Standard Cell Library Design and Optimization with CDM for Deeply Scaled Finfet Devices
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Section 3. ASIC Industry Trends
3 ASIC INDUSTRY TRENDS ASSPs AND ASICs The term ASIC (Application Specific IC) has been a misnomer from the very beginning. ASICs, as now known in the IC industry, are really customer specific ICs. In other words, the gate array or standard cell device is specifically made for one customer. ASIC, if taken literally, would mean the device was created for one particular type of system (e.g., a disk-drive), even if this device is sold to numerous customers and/or is put in the IC manufacturer’s catalog. Currently, a device type that is sold to more than one user, even if it is produced using ASIC tech- nology, is considered a standard IC or ASSP (Application Specific Standard Product). Thus, we are left with the following nomenclature guidelines (Figure 3-1). ASIC: A device produced for only one customer. PLDs are included as ASICs because the customer “programs” that device for its needs only. CSIC: What ASICs should have been called from the beginning. Some companies differentiate an ASIC from a CSIC by who completes or is responsible for the majority of the IC design effort. If it is the IC producer, the part is labeled a CSIC, if it is the end-user, the device is called an ASIC. This term is not currently used very often in the IC industry. ASSP: A relatively new term for ICs targeting specific types of systems. In many cases the IC will be manufactured using ASIC technology (e.g., gate or linear array or standard cell techniques) but will ultimately be sold as a standard device type to numerous users (i.e., put into a product catolog). -
Introduction to ASIC Design
’14EC770 : ASIC DESIGN’ An Introduction Application - Specific Integrated Circuit Dr.K.Kalyani AP, ECE, TCE. 1 VLSI COMPANIES IN INDIA • Motorola India – IC design center • Texas Instruments – IC design center in Bangalore • VLSI India – ASIC design and FPGA services • VLSI Software – Design of electronic design automation tools • Microchip Technology – Offers VLSI CMOS semiconductor components for embedded systems • Delsoft – Electronic design automation, digital video technology and VLSI design services • Horizon Semiconductors – ASIC, VLSI and IC design training • Bit Mapper – Design, development & training • Calorex Institute of Technology – Courses in VLSI chip design, DSP and Verilog HDL • ControlNet India – VLSI design, network monitoring products and services • E Infochips – ASIC chip design, embedded systems and software development • EDAIndia – Resource on VLSI design centres and tutorials • Cypress Semiconductor – US semiconductor major Cypress has set up a VLSI development center in Bangalore • VDAT 2000 – Info on VLSI design and test workshops 2 VLSI COMPANIES IN INDIA • Sandeepani – VLSI design training courses • Sanyo LSI Technology – Semiconductor design centre of Sanyo Electronics • Semiconductor Complex – Manufacturer of microelectronics equipment like VLSIs & VLSI based systems & sub systems • Sequence Design – Provider of electronic design automation tools • Trident Techlabs – Power systems analysis software and electrical machine design services • VEDA IIT – Offers courses & training in VLSI design & development • Zensonet Technologies – VLSI IC design firm eg3.com – Useful links for the design engineer • Analog Devices India Product Development Center – Designs DSPs in Bangalore • CG-CoreEl Programmable Solutions – Design services in telecommunications, networking and DSP 3 Physical Design, CAD Tools. • SiCore Systems Pvt. Ltd. 161, Greams Road, ... • Silicon Automation Systems (India) Pvt. Ltd. ( SASI) ... • Tata Elxsi Ltd. -
HSPICE Tutorial
