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Master of Science

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At A Glance TUM is ranked as the #1 + JOINT DEGREE BY University in Germany Technische Universität München (TUM) 1 Nanyang Technological University (NTU) NTU is ranked #1 in Asia 20 MONTHS FULL TIME for ++ PROGRAMME Coursework in Singapore 1 NTU is ranked #1 in the PRACTICAL KNOWLEDGE world for industry income Compulsory Internship & Dissertation and innovation* GLOBAL PROSPECTS 1 Internationally Recognized Degree TUM ranked #11 in the Global INTAKE Employability Survey^ August Every Year 11 # TO APPLY Both TUM & NTU Apply online from 1st November at are in the world’s www.tum-asia.edu.sg 50 Top 50 Universities Technische Universität München (TUM) Nanyang Technological University (NTU) Founded in 1868, Technische Universität München Inaugurated in 1991, Nanyang Technological University (TUM) has long established itself as a premier institute (NTU) has grown to become a full-fledged research of higher learning in Germany. TUM has produced university, and is ranked as one of the fastest-rising 13 Nobel Laureates and is ranked as Germany’s #1 Asian universities in the world’s top 50**. Hailing from University* for 3 consecutive years in the Shanghai more than 70 countries, NTU’s 3,800 strong teaching Rankings. Having earned itself the reputation of being and research staff contribute their dynamic an institute that produces world-changing technologies, perspectives and years of solid industry experience. TUM Asia was set up in 2002 to bring German excellence to Asia. NTU’s academic and research programmes, with real-world relevance, have reaped dividends in the Today, TUM Asia offers standalone and joint Bachelor form of strong support from major corporations and and Master programmes in Singapore together with industry leaders, in terms of both research funding our partner universities such as National University of and partnerships as well as global internship Singapore (NUS), Nanyang Technological University opportunities for our students. (NTU) and Singapore Institute of Technology (SIT). As the main Science and Technology university in Moving forward, TUM Asia strives to launch more Singapore, NTU has made substantial contributions Master and Bachelor programmes that continue to be to Singapore’s drive for research and innovation, industry-focused and in tune with the needs of the with the 2014 Quacquarelli Symonds (QS) ranking global economy. NTU at 10th in the World for Electrical & Electronic Engineering.

* As ranked in 2011, 2012 & 2013 Shanghai Rankings (Academic ** As rated by 2013/2014 QS World University Ranking Ranking of World Universities)

02 Technische Universität München Asia - TUM Asia Master of Science Integrated Circuit Design

The joint TUM-NTU Master of Science in Integrated JOINT DEGREE Circuit Design (MSc in ICD) equips students with Conferred by Technische Universität the academic proficiency and hands-on knowledge München (Germany) and Nanyang required in the design, development, and manufacture of integrated circuit or integrated electronic products. Technological University (Singapore)

3 SEMESTERS COURSE OUTLINE Full-time research and application focused programme, inclusive of The student has to complete 14 internship experience and Master modules in 2 semesters Dissertation writing (9 Core Modules, 4 Elective Modules, Cross Discipline Modules) 14 INDUSTRY RELEVANCE Our professors are actively involved in research and cooperation projects with leading industrial companies, allowing them to base the curriculum around Contact hours for every Core & the latest technological trends and 45 Elective Module knowledge GLOBAL OPPORTUNITIES You are able to complete your Technical Core Modules required to be Internship and Dissertation in Munich, completed by every student Singapore, or anywhere in the world, to 8 look for job opportunities globally Duration of the Programme: 20 months August 5 Months 6 Months 3 Months 6 Months Graduation

Arrival in • Business & • Core Internship Master End of Singapore Technical Modules Dissertation Programme English • Elective at NTU/TUM, • Core Modules a relevant Modules • Cross company, or • Lab Discipline research Modules Modules institute • Cross Discipline Modules

Technische Universität München Asia - TUM Asia 03 Module Sypnopsis Core Modules assembling, sealing and encapsulation. IC packaging failure Digital IC Design and reliability. Microsystems packaging and applications.

