DOCSLIB.ORG

Design-Build Package

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Design-Build Package -- STATE OF NORTH CAROLINA-- DEPARTMENT OF TRANSPORTATION RALEIGH, N.C. DESIGN-BUILD PACKAGE FINAL RFP February 7, 2005 VOID FOR BIDDING DATE AND TIME OF TECHNICAL AND PRICE PROPOSAL SUBMISSION: March 22, 2005 AT 4:00 PM DATE AND TIME OF PRICE PROPOSAL OPENING: April 14, 2005 AT 10:00 AM CONTRACT ID: C 201277 MILES: 1.61 WBS ELEMENT NO. 34233.2.1 FEDERAL-AID NO. NHIMF-40-1 (142) 46 COUNTY: BUNCOMBE ROUTE NO. I-40 T.I.P. NO. I-4401 LOCATION: I-40 FROM WEST OF SR 1224 (MONTE VISTA ROAD) TO I-240 IN ASHEVILLE TYPE OF WORK: DESIGN-BUILD AS SPECIFIED IN THE SCOPE OF WORK CONTAINED IN THE DESIGN-BUILD PACKAGE NOTICE: ALL PROPOSERS SHALL COMPLY WITH ALL APPLICABLE LAWS REGULATING THE PRACTICE OF GENERAL CONTRACTING AS CONTAINED IN CHAPTER 87 OF THE GENERAL STATUTES OF NORTH CAROLINA WHICH REQUIRES THE PROPOSER TO BE LICENSED BY THE N.C. LICENSING BOARD FOR CONTRACTORS WHEN BIDDING ON ANY NON-FEDERAL AID PROJECT WHERE THE BID IS $30,000 OR MORE, EXCEPT FOR CERTAIN SPECIALTY WORK AS DETERMINED BY THE LICENSING BOARD. PROPOSERS SHALL ALSO COMPLY WITH ALL OTHER APPLICABLE LAWS REGULATING THE PRACTICES OF ELECTRICAL, PLUMBING, HEATING AND AIR CONDITIONING AND REFRIGERATION CONTRACTING AS CONTAINED IN CHAPTER 87 OF THE GENERAL STATUTES OF NORTH CAROLINA. ___________ 5% BID BOND OR BID DEPOSIT REQUIRED ___________ PROPOSAL FORM FOR THE CONSTRUCTION OF CONTRACT NO. C201277 IN BUNCOMBE COUNTY, NORTH CAROLINA Date_________________________ 20_________ DEPARTMENT OF TRANSPORTATION, RALEIGH, NORTH CAROLINA The Design Build Team has carefully examined the location of the proposed work to be known as Contract No. C201277; has carefully examined the plans and specifications, which are acknowledged to be part of the proposal, the special provisions, the Design-Build Package, the form of contract, and the forms of contract payment bond and contract performance bond; and thoroughly understands the stipulations, requirements and provisions. The undersigned Design Build Team agrees to bound upon his execution of the proposal and subsequent award to him by the Board of Transportation in accordance with this proposal to provide the necessary contract payment bond and contract performance bond within fourteen calendar days after the written notice of award is received by him. The undersigned Design Build Team further agrees to provide all design services and all necessary machinery, tools, labor, and other means of construction; and to do all the work and to furnish all materials, except as otherwise noted, necessary to perform and complete the said contract in accordance with the 2002 Standard Specifications for Roads and Structures by no later than the dates(s) specified in the Design Build Package and in accordance with the requirements of the Engineer, and at the lump sum price(s) for the various items given on the sheets contained herein. The Design-Build Team shall provide a Technical Proposal, a Price Proposal and furnish all the materials, machinery, implements, appliances and tools, and perform the work and required labor to design construct and complete State Highway Contract No. C201277 in Buncombe County, for the lump sum price(s) bid by the Design Build Team in his Price Proposal and according to the proposal, plans, and specifications prepared by said Department and/or Design Build Team, which proposal, plans, and specifications show the details covering this project, and hereby become a part of this contract. C201277 (I-4401) Buncombe County The published volume entitled North Carolina Department of Transportation, Raleigh, Standard Specifications for Roads and Structures, JANUARY 2002 with all amendments and supplements