FP4 Inductor Data Sheet

Effective December 2015 Technical Data 4119 Supersedes March 2007 FP4 High current power inductors

Applications • Servers • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Server and desktop

• Graphics processing unit (GPU)

• Application specific integrated circuit (ASIC)

• High power density • Battery power systems • Graphics cards Product description • High current carrying capacity Environmental data • Inductance range from 0.090uH to 0.200uH • Storage temperature range (component): • Current range 30 to 72 Amps -40°C to +155°C • 10.2 x 6.8mm footprint surface mount package • Operating temperature range: -45°C to +155°C in a 5.0mm height (Ambient plus self temperature rise) • Ferrite core material • Solder reflow temperature: J-STD-020D • Halogen free, lead free, RoHS compliant compliant

HALOGEN HF Pb FREE Technical Data 4119 FP4 Effective December 2015 High current power inductors

Product specifications OCL1 (μH) DCR (Ω) typical DCR (Ω) maximum Volt-μsec4 5 2 3 Part number ±15% lrms (amps) lsat (amps) @ 20°C @ 20°C (V-usec) FP4-100-R 0.100 40 64 0.00038 0.00065 1.33 FP4-120-R 0.120 40 54 0.00038 0.00065 1.33 FP4-150-R 0.150 40 42 0.00038 0.00065 1.33 FP4-200-R 0.200 40 30 0.00038 0.00065 1.33

1. Open Circuit Inductance (OCL) Test parameters: 1MHz, 0.100Vrms, 0.0Adc @20°C. 4. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 2. Irms: DC current for an approximate ΔT of 40°C without core loss. Derating is necessary for AC 500kHz necessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise. currents. PCB layout, trace thickness and width, airflow, and proximity of other heat generating 5. Part Number Definition: FP4-xxx-R components will affect the temperature rise. It is recommended that the temperature of the part FP4 = Product code and size not exceed 155°C. xxx= Inductance value in uH, R= decimal point 3. Isat : Peak current for approximately 30% rolloff @ +20ºC. -R suffix = RoHS compliant

OCL1 (μH) 5 2 3 4 Part number ±15% lrms (amps) lsat (amps) DCR (mΩ) @25°C Volt-μsec (V-usec) FP4-090SK-R 0.090 33 72 0.423-0.517 1.33

1. Open Circuit Inductance (OCL) Test parameters: 100kHz, 1.0Vrms, 0.0Adc @25°C. 4. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 2. Irms: DC current for an approximate ΔT of 40°C without core loss. Derating is necessary for 500kHz necessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise. AC currents. PCB layout, trace thickness and width, airflow, and proximity of other heat generating 5. Part Number Definition: FP4-xxxSK-R components will affect the temperature rise. It is recommended that the temperature of the part FP4, SK = Product code and size not exceed 155°C. xxx= Inductance value in uH, R= decimal point 3. Isat : Peak current for approximately 20% rolloff @ +25ºC. -R suffix = RoHS compliant

Dimensions–mm

TOP VIEW SIDE VIEW RECOMMENDED PAD LAYOUT

1 FRONT VIEW Part Number Dimension “A” SCHEMATIC (mm) ref.

1.0 min. FP4-100-R 3 .0 1 (2x) 5.00 Max 10.20 10.50 FP4-120-R 3 .0 or Max FP4-150-R 3 .0 FP4-XXX wwllyy R

FP4-XXXSK 1.30 ref. FP4-200-R 3 .0 2 (2x) 2.50 (2x) A FP4-090SK-R 2 .8 2 4.50 (2x) 6.80 Max

Part marking: FP4-xxx (FP4=Product code and size),(xxx=inductance value in uH, R=decimal point) FP4-xxxSK (FP4, SK=Product code and size),(xxx=inductance value in uH, R=decimal point) wwllyy = date code, R = revision level Tolerances are ±0.15 millimeters unless stated otherwise PCB tolerances are ±0.2 millimeters unless stated otherwise Do not route traces or vias underneath the inductor

Packaging information (mm) Supplied in tape and reel packaging, 900 parts per 13” diameter reel.

12.0 Ø1.50 Min. Ø1.50 +0.1/-0.0 0.35 ±0.05 2.00 ±0.1 A 1.75±0.10 4.00

R0.30 Max.

11.50±0.1 24.00 ±0.3

Bo or FP4-XXX wwllyy R FP4-XXXSK

Ao=7.20mm

Bo=10.60mm R0.50 Typ. Ko A Ao Ko=5.40mm User direction of feed SECTION A-A

2 www.eaton.com/elx FP4 Technical Data 4119 High current power inductors Effective December 2015

Inductance characteristics

OCL vs. Isat

100.0

75.0

FP4-100 FP4-150 OCL

f FP4-200

%o 50.0 FP4-120

25.0

0.0 01020304050

Isat (ADC)

OCL vs Isat

100

75 L C O

f FP4-090SK 50 %o

0 0510 15 20 25 30 35 40 45 50 55 60 65 70 75

Isat (ADC)

www.eaton.com/elx 3 Technical Data 4119 FP4 Effective December 2015 High current power inductors

Core loss

Irms Derating with Core Loss 0

40 50

80 (maximum)

z z Hz Hz

rms MH k 5 0 0k . 0 00kH 1 1MHz 5 30 1 mI

ro 90

92 Losse sf

f 94 95 %o 96

99 10 20 30 40 50 60 80 100 200 300 400 500 600800 1000 %of Applied Volt-μ-second

4 www.eaton.com/elx FP4 Technical Data 4119 High current power inductors Effective December 2015

Solder reflow profile

TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350

TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A Tsmax Table 2 - Lead (Pb) Free Solder (Tc) Volume Volume Volume 3 3 3 Tsmin Package mm mm mm Thickness <350 350 - 2000 >2000

Temperature ts <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C

25°C Time 25°C to Peak Time

Reference JDEC J-STD-020D

Profile Feature Standard SnPb Solder Lead (Pb) Free Solder

Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.

Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx