Dual Buses for Industrial 110

Total Page:16

File Type:pdf, Size:1020Kb

Dual Buses for Industrial 110 ... L r 7 L v 1 ..r 11. .. M. M `S. r , .. L. T: , r 1iu 4....L ` ../ .. r r , ...... .. sr L L ,_ i i . r r , t 1 r L. V . .. v $ . )1, ` k....L.0' .... 3 - L .0 r, .. r r 4C... --../ v S..or " L. L/ 1/4...,v J ....,0J v v r -,i` v - (,i y II -./ 10 ls . ..r .. -' v r 7 (...4 J .r á., L/ u J ..i v r ' C, t J J - s V_ M r 1/4..J '...1 J J J ,J it r ` . _+' ` i _ ! - 7y Dual buses for industrial 110 Anthony Winter of Arcom Control Systems outlines some of the cost -saving options provided by the use of VN1E/STE mixed -bus architectures It seems that the vast majority of com- a standard hus*. The bus in question is latching circuity to allow very low-cost plementary bus developments over the IEEE -1000 STEhus: a single-Eurocard (STEhus) processors to he used for adding past few years have been aimed at in- scheme which is closely matched to the intelli¢ence to an I/O subsystem. Both these creasing or optimizing overall system needs of the industrial control designer. Its approaches are embodied in Arcom's VME- throughput. Typical examples are buses to limitation' of an 8 -hit data path is. in fact. a bus hoard line. The easiest way to under- provide fast local memory accessing or benefit for industrial I/O applications, be- stand the concept is to consider a CPU hoard message passing between semi-independent cause it makes interfacing both simple and which has dual -bus interfaces. intelligent subsystems. This is good news for cheap and there is little or no performance the designer of. say. CAE workstations penalty for the majority of tasks. because ONE T\\'O BUSES whose foremost concern is handling as many most I/O chips are designed for 8 -bit buses waft microinstructions per second as possible. With more than 50 suppliers now in the The VSCO20 CPU board illustrated is a hut what about the more down-to-earth STEhus market. there are hundreds of mod- conventional double -height VMEhus 68020 engineer developing a medium -complexity ules to choose from and. moreover. the processor module with an expansion con- industrial control system? This type of pro- members of the S'I Ebus industry have co- nector to accept a single Eurocard contain- ject needs a reasonable amount of comput- operated to adopt a further informal 'signal - ing the STEhus interface: the 68020's mem- ing power and. perhaps because of this. the conditioning' standard which has resulted in ory is linked to the \ MEhus. STEhus and engineer initially opts for a bus like \'ME. a very wide range of complementary. single- 68020. The interface to STEhus memory and But when it comes to implementing the I/O Eurocard. real -world interface functions I/O space appear as windows in the CPU's scheme, which might run into hundreds of with screw terminals for easy connection to memory map. All the system designer needs channels, cost reduction becomes the major plant. to do to access the STEhus is write into this driving force. Unfortunately. this need is The concept of integrating the VME and portion of the memory map - in the same generally incompatible with the interfacing STE buses was designed into STE from the manner as if defining the width of \'MEhus requirements of the \'MEbus scheme and start. It can be achieved by either adding an memory access, for instance - and the also, it has to be said, with the apparent interface to a \'ME processor hoard and command is transferred. The memory map high -profit business objectives of the major- porting the processor's memory to both the opposte illustrates this. ity of VIM Ebus hoard manufacturers. VDIE and STE buses, or by building \'ME I/O With two bus interfaces available. the This makes industrial I/O an area ripe for hoards with dual -bus interfaces and some designer is free to partition the system for exploitation by multiple -bus architectures. optimum cost-effectiveness. choosing \'CIE 'See. for esanrhk. 'STE hus as an i/o bus in 1:VE :r:arms' which allow significant reductions in costs. modules for computation and memory. but he Tim Ellsmore. Elri t r-uniis& I1'ircles World. February. It is now possible to achieve this result using 1987. pages I 13 -fi. selecting STEhus modules for the industrial May 1989 ELECTRONICS & WIRELESS WORLD 517 The VSCO20 board with dual VME and STEBUS BASICS STEbus interfaces. The STEbus interface is a daughter board, connected to the outer STEbus is now approved as a full world For many designers, one of the key design rows of the P2 connector. The board standard by the American IEEE. The 1987 choices influencing bus selection is proces- contains a 68020, a socket for a 68881 standard, IEEE 1000, brings major benefits sor type. STEbus gives virtually unlimited floating-point unit. 1Mbyte of ram, four to the systems -building community, offering - freedom in this respect Arcom alone offers a powerful, fast and above all no less than 12 choices of CPU embracing 32 -pin eprom sockets and two serial I/O designers cost-effective means of implementing sys- nine different processor families: Z80A, channels. It costs £1250 in its 12MHz form tems for applications such as control and 64180, Z280, 80188, 8052, 6809, 68008, instrumentation systems. 