thereto, is by reference, incorporated into and made a part of this contract; that, except as herein modified, all the Construction and work included in this contract is to be done in accordance with the specifications contained in said volume, and amendments and supplements thereto, under the direction of the Engineer. All design manuals, policy and procedures manuals, and AASHTO publications and guidelines referenced in the Request For Proposal, are by reference, incorporated and made part of this contract. If the proposal is accepted and the award is made, the technical proposal submitted by the proposer is by reference, incorporated and made part of this contract. The contract is valid only when signed either by the Contract Officer or such other person as may be designated by the Secretary to sign for the Department of Transportation. The conditions and provisions herein cannot be changed except by written approval as allowed by the Request For Proposal. Accompanying this Proposal is a bid bond secured by a corporate surety, or certified check payable to the order of the Department of Transportation, for five percent of the total bid price, which deposit is to be forfeited as liquidated damages in case this bid is accepted and the Design-Build Team shall fail to provide the required payment and performance bonds with the Department of Transportation, under the condition of this proposal, within 14 calendar days after the written notice of award is received by him, as provided in the Standard Specifications; otherwise said deposit will be returned to the Design Build Team. State Alternative Delivery State Contract Officer Systems Engineer C 201277 (I-4401) Buncombe County TABLE OF CONTENTS COVER SHEET PROPOSAL SHEETS PROJECT SPECIAL PROVISIONS (GREEN SHEETS) PAGE NO. Contract Time and Liquidated Damages………………………………………. 1 Other Liquidated Damages and Incentives.…………………………………….1-2 Workspace for Department Staff………………………………………………. 2 Progress Schedule……………………………………………………………… 2-6 Partnering……………………………………………………………………….6-7 Execution of Signature Sheets and Debarment Certification………………….. 7 Submission of Design-Build Proposals………………………………………... 7-8 Confidential Questions………………………………………………………… 8 Value Analysis………………………………………………………………… 8-9 Schedule of Estimated Completion Progress………………………………….. 9 Disadvantaged Business Enterprise…………….……………………………... 9-18 Certification for Federal-Aid Projects…….…………………………………... 18-19 Contractor’s License Requirements.…………………………………………... 19 Domestic Steel and Iron Products………………………………………….….. 19-20 U. S. Department of Transportation Hotline…………………………………... 20 Submission of Records – Federal-Aid Projects………………………………... 20 Design Build Team Borrow Source….………………………………………... 20-21 Subsurface Information………………………………………………….…….. 21 Training Requirements………………………………………………………… 21 Safety Vests……………………………………………………………………. 22 Bid Documentation…………………………………………………………….. 22-25 Twelve Month Guarantee……………………………………………………… 25 Crane Safety…………………………………………………………………… 25-26 Clearing and Grubbing………………………………………………………… 26 Price Adjustments for Asphalt Binder………………………………………… 27 Price Adjustments Asphalt Concrete Plant Mix………………………….…… 27 GENERAL (GREEN SHEETS) ……………..…………………………………. 28-39 SCOPES OF WORK (GREEN SHEETS) Roadway Design………………………………………………………………. 40-44 Pavement Management Design…………………………………….………….. 45-46 Structure Design…………………………………………….…………………. 47-50 Geotechnical Engineering………………………………………………………51-58 Hydraulics Design……………………………………………………….…….. 59 Lighting……………………………….………………………………………...60-63 Signing………………………………….……………………………………… 64-69 Traffic Control…………………………………………………………………. 70-85 Utilities Coordination……………………………………………..…………… 86-90 Traffic Management and Signal Systems..……………………………..