Industrial Design - Design Activities
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Electronic Circuit Design and Component Selecjon
Electronic circuit design and component selec2on Nan-Wei Gong MIT Media Lab MAS.S63: Design for DIY Manufacturing Goal for today’s lecture • How to pick up components for your project • Rule of thumb for PCB design • SuggesMons for PCB layout and manufacturing • Soldering and de-soldering basics • Small - medium quanMty electronics project producMon • Homework : Design a PCB for your project with a BOM (bill of materials) and esMmate the cost for making 10 | 50 |100 (PCB manufacturing + assembly + components) Design Process Component Test Circuit Selec2on PCB Design Component PCB Placement Manufacturing Design Process Module Test Circuit Selec2on PCB Design Component PCB Placement Manufacturing Design Process • Test circuit – bread boarding/ buy development tools (breakout boards) / simulaon • Component Selecon– spec / size / availability (inventory! Need 10% more parts for pick and place machine) • PCB Design– power/ground, signal traces, trace width, test points / extra via, pads / mount holes, big before small • PCB Manufacturing – price-Mme trade-off/ • Place Components – first step (check power/ground) -- work flow Test Circuit Construc2on Breadboard + through hole components + Breakout boards Breakout boards, surcoards + hookup wires Surcoard : surface-mount to through hole Dual in-line (DIP) packaging hap://www.beldynsys.com/cc521.htm Source : hap://en.wikipedia.org/wiki/File:Breadboard_counter.jpg Development Boards – good reference for circuit design and component selec2on SomeMmes, it can be cheaper to pair your design with a development -
Analog Integrated Circuit Design, 2Nd Edition
ffirs.fm Page iv Thursday, October 27, 2011 11:41 AM ffirs.fm Page i Thursday, October 27, 2011 11:41 AM ANALOG INTEGRATED CIRCUIT DESIGN Tony Chan Carusone David A. Johns Kenneth W. Martin John Wiley & Sons, Inc. ffirs.fm Page ii Thursday, October 27, 2011 11:41 AM VP and Publisher Don Fowley Associate Publisher Dan Sayre Editorial Assistant Charlotte Cerf Senior Marketing Manager Christopher Ruel Senior Production Manager Janis Soo Senior Production Editor Joyce Poh This book was set in 9.5/11.5 Times New Roman PSMT by MPS Limited, a Macmillan Company, and printed and bound by RRD Von Hoffman. The cover was printed by RRD Von Hoffman. This book is printed on acid free paper. Founded in 1807, John Wiley & Sons, Inc. has been a valued source of knowledge and understanding for more than 200 years, helping people around the world meet their needs and fulfill their aspirations. Our company is built on a foundation of principles that include responsibility to the communities we serve and where we live and work. In 2008, we launched a Corporate Citizenship Initiative, a global effort to address the environmental, social, economic, and ethical challenges we face in our business. Among the issues we are addressing are carbon impact, paper specifications and procurement, ethical conduct within our business and among our vendors, and community and charitable support. For more information, please visit our website: www.wiley.com/go/citizenship. Copyright © 2012 John Wiley & Sons, Inc. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted in any form or by any means, electronic, mechanical, photocopying, recording, scanning or otherwise, except as permitted under Sections 107 or 108 of the 1976 United States Copyright Act, without either the prior written permission of the Publisher, or authorization through payment of the appropriate per-copy fee to the Copyright Clearance Center, Inc. -
A General CAD Concept and Design Framework Architecture for Integrated Microsystems^
Transactions on the Built Environment vol 12, © 1995 WIT Press, www.witpress.com, ISSN 1743-3509 A general CAD concept and design framework architecture for integrated microsystems^ A. Poppe," J.M. Kararn,*) K. Hoffmann," M. Rencz/ B. Courtois,^ M. Glesner/V. Szekely" "Technical University of Budapest, Department of Electron Devices, H-1521 Budapest, Hungary *77M4/77MC, 46 av. F ^bZ/eA F-J&OJ7 GrgMo6/g Ce^x, France *THDarmstadt, Institute of Microelectronic Systems, D-64283 Darmstadt, Germany Abstract Besides foundry facilities, CAD-tools are also required to move microsystems from research prototypes to an industrial market. CAD tools of microelectronics have been developed for more than 20 years, both in the field of circuit design tools and in the area of TCAD tools. Usually a microelectronics engineer is involved only in one side of the design: either he deals with application design or he is par- ticipating in the manufacturing design, but not in both. This is one point that is to be followed in case of microsystem design, if higher level of design productivity is expected. Another point is that certain standards should also be established in case of microsystem design too: based on selected technologies a set of stan- dard components should be pre-designed and collected in a standard component library. This component library should be available from within microsystem de- sign frameworks which might be well established by a proper configuration and extension of existing 1C design frameworks. A very important point is the devel- opment of proper simulation models of microsystem components that are based on e.g. -