UNIVERSITY OF CALIFORNIA AT BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences EE105 Lab Experiments HSPICE Tutorial Contents 1 Introduction 1 2 Windows vs. UNIX 1 2.1 Windows ......................................... ...... 1 2.1.1 ConnectingFromHome .. .. .. .. .. .. .. .. .. .. .. .. ....... 2 2.1.2 RunningHSPICE ................................. ..... 2 2.2 UNIX ............................................ ..... 3 2.2.1 Software...................................... ...... 3 2.2.2 RunningSSH.................................... ..... 4 2.2.3 RunningHSPICE ................................. ..... 4 3 Simulating Circuits in HSPICE and Awaves 5 3.1 HSPICENetlistSyntax ............................. .......... 5 3.2 Examples ........................................ ....... 6 3.2.1 Transient analysis of a simple RC circuit . ............... 6 3.2.2 Operatingpointanalysisforadiode . ............. 7 3.2.3 DCanalysisofadiode............................ ........ 8 3.2.4 ACanalysisofahigh-passfilter. ............ 9 3.2.5 Transferfunctionanalysis . ............ 10 3.2.6 Pole-zeroanalysis. .......... 10 3.2.7 The .measure command................................... 11 3.3 Includinganotherfile. .. .. .. .. .. .. .. .. .. .. .. .. ............ 12 4 Using Awaves 13 4.1 Interfacedescription . ............. 13 4.2 Deletingplots................................... .......... 13 4.3 Printingplots................................... .......... 13 4.4 Makingameasurement .............................. ......... 13 4.5 Zooming........................................ -
ICS904/EN2 : Design of Digital Integrated Circuits
ICS904/EN2 : Design of Digital Integrated Circuits L5 : Design automation : The "liberty" file format Yves MATHIEU [email protected] Standard Cell characterization "Liberty" files Give all necessary informations to the synthesis and P&R tools A de-facto standard : "Liberty" files from "Synopsys" company. For each cell : • Logic behavior • Area • Power Consumption • Timing But also, for a whole library : • Characterization conditions (Process, Supply Voltage , Temperature) • Characterization conditions (Max rising time, Max capacitances,...) • Statistical capacitance model for wiring... 3/35 ICS904-EN2-L5 Yves MATHIEU An example library Nangate 45nm Open Cell Library Nangate is company creating characterization tools for standard cell libraries. Library distributed by Si2 (Silicon Integration Initiative) an association of electronic design automation companies. No way to process any true circuit, but usable for research and teaching purposes. Based on the NCSU (North Carolina State University) FreePDK45 process kit. FreePDK45 : An open source fictitious, non manufacturable process. 4/35 ICS904-EN2-L5 Yves MATHIEU Nangate 45nm Open Cell Library Units for measurements /* Units Attributes */ voltage_unit : "1V"; current_unit : "1mA"; pulling_resistance_unit : "1kohm"; capacitive_load_unit (1,ff); All measurements use defined units. 6/35 ICS904-EN2-L5 Yves MATHIEU Nangate 45nm Open Cell Library Characterization conditions /* Operation Conditions */ nom_process : 1.00; nom_temperature : 25.00; nom_voltage : 1.10; voltage_map (VDD,1.10); -
Nanoelectronic Mixed-Signal System Design
Nanoelectronic Mixed-Signal System Design Saraju P. Mohanty Saraju P. Mohanty University of North Texas, Denton. e-mail: [email protected] 1 Contents Nanoelectronic Mixed-Signal System Design ............................................... 1 Saraju P. Mohanty 1 Opportunities and Challenges of Nanoscale Technology and Systems ........................ 1 1 Introduction ..................................................................... 1 2 Mixed-Signal Circuits and Systems . .............................................. 3 2.1 Different Processors: Electrical to Mechanical ................................ 3 2.2 Analog Versus Digital Processors . .......................................... 4 2.3 Analog, Digital, Mixed-Signal Circuits and Systems . ........................ 4 2.4 Two Types of Mixed-Signal Systems . ..................................... 4 3 Nanoscale CMOS Circuit Technology . .............................................. 6 3.1 Developmental Trend . ................................................... 6 3.2 Nanoscale CMOS Alternative Device Options ................................ 6 3.3 Advantage and Disadvantages of Technology Scaling . ........................ 9 3.4 Challenges in Nanoscale Design . .......................................... 9 4 Power Consumption and Leakage Dissipation Issues in AMS-SoCs . ................... 10 4.1 Power Consumption in Various Components in AMS-SoCs . ................... 10 4.2 Power and Leakage Trend in Nanoscale Technology . ........................ 10 4.3 The Impact of Power Consumption -