8088 and 68020. The bus was designed by a group of engineers independently of commercial in- Information on STEbus ís available freely terest, and now has a major following, with via an independent manufacturers' and us- dozens of suppliers and hundreds of users. ers' group - STEMUG. This organisation I/O. This approach to system design changes STEbus' main features are provides a number of helpful services in- the economics drastically. For example, a an 8 -bit bus embracing the Eurocard stan- cluding a document which describes the bus typical VMEhus I/O hoard, say a digital I/O dard and designed for low cost in considerable detail for prospective users. function, costs around £500. Implementing independence of processor manufactur- Free copies may be obtained from Arcom on request (Units 8-10. Clifton Road. Cambridge the equivalent function via STEbus - which ers, giving the widest choice of processor on any 8 -bit bus CB1 4WH). requires a simpler bus interface - works out provision for future requirements through - at around £250. The larger the system. the asynchronous, non -multiplexed data In the UK. the bus has over the last 3-4 greater the savings. VSCO20 also provides a transfers at over 5Mbyte/s years, literally changed the face of the UK's upgrade path for STEhus users: powerful a full 1Mbyte addressing range board -level computer market sweeping some simple software changes allow an up to 4Kbyte I/O space aside STD and dozens of proprietary single- existing STEbus system's processing power a positionindependent, non -daisy - Eurocard bus standards to become the to he multiplied around tenfold (this figure chained bus dominant 8 -bit board -level standard. Its is taken from benchmarks of an 8N11 -1z 68008 multiprocessor capability main application area is in small -to -medium STEhus CPU against the l6?ll Iz version of high-speed burst transfer mode size data acquisition and control systems, as IEEE has this 6801_0 hoard), whilst retaining all the eight attention -request lines and its standardisation -1000 vectored or non -vectored interrupts resulted in widespread user acceptance and basic programs and OS -9 operating system interrupt -acknowledge cycle a fast-growing following of manufacturers. environment. read -modify -write cycle The result is a UK STEbus market currently This facility to migrate the design either fully buffered signals and terminated running at some f7M pa and growing at up or down in processing power is an backplane for data integrity around 50% pa. additional and powerful capability. When a design cycle starts, unless you possess some similar detailed experience or have under- taken extensive feasibility studies, it is usual- 4 Gigabytes Expansion showing ly not clear how much processing power you FFFF FFFF the STE bus need. The result can be a 32 -hit VMEbus interface system performing a control task that is well Arcom VME within reach of a Z80 running on STEbus (at A16 /1:116 slave address say one -quarter of the cost), or an STEhus Repeat 4 16 /032 7F00 system designer resorting to techniques of lower Control 2G byte such as rewriting sections of code in assemb- Memory 7E40 ler or adding another CPU. offloading a 1/o computing task to get the system functional. 7E80 in man- 7E40 An STEhus system configured this 7EFF FFFF ner has nothing left in reserve to cope with Not used 7E80 0000 any future system expansions. The VMEbus Serial i/o has a high price for the 7E 2800 XX designer to pay very Reserved system, whilst the STEbus designer's costs A32/016 7E 20XXXX Eprom and development time have mounted out of space 7E 00 proportion - and with the possibility of a redesign. 424/016 The dual VME/STEbus concept changes this situation. Provided that you choose a 7D00 68K -family processor running under the A32/032 space OS -9 operating system. you can start with an A24 /032 STEbus CPU and upgrade the computer power at a later date. or start on VME with 000F FFFF 7C 00 1 Mbyte STEbus I/O and downgrade to. say. a 68008 Hex address onboard dram High character hex address for the target -system versions.
