Bus Based Technology9 Listed Atthefootof Thepage
For
9.01 Bus Based Technology9 listed atthefootof thepage. instances, theproductwillbe products willbecoveredFrom by 1stJanuary 1997certain the Low Voltage Directive 73/23/EEC. Inthese to assistinachievingfullcompliance. undertaken extensiverepresentative measurementsandparticipatedinworkinggroupswillcontinue VERO ElectronicsCircuitBoardDivision haveinvestedheavilyinpre-compliancetestfacilitiesand service andtomarkdeclareas such. not According tothedirective,itemsincludedinthissectionareconsidered sub-assemblies,andassuchare CE CE CE CE systems. PleasecontactVEROElectronicsforfurtherdetails. Customised versions oftheMicroracks offer aneasysolutiontoimplementationofspecialiseddevelopment systems. modules andotheraccessoriesareavailabletogetherwithanextensiverangeofMicrorackdevelopment In additiontothebackplanessupportingthesebusstructuresawiderangeofextenderboards,terminator modified standardandfullycustomisedforms. and Multibus II,STEbus, G-64bus andG-96bus. The backplane rangeismadeavailable instandard, structures includingFuturebus+,VMEbus,VME64,VME64Extensions,VXIbus,CompactPCI,Multibus The CircuitBoardDivisionof definedbus VERO allinternationally Electronicsoffers productstosupport BUS BASEDTECHNOLOGY TECHNOLOGY BASED BUS CE CE Marking accordingtotheEMCdirective Marking 89/336/EECbecameeffective 1996. asof1stJanuary CE CE MARKING marked.Itremainstheresponsibilityofintegratortoensurecompliance atthepointoftakinginto Markingofspecific products,pleasecontact VERO Electronics Technical onthenumber Enquiries VERO Electronics CE markedandadeclaration ofconformitycanbesupplied onrequest. Technical Enquiries Technical
☎ U.K.
01489 780078 780078 01489 Backplanes. a 2U,3SlotVMEbusMicrorackandCompactPCI EC2 0 EC2 0 CECC23100 CECC23200 CECC 23300 full rangeofVME New tothiseditionoftheProductHandbookarea new orenhancedproducts. development VEROElectronicsregularlyintroduces ISO9001. systems approvalinaccordancewithBSEN BS9000, CECC23000andIECQPCQ88,with in accordancewithqualityassurancelevelsto All VEROElectronicsbackplanesaremanufactured MANUFACTURING STANDARDS ▲ S96 S96 BS9763 BS9762 BS 9761 U.S.A. In linewithitsstatedpolicyofconstantproduct
Underwriters Laboratories 1 800 242 2863 242 800 1 Certificate Number CECC 23300-004 BS ENISO9001 2 VME64Extensionsbackplanes, Hedge End FM 14253 NEW PRODUCTS BUS BASED TECHNOLOGY
VMEbus ...... 9.03-9.19 VXIbus ...... 9.20-9.23 MULTIBUS ...... 9.28
VMEXCEL J1 & J2 3U and 6U Monolithic backplanes VXIbus backplanes ...... 9.20 Multibus iPSB / iLBX backplanes ...... 9.28 9 ...... 9.03-9.08 VXIbus Microracks ...... 9.21-9.22 High Performance VMEELITE Monolithic backplanes VXIbus prototyping boards ...... 9.23 MULTIBUS II ...... 9.29-9.30 ...... 9.09-9.10 VXIbus Extender board ...... 9.23 Multibus II iPSB backplanes ...... 9.29 VME2 - VME64 Extensions backplanes .. 9.11-9.12 VXIbus Light and normal duty modules ...... 9.23 Multibus II iLBX backplanes ...... 9.30 High Performance VMEbus J1 backplanes .... 9.13 Multibus II Extender board ...... 9.30 VMEbus Live Insertion Module ...... 9.14 CompactPCI ...... 9.24 VMEbus Extender boards ...... 9.15 CompactPCI backplanes ...... 9.24 STEbus ...... 9.31 BGRANT/IACK jumper board ...... 9.15 STEbus backplanes ...... 9.31 FUTUREBUS+ ...... 9.25-9.27 STEbus terminator ...... 9.31
120mm Adaptor ...... 9.15 Technology Bus Based 60mm Adaptor ...... 9.15 Multi-profile Futurebus + Backplanes ...... 9.25 STEbus extender board ...... 9.31 Futurebus+ 4 Slot Microracks - Entry level .... 9.26 VME Subsystem - VSB ...... 9.15 G-64/G-96 ...... 9.32 VMEbus Powerfail module ...... 9.15 Futurebus+ 4 Slot Microrack - Advanced ...... 9.26 Futurebus+ 14 Slot Microrack - Entry level .... 9.27 G-64bus backplanes ...... 9.32 VMEbus Modular Microrack System ...... 9.16-9.18 G-96bus backplanes ...... 9.32 VMEbus 3 slot Microracks ...... 9.19 Futurebus+ 14 Slot Microrack - Advanced ..... 9.27
VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.02 9.03 Bus Based Technology9 VME Electronics. associated withbackplanetechnologyfromVERO still enjoythequalityandperformanceadvantages backplanes whicharecompetitivelypositioned,but production methods,hasresultedinarangeof Value combinedwiththeimproved engineering, requirements andbudget. user totailortheproductsuithisexact The abilitytoconfigurethebackplanepermits marketplace. and quicklyintroduceaversatileproducttothe been employed toimprove productionefficiency Just In Time (JIT)manufacturing techniqueshave new conceptofcustomerconfiguredbackplanes. FEATURES design. impedance, powerdistributionandtermination characteristics inthekeyareasofcontrolled ● ● ● ● ● ● ● ● ● ● ● ● ● The VME INTRODUCTION VME VME ݗ decoupling capacitorsandanti-crosstalklayout Termination stubs, designfeatures short Low groundshift Excellent crosstalkperformance Patented earthguardtrackdesign 57 4 Layerstriplineconstruction-J2 6 Layerstriplineconstruction-J1andMonolithic 1994) to Conforms VME64 specification(ANSI/VITA1- backplane tomatchsystemparameters each slotpositionpermittingfinetuningofthe A decouplingcapacitorpositionisprovidedfor Monolithic Two power connectionpositionoptions- ■ ■ ■ ■ Four powerconnectoroptions- (Flying leadandmatingconnectorsupplied) Latchable servicesconnector Auto BusGrant(ABG)Connectorsasanoption XCEL Ω Faston Mate 'N'Lok Busbars Power Bug/Fastonconnectors XCEL characteristicimpedancecontrol XCEL XCEL offers excellent performance BACKPLANES familyofbackplanesintroducesa BACKPLANES VERO Electronics ● ● ● ● ● ● ● ● Technical Enquiries Technical VME 64compatible-Monolithic VSB backplanes Screw fixingoptiononJ2connectorsforusewith Passive andactiveterminationoptions On andOff-boardtermination (including matingconnector) Mate 'N'Lokconnectorssupplied Long tailedconnectorsaregoldplated Long tailsandshroudsonallJ2slotpositions area ofbackplane Long tailsandshroudsonslot1“n”J1 ݘ
☎ U.K.
01489 780078 780078 01489 Mate 'N' Lok is a trademark ofAMP Mate 'N'Lokisatrademark VME ݙ ݘ ݗ VME VME VME ݙ U.S.A. XCEL isatrademarkofVEROElectronicsLimited XCEL XCEL XCEL
1 800 242 2863 242 800 1 MonolithicBackplane J2Backplane J1backplane VMEXCEL BACKPLANES GUARD TRACKING TERMINATION actual savings afforded by active termination over passive termination can be as high as 5 Watts. All VMEbus backplanes manufactured by VERO It is recommended that VMEbus backplanes are Electronics adopt the company’s patented guard terminated at both ends, which is why VERO The main applications for active termination are tracking layout. This layout guarantees the Electronics always provide backplanes which portable battery operated systems or very small, backplane a superior level of crosstalk (noise) include two sets of terminators (except the 2 and 3 low power systems. performance. slot versions, which require only one). Although termination is included as standard with The use of guard tracking, in addition to improving crosstalk VERO can supply termination in passive on- or off- all VMEbus backplanes supplied by VERO, performance, aids the reduction of layer count. board or active off-board formats. additional terminator modules may be ordered separately. With the signal lines being shielded by power layers All VMEbus termination modules from VERO are in one plane and by individual 0V guard tracks in universal, thus they can be fitted to either end of JUMPER LINKS the other, VERO’s patented guard tracking gives a the backplane without fouling the subrack on which pseudo-coaxial style of protection. the board is mounted. Each backplane is supplied with 10 red jumper links for implementing “bus grant” and “IACK” when a ON-BOARD TERMINATION daughter board is removed from a working system. These jumper links are fitted to the backplane during On-board passive is the most popular - and cost assembly and for correct operation they will need effective - method of terminating because the 0V / Guard to be removed from the board. They should only be resistors are fitted directly onto the backplane replaced when the user requires a slot to be left Signal adjacent to the first and last slots. There is no loss vacant between occupied slots during operation. 0V / Guard of usable slots with VERO's on-board, inboard termination layout which is used as standard on all Signal VMEXCEL backplanes. 0V / Guard
Signal
0V / Guard 9
VMEbus Guard Tracking
Jumper Links
LATCHABLE SERVICES TERMINATION Ordering information CONNECTOR Technology Bus Based Description Qty. Order code All VMExcel backplanes are supplied as standard Universal passive with a latchable services header. 2 243-52821K J1 terminator The 5 way header is located on the rear (wiring side) Universal passive 2 188-52865D top corner of the backplane, above the space J2 terminator between connectors 1 and 2. OFF-BOARD TERMINATION Universal active 1 243-310274L The mating half of the connector, with 1 metre of Off-board passive is popular where a quick “Mean J1 terminator cable attached to each of the five lines, is also Time to Repair” is required. This is because the Universal active included. 