……… 91-95 C 201277 (I-4401) Buncombe County Intelligent Transportation Systems…………………………………………….. 96-142 Right of Way……………………………………………………………………143-144 Construction Engineering & Inspection……………………………………….. 145-149 Erosion and Sedimentation Control…………………………………………… 150-152 Railroad Coordination…………………..………………………………………153-154 Environmental Permits………………………………………………………….155-158 STANDARD SPECIAL PROVISIONS (YELLOW SHEETS) Retainage and Prompt Payment………………………………………………...159 Borrow and Waste Site Reclamation Procedures……………………………… 160 Plant Pest Quarantine………………………………………………………….. 160-161 Borrow Excavation (Excavation of Wetlands)…..…………………………….. 161 Reinforced Bridge Approach Fills……………………………………………...161-163 Preparation of Base and Subbase……………………………………………….163-164 Aggregate Base Course Gradation And Plasticity Index……………………….164 Asphalt Pavements- Superpave………………………………………………... 164-179 Asphalt Binder Content of Asphalt Plant Mixes………………………………. 179-180 Final surface Testing – Asphalt Pavements ……………………………………180-183 Disposal of Waste and Debris…………………………………………………. 183 Guardrail Posts and Offset Blocks…………………………………………….. 183-185 Street Signs and Markers and Route Markers…………………………………. 185 Aggregate Production………………………………………………………….. 185 Concrete Brick and Block Production.………………………………………… 186 Fine Aggregate………………………………………………………………… 187 Borrow Material……………………………………………………………….. 187 Traffic Control-Retroreflective Sheeting……………………………………… 187-189 Drums …………………………………………………………………………. 190 Portable Concrete Barrier……………………………………………………… 190 Work Zone Signs………………………………………………………………. 191-192 Barricades……………………………………………………………………… 192-193 Pavement Marking General Requirements……………………………………. 193 Coordination of Lighting Work..……………………………………………… 193 Availability of Funds – Termination of Contracts…………………………….. 194 General Seed Specification for Seed Quality …………………………………. 195-197 Errata…………………………………………………………………………... 198-199 Award of Contract…………………………………………………………….. 200 Minority and Female Employment Requirements..…………………………….201-203 Required Contract Provisions Federal-Aid Construction Contracts..…………. 204-212 Training Special Provisions……………………………………………………
Load more

Recommended publications
  • Electronic Circuit Design and Component Selecjon
    Electronic circuit design and component selec2on Nan-Wei Gong MIT Media Lab MAS.S63: Design for DIY Manufacturing Goal for today’s lecture • How to pick up components for your project • Rule of thumb for PCB design • SuggesMons for PCB layout and manufacturing • Soldering and de-soldering basics • Small - medium quanMty electronics project producMon • Homework : Design a PCB for your project with a BOM (bill of materials) and esMmate the cost for making 10 | 50 |100 (PCB manufacturing + assembly + components) Design Process Component Test Circuit Selec2on PCB Design Component PCB Placement Manufacturing Design Process Module Test Circuit Selec2on PCB Design Component PCB Placement Manufacturing Design Process • Test circuit – bread boarding/ buy development tools (breakout boards) / simulaon • Component Selecon– spec / size / availability (inventory! Need 10% more parts for pick and place machine) • PCB Design– power/ground, signal traces, trace width, test points / extra via, pads / mount holes, big before small • PCB Manufacturing – price-Mme trade-off/ • Place Components – first step (check power/ground) -- work flow Test Circuit Construc2on Breadboard + through hole components + Breakout boards Breakout boards, surcoards + hookup wires Surcoard : surface-mount to through hole Dual in-line (DIP) packaging hap://www.beldynsys.com/cc521.htm Source : hap://en.wikipedia.org/wiki/File:Breadboard_counter.jpg Development Boards – good reference for circuit design and component selec2on SomeMmes, it can be cheaper to pair your design with a development