Review of integrated circuit fundamentals. Layout and design issues. CMOS digital circuits. BiCMOS digital circuits. IC Marketing/ Business/ Management Sub-system design in digital circuits. Design methodologies. Trends in the IC industry: technology and manufacturing trends, demand applications and product trends. Market Analog IC Design characteristics: the customers, business cycles, demand Review of fundamentals. Analog building blocks. Switched lead and supply lag (the bull-whip effect), IC industry, supply capacitor circuits. Current mode circuits. Continuous-Time and value chain, stakeholders, geographical distribution of filters. Data converters. excellence centers, technology centers, design centers, fabrication centers, the dis-integration of the value chain, System-on-Chip Solutions & outsourcing trends. Managing the marketing function: the The course addresses application-specific digital CMOS sources of product ideas, the role of standards, formats, and integrated circuits (ASICs) from a system’s perspective. intellectual property. Strategic partnership, distributorship, Covering multiple levels of abstraction from MOSFET , demand forecast, matching supply with demand. to realization of combinational / sequential logic, finite state machines (FSM), memory (SRAM, DRAM, FLASH), to chip- Advanced MOSEFT & Novel Devices interconnect technology (busses, network-on-chip (NoC)). Historical development of mainstream MOSFETs until today: Furthermore, the course complements the understanding of economical, technological and physical fundamentals. digital integrated circuit design by investigating the architectural Properties of long channel and short channel MOSFETs, high- composition of multiple real-world case studies taken from field effects, scaling rules. Basics of charge carrier transport, existing SoC products in the area of Internet networking. drift-diffusion, Boltzmann-Bloch equation, hydrodynamic We will investigate and compare generic RISC CPU platform transport, ballistics and consequences for IV-characteristics. with network processor units (NPUs), LAN/SAN Advanced MOSFETs, mobility-enhancement, metal-gate, (Local area / System area network) switches and SONET/SDH FinFETs, MuGFETs. Hot-electron and ballistic , transmission framers of wide area networks (WAN). Impact-MOSFETs, Spintronic devices. Tunneling-MOSFETs, single-electron transistors. Design Methodology & Automation Computer-aided design of integrated circuits. VLSI design Nano- flow overview: system level, algorithmic level, register transfer Low dimensional structures: quantum wells, quantum wires and level, logic level, and circuit level. Detailed discussion of quantum dots. Electronic, optical, transport properties of nano- VLSI especially for . Digital structures. Quantum semiconductor devices. Fabrication and simulation, hardware description language, test development characterization techniques of nanotechnology. Applications including design for testability. Techniques from discrete of nanostructures, nanodevices and nanosystems. The bottom- mathematics and computer science are explained and up approach to nanotechnology: introduction to molecular employed. electronics and optoelectronics. Organic materials for electronics: self-assembled monolayers, conducting polymers, Digital Signal Processing carbon nanotubes. Circuit implementations and architectures Introduction. Discrete Fourier transform (DFT) and fast Fourier for nanostructures: quantum cellular automata and cellular transform (FFT). Z transform. Digital filters. Linear prediction non-linear networks. Introduction to quantum . and optimum linear filters. Power spectrum estimation. Embedded Systems Mixed Signal Circuit Design Basics of processor architectures. Memory organization Fundamentals of discrete time signal processing. MOSFET and caches. Worst-Case Execution Time (WCET) Analysis. as a switch. Sample & hold circuits, switched capacitor Compositional Timing Analysis for embedded systems. circuits. Data converter fundamentals. Nyquist rate D/A and A/D Embedded software platforms and tools for host-target- converters. Over sampling, noise shaping, A/D and D/A development. Performance analysis of embedded systems converters using sigma-delta modulators. Switched capacitor and design exploration. Model-based design and code filters. generation. Formal verification and validation of embedded