1 243-310276G termination is on separate modules which can easily J2 terminator be plugged in and out of the rear of a backplane. The lines, and the relevant colour codings, are Retainer/ejector kit 4 188-53119H arranged as follows; GND - black, +5V - red, ACFL Jumper links / red 10 188-39180G - blue, SYSFL - grey and SYSRES - orange. CONNECTOR TYPES STANDARD (STD) - These are high quality DIN 41612 class 2 96/96 way connectors AUTO BUS GRANT CONNECTOR (ABG) - The use of Auto Bus Grant Connectors (also known in some markets as Auto Daisy Chain Connectors) in the new VMEXCEL range negates the need to provide jumper links for empty slots or partially configured systems. Connectors have high reliability and are DIN 41612 conformant (Class 2). In addition to the Standard and Auto Bus Grant connectors other connector types are available by special request, subject to a minimum order quantity.
Off-board active modules are supplied as standard. SCREW FIXINGS FOR VSB Contact VERO Electronics for details of on-board active For VMEXCEL, the normal method of attaching the Latchable Services Header termination, which can be supplied as a special option. rear shrouds to the backplane is by riveting. If it is Active termination offers a lower power method of intended to use positive retention to hold termination due to its use of Op-Amp in conjunction connectors or boards which are plugged into the with resistors, rather than simply employing the rear of the backplane, then screw fixings should resistors used in passive termination. be requested. These alternative fixings allow the easy deletion or addition of fittings in selected slots. Depending on the level of activity on the bus, the
VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.04 faston israted at18Ampsperconnector. 6,35mm faston tabs. The combinedpower bug/ system givinganM4screwterminalwithtwo POWER BUG/FASTON -Acombinationconnector
9.05 Bus Based Technology9 connectors aresuppliedwiththebackplanes. at10Amps.with eachcontactrated Mating MATE latchable 'N'LOK-Apolarised, connector to thebackplane. of methodsinwhichthepowermaybeintroduced Power Bug / Faston Connectors Faston / Bug Power Connectors Lok 'N' Mate The VME POWER-ON OPTIONS VME XCEL XCEL backplanerangeemploysavariety BACKPLANES VERO Electronics backplane. feature mustbespecifiedwhenorderingthe power railsofthebackplanes istin-leadplated. This connecting strap. The strap, whichattachestothe J1 andJ2backplanes only, anoptionalpower as amethodofformingcontinuouscircuitbetween Busbar POWER STRAP - The VME Connector Spade 6,35mm Faston connector, rated at12Amps. FASTON -Asimple6,35mmfaston spade busbar isupto125Aona21slotbackplane. simplifies wiring. powerThe maximum rating ofthe busbar methodimprovespowerdistributionand whenusedonlargerbackplanes.particularly The is aconvenientformofpowerconnection, thick x10mmwidetinleadplatedcopperbar. This (without fastontabs)connectedtogetherviaa2mm BUSBAR -Acombinationofupto6power bugs Power Strap Power Technical Enquiries Technical
☎ U.K. XCEL
rangefeatures, 01489 780078 780078 01489 is abletotailorthebackplaneexactrequirements. and offering thispower-on positionflexibility, VERO with busbarmountingscrews. take M6cableclamps.Itissuppliedasapaircomplete connection ofpowertothebusbarviaaholedrilled as anaccessoryinordertoallowalternative Power Bracket Power By utilisingtheestablishedVME between theJ1andJ2areas. either intheJ1areaofbackplaneorcentrally 'N' Lok,Faston, Power Bugorbusbar, islocated The connectionfor power, whichismadeby Mate illustrated) position (central Options Position Power may beintroducedtothebackplane. Monolithic hastwopositionsinwhichthepower POWER POSITIONOPTIONS- The VME U.S.A. Power Bracket
1 800 242 2863 242 800 1 POWER BRACKET - The Power Bracket isoffered XCEL buildcriteria 243-310367D XCEL VMEXCEL BACKPLANES MECHANICAL SPECIFICATIONS
The VMEXCEL backplane range - J1, J2 and Monolithic - employs the following mechanical specifications
BACKPLANE HEIGHT J1 and J2 3U (128,5 mm / 5,06”) Monolithic 6U (262 mm / 10,31”)
BACKPLANE WIDTH
The width of all VMEXCEL backplanes can be calculated using the following formula;
Board width = 0.752” + ([N-1] x 0.8) inches (x 25.4 = mm)
Where N = number of slots X = 0,281” + 0,752” is the sum of the overhang at either end of Y = 0,471” the backplane 0,752”
CONNECTOR PITCH Backplane Width All connectors mounted on VMEbus backplanes use a 4HP (20,32mm / 0,8”) pitch
BOARD THICKNESS 9
All VMEXCEL backplanes are 2,7mm (0,11”) thick multilayer constructions.