Recommended publications
  • Printing Machine Computer Based Control System
    Printing Machine Computer Based Control System Sayed Haroon Shadad A thesis submitted to University of Khartoum, the Faculty of Engineering, Department of Electrical and Electronic Engineering, in complete fulfillment of the requirements for the degree of Masters of Science In Electrical & Electronic Engineering Supervisor: Dr. Sami Mohamed Sharif 2004 Keywords: printing, machine, computer based, control ﺑﺴﻢ اﷲ اﻟﺮﺣﻤﻦ اﻟﺮﺣﻴﻢ (وءاﺗﺎآﻢ ﻡﻦ آﻞ ﻡﺎ ﺱﺄﻟﺘﻤﻮﻩ وإن ﺗﻌﺪوا ﻧﻌﻤﺖ اﷲ ﻻ ﺗﺤﺼﻮهﺎ إن اﻹﻧﺴﺎن ﻟﻈﻠﻮم آﻔﺎر) اﻵیﺔ (٣٤) ﻡﻦ ﺱﻮرة إﺑﺮاهﻴﻢ i Dedication To my daughters and sons: “A little knowledge is a dangerous thing---incomplete knowledge about a subject is sometimes worse than no knowledge at all” ii AKNOWLEDEMENT First, I would like to express my thanks to Allah for his great help in the completion of this thesis. I would like to express my sincere thanks to my supervisor, Dr Sami Mohamed Sharif for his fruitful efforts, guidance and interest. My thanks to Dr. Ezeldeen Kamil Amin, for his advice and encouragement. I would like to express my deep thanks to all the staff in my company; Sudan Currency printing Press (SCPP) represented by the General Manager Dr. Hassan Omer A/Rahman for his great assistance and encouragement and for taking the burden of the costs of the project. My, deep thanks to the following colleagues for their kind support in the gloomy days: ¾ Mustafa Arena Computer Engineer. ¾ Al Doma Al Bager Electrical Technician. ¾ Tag Al Sir Mohammed Electrical Technician. iii اﻟﺨﻼﺻﺔ ﺗﻤﺘﻠﻚ ﺷﺮآﺔ ﻡﻄﺎﺑﻊ اﻟﺴﻮدان ﻟﻠﻌﻤﻠﺔ اﻟﻮرﻗﻴﺔ ﻋﺪد ﻡﻦ ﻡﺎآﻴﻨﺎت اﻟﻄﺒﺎﻋﺔ و هﻨﺎك ﺱﺘﺔ ﻡﻦ هﺬﻩ اﻟﻤﺎآﻴﻨﺎت ﺗﻌﺘﺒﺮ ﻗﺪیﻤﺔ ﻧﺴﺒﻴﺎ.
    [Show full text]
  • A Multiple-Bus, Active Backplane Architecture for Multiprocessor Systems Scott Alan Irwin Iowa State University
    Iowa State University Capstones, Theses and Retrospective Theses and Dissertations Dissertations 1990 A multiple-bus, active backplane architecture for multiprocessor systems Scott Alan Irwin Iowa State University Follow this and additional works at: https://lib.dr.iastate.edu/rtd Part of the Computer Sciences Commons, and the Electrical and Electronics Commons Recommended Citation Irwin, Scott Alan, "A multiple-bus, active backplane architecture for multiprocessor systems " (1990). Retrospective Theses and Dissertations. 9509. https://lib.dr.iastate.edu/rtd/9509 This Dissertation is brought to you for free and open access by the Iowa State University Capstones, Theses and Dissertations at Iowa State University Digital Repository. It has been accepted for inclusion in Retrospective Theses and Dissertations by an authorized administrator of Iowa State University Digital Repository. For more information, please contact [email protected]. Kmwi m««m» tM: gMgea)^ g«v% ,*%&v nî % -"T w}-t r << _ ^ y, , 6 "^"'"'1 ;/< c . i'7 L., '"0!^ ' ,/,i ' } C V' »,, VI i'.i? K !** ' ,'\''\^ja 4% /.ly - f ^ \''' ' %A. , .%V ' %Kie ^ w, * . s» fsf/aK, .y/;, %,,r. INFORMATION TO USERS The most advanced technology has been used to photograph and reproduce this manuscript from the microfilm master. UMI films the text directly from the original or copy submitted. Thus, some thesis and dissertation copies are in typewriter face, while others may be from any type of computer printer. The quality of this reproduction is dependent upon the quality of the copy submitted. Broken or indistinct print, colored or poor quality illustrations and photographs, print bleedthrough, substandard margins, and improper alignment can adversely affect reproduction.