    [Show full text]
  • Analog Integrated Circuit Design, 2Nd Edition
    ffirs.fm Page iv Thursday, October 27, 2011 11:41 AM ffirs.fm Page i Thursday, October 27, 2011 11:41 AM ANALOG INTEGRATED CIRCUIT DESIGN Tony Chan Carusone David A. Johns Kenneth W. Martin John Wiley & Sons, Inc. ffirs.fm Page ii Thursday, October 27, 2011 11:41 AM VP and Publisher Don Fowley Associate Publisher Dan Sayre Editorial Assistant Charlotte Cerf Senior Marketing Manager Christopher Ruel Senior Production Manager Janis Soo Senior Production Editor Joyce Poh This book was set in 9.5/11.5 Times New Roman PSMT by MPS Limited, a Macmillan Company, and printed and bound by RRD Von Hoffman. The cover was printed by RRD Von Hoffman. This book is printed on acid free paper. Founded in 1807, John Wiley & Sons, Inc. has been a valued source of knowledge and understanding for more than 200 years, helping people around the world meet their needs and fulfill their aspirations. Our company is built on a foundation of principles that include responsibility to the communities we serve and where we live and work. In 2008, we launched a Corporate Citizenship Initiative, a global effort to address the environmental, social, economic, and ethical challenges we face in our business. Among the issues we are addressing are carbon impact, paper specifications and procurement, ethical conduct within our business and among our vendors, and community and charitable support. For more information, please visit our website: www.wiley.com/go/citizenship. Copyright © 2012 John Wiley & Sons, Inc. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted in any form or by any means, electronic, mechanical, photocopying, recording, scanning or otherwise, except as permitted under Sections 107 or 108 of the 1976 United States Copyright Act, without either the prior written permission of the Publisher, or authorization through payment of the appropriate per-copy fee to the Copyright Clearance Center, Inc.
    [Show full text]
  • A General CAD Concept and Design Framework Architecture for Integrated Microsystems^
    Transactions on the Built Environment vol 12, © 1995 WIT Press, www.witpress.com, ISSN 1743-3509 A general CAD concept and design framework architecture for integrated microsystems^ A. Poppe," J.M. Kararn,*) K. Hoffmann," M. Rencz/ B. Courtois,^ M. Glesner/V. Szekely" "Technical University of Budapest, Department of Electron Devices, H-1521 Budapest, Hungary *77M4/77MC, 46 av. F ^bZ/eA F-J&OJ7 GrgMo6/g Ce^x, France *THDarmstadt, Institute of Microelectronic Systems, D-64283 Darmstadt, Germany Abstract Besides foundry facilities, CAD-tools are also required to move microsystems from research prototypes to an industrial market. CAD tools of microelectronics have been developed for more than 20 years, both in the field of circuit design tools and in the area of TCAD tools. Usually a microelectronics engineer is involved only in one side of the design: either he deals with application design or he is par- ticipating in the manufacturing design, but not in both. This is one point that is to be followed in case of microsystem design, if higher level of design productivity is expected. Another point is that certain standards should also be established in case of microsystem design too: based on selected technologies a set of stan- dard components should be pre-designed and collected in a standard component library. This component library should be available from within microsystem de- sign frameworks which might be well established by a proper configuration and extension of existing 1C design frameworks. A very important point is the devel- opment of proper simulation models of microsystem components that are based on e.g.