MOUNTING POSITIONS
VMEXCEL J1 and J2 backplanes have two rows of Hole clearance mounting holes, monolithic backplanes have three 2,5mm rows.
Each row of backplane mounting holes is aligned Technology Bus Based with the connector mounting holes. The connector mounting holes are 0,3mm (0,012”) to the left of centre of row b pins when viewed from the front (connector side) of the backplane. Each backplane is supplied with enough screws (M2,5 x 6mm long cheese head) to secure it to the tie bars of a subrack. Backplane spacer strips are also required and must be ordered separately. Please refer to Subracks; section 4, page 4.31 for spacer details.
BACKPLANE ASSEMBLY DEPTH Backplane Mounting Positions
The overall depth of the J1 VMEXCEL off board terminated backplane assembly, X, covers the distance from the front face of the subrack tie bar spacer to the rear of the terminator module’s pcb. Off board terminated assembly depth, X = 22,5mm.
VMEXCEL J2 terminator modules are fitted with a DIN 41612 reverse connector shell which increases the overall depth of the backplane assembly by 13mm.
Depth of Backplane Assembly - J1 off board termination illustrated
VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.06 VME
9.07 Bus Based Technology9 Power Bug/Fastonpowerconnection,21slotswide Auto BusGrantconnectors,off boardtermination, VME To configureyour VME XCEL τ ω δ β α Notes Example: 4 slotandaboveonly 7 slotandbelowonly 8 slotandaboveonly J2 only Includes terminatormodules J1 Backplanes J1 4 xx x x x 4 - 243 XCEL 243-412121 BACKPLANES - 3U J1 and J2 and J1 3U - BACKPLANES α β XCEL OffBoard Termination (Active, screw fixingfor VSB) /STDConnector= VERO Electronics bcpae s h hr eo oslc h etrsadotosyurqie Ordering Information below backplane, toselectthefeatures usethechart andoptionsyou require: α β β isaVME OnBoard Termination (Screw fixingfor VSB) /STDConnector= OffBoard Termination (Screw fixingfor VSB) /STDConnector= XCEL J1backplanewith
α α OffBoard Termination (Active) /ABGConnector= OffBoard Termination (Active) /STDConnector= α α VME OffBoard Termination /ABGConnector= OnBoard Termination /STDConnector= OffBoard Termination /STDConnector= On Board Termination /ABGConnector= Technical Enquiries Technical XCEL VME VME For any other configuration or slot size, please contact please size, slot or configuration other any For VERO Electronics Sales Office. Sales Electronics VERO J2 Backplanes J2 XCEL XCEL J2= J1= ẘ ẗ
δ ☎ PowerBug/Faston-withStrap=
U.K. τ Mate'N'Lok-withPowerStrap=
ω δ 01489 780078 780078 01489 Busbar-withPowerStrap= Faston-withPowerStrap= δ ẞ ẓ Ẓ ẛ ẚ ẙ ẘ ẗ ẻ PowerBug/Faston= τ Mate'N'Lok= backplane withbusbarpowerconnection. The maximumfiguresareobtainedfroma21slot 1,5A perpinfortheDINconnectors. from theVMEbusspecificationusingafigureof
ω δ VME the maximumpowerhandlingcapabilitiesof The abovefiguresareprovidedasanindicationof POWER RATINGS (21SLOT BACKPLANE) J1 ANDJ23U Busbar= Faston= VTY15 / 4 n/a 24A n/a 1.5A 5VSTBY Voltage 1V15 / 4 n/a 24A n/a 1.5A +12V 1V15 / 4 n/a 24A n/a 1.5A -12V V45 ,A15 125A 125A 4,5A 4,5A 5V U.S.A. XCEL Preferred slotsizes . The maximum perslotfiguresaretaken
ẓ Ẓ ẛ ẚ ẙ ẘ ẗ ẻ 1 800 242 2863 242 800 1 1J 1J2 J1 J2 J1 a.prso Totalpower Max. perslot ẻ ẗẘ ẻẙ ẻẟ ẘẗ ẻẝ ẘẻ ẻẒ ẗẒ ẻẛ ẗẚ ẻẚ ẘẗẻ ẻẘ VMEXCEL BACKPLANES - 6U MONOLITHIC
