That Shook the World
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"Bob" Schreiner
Oral History of Robert “Bob” Schreiner Interviewed by: Stephen Diamond Recorded: June 10, 2013 Mountain View, California CHM Reference number: X6873.2014 © 2013 Computer History Museum Oral History of Robert “Bob” Schreiner Stephen Diamond: We're here at the Computer History Museum with Bob Schreiner. It's June 10th, 2013, and we're going to talk about the oral history of Synertek and the 6502. Welcome, Bob. Thanks for being here. Can you introduce yourself to us? Robert “Bob” Schreiner: Okay. My name is Bob Schreiner. I'm an ex-Fairchilder, one of the Fairchildren in the valley, and then involved in running a couple of other small semiconductor companies, and I started a semiconductor company. Diamond: So that would be Synertek. Schreiner: Synertek. Diamond: Tell us about that. Schreiner: Okay. As you know from an earlier session I left Fairchild Semiconductor around 1971. And at the time I left I was running the LSI program at Fairchild, and I was a big believer that the future marketplace for MOS technology would be in the custom area. And since Fairchild let that whole thing fall apart, I decided there's got to be room for a company to start up to do that very thing, work with big producers of hardware and develop custom chips for them so they would have a propriety product that would be difficult to copy. So I wrote a business plan, and I went around to a number of manufacturers. I had a computer guy [General Automation], and I had Bulova Watch Company, and I had a company that made electronic telephones [American Telephones], and who was the fourth guy? Escapes my memory right now, but the pitch basically was, "Your business, which now you manufacture things with discrete components, it's going to change. -
Download/Face- Modules/Documents/Face-Modules-Hw-Specifications.Pdf
I PC H “ CompuLab Ltd. Revision 1.2 December 2013 Legal Notice © 2013 CompuLab Ltd. All Rights Reserved. No part of this document may be photocopied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means whether, electronic, mechanical, or otherwise without the prior written permission of CompuLab Ltd. No warranty of accuracy is given concerning the contents of the information contained in this publication. To the extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by CompuLab Ltd., its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or inaccuracies in this document. CompuLab Ltd. reserves the right to change details in this publication without notice. Product and company names herein may be the trademarks of their respective owners. CompuLab Ltd. 17 HaYetsira St., Yokneam Elite 20692, P.O.B 687 ISRAEL Tel: +972-4-8290100 http://www.compulab.co.il http://fit-pc.com/web/ Fax: +972-4-8325251 CompuLab Ltd. Intense PC Hardware Specification Page 2 of 74 Revision History Revision Engineer Revision Changes 1.0 Maxim Birger Initial public release 1.1 Maxim Birger Memory Interface updated Super-IO Controller peripheral section added RS232 serial com port info added 1.2 Maxim Birger HDMI Block Diagram updated DP Block Diagram updated CompuLab Ltd. Intense PC Hardware Specification Page 3 of 74 Table of Contents Legal Notice .................................................................................................................................................. -
A Vhsic Hardware Description Language Compiler for Logic Cell Arrays
A VHSIC HARDWARE DESCRIPTION LANGUAGE COMPILER FOR LOGIC CELL ARRAYS by Bing Liu A thesis presented to the university of Mânitoba in partial fulfillment of úe requirements of the degree of Maste¡ of Science in Elecrical and Computel Engineering Winnipeg, Manitoba, Canada @ Bing Liu, January 1990 Bibliothèque nat¡onale rE fr"3""i"i;tjo'",' du Canada Canadian Theses Serv¡ce Service des thèses canadiennes Otta'¿/ã. Can¿da Kl A ON¡ The author has granted an inevocable non' L'auteur a accordé une licence iffévocable et exclusive licence allowing the National Library non exclusive permettant à h Bibliothèque of Canada to reproduce, loan, distribute or sell nationale du Canada.de reproduire, prêter, copies of his/her thesis by any means and in distribuer ou vendre des copies de sa thèse any form or format, making this thesis avaihble de quelque manière et sous quelque forme to ¡nterested persons. que ce soit pour mettre des exemplaires de cette thèse à la disposition des personnes intéressées. The author retains ownership of the copyright L auteur conserve la propriété du droit d'auteur in his/her thesis. Neither the thesis nor qui protà?e sa thèse. Ni la thèse ni des extraits substantial extracts from it may be printed or substantiels de celle-ci ne doivent être otherw¡se reproduced without his/her per' imprimés ou autrement reproduits sans son mission. autorisation. ISBN ø-315-7 r7s t -3 Canadä A VHSIC HARDWARE DESCRIPTION I.ANGUAGE COMPILER FOR LOG]C CEI,L ARRAYS BY BING LIU A thesis subnrined lo thc Fact¡lty of Crâduate Studies of the University of M¿nitoba in partial fulfìllment of the requirenrents of the degree of MASTM O¡' SC]MICE o 1990 Permission has becn granted to the L¡BRÁRY OF THE UNIVER' SITY OF MANITOBA to lend o¡ sell copies of tlt¡s thesis. -