Circuit System Design Cards: a System Design Methodology for Circuits Courses Based on Thévenin Equivalents Neil E
Circuit System Design Cards: a system design methodology for circuits courses based on Thévenin equivalents Neil E. Cotter, Member, IEEE, and Cynthia Furse, Fellow, IEEE Abstract—The Circuit System Design cards described here signal being processed in the system design is the Thévenin allow students to design complete circuits with sensors and op- equivalent voltage rather than the circuit output voltage per se. amps by laying down a sequence of cards. The cards teach Furthermore, the Thévenin equivalent may be extended from students several important concepts: system design, Thevénin one card to the next, moving left-to-right, with pre-calculated equivalents, input/output resistance, and op-amp formulas. formulas. Students may design circuits by viewing them as combinations of system building blocks portrayed on one side of the cards. The This paper discusses how the cards are used and the theory other side of each card shows a circuit schematic for the building on which they are based. The next section discusses one card block. Thevénin equivalents are the crucial ingredient in tying in detail, and the following section discusses a two-card the circuits to the building blocks and vice versa. system. The final sections catalog the symbols incorporated on the cards and the entire set of card images. Index Terms—Linear, circuit, system design, cards, Thevénin equivalent II ONE-CARD EXAMPLE I INTRODUCTION One side of each CSD card shows a system view of how the card processes its input signal. Fig. 1(a) shows the system HE deck of 32 Circuit System Design (CSD) cards allows side of the Voltage Reference card that produces an output users to design complete circuits by laying down cards in T voltage, v , from a power supply voltage, V . -
Design for Manufacturability and Reliability in Extreme-Scaling VLSI
SCIENCE CHINA Information Sciences . REVIEW . June 2016, Vol. 59 061406:1–061406:23 Special Focus on Advanced Microelectronics Technology doi: 10.1007/s11432-016-5560-6 Design for manufacturability and reliability in extreme-scaling VLSI Bei YU1,2 , Xiaoqing XU2 , Subhendu ROY2,3 ,YiboLIN2, Jiaojiao OU2 &DavidZ.PAN2 * 1CSE Department, The Chinese University of Hong Kong, NT Hong Kong, China; 2ECE Department, University of Texas at Austin, Austin, TX 78712,USA; 3Cadence Design Systems, Inc., San Jose, CA 95134,USA Received December 14, 2015; accepted January 18, 2016; published online May 6, 2016 Abstract In the last five decades, the number of transistors on a chip has increased exponentially in accordance with the Moore’s law, and the semiconductor industry has followed this law as long-term planning and targeting for research and development. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. In this paper, we will discuss some key process technology and VLSI design co-optimization issues in nanometer VLSI. Keywords design for manufacturability, design for reliability, VLSI CAD Citation Yu B, Xu X Q, Roy S, et al. Design for manufacturability and reliability in extreme-scaling VLSI. Sci China Inf Sci, 2016, 59(6): 061406, doi: 10.1007/s11432-016-5560-6 1 Introduction Moore’s law, which is named after Intel co-founder Gordon Moore, predicts that the density of transistor on integrated circuits (ICs) roughly doubles every two years. -
Designing Digital Circuits a Modern Approach
Designing Digital Circuits a modern approach Jonathan Turner 2 Contents I First Half 5 1 Introduction to Designing Digital Circuits 7 1.1 Getting Started . .7 1.2 Gates and Flip Flops . .9 1.3 How are Digital Circuits Designed? . 10 1.4 Programmable Processors . 12 1.5 Prototyping Digital Circuits . 15 2 First Steps 17 2.1 A Simple Binary Calculator . 17 2.2 Representing Numbers in Digital Circuits . 21 2.3 Logic Equations and Circuits . 24 3 Designing Combinational Circuits With VHDL 33 3.1 The entity and architecture . 34 3.2 Signal Assignments . 39 3.3 Processes and if-then-else . 43 4 Computer-Aided Design 51 4.1 Overview of CAD Design Flow . 51 4.2 Starting a New Project . 54 4.3 Simulating a Circuit Module . 61 4.4 Preparing to Test on a Prototype Board . 66 4.5 Simulating the Prototype Circuit . 69 3 4 CONTENTS 4.6 Testing the Prototype Circuit . 70 5 More VHDL Language Features 77 5.1 Symbolic constants . 78 5.2 For and case statements . 81 5.3 Synchronous and Asynchronous Assignments . 86 5.4 Structural VHDL . 89 6 Building Blocks of Digital Circuits 93 6.1 Logic Gates as Electronic Components . 93 6.2 Storage Elements . 98 6.3 Larger Building Blocks . 100 6.4 Lookup Tables and FPGAs . 105 7 Sequential Circuits 109 7.1 A Fair Arbiter Circuit . 110 7.2 Garage Door Opener . 118 8 State Machines with Data 127 8.1 Pulse Counter . 127 8.2 Debouncer . 134 8.3 Knob Interface . 137 8.4 Two Speed Garage Door Opener . -
Integrated Circuit Design Macmillan New Electronics Series Series Editor: Paul A