    [Show full text]
  • Circuit System Design Cards: a System Design Methodology for Circuits Courses Based on Thévenin Equivalents Neil E
    Circuit System Design Cards: a system design methodology for circuits courses based on Thévenin equivalents Neil E. Cotter, Member, IEEE, and Cynthia Furse, Fellow, IEEE Abstract—The Circuit System Design cards described here signal being processed in the system design is the Thévenin allow students to design complete circuits with sensors and op- equivalent voltage rather than the circuit output voltage per se. amps by laying down a sequence of cards. The cards teach Furthermore, the Thévenin equivalent may be extended from students several important concepts: system design, Thevénin one card to the next, moving left-to-right, with pre-calculated equivalents, input/output resistance, and op-amp formulas. formulas. Students may design circuits by viewing them as combinations of system building blocks portrayed on one side of the cards. The This paper discusses how the cards are used and the theory other side of each card shows a circuit schematic for the building on which they are based. The next section discusses one card block. Thevénin equivalents are the crucial ingredient in tying in detail, and the following section discusses a two-card the circuits to the building blocks and vice versa. system. The final sections catalog the symbols incorporated on the cards and the entire set of card images. Index Terms—Linear, circuit, system design, cards, Thevénin equivalent II ONE-CARD EXAMPLE I INTRODUCTION One side of each CSD card shows a system view of how the card processes its input signal. Fig. 1(a) shows the system HE deck of 32 Circuit System Design (CSD) cards allows side of the Voltage Reference card that produces an output users to design complete circuits by laying down cards in T voltage, v , from a power supply voltage, V .
    [Show full text]
  • Design for Manufacturability and Reliability in Extreme-Scaling VLSI
    SCIENCE CHINA Information Sciences . REVIEW . June 2016, Vol. 59 061406:1–061406:23 Special Focus on Advanced Microelectronics Technology doi: 10.1007/s11432-016-5560-6 Design for manufacturability and reliability in extreme-scaling VLSI Bei YU1,2 , Xiaoqing XU2 , Subhendu ROY2,3 ,YiboLIN2, Jiaojiao OU2 &DavidZ.PAN2 * 1CSE Department, The Chinese University of Hong Kong, NT Hong Kong, China; 2ECE Department, University of Texas at Austin, Austin, TX 78712,USA; 3Cadence Design Systems, Inc., San Jose, CA 95134,USA Received December 14, 2015; accepted January 18, 2016; published online May 6, 2016 Abstract In the last five decades, the number of transistors on a chip has increased exponentially in accordance with the Moore’s law, and the semiconductor industry has followed this law as long-term planning and targeting for research and development. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. In this paper, we will discuss some key process technology and VLSI design co-optimization issues in nanometer VLSI. Keywords design for manufacturability, design for reliability, VLSI CAD Citation Yu B, Xu X Q, Roy S, et al. Design for manufacturability and reliability in extreme-scaling VLSI. Sci China Inf Sci, 2016, 59(6): 061406, doi: 10.1007/s11432-016-5560-6 1 Introduction Moore’s law, which is named after Intel co-founder Gordon Moore, predicts that the density of transistor on integrated circuits (ICs) roughly doubles every two years.
    [Show full text]
  • Designing Digital Circuits a Modern Approach
    Designing Digital Circuits a modern approach Jonathan Turner 2 Contents I First Half 5 1 Introduction to Designing Digital Circuits 7 1.1 Getting Started . .7 1.2 Gates and Flip Flops . .9 1.3 How are Digital Circuits Designed? . 10 1.4 Programmable Processors . 12 1.5 Prototyping Digital Circuits . 15 2 First Steps 17 2.1 A Simple Binary Calculator . 17 2.2 Representing Numbers in Digital Circuits . 21 2.3 Logic Equations and Circuits . 24 3 Designing Combinational Circuits With VHDL 33 3.1 The entity and architecture . 34 3.2 Signal Assignments . 39 3.3 Processes and if-then-else . 43 4 Computer-Aided Design 51 4.1 Overview of CAD Design Flow . 51 4.2 Starting a New Project . 54 4.3 Simulating a Circuit Module . 61 4.4 Preparing to Test on a Prototype Board . 66 4.5 Simulating the Prototype Circuit . 69 3 4 CONTENTS 4.6 Testing the Prototype Circuit . 70 5 More VHDL Language Features 77 5.1 Symbolic constants . 78 5.2 For and case statements . 81 5.3 Synchronous and Asynchronous Assignments . 86 5.4 Structural VHDL . 89 6 Building Blocks of Digital Circuits 93 6.1 Logic Gates as Electronic Components . 93 6.2 Storage Elements . 98 6.3 Larger Building Blocks . 100 6.4 Lookup Tables and FPGAs . 105 7 Sequential Circuits 109 7.1 A Fair Arbiter Circuit . 110 7.2 Garage Door Opener . 118 8 State Machines with Data 127 8.1 Pulse Counter . 127 8.2 Debouncer . 134 8.3 Knob Interface . 137 8.4 Two Speed Garage Door Opener .