HP RP5810 Retail System, Model 5810
QuickSpecs HP RP5 Retail System, Model 5810 Overview HP RP5 Retail System, Model 5810 Front View 1. 5.25” external optical drive 5. NIC link indicator LED 2. Power/ Diagnostic LED 6. Hard Drive LED 3. NIC link indicator LED 7. Power button 4. 2 USB 2.0 ports with sliding door c04304464 — DA - 14956 Worldwide — Version 8 — December 8, 2014 Page 1 QuickSpecs HP RP5 Retail System, Model 5810 Overview Rear View 1. 24 Volt USB + PWR port 10. PS/2 keyboard port 2. Two (2) Full-Height Slots* 11. VGA port 3. RS232 serial COM3 12. 3 USB 2.0 ports 4. RJ-45 LAN jack 13. 2 USB 3.0 ports 5. RS232 serial (power configurable) COM1 port 14. RS232 serial (power configurable) COM2 port 6. PS/2 mouse port 15. DisplayPort 7. 240W EPA – Active PFC power supply (no line 16. RJ12 cash drawer port switching required) 8. Line in audio jack 17. One (1) PCIe x16 Slot (wired as x16)** – shown is optional three (3) port 12 Volt USB +Power Card 9. Line out audio jack 18. One (1) PCIe x16 Slot (wired as x4)** – shown is optional three (3) port 12 Volt USB + Power Card * Can be configured either as two (2) PCI x1 or two (2) PCIe x1 Full-Height slots. Shown is optional 2 Port RS232 serial (power configurable) Card, COM4 port (left) and COM3 port (right port). **A variety of cards are available to populate slots, dependant on riser choice and connectors utilized. For full details, please contact your HP sales representative for configuration choices. -
Going Vertical: a New Integration Era in the Semiconductor Industry Table of Contents
Going vertical: A new integration era in the semiconductor industry Table of contents 01 Executive overview Integration in the 02 semiconductor industry Strategic options for 03 semiconductor companies Moving forward: what semiconductor 04 companies must consider today Going vertical: A new integration era in the semiconductor industry 2 Executive overview Like many industries, the semiconductor industry is not immune to waves of diversification and consolidation through inorganic and organic growth. While inflection points with large-scale systemic changes in the value chain are relatively rare, our perspective is that there is a systemic change currently trending in the industry. Since the inception of the industry, semiconductor companies have recognized the value of technology. Accordingly, the market has rewarded semiconductor companies for specializing in distinct parts of the value chain by developing technological advantages by investing in R&D and by scaling technology through horizontal integration. This way of working transformed an industry that was initially vertically integrated (semiconductor design, semiconductor manufacturing, and system integration) into an ecosystem focused on specific areas of design, manufacturing, and/or systems. In the past five years, business value in some segments has moved from underlying technology to specific use cases to better monetize end-customer data and experience. • 5G, automotive, AI, cloud, system integration and hardware-software integration System integrators and software and cloud platform companies are no longer just important customers for the semiconductor industry—they are directly expanding into multiple upstream areas. • Taking advantage of silicon and system design • Control more of the technology stack • Optimize system performance • Improve the customer experience This vertical integration trend is distinctly different from the vertical integration which occurred at the inception of the semiconductor and integrated device manufacturing industry more than 50 years ago. -
Native Configuration Manager API for Windows Library Reference
Native Configuration Manager API for Windows Operating Systems Library Reference December 2003 05-1903-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. This Native Configuration Manager API for Windows Operating Systems Library Reference as well as the software described in it is furnished under license and may only be used or copied in accordance with the terms of the license. The information in this manual is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by Intel Corporation. Intel Corporation assumes no responsibility or liability for any errors or inaccuracies that may appear in this document or any software that may be provided in association with this document. Except as permitted by such license, no part of this document may be reproduced, stored in a retrieval system, or transmitted in any form or by any means without express written consent of Intel Corporation. -
IEEE Spectrum: 25 Microchip