Full-Custom Ics Standard-Cell-Based
Full-Custom ICs Design a chip from scratch. Engineers design some or all of the logic cells, circuits, and the chip layout specifi- cally for a full-custom IC. Custom mask layers are created in order to fabricate a full-custom IC. Advantages: complete flexibility, high degree of optimization in performance and area. Disadvantages: large amount of design effort, expensive. 1 Standard-Cell-Based ICs Use predesigned, pretested and precharacterized logic cells from standard-cell li- brary as building blocks. The chip layout (defining the location of the building blocks and wiring between them) is customized. As in full-custom design, all mask layers need to be customized to fabricate a new chip. Advantages: save design time and money, reduce risk compared to full-custom design. Disadvantages: still incurs high non-recurring-engineering (NRE) cost and long manufacture time. 2 D A B C A B B D C D A A B B Cell A Cell B Cell C Cell D Feedthrough Cell Standard-cell-based IC design. 3 Gate-Array Parts of the chip are pre-fabricated, and other parts are custom fabricated for a particular customer’s circuit. Idential base cells are pre-fabricated in the form of a 2-D array on a gate-array (this partially finished chip is called gate-array template). The wires between the transistors inside the cells and between the cells are custom fabricated for each customer. Custom masks are made for the wiring only. Advantages: cost saving (fabrication cost of a large number of identical template wafers is amortized over different customers), shorter manufacture lead time. -
Writing Simple Spice Netlists
By Joshua Cantrell Page <1> [email protected] Writing Simple Spice Netlists Introduction Spice is used extensively in education and research to simulate analog circuits. This powerful tool can help you avoid assembling circuits which have very little hope of operating in practice through prior computer simulation. The circuits are described using a simple circuit description language which is composed of components with terminals attached to particular nodes. These groups of components attached to nodes are called netlists. Parts of a Spice Netlist A Spice netlist is usually organized into different parts. The very first line is ignored by the Spice simulator and becomes the title of the simulation.1 The rest of the lines can be somewhat scattered assuming the correct conventions are used. For commands, each line must start with a ‘.’ (period). For components, each line must start with a letter which represents the component type (eg., ‘M’ for MOSFET). When a command or component description is continued on multiple lines, a ‘+’ (plus) begins each following line so that Spice knows it belongs to whatever is on the previous line. Any line to be ignored is either left blank, or starts with a ‘*’ (asterik). A simple Spice netlist is shown below: Spice Simulation 1-1 *** MODEL Descriptions *** .model nm NMOS level=2 VT0=0.7 KP=80e-6 LAMBDA=0.01 vdd *** NETLIST Description *** R1 M1 M1 vdd ng 0 0 nm W=3u L=3u in 3µ/3µ + R1 in ng 50 ng 5V - Vdd Vdd vdd 0 5 50Ω Vin in 0 2.5 Vin + *** SIMULATION Commands *** - 2.5V 0 .op .end Figure 1: Schematic of Spice Simulation 1-1 Netlist The first line is the title of the simulation. -
SPICE Netlist Generation for Electrical Parasitic Modeling of Multi-Chip Power Module Designs Peter Tucker University of Arkansas, Fayetteville