To configure your VMEXCEL Monolithic backplane, use the chart below to select the features and options you require: Ordering Information 243 - 4 3 X X XX J1/J2 Monolithic
α Off Board Termination / STD Connector = ẻ On Board Termination / STD Connector = ẗ α Off Board Termination / ABG Connector = ẘ On Board Termination / ABG Connector = ẙ α Off Board Termination (Active) / STD Connector = ẚ α Off Board Termination (Active) / ABG Connector = ẛ On Board Termination (Screw fixing for VSB) / STD Connector = Ẓ α Off Board Termination (Screw fixing for VSB) / STD Connector = ẓ α Off Board Termination (Active, screw fixing for VSB) / STD Connector = ẞ
τ Mate 'N' Lok = ẻ Σ Option 1 δ Power Bug/Faston = ẗ (J1) δ Notes { Busbar = ẘ ω α Includes terminator modules Faston = ẙ τ τ 4 slot and above only Mate 'N' Lok = ẚ Σ Option 2 δ δ 8 slot and above only Power Bug/Faston = ẛ (Centre) δ ω 7 slot and below only { Busbar = Ẓ ω Σ Option 1 locates the power connectors Faston = ẓ 9 in the J1 position on the board Preferred Slot Sizes ẻẗ ẗẘ Σ Option 2 locates the power connectors ẻẙ ẗẚ centrally. ẻẛ ẗẒ
Example: 243-436614 is a VMEXCEL Monolithic ẻẝ ẘẻ ẻẟ ẘẗ backplane with on-board termination, screw fixings ẗẻ for VSB, standard connectors, busbar power For any other configuration or slot size, please contact connection in the centre position, 14 slots wide. VERO Electronics Sales Office. Technology Bus Based
VMEXCEL Monolithic Backplanes MONOLITHIC 6U MATERIAL SPECIFICATIONS - POWER RATINGS (21 SLOT BACKPLANE) VMEXCEL RANGE Voltage Max. per slot Total Board 5V 9A 125A Epoxyglass fibre to BS 4584 EP-GC-CU-3 (FR4) +12V 1.5A 24A Material thickness 2.7mm nominal -12V 1.5A 24A Bare boards are UL 94V-0 rated. 5VSTBY 1.5A 24A File number E. 116551 Connectors - Standard DIN 41612 and Auto Bus Grant (ABG) The above figures are provided as an indication of IEC 603-2 (DIN 41612) 96 way the maximum power handling capabilities of Body material: glass filled polyester UL 94V-0 rated VMEXCEL. The maximum per slot figures are taken from the VMEbus specification using a figure of Insertion force (mating)/pair: ͧ90N 1,5A per pin for the DIN connectors. Withdrawal force (unmating)/pair: ͧ90N Min. pin to board retention force: 30N per contact Environmental The maximum figures are obtained from a 21 slot o o backplane with busbar power connection. Temperature range - storage: - 40 C to + 120 C Temperature range - working: - 20oC to + 85oC It is possible to modify standard product to provide Altitude: 3000 m in excess of 200A on the +5V line if required. Please Humidity: 90% R.H. non-condensing contact VERO Electronics. Shock and vibration resistant: commercial MTBF to MIL -HBK-217E: >225000 hours Conditions: Ground benign Temperature 25oC Insertion frequency: 0.5 to 5 per 1000 hours
QUALITY ASSURANCE
VMEXCEL backplanes are manufactured in accordance with quality assurance levels to BS9000, CECC 23000 and IECQ PCQ88. Systems approval in accordance with BS EN ISO 9001, ISO 9002 and EN 29002.
VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.08 liue 3000m Groundbenign 0.5to 5 per1000hours 90%R.H. non-condensing hours >225000 frequency: Insertion commercial Conditions: MTBF toMIL-HBK-217E