    [Show full text]
  • Bi-Directional Optical Backplane Bus for General Purpose Multi-Processor B Oard-To-B Oard Optoelectronic Interconnects
    JOURNAL OF LIGHTWAVE TECHNOLOGY, VOL. 13, NO. 6, JUNE 1995 1031 Bi-Directional Optical Backplane Bus for General Purpose Multi-Processor B oard-to-B oard Optoelectronic Interconnects Srikanth Natarajan, Chunhe Zhao, and Ray. T. Chen Absfract- We report for the first time a bidirectional opti- cal backplane bus for a high performance system containing nine multi-chip module (MCM) boards, operating at 632.8 and 1300 nm. The backplane bus reported here employs arrays of multiplexed polymer-based waveguide holograms in conjunction with a waveguiding plate, within which 16 substrate guided waves for 72 (8 x 9) cascaded fanouts, are generated. Data transfer of 1.2 GbUs at 1.3-pm wavelength is demonstrated for a single bus line with 72 cascaded fanouts. Packaging-related issues such as Waveguiding Plate transceiver size and misalignment are embarked upon to provide n a reliable system with a wide bandwidth coverage. Theoretical U hocessor/Memory Board treatment to minimize intensity fluctuations among the nine modules in both directions is further presented and an optimum I High-speed Optoelectronic Transceiver design rule is provided. The backplane bus demonstrated, is for general-purpose and therefore compatible with such IEEE stan- - Waveguide Hologram For Bi-Directional Coupling dardized buses as VMEbus, Futurebus and FASTBUS, and can Fig. 1. Optical equivalent of a section of a single bidirectional electronic function as a backplane bus in existing computing environments. bus line. I. INTRODUCTION needed to preserve the rising and falling edges of the signals HE LIMITATIONS of current computer backplane buses increases. This makes using bulky, expensive, terminated Tstem from their purely electronic interconnects.
    [Show full text]
  • International Standard ISO/IEC 10859 Was Prepared by Joint Technical Committee ISO/IEC JTC1, Information Technology, SC 26: Microprocessor System
    This is a preview - click here to buy the full publication INTERNATIONAL ISO/IEC STANDARD 10859 First edition 1997-06 Information technology – 8-bit backplane interface: STEbus and mechanical core specifications for microcomputers Technologies de l'information – Interface de fond de panier 8 bits – Bus STE ISO/IEC 1997 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. ISO/IEC Copyright Office • Case postale 56 • CH-1211 Genève 20 • Switzerland This is a preview - click here to buy the full publication – 2 – 10859 © ISO/IEC:1997 CONTENTS Page FOREWORD ................................................................................................................... 3 IEEE STANDARD FOR A 8-BIT BACKPLANE INTERFACE: STEBUS INTRODUCTION ............................................................................................................. 4 Clause 1 General .................................................................................................................... 5 2 Functional description............................................................................................... 9 3 Signal lines............................................................................................................... 10 4 Arbitration................................................................................................................
    [Show full text]
  • PC Hardware Contents
    PC Hardware Contents 1 Computer hardware 1 1.1 Von Neumann architecture ...................................... 1 1.2 Sales .................................................. 1 1.3 Different systems ........................................... 2 1.3.1 Personal computer ...................................... 2 1.3.2 Mainframe computer ..................................... 3 1.3.3 Departmental computing ................................... 4 1.3.4 Supercomputer ........................................ 4 1.4 See also ................................................ 4 1.5 References ............................................... 4 1.6 External links ............................................. 4 2 Central processing unit 5 2.1 History ................................................. 5 2.1.1 Transistor and integrated circuit CPUs ............................ 6 2.1.2 Microprocessors ....................................... 7 2.2 Operation ............................................... 8 2.2.1 Fetch ............................................. 8 2.2.2 Decode ............................................ 8 2.2.3 Execute ............................................ 9 2.3 Design and implementation ...................................... 9 2.3.1 Control unit .......................................... 9 2.3.2 Arithmetic logic unit ..................................... 9 2.3.3 Integer range ......................................... 10 2.3.4 Clock rate ........................................... 10 2.3.5 Parallelism .........................................