systems. Real-Time Operating Systems. Power management Laboratory 1 Analog IC Design for embedded systems. Design of a wide-band amplifier from to layout verification. Simulation and Optimization of Analog Circuits Principles of circuit simulation: DC/AC/TR analysis. Basic Laboratory 2 Digital IC Design analog optimization tasks: worst-case analysis, yield analysis, Design, simulation, layout and synthesis of digital integrated nominal design, design centering. Basic principles of circuits & systems. optimization: optimality conditions, line search, Nelder-Mead method, Newton approach, Conjugate Gradient approach, Elective Modules (Choose 4) Quadratic Programming, Sequential Quadratic Programming. RF IC Design Structural analysis of analog circuits. System design considerations. CMOS RF components and devices. Low-noise amplifier (LNA), Mixers, Voltage-controlled Cross Discipline Modules oscillators (VCOs). RF power amplifiers. Phase-Locked Loops • Aspects of Asian and European Relations Today and Frequency Synthesizers. • Cultural, Social & Economical Aspects of Globalisation IC Packaging • International Intellectual Property Law Packaging overview. Electrical packaging design and thermal • Selected Topics in Business Administration management. Single chip, multichip and 3D packaging. IC • Selected Topics in Business Management

04 Technische Universität München Asia - TUM Asia Admissions Information

ADMISSION CRITERIA *

• Hold a minimum 3-year bachelor degree in Electrical, Electronics Engineering, or equivalent degree in other relevant disciplines • Submit two (2) copies of Official / Provisional Bachelor Degree Certificates and two (2) copies of Official or Provisional Academic Transcript (Documents must be a certified true copy or notarised / attested copy format) • Submit two (2) different recommendation letters from a Professor or an Employer • Submit one (1) letter of motivation that indicates the reason(s) you are interested in the programme • Submit one (1) Curriculum Vitae • Submit two (2) Passport size photographs and one (1) Passport Biodata Page copy (the page with your personal particulars) • TOEFL / IELTS (Required for applicants whose native tongue or medium of instruction from previous studies is not in English) • Akademische Prüfstelle (APS) certificate (Required for applicants who hold a degree from China, Vietnam, or Mongolia)

TOEFL: Minimum 605 for the Paper-Based test / 234 for the Computer-Based test / 88 for the Internet-Based Test IELTS: Overall IELTS results of at least 6.5

Important: Documents that are not in English must be translated by a certified translator * Find out about the full application process on www.tum-asia.edu.sg/application-process TO APPLY Applications open 1st November every year. Apply online at www.tum-asia.edu.sg

TUITION FEES APPLICATION FEE PAYMENT OF TUITION FEES

S$70 (inclusive of GST) A Total of SGD 34,240 * (Actual fee split into SGD and EURO) or Euro 45 is payable Tuition fees includes teaching fees, laboratory expenses and cost of for each application per mandatory events. Expenses excluded from this fee and to be borne programme by students include: airfare, accommodation, living expenses, and NTU miscellaneous fees, inclusive of registration, IT facilities, matriculation, examination, amenities, copy right, sports, insurance and medical. The tuition fee will be paid in 3 installments.

* Tution fees are accurate as of 1 September 2014. Tuition fees are subject to revision due to currency fluctuations, at the discretion of TUM Asia. Fees quoted are inclusive of 7% Singapore’s Government Goods & Services Tax. Please refer to www.tum-asia.edu.sg/MScfees for the latest tuition fees.

Campus of Nanyang Technological University (NTU) Studying With Us “Talents Are Our Assets, Reputation Is Our Return”

Entrepreneurial Thinking and Engagement Highest International Standards Globalization is now an inevitable force that is here to You will be studying with the world’s best professors stay. At TUM Asia, our classroom reflects this diversity from TUM and NTU, as well as experts from the industry. with an enrolment of over 28 nationalities. This means Not only will the student benefit from professors who are that we foster a vibrant learning environment where the actively involved in research, one will also receive a student learns not only from the textbook but also through holistic learning experience with the engagement of local the lives of their counterparts. Classroom ideas are lecturers from academia and industry. Our TUM modules synthesized across the diverse economic realities and are covered by professors who fly in from Germany on an students learn to see from multiple vantage points, exclusive teaching basis, to ensure that students get the creating a capacity to solve problems in creative ways. undivided attention of their lecturers. The unique 20 month joint degree equips the student with not only technical and scientific knowledge, but with an enriched curriculum composed of business and cultural modules.