University of Arkansas, Fayetteville ScholarWorks@UARK Electrical Engineering Undergraduate Honors Electrical Engineering Theses 5-2013 SPICE netlist generation for electrical parasitic modeling of multi-chip power module designs Peter Tucker University of Arkansas, Fayetteville Follow this and additional works at: http://scholarworks.uark.edu/eleguht Part of the Electrical and Electronics Commons, and the Electronic Devices and Semiconductor Manufacturing Commons Recommended Citation Tucker, Peter, "SPICE netlist generation for electrical parasitic modeling of multi-chip power module designs" (2013). Electrical Engineering Undergraduate Honors Theses. 4. http://scholarworks.uark.edu/eleguht/4 This Thesis is brought to you for free and open access by the Electrical Engineering at ScholarWorks@UARK. It has been accepted for inclusion in Electrical Engineering Undergraduate Honors Theses by an authorized administrator of ScholarWorks@UARK. For more information, please contact [email protected], [email protected]. SPICE NETLIST GENERATION FOR ELECTRICAL PARASITIC MODELING OF MULTI-CHIP POWER MODULE DESIGNS SPICE NETLIST GENERATION FOR ELECTRICAL PARASITIC MODELING OF MULTI-CHIP POWER MODULE DESIGNS An Undergraduate Honors College Thesis in the Department of Electrical Engineering College of Engineering University of Arkansas Fayetteville, AR by Peter Nathaniel Tucker April 2013 ABSTRACT Multi-Chip Power Module (MCPM) designs are widely used in the area of power electronics to control multiple power semiconductor devices in a single package. The work described in this thesis is part of a larger ongoing project aimed at designing and implementing a computer aided drafting tool to assist in analysis and optimization of MCPM designs. This thesis work adds to the software tool the ability to export an electrical parasitic model of a power module layout into a SPICE format that can be run through an external SPICE circuit simulator. -
Simulatorreference.Pdf
SIMetrix SPICE and Mixed Mode Simulation Simulator Reference Manual Copyright ©1992-2006 Catena Software Ltd. Trademarks PSpice is a trademark of Cadence Design Systems Inc. Star-Hspice is a trademark of Synopsis Inc. Contact Catena Software Ltd., Terence House, 24 London Road, Thatcham, RG18 4LQ, United Kingdom Tel.: +44 1635 866395 Fax: +44 1635 868322 Email: [email protected] Internet http://www.catena.uk.com Copyright © Catena Software Ltd 1992-2006 SIMetrix 5.2 Simulator Reference Manual 1/1/06 Catena Software Ltd. is a member of the Catena group of companies. See http://www.catena.nl Table of Contents Table of Contents Chapter 1 Introduction The SIMetrix Simulator - What is it? ................................10 A Short History of SPICE.................................................10 Chapter 2 Running the Simulator Using the Simulator with the SIMetrix Schematic Editor..12 Adding Extra Netlist Lines ........................................12 Displaying Net and Pin Names.................................12 Editing Device Parameters.......................................13 Editing Literal Values - Using shift-F7 ......................13 Running in non-GUI Mode...............................................14 Overview...................................................................14 Syntax.......................................................................14 Aborting ....................................................................15 Reading Data............................................................16 Configuration -
Development and Verification of a Small CMOS Digital Standard Cell Library Based on SMIC 130Nm Process
4th International Conference on Mechatronics, Materials, Chemistry and Computer Engineering (ICMMCCE 2015) Development and Verification of A Small CMOS Digital Standard Cell Library Based on SMIC 130nm Process Yiwen Wang1,a,*, Hang Su1,a, Mingjiang Wang1,a, Jipan Huang2,b, Hao Chen2,b 1School of Electronic and Information Engineering, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen, China 2School of Electronic and Computer Engineering, Peking University Shenzhen Graduate School, Shenzhen, China [email protected], [email protected] Keywords: Standard cell library; Full adder; Optimization; Verification; P&R Abstract. Nowadays, Semi-custom design based on the standard cells is the mainstream design method for digital IC chip. In this thesis, the standard cell library is built and verified based on the SMIC 130nm technology, especially the optimization of a 1-bit full adder cell, during which the structure and layout of the full adder in the SMIC library is analyzed. As a result, the structure and size of the adder cell are improved better, which is simulated by H-spice. The comparison shows that the optimized adder is not only smaller in area, with width decreased by 0.82μm, but also have advantages in power consumption and timing, with energy delay product reduced by 7.7% .In the end, the s298 circuit in ISCAS Benchmark89 is used as the benchmark to complete the verification method of the standard cell library. Introduction Standard cell library is the basis of gate-level module based circuit design, and it has a direct impact on the performance[1,2], power consumption, size and yield of the final flowing out circuits. -
Eg, Nangate 15 Nm Standard Cell Library
Nanosystem Design Kit (NDK): Transforming Emerging Technologies into Physical Designs of VLSI Systems G. Hills, M. Shulaker, C.-S. Lee, H.-S. P. Wong, S. Mitra Stanford Massachusetts University Institute of Technology Abundant-Data Explosion “Swimming in sensors, drowning in data” Wide variety & complexity Unstructured data 0 40K 0 ExaB (Billionsof GB) 2006 Year 2020 Mine, search, analyze data in near real-time Data centers, mobile phones, robots 2 Abundant-Data Applications Huge memory wall: processors, accelerators Energy Measurements Genomics classification Natural language processing 5% 18 % 0% 0% … 95 82 % % Compute Memory Intel performance counter monitors 2 CPUs, 8-cores/CPU + 128GB DRAM 3 US National Academy of Sciences (2011) 4 Computing Today 2-Dimensional 5 3-Dimensional Nanosystems Computation immersed in memory 6 3-Dimensional Nanosystems Computation immersed in memory Increased functionality Fine-grained, Memory ultra-dense 3D Computing logic Impossible with today’s technologies 7 Enabling Technologies 3D Resistive RAM Massive storage No TSV 1D CNFET, 2D FET Compute, RAM access thermal STT MRAM Ultra-dense, Quick access fine-grained 1D CNFET, 2D FET vias Compute, RAM access thermal 1D CNFET, 2D FET Silicon Compute, Power, Clock compatible thermal 8 Nanosystems: Compact Models Essential 3D Resistive RAM nanohub Massive storage 1D CNFET, 2D FET Compute, RAM access thermal STT MRAM Quick access m-Cell 1D CNFET, 2D FET Compute, RAM access thermal 1D CNFET, 2D FET Compute, Power, Clock thermal 9 Compact Models: Insufficient Alone Design for Realistic Systems Wire parasitics Inter-module interface circuits Routing congestion Application-dependent workloads Multiple clock domains Cache architecture Memory access patterns Processor vs. -
Standard Cell Library Design with Transistor Folding Using
STANDARD CELL LIBRARY DESIGN WITH TRANSISTOR FOLDING USING 65NM TECHNOLOGY BY GLOBAL FOUNDRIES by Vibhav Kumarswami Salimath APPROVED BY SUPERVISORY COMMITTEE: ___________________________________________ Dr. Carl M. Sechen, Chair ___________________________________________ Dr. William Swartz ___________________________________________ Dr. Benjamin Carrion Schaefer Copyright 2018 Vibhav Kumarswami Salimath All Rights Reserved To my family and my teachers STANDARD CELL LIBRARY DESIGN WITH TRANSISTOR FOLDING USING 65NM TECHNOLOGY BY GLOBAL FOUNDRIES by VIBHAV KUMARSWAMI SALIMATH, B.E. THESIS Presented to the Faculty of The University of Texas at Dallas in Partial Fulfillment of the Requirements for the Degree of MASTER OF SCIENCE IN ELECTRICAL ENGINEERING THE UNIVERSITY OF TEXAS AT DALLAS May 2018 ACKNOWLEDGMENTS I want to thank my advisor, Dr. Carl Sechen, for his continuous supervision and guidance. I took Dr. Sechen’s course during my first semester in the master’s degree program. I loved the way he taught and came away from the course with a clear idea of my research interests. Working at the Nanometer Design Lab has been an incredible experience and I am most grateful for this opportunity. Thank you to my friends at Nanometer Design Lab for their valuable input, especially Xiangyu Xu and Qiongdan Huang (Olivia). I wish to specially thank Dr. William Swartz Jr. for providing me with timely help and support. Thank you to Dr. William Swartz Jr. and Dr. Benjamin Carrion Schaefer for serving as the committee members for my defense and providing me with their support and advice. I am extremely grateful to my family and friends for their encouragement, which has motivated me to do my best academically.