    [Show full text]
  • SFF-TA-1005 Universal Backplane Management
    Published SFF-TA-1005 Rev 1.3 SFF-TA-1005 Specification for Universal Backplane Management (UBM) Rev 1.3 January 14, 2020 Secretariat: SFF TA TWG Abstract: This specification defines the Universal Backplane Management structure. This specification provides a common reference for systems manufacturers, system integrators, and suppliers. This specification is made available for public review, and written comments are solicited from readers. Comments received by the members will be considered for inclusion in future revisions of this specification. The description of a connector in this specification does not assure that the specific component is actually available from connector suppliers. If such a connector is supplied it shall comply with this specification to achieve interoperability between suppliers. POINTS OF CONTACT: Josh Sinykin/Jason Stuhlsatz Chairman SFF TA TWG Broadcom Limited Email: [email protected] 4385 River Green Parkway Duluth, GA 30096 Ph: 678-728-1406 Email: [email protected] /[email protected] Universal Backplane Management (UBM) Page 1 Copyright © 2020 SNIA. All rights reserved. Published SFF-TA-1005 Rev 1.3 Intellectual Property The user's attention is called to the possibility that implementation of this specification may require the use of an invention covered by patent rights. By distribution of this specification, no position is taken with respect to the validity of a claim or claims or of any patent rights in connection therewith. This specification is considered SNIA Architecture and is covered
    [Show full text]
  • User Manual Compactpci Backplanes
    User Manual CompactPCI Backplanes 73972-101 Rev.000 CompactPCI Manual Overview What is The latest specification for PCI-based industrial computers is called CompactPCI. It is electrically, a superset of desktop PCI with a different physical form factor. CompactPCI utilizes the Eurocard form factor popularized by the VME bus. Defined for both 3U (100mm by 160 mm) and 6U (160mm by 233 mm) card sizes, CompactPCI has the following features: Standard Eurocard dimensions (compliant with IEEE 1101.1 mechanical standards) High density 2mm Pin-and-Socket connectors (IEC approved and Bellcore qualified) Vertical card orientation for effective cooling Easy card retention Excellent shock and vibration characteristics Metal front panel User I/O connections on front or rear of module Standard chassis available from many suppliers Uses standard PCI silicon, manufactured in large volumes Staged power pins for Hot Swap capability Eight slots in basic configuration. Easily expanded with Bridge Chips What is PICMG PICMG (PCI Industrial Computer Manufacturers Group) is a consortium of over 600 companies who collaboratively develop open specifications for high performance telecommunications and industrial computing applications. The members of the consortium have a long history of developing leading edge products for these industries. CompactPCI Connector The CompactPCI connector is a shielded 2mm pitch, 5+2 row connector, compliant to IEC 61076-4-101. Main features of this connector are the pin stagging for hot swap and shielding for EMI/RFI protection. Page 1 of 25 CompactPCI Manual Schroff CPCI Backplanes Schroff CompactPCI Backplanes Schroff CompactPCI backplanes are fully compliant to the latest PICMG specifications. PICMG 2.0 R 3.0 cPCI Core Specification PICMG 2.1 cPCI Hot Swap Specification PICMG 2.6 Bridging Specification PICMG 2.9 System Management Bus Specification PICMG 2.10 Keying Specification Schroff CompactPCI backplanes are specially designed to achieve exellent power distribution, best signal integrity, virtually zero cross talk, and minimum clock skew.