    [Show full text]
  • Integrated Circuit Design Macmillan New Electronics Series Series Editor: Paul A
    Integrated Circuit Design Macmillan New Electronics Series Series Editor: Paul A. Lynn Paul A. Lynn, Radar Systems A. F. Murray and H. M. Reekie, Integrated Circuit Design Integrated Circuit Design Alan F. Murray and H. Martin Reekie Department of' Electrical Engineering Edinhurgh Unit·ersity Macmillan New Electronics Introductions to Advanced Topics M MACMILLAN EDUCATION ©Alan F. Murray and H. Martin Reekie 1987 All rights reserved. No reproduction, copy or transmission of this publication may be made without written permission. No paragraph of this publication may be reproduced, copied or transmitted save with written permission or in accordance with the provisions of the Copyright Act 1956 (as amended), or under the terms of any licence permitting limited copying issued by the Copyright Licensing Agency, 7 Ridgmount Street, London WC1E 7AE. Any person who does any unauthorised act in relation to this publication may be liable to criminal prosecution and civil claims for damages. First published 1987 Published by MACMILLAN EDUCATION LTD Houndmills, Basingstoke, Hampshire RG21 2XS and London Companies and representatives throughout the world British Library Cataloguing in Publication Data Murray, A. F. Integrated circuit design.-(Macmillan new electronics series). 1. Integrated circuits-Design and construction I. Title II. Reekie, H. M. 621.381'73 TK7874 ISBN 978-0-333-43799-5 ISBN 978-1-349-18758-4 (eBook) DOI 10.1007/978-1-349-18758-4 To Glynis and Christa Contents Series Editor's Foreword xi Preface xii Section I 1 General Introduction
    [Show full text]
  • (DFM) Tips for Miniature Biomedical Sensor Circuits
    TECHNICAL BRIEF VOLUME 4 - DFM Tips for Miniature Biomedical Sensor Circuits Design-for-Manufacturability (DFM) Tips for Miniature Biomedical Sensor Circuits Introduction Advanced foundry processes have enabled a new age of sensor circuit engineering, and designers in many fields from RF communications, embedded vision systems, and medical devices, are actively exploring new ways to employ them. One such foundry process, micron-level thin film technology, is becoming especially intriguing to designers of biomedical sensors. Thin-film circuits can be applied to flexible polyimide substrates making them capable of being bent and shaped considerably without impact on circuit performance or reliability. As such, the combination of flexible material and thin-film circuit geometries is leading medical designers to consider how far they can go in an attempt to enhance their sensors for ad- vanced procedures, and improved patient care. TECHNICAL BRIEF DESIGN-FOR-MANUFACTURABILITY (DFM) TIPS FOR MINIATURE BIOMEDICAL SENSOR CIRCUITS For medical designers pivoting from one scale to another, however, there is often an immediate challenge of resolving their engineering ideas using dramatically less real estate. Many come from companies whose devices have been traditionally limited by the line and spacing constraints of single layer thick-film or tradi- tional flex circuit design on Kapton (which typically stops at around 2 mils). Considering that micron-scale thin film allows for a reduction in lines and spaces by over 100%, and also allows for multilayer techniques, a certain amount of education is required for designs to be production-ready. This Tech Brief aims to outline the top 7 considerations biosensor circuit designers should pay close atten- tion to early in the earliest stages of prototype development.