IEEE Spectrum: 25 Microchips That Shook the World http://www.spectrum.ieee.org/print/8747 Sponsored By Select Font Size: A A A 25 Microchips That Shook the World By Brian R. Santo This is part of IEEE Spectrum 's Special Report: 25 Microchips That Shook the World . In microchip design, as in life, small things sometimes add up to big things. Dream up a clever microcircuit, get it sculpted in a sliver of silicon, and your little creation may unleash a technological revolution. It happened with the Intel 8088 microprocessor. And the Mostek MK4096 4-kilobit DRAM. And the Texas Instruments TMS32010 digital signal processor. Among the many great chips that have emerged from fabs during the half-century reign of the integrated circuit, a small group stands out. Their designs proved so cutting-edge, so out of the box, so ahead of their time, that we are left groping for more technology clichés to describe them. Suffice it to say that they gave us the technology that made our brief, otherwise tedious existence in this universe worth living. We’ve compiled here a list of 25 ICs that we think deserve the best spot on the mantelpiece of the house that Jack Kilby and Robert Noyce built. Some have become enduring objects of worship among the chiperati: the Signetics 555 timer, for example. Others, such as the Fairchild 741 operational amplifier, became textbook design examples. Some, like Microchip Technology’s PIC microcontrollers, have sold billions, and are still doing so. A precious few, like Toshiba’s flash memory, created whole new markets. -
Delft University of Technology on Leveraging Vertical Proximity in 3D
Delft University of Technology On Leveraging Vertical Proximity in 3D Memory Hierarchies Lefter, Mihai DOI 10.4233/uuid:f744c1af-505e-440c-bc49-2a1d95d0591d Publication date 2018 Document Version Final published version Citation (APA) Lefter, M. (2018). On Leveraging Vertical Proximity in 3D Memory Hierarchies. https://doi.org/10.4233/uuid:f744c1af-505e-440c-bc49-2a1d95d0591d Important note To cite this publication, please use the final published version (if applicable). Please check the document version above. Copyright Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons. Takedown policy Please contact us and provide details if you believe this document breaches copyrights. We will remove access to the work immediately and investigate your claim. This work is downloaded from Delft University of Technology. For technical reasons the number of authors shown on this cover page is limited to a maximum of 10. On Leveraging Vertical Proximity in 3D Memory Hierarchies Cover inspired by the works of Dirk Huizer and Anatoly Konenko. On Leveraging Vertical Proximity in 3D Memory Hierarchies Dissertation for the purpose of obtaining the degree of doctor at Delft University of Technology by the authority of the Rector Magnificus Prof. dr. ir. T.H.J.J. van der Hagen chair of the Board for Doctorates to be defended publicly on Wednesday 14 November 2018 at 10:00 o’clock by Mihai LEFTER Master of Science in Computer Engineering Delft University of Technology, The Netherlands born in Bras, ov, Romania This dissertation has been approved by the promotors. -
DEVICE and CIRCUIT DESIGN for VLSI by Amr Mohsen
31 DEVICE AND CIRCUIT DESIGN FOR VLSI by Amr Mohsen* Intel Corporation 3065 Bowers Avenue Santa Clara, California 95051 ABSTRACT A review of the device and circuit design complexity and limitations for VLSI is presented. VLSI device performance will be limited by second order device effects, interconnection line de lay and current density and chip power dissipation. The complexity of VLSI circuit design will require hierarchial structured design methodology with special consideration of testability dnd more emphasis on redundancy. New organizations of logic function architectures and smart memories will evolve to take advantage of the topological properties of the VLSI silicon technology. * The author is also on the faculty of California Institute of Technology CALTECH CONFERENCE ON VLSI, January 1979 32 Amr Mohsen I. INTRODUCTION: As semiconductor technology has evolved from discrete to small-scale to medium-scale and through large-scale integration levels a rapid decrease in the cost per function provided by the technology have opened up new applications and industries. Today there is a large interest in the next phase of integration: very large scale integration (VLSI). The semi conductor technology will be able to fabricate chips with more than lOOK devices (l) in the 1980's. The continuous scaling of the semi- conductor devices and increase in components counts on a single chip is resulting in more complex technology developments, device and circuit designs and product definition. In this review paper, projections of how device technology will evolve in the future and the problems and limitations of device and circuit design for VLSI are presented. VLSI TECHNOLOGIES: In Fig. -
Tube Application Note