    [Show full text]
  • RAC6000 Industrial Computers Technical Reference Guide RAC6000 Industrial Computers Technical Reference Guide
    RAC6000 Industrial Computers Technical Reference Guide RAC6000 Industrial Computers Technical Reference Guide This document contains a collection of general computer technology information. It also contains detailed technical information for the RAC6000 industrial computer products. Here is an overview of the document: • Glossary of Terms – some independent websites of computer glossaries. • Computer Component Definitions – overview of key computer components and application to RAC6000 products. • Reliability Information – product MTBF overview and data. • RAC6000 Product Support – overview of RAC6000 computer support strategy. • Computer Technical Data Sheets – detailed technical specifications for RAC6000 Processor Cards and Active Motherboards. • RAC6000 Chemical Resistance – comprehensive tables for 6180, 6181, and 6185 products. Glossary of Terms The following websites contain detailed glossaries for computer terms and acronyms. http://www.geek.com/glossary/glossary.htm http://homepages.enterprise.net/jenko/Glossary/G.html http://www.computeruser.com/resources/dictionary/dictionary.html Computer Component Definitions The following sections provide an overview for various computer terms and components, as well as their application to RAC6000 computer products. Passive Backplane Computers A computer platform consisting of a multi-slot backplane and a separate plug-in CPU card. Several years ago when computers were less reliable and changing rapidly, passive backplane computers were popular because it is easy to replace the CPU card for repairs or upgrades. Today passive backplane computers are popular because they can offer lots of add-in card slots, or can be designed to fit small enclosures. Passive backplane computers are primarily used in industrial and telecommunications applications, so their technology usually lags commercial PCs by at least 6 months.
    [Show full text]
  • Vmebus for Software Engineers Introduction
    1 VMEbus for Software Engineers Software and hardware engineers see things differently. So too with their views of VMEbus. Instead of nanoseconds and rise-times and access widths, system programmers want to know how and why to assign memory space, how to use special-purpose VME I/O boards without conflicting with on-board devices, and how to recognize software errors caused by hardware configuration problems. This article, originally published in 1993 (see “Publication History”), presents VMEbus operation and configuration from a software perspective, in terms and views familiar to the software engineer. Foundation – Why It Works That Way Introduction Early Years– Market Pressure and Competition Nuts and Bolts– Dry and Dusty Specifications Serial and Parallel – Watch Out! Roles, Players and Operations Master-Slave Operations– Changing Roles Taking Control– Who’s the Boss? Bus Errors– Five Kinds Interrupts– How Much Overhead? Moving Data – Meat and Potatoes Choices and Consequences Addressing Memory– Who’s On First Letting Go– Can’t Make Me! VME64– Life-Extender or Next Generation? Additional Information – Where To Get It Administrivia Publication History Author Introduction In the design and debugging of complex systems, it is becoming more and more important for software engineers to understand VMEbus. Embedded systems, in particular, make frequent use of this important architecture. Engineers with software skills are increasingly called upon to make full use of its capabilities, and a firm understanding of the standard’s intentions and limitations is essential. 2 This article describes VMEbus as it relates to the software realm. Included are some typical uses as well as historical information that may help put developments and current usage into perspective.
    [Show full text]
  • ISO/IEC JTC 1/SC 25 N 4Chi008 Date: 2004-06-22
    ISO/IEC JTC 1/SC 25 N 4Chi008 Date: 2004-06-22 ISO/IEC JTC 1/SC 25 INTERCONNECTION OF INFORMATION TECHNOLOGY EQUIPMENT Secretariat: Germany (DIN) DOC TYPE: Administrative TITLE: Status of projects of SC25/WG 4, Chitose, Japan, 2004-06-22/24. SOURCE: ISO/IEC JTC 1/SC 25/WG 4 Convener PROJECT: All projects of SC 25/WG 4 STATUS: Agenda ACTION ID: FYI DUE DATE: n/a REQUESTED: For information ACTION MEDIUM: Open DISTRIBUTION: ITTF, JTC 1 Secretariat P-, L-, O-Members of SC 25 No of Pages: 08 (including cover) Page 1 of 8 Status of projects of WG 4, Chitose, Japan, 2004-06-22/24 6 Project 1.25.13.01.XX - Channel Interface Specifications: Fibre Distributed Data Interface (FDDI) 6.1. Project 1.25.13.01.03 - FDDI - Part 1: Physical Layer Protocol (PHY) [ISO 9314-1:1989] no action required 6.2. Project 1.25.13.01.04 - FDDI - Part 2: Media Access Control (MAC) [ISO 9314-2:1989] - - no action required 6.3. Project 1.25.13.01.05 - FDDI - Part 3: Physical Layer Medium Dependent (PMD) [ISO/IEC 9314-3:1990] no action required 6.4. Project 1.25.13.01.06 - FDDI - Part 4: Single-Mode Fibre Physical Layer Medium Dependent (SMF-PMD) [ISO/IEC 9314-4:1999] -- no action required 6.5. Project 1.25.13.01.07 - FDDI - Part 5: Hybrid Ring Control (HRC) [ISO/IEC 9314- 5:1995] no action required 6.6. Project 1.25.13.01.08 - FDDI - Part 6: Station Management (SMT) [ISO/IEC 9314- 6:1998] no action required 6.7.