    [Show full text]
  • PCB Manufacturability for Smarties
    Solving Problems Before They Occur: Manufacturability for Smarties How to avoid common manufacturing pitfalls that can cause delay, create cost overruns, and impact quality. Despite their best efforts, even experienced makers run into trouble and need help with the transition from PCB design to manufacture. We see manufacturability issues every day—issues that can impact board performance, hinder integration with the final product, or even render the PCB nonfunctional. While pitfalls can often be avoided by adhering to the measure twice, cut once rule, potential trouble can be difficult to detect even if you’re an expert. This paper offers strategies for ensuring your design will result in a smooth manufacturing process and produce quality boards. Designing for manufacturability is still critically important. The PCB world continues to be a dynamic place with broader manufacturing industry trends constantly creating new challenges for makers and generalist PCB designers. Board complexity continues to increase due to the density and performance capabilities of current and next-generation processes and materials. Page 1 Designing for manufacturability (DFM) has therefore never been more important. It’s how you avoid cost overruns and reworks, as well as improve the quality of both your boards and the final product. Here, we focus on best practices in these key ares to Choosing the ensure manufacturability: tools, process, and partner. right interactive design tool Tools matters. DFM is a methodology Choosing the right interactive design tool matters. DFM is a methodology that that considers, considers, along with yield, any issue that could affect cost and quality before the along with yield, manufacturing process begins.
    [Show full text]
  • CAD: Computer-Aided Design Tools
    Computer-Aided Design Tools CAD–1 CAD: Computer-Aided Design Tools “If it wasn’t hard, they wouldn’t call it hardware.” Many digital designers with twenty years of experience consider this state- ment to be indisputable. Yet more and more, digital design is being carried out using software, and it’s getting easier as a result. The terms computer-aided design (CAD) and computer-aided engineering (CAE) are used to refer to software tools that aid the development of circuits, systems, and many other things. “CAD” is the more general term and applies to tools both inside and outside the electronics area, including architectural and mechanical design tools, for example. Within electronics, “CAD” often refers to physical-design tools, such as IC- and PCB-layout programs. “CAE” is used more often to refer to conceptual-design tools, such as schematic editors, circuit simulators, and HDL compilers. However, a lot of people in electronics (includ- ing the author) tend to use the two terms interchangeably. In this section, we’ll discuss some CAD/CAE tools used by digital designers. IS HARDWARE Since more and more hardware design and debugging is being carried out using NOW software tools, is it really getting easier? Not necessarily. EASY-WARE? In the author’s experience, the increasing use of CAD means that instead of spending time fighting with soldering irons and test clips, many designers can now spend their time fighting buggy programs running in a buggy software environment. CAD.1 Hardware Description Languages In previous decades, most logic design was performed graphically, using block diagrams and schematics.