16th January 1992 Support Group Application Note Number: 004 Issue: 1 Author: Tube Application Note Applicable Related Hardware : Application BBC B Notes: BBC B+ BBC Master 128 Copyright © Acorn Computers Limited 1992 Every effort has been made to ensure that the information in this leaflet is true and correct at the time of printing. However, the products described in this leaflet are subject to continuous Support Group development and improvements and Acorn Computers Limited reserves the right to change its specifications at any time. Acorn Computers Limited cannot accept liability for any loss Acorn Computers Limited or damage arising from the use of any information or particulars in this leaflet. ACORN, Acorn House ECONET and ARCHIMEDES are trademarks of Acorn Computers Limited. Vision Park Histon Cambridge CB4 4AE Support Group Application Note No. 004, Issue 1 16th June 1992 Overview One of the BBC Microcomputer's strengths lies in its sophisticated Operating System, the MOS. This operating system has a very fast and flexible response to Interrupts, which allows the machine to take a wide range of peripherals and handle them with ease. The TUBE is a fast bus interface through which additional Co-processors (also called second processors) can be added. when a co-processor is connected to the TUBE interface, the BBC Micro continues to look after all of the I/O processing, whilst the additional co-processor now carries out the task of running the Language Application. The Co-Processor The co-processor can be based on any microprocessor chip, and can have any memory size that this chip can address. -
Professor Won Woo Ro, School of Electrical and Electronic Engineering Yonsei University the Intel® 4004 Microprocessor, Introdu
Professor Won Woo Ro, School of Electrical and Electronic Engineering Yonsei University The 1st Microprocessor The Intel® 4004 microprocessor, introduced in November 1971 An electronics revolution that changed our world. There were no customer‐ programmable microprocessors on the market before the 4004. It propelled software into the limelight as a key player in the world of digital electronics design. 4004 Microprocessor Display at New Intel Museum A Japanese calculator maker (Busicom) asked to design: A set of 12 custom logic chips for a line of programmable calculators. Marcian E. "Ted" Hoff Recognized the integrated circuit technology (of the day) had advanced enough to build a single chip, general purpose computer. Federico Faggin to turn Hoff's vision into a silicon reality. (In less than one year, Faggin and his team delivered the 4004, which was introduced in November, 1971.) The world's first microprocessor application was this Busicom calculator. (sold about 100,000 calculators.) Measuring 1/8 inch wide by 1/6 inch long, consisting of 2,300 transistors, Intel’s 4004 microprocessor had as much computing power as the first electronic computer, ENIAC. 2 inch 4004 and 12 inch Core™2 Duo wafer ENIAC, built in 1946, filled 3000‐cubic‐ feet of space and contained 18,000 vacuum tubes. The 4004 microprocessor could execute 60,000 operations per second Running frequency: 108 KHz Founders wanted to name their new company Moore Noyce. However the name sounds very much similar to “more noise”. "Only the paranoid survive". Moore received a B.S. degree in Chemistry from the University of California, Berkeley in 1950 and a Ph.D. -
MOSTEK 1980 CIRCUITS and SYSTEMS PRODUCT GUIDE Mostek Reserves the Right to Make Changes in Specifications at Any Time and Without Notice
MOSTEK 1980 CIRCUITS AND SYSTEMS PRODUCT GUIDE Mostek reserves the right to make changes in specifications at any time and without notice. The information furnished by Mostek in this publication is believedto be accurate and reliable. However, no responsibility is assumed by Mostek for its use; nor for any infringements of patents or other rights of third parties resulting from its use. No license is granted under any patents or patent rights of Mostek. The "PRELIMINARY" designation on a Mostek data sheet indicates that the product is not characterized. The specifications are subject to change, are based on design goals or preliminary part evaluation, and are not guaranteed. Mostek Corporation or an authorized sales representative should be consulted for current information before using this product. No responsibility is assumed by Mostek for its use; nor for any infringements of patents and trademarks or other rights ofthird parties resulting from its use. No license is granted under any patents, patent rights, or trademarks of Mostek. Mostek reserves the right to make changes in specifications at anytime and without notice. PRINTED IN USA April 1980 Publication Number Trade Marks Registered® STD No 01009 Copyright © 1980 Mostek Corporation (All rights reserved) II ~~~~~~~;;;;' Table of Contents '~~~~~~;;;;; Table of Contents ................................................... 111 Numerical Index ...................................................VIII Alphabetical Index . ................................................. x Mostek Profile