strong growth in monitor and notebook businesses in 2020. -
Unstructured Computations on Emerging Architectures
Unstructured Computations on Emerging Architectures Dissertation by Mohammed A. Al Farhan In Partial Fulfillment of the Requirements For the Degree of Doctor of Philosophy King Abdullah University of Science and Technology Thuwal, Kingdom of Saudi Arabia May 2019 2 EXAMINATION COMMITTEE PAGE The dissertation of M. A. Al Farhan is approved by the examination committee Dissertation Committee: David E. Keyes, Chair Professor, King Abdullah University of Science and Technology Edmond Chow Associate Professor, Georgia Institute of Technology Mikhail Moshkov Professor, King Abdullah University of Science and Technology Markus Hadwiger Associate Professor, King Abdullah University of Science and Technology Hakan Bagci Associate Professor, King Abdullah University of Science and Technology 3 ©May 2019 Mohammed A. Al Farhan All Rights Reserved 4 ABSTRACT Unstructured Computations on Emerging Architectures Mohammed A. Al Farhan his dissertation describes detailed performance engineering and optimization Tof an unstructured computational aerodynamics software system with irregu- lar memory accesses on various multi- and many-core emerging high performance computing scalable architectures, which are expected to be the building blocks of energy-austere exascale systems, and on which algorithmic- and architecture-oriented optimizations are essential for achieving worthy performance. We investigate several state-of-the-practice shared-memory optimization techniques applied to key kernels for the important problem class of unstructured meshes. We illustrate -
HIMX Presentation
Human Interface and Display Technologies : HIMX August 2021 INVESTOR PRESENTATION Forward Looking Statements Factors that could cause actual events or results to differ materially from those described in this conference call include, but are not limited to, the effect of the Covid-19 pandemic on the Company’s business; general business and economic conditions and the state of the semiconductor industry; market acceptance and competitiveness of the driver and non- driver products developed by the Company; demand for end-use applications products; reliance on a small group of principal customers; the uncertainty of continued success in technological innovations; our ability to develop and protect our intellectual property; pricing pressures including declines in average selling prices; changes in customer order patterns; changes in estimated full-year effective tax rate; shortage in supply of key components; changes in environmental laws and regulations; changes in export license regulated by Export Administration Regulations (EAR); exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; our ability to collect accounts receivable and manage inventory and other risks described from time to time in the Company's SEC filings, including those risks identified in the section entitled "Risk Factors" in its Form 20-F for the year ended December 31, 2020 filed with the SEC, as may be amended. Images of devices depicted in this presentation may be representative of those in which Himax has specification, or for reference-only and may not be associated with actual bill-of-material or design-win in the displayed image. Any association of such, without a confirmed disclosure of such by the Company or the Company's customer are coincidental.