Our students are not just learning TUM CREATE - Centre for Electromobility about Integrated Circuit Design. TUM is known for its research capabilities and strength in innovation. As such, TUM Asia spearheaded The joint TUM-NTU ICD Master the set up of TUM CREATE as a base of research in programme equips you to become Singapore. TUM Create is a joint programme between Technische Universität München (TUM) and Nanyang an excellent independent engineer Technological University (NTU). The electromobility for the rest of your professional institute brings together the expertise and innovation of Germany and Singapore, to drive innovation to shape life. We teach you to master the the future of sustainable mobility by tackling issues “ ranging from the molecues to the megacity. challenges! Graduates from the TUM Asia Master programmes have the opportunity to apply for positions at Dr. Helmut Graeb TUM Create, especially if your interest lies in research/ Professor at Technische Universität München, electromobility. Institute for Electronic Design Automation

06 Technische Universität München Asia - TUM Asia DID YOU KNOW THAT A PART OF YOUR GADGET - COMPUTER, MOBILE PHONE, TABLET OR VIDEO CONSOLE - WAS DESIGNED OR MANUFACTURED IN SINGAPORE?

Electronics: The Core of Today, Singapore accounts for 1 out of 10 wafer starts in the world Singapore’s Progress 1 Three of the world’s top six outsourced Since the 1960s, Singapore’s electronics industry semiconductor assembly and test companies are has been a major contributing sector to the nation’s located in Singapore manufacturing output. Over the years, the electronics 3 sector has continued to flourish and move up the 15 of the world’s top 25 fabless semiconductor manufacturing chain as companies started to pour into companies, and close to 40 integrated circuit higher-end functions such as Research & Development design centres are located in Singapore (R&D). Singapore aims to become a world class 15 innovation-driven electronics hub, providing technology, manufacturing and business solutions and enabling the Today, Singapore is home to approximately 20 development of new growth areas. 20 semiconductor assembly and test operations Electronics is the major industry underpinning The Semiconductor Industry in Singapore’s economic growth, it contributes Singapore 25 25% of the total manufacturing value-add 40% of the global hard disk manufactured in The global industry being dominated by USA, South Singapore Korea, Japan, Taiwan, Singapore, and European 40 Union. Every year, chip makers and dramatically increase the performance of their products while decreasing prices, making high-end technology goods increasingly productive and affordable for consumers. Singapore’s semiconductor industry has the The programme offered a module highest growth potential and is currently the fastest that was related to intellectual growing industry sector in the country. properties and invited a German

professional patent attorney to Our Graduates teach it. The module opened a new

Our graduates in Integrated Circuit Design are window for me and helped me to employed all over the world, such as in discover a career path that I was “ Singapore (77.6%), Europe (13.8%), India passionate about. (8.6%) “ Minghui Sun Alumni, Master of Science in Integrated Circit Specialist, SHUSAKU·YAMAMOTO The most commonly accepted positions are Integrated Circuit , Research Associate, Engineer, and PhD Researcher When I look at the MSc in ICD interns, I see highly motivated indviduals with a strong desire to learn and Our graduates are expected to have a high acquire new knowledge and skills. amount of job opportunities due to strong That mentality is very important in partnerships with the industry. Companies that we partner closely with include Infineon, this dynamic industry. Lantiq, and STMicroelectronics STMicroelectronics Asia Pacific Pte Ltd

Technische Universität München Asia - TUM Asia 07 German Institute of Science & Technology - TUM Asia 10 Central Exchange Green #03-01 Pixel Building Singapore 138649 Tel: +65 6777 7407 / +49 89 416 177428 Fax: +65 6777 7236 Email: [email protected] www.tum-asia.edu.sg

German Institute of Science & Technology - TUM Asia Pte Ltd CPE Registration No.: 200105229R CPE Registered Period: 13/06/2011 to 12/06/2017

All information is accurate at time of printing and subjected to change. Printed September 2014.

+ As rated by Academic Ranking of World Universities (Shanghai Ranking) 2011, 2012 and 2013 and 2012/2013 QS World University Ranking ++ As rated by Academic Ranking of World Universities (Shanghai Ranking) 2014 * As rated by the Times Higher Education University Ranking 2013/2014 ^ As ranked in the 2013 Global Employability Survey by The New York Times # As ranked by Academic Ranking of World Universities (Shanghai Ranking) 2013 and 2013/2014 QS World University Ranking