Integrated Circuit Design Macmillan New Electronics Series Series Editor: Paul A. Lynn Paul A. Lynn, Radar Systems A. F. Murray and H. M. Reekie, Integrated Circuit Design Integrated Circuit Design Alan F. Murray and H. Martin Reekie Department of' Electrical Engineering Edinhurgh Unit·ersity Macmillan New Electronics Introductions to Advanced Topics M MACMILLAN EDUCATION ©Alan F. Murray and H. Martin Reekie 1987 All rights reserved. No reproduction, copy or transmission of this publication may be made without written permission. No paragraph of this publication may be reproduced, copied or transmitted save with written permission or in accordance with the provisions of the Copyright Act 1956 (as amended), or under the terms of any licence permitting limited copying issued by the Copyright Licensing Agency, 7 Ridgmount Street, London WC1E 7AE. Any person who does any unauthorised act in relation to this publication may be liable to criminal prosecution and civil claims for damages. First published 1987 Published by MACMILLAN EDUCATION LTD Houndmills, Basingstoke, Hampshire RG21 2XS and London Companies and representatives throughout the world British Library Cataloguing in Publication Data Murray, A. F. Integrated circuit design.-(Macmillan new electronics series). 1. Integrated circuits-Design and construction I. Title II. Reekie, H. M. 621.381'73 TK7874 ISBN 978-0-333-43799-5 ISBN 978-1-349-18758-4 (eBook) DOI 10.1007/978-1-349-18758-4 To Glynis and Christa Contents Series Editor's Foreword xi Preface xii Section I 1 General Introduction -
How to Solder Electronics 15 Rules for Successful Soldering
How to Solder Electronics 15 Rules for Successful Soldering i www.sra-solder.com How to Solder Electronics 15 Rules for Successful Soldering Written and published by SRA Soldering Products www.sra-solder.com How to Solder Electronics: 15 Rules for Successful Soldering Written and Published by SRA Soldering Products 24 Walpole Park South, Suite #10, Walpole, MA 02081 www.sra-solder.com © 2020 SRA Soldering Products All rights reserved. No portion of this book may be reproduced in any form without permission from the publisher, except as permitted by U.S. copyright law. For permissions contact: [email protected] ISBN: 9798656683746 iii www.sra-solder.com Contents Introduction .......................................................................................viii Rule #1 – Know the Fundamentals ��������������������������������������������1 What is Flux? ......................................................................................1 What is Solder? ...................................................................................1 What is Wetting? ���������������������������������������������������������������������������������2 Methods of Heat Transfer ....................................................................3 The Difference Between Soldering, Brazing, and Welding .................4 When Do I Need to Solder? ����������������������������������������������������������������6 Rule #2 – Identify the Construction Method �����������������������������8 Breadboards and Learning Labs .........................................................8 -
(DFM) Tips for Miniature Biomedical Sensor Circuits
TECHNICAL BRIEF VOLUME 4 - DFM Tips for Miniature Biomedical Sensor Circuits Design-for-Manufacturability (DFM) Tips for Miniature Biomedical Sensor Circuits Introduction Advanced foundry processes have enabled a new age of sensor circuit engineering, and designers in many fields from RF communications, embedded vision systems, and medical devices, are actively exploring new ways to employ them. One such foundry process, micron-level thin film technology, is becoming especially intriguing to designers of biomedical sensors. Thin-film circuits can be applied to flexible polyimide substrates making them capable of being bent and shaped considerably without impact on circuit performance or reliability. As such, the combination of flexible material and thin-film circuit geometries is leading medical designers to consider how far they can go in an attempt to enhance their sensors for ad- vanced procedures, and improved patient care. TECHNICAL BRIEF DESIGN-FOR-MANUFACTURABILITY (DFM) TIPS FOR MINIATURE BIOMEDICAL SENSOR CIRCUITS For medical designers pivoting from one scale to another, however, there is often an immediate challenge of resolving their engineering ideas using dramatically less real estate. Many come from companies whose devices have been traditionally limited by the line and spacing constraints of single layer thick-film or tradi- tional flex circuit design on Kapton (which typically stops at around 2 mils). Considering that micron-scale thin film allows for a reduction in lines and spaces by over 100%, and also allows for multilayer techniques, a certain amount of education is required for designs to be production-ready. This Tech Brief aims to outline the top 7 considerations biosensor circuit designers should pay close atten- tion to early in the earliest stages of prototype development. -
PCB Manufacturability for Smarties