    [Show full text]
  • Solution Microcap 5 Reviewed Nulling Coil Interaction Analogue Filters Alternative Balanced Amplifier Analysing Fm Noise
    EW+WW exclusivea0% off virtual instruments ELECTRONICS Denmark DKr. 65.00 Germany DM 15.00 Greece Dra.950 Holland Dfl. 14 Italy L. 8000 IR £3.30 Singapore 5S12.60 WORLD Spain Pts. 750 USA $4.94 A REED BUSINESS PUBLICATION +WIRELESS WORLD SOR DISTRIBUTION September 1995£2.10 New audio power solution MicroCap 5 reviewed Nulling coil interaction Analogue filters Alternative balanced amplifier Analysing fm noise 20% discountumaudio analyser UK launch MICROMASTER LV PROGRAMMER by marl manufActurers111(10611g AMD MICROCHIP ATMEL from only £495 THE ONLY PROGRAMMERS WITH TRUE 3 VOLT SUPPORT The Only True 3V and 5V FEATURES Widest ever device support Universal Programmers including EPROMs, EEPROMs, Flash, Serial PROMs, BPROMs, ce Technology's universal programming solutions are designed with the future in mind. In PALs, MACH, MAX, MAPL, PEELs, addition totheir comprehensive, ever widening device support, they arethe only EPLDs, Microcontrollers etc. programmers ready to correctly programme and verify 3 volt devices NOW. Operating from battery or mains power, they are flexible enough for any programming needs. Correct programming and verification of 3 volt devices. The Speedmaster LV and Micromaster LV have been rigorously tested and approved by some of the most well known names in semiconductor manufacturing today, something that very few Approved by major manufacturers. programmers can claim, especially at this price level! High speed: programmes and Not only that, we give free software upgrades so you can dial up our bulletin board any time for verifies National 27C512 in under the very latest in device support. II seconds. Speedmaster LV and Micromaster LV - they're everything you'll need for programming, chip Full range of adaptors availab e for testing and ROM emulation, now and in the future.
    [Show full text]
  • Coherent Data Collectors: a Hardware Perspective
    COHERENT DATA COLLECTORS: A HARDWARE PERSPECTIVE Coherent Data Collectors: A Hardware Perspective Russell Rzemien For more than 15 years, the Applied Physics Laboratory has been designing and operating coherent radar data-collection instrumentation. In this article, the engineer- ing challenges and design approaches used to meet analysis requirements are described, examples of collectors are provided, and the nature of future development efforts is outlined. (Keywords: Coherent signal processing, Radar analysis, Radar instrumentation, Radar systems, Test and evaluation.) INTRODUCTION Radar1–3 is an acronym derived from the words radio processors that only use amplitude information may fail detection and ranging. The term reveals much about to detect these targets in such environments. the operation and use of early radars. Those first devices Far better performance is achieved by coherent ra- used radio waves to detect the presence of objects and dars, i.e., radars that use the phase or frequency infor- to measure the ranges of those objects. Modern radars mation of the return echoes and not just the amplitude frequently provide additional information, such as of the return signal. An echo’s phase (or frequency) angular position and inbound velocity of an approach- remains constant for stationary objects like clutter, ing target. However, the primary function of radar is whereas the phase varies for moving objects. It is this target detection; all else follows from this. The detec- changing phase, along with the amplitude of the echo, tion problem remains a challenge, particularly with the that the signal processors in coherent radars use to development of stealth design techniques that signif- discriminate targets from background clutter.
    [Show full text]