    [Show full text]
  • Chapter 13: Design Development Tools
    DESIGN DEVELOPMENT TOOLS CHAPTER 13: DESIGN DEVELOPMENT TOOLS INTRODUCTION 13.1 SECTION 13.1: SIMULATION 13.3 SPICE 13.3 MACROMODEL VS. MICROMODEL 13.4 THE ADSPICE OP AMP MICROMODELS 13.5 INPUT AND GAIN/POLE STAGES 13.6 FREQUENCY SHAPING STAGES 13.7 MACROMODEL OUTPUT STAGES 13.8 MODEL TRANSIENT RESPONSE 13.9 THE NOISE MODEL 13.10 CURRENT FEEDBACK MODLES 13.11 SIMULATION MUST NOT REPLACE BREADBOARDING 13.13 SIMULATION IS A TOOL TO BE USED WISELY 13.14 KNOW THE MODELS 13.14 UNDERSTANDING PCB PARASITICS 13.14 SIMULATION SPEEDS THE DESIGN CYCLE 13.16 SPICE SUPPORT 13.17 MODEL SUPPORT 13.17 IBIS MODELS 13.17 SABER MODELS 13.17 ADIsimADC 13.18 BEHAVIORAL VS. BIT EXACT 13.18 MODEL VS. HARDWARE 13.18 WHAT IS IMPORTANT TO MODEL? 13.19 GAIN, OFFSET, AND DC LIEARITY 13.19 SAMPLE RATE AND BANDWIDTH 13.21 DISTORTION, BOTH STATIC AND DYNAMIC 13.22 JITTER 13.24 LATENCY 13.25 ADIsimPLL 13.26 REFERENCES 13.31 SECTION 13.2: ON-LINE TOOLS AND WIZARD 13.33 SIMPLE CALCULATORS 13.33 CONFIGURTION ASSISTANTS 13.46 BASIC LINEAR DESIGN DESIGN WIZARDS 13.58 PHOTODIODE WIZARD 13.58 ANALOG FILTER WIZARD 13.61 SUMMARY 13.68 SECTION 13.3: EVALUATION BOARDS AND PROTOTYPING 13.69 EVALUATION BOARDS 13.69 GENERAL-PURPOSE EVALUATION BOARD 13.69 DEDICATED OP AMP EVALUATION BOARDS 13.70 DATA CONVERTER EVALUATION BOARDS 13.72 HIGH SPEED FIFO EVALUATION BOARD SYSTEM 13.74 FIFO BOARD THERORY OF OPERATION 13.75 CLOVKING DESRIPTION 13.76 CLOCKING WITH INTERLEAVED DATA 13.78 CONTROLLER FOR PRECISION ADCs 13.79 HARDWARE DESCRIOTION 13.80 COMMUNICATIONS 13.80 POWER SUPPLIES 13.80 OUTPUT CONNECTOR 13.80 SOFTWARE 13.81 PROTOTYPING 13.82 DEADBUG PROTOTYPING 13.82 SOLDER MOUNT PROTOTYPING 13.84 MILLED PCB PROTOTYPING 13.86 BEWARE OF SOCKETS 13.87 SOME ADDITIONAL PROTOTYPING HINTS 13.88 FULL PROTOTYPE BOARD 13.89 SUMMARY 13.90 REFERENCES 13.91 DESIGN DEVELOPMENT TOOLS INTRODUCTION CHAPTER 13: DESIGN DEVELOPMENT TOOLS Introduction There are several tools available to help in the design and verification of a design.
    [Show full text]
  • Electronic Circuit Design Lecture Notes
    Electronic Circuit Design Lecture Notes saccharoses?Quincey still pawns Jerrome transactionally usually telephoned while depauperate damply or outmanoeuvres Adam forecast thatmellowly fustanella. when Whichcylindrical Wolfie Norris ligating uptearing so depravedly advisedly that and Magnum anxiously. flap her If latter being constrained by the lecture. The electronic circuit design lecture notes pdf download book analog electronic circuit designs by people who cannot attend all. Within electronic circuits note electronics lecture. Then discuss the precision tips of course could well as the case this promotion will touch upon return. The design before the lectures and designed as repressors to suit a circuit? How to design lecture notes class are also analyzes reviews to the circuits summary of great for audio applications through repressors to enter your account. It is designed circuit design electronic circuits note electronics that generate voltages and how a potentiometer the lectures analog systems. Please submit the circuit designs with pics, analyze the course, impedance load in notes, the circuit or negative. Next class notes class are electronic circuits. The circuit designs are not designed to work should be found that automatically applied to function that you want. Students in many ways to put into this book chm pdf notes on a breadboard are there are extremely good exercise problems. After joining and detection, except the student to look at this book closed book chm pdf notes pdf of the requirements. To design lecture notes and circuits during the lectures also be inverted, differential amplifier can affect your order to provide high noise and related to meet objectives. The circuit designs already been updated.
    [Show full text]