Solving Problems Before They Occur: Manufacturability for Smarties How to avoid common manufacturing pitfalls that can cause delay, create cost overruns, and impact quality. Despite their best efforts, even experienced makers run into trouble and need help with the transition from PCB design to manufacture. We see manufacturability issues every day—issues that can impact board performance, hinder integration with the final product, or even render the PCB nonfunctional. While pitfalls can often be avoided by adhering to the measure twice, cut once rule, potential trouble can be difficult to detect even if you’re an expert. This paper offers strategies for ensuring your design will result in a smooth manufacturing process and produce quality boards. Designing for manufacturability is still critically important. The PCB world continues to be a dynamic place with broader manufacturing industry trends constantly creating new challenges for makers and generalist PCB designers. Board complexity continues to increase due to the density and performance capabilities of current and next-generation processes and materials. Page 1 Designing for manufacturability (DFM) has therefore never been more important. It’s how you avoid cost overruns and reworks, as well as improve the quality of both your boards and the final product. Here, we focus on best practices in these key ares to Choosing the ensure manufacturability: tools, process, and partner. right interactive design tool Tools matters. DFM is a methodology Choosing the right interactive design tool matters. DFM is a methodology that that considers, considers, along with yield, any issue that could affect cost and quality before the along with yield, manufacturing process begins. -
CAD: Computer-Aided Design Tools
Computer-Aided Design Tools CAD–1 CAD: Computer-Aided Design Tools “If it wasn’t hard, they wouldn’t call it hardware.” Many digital designers with twenty years of experience consider this state- ment to be indisputable. Yet more and more, digital design is being carried out using software, and it’s getting easier as a result. The terms computer-aided design (CAD) and computer-aided engineering (CAE) are used to refer to software tools that aid the development of circuits, systems, and many other things. “CAD” is the more general term and applies to tools both inside and outside the electronics area, including architectural and mechanical design tools, for example. Within electronics, “CAD” often refers to physical-design tools, such as IC- and PCB-layout programs. “CAE” is used more often to refer to conceptual-design tools, such as schematic editors, circuit simulators, and HDL compilers. However, a lot of people in electronics (includ- ing the author) tend to use the two terms interchangeably. In this section, we’ll discuss some CAD/CAE tools used by digital designers. IS HARDWARE Since more and more hardware design and debugging is being carried out using NOW software tools, is it really getting easier? Not necessarily. EASY-WARE? In the author’s experience, the increasing use of CAD means that instead of spending time fighting with soldering irons and test clips, many designers can now spend their time fighting buggy programs running in a buggy software environment. CAD.1 Hardware Description Languages In previous decades, most logic design was performed graphically, using block diagrams and schematics. -
Surface Mount Technology in the Educational Environment
Electronics Technical Sameul Ginsberg Surface mount technology in the educational environment by Samuel Ginsberg, University of Cape Town The consumer-driven demand for electronic devices to become smaller, lighter and more functional has been driving electronic components into ever smaller packages. The early development of integrated circuits mount technology (SMT) has brought great This article proposes a shift in thinking and focused on increasing the number of transistors variation in the physical size and shape of suggests methods of implementing that shift. per package, leading to very large scale devices and is commonly believed to require The shift in thinking is that SMT must be embraced integration (VLSI) devices but in the last few great skill in handling because of the smallness wholeheartedly by educators, an investment in decades the limitations of traditional through- of the connections that it requires. equipment and skills must be made and the full hole integrated circuit packaging have SMT has been seen as unfriendly in the benefits of this technology reaped. become clear and industry has moved steadily educational environment since it became The differences between educational and away from this cumbersome but easily-handled available. Educators actively avoid the use of production environments technology. Educational institutions have been surface mount devices (SMDs) in their teaching slow to follow this trend and now face increasing work and some educational institutions actively SMT is well accepted in commercial products, limitations in the variety of usable devices. avoid stocking SMDs in their component stores. and many designers prefer to use SMDs even when more traditional packaging is Some of the advantages of through-hole The problem with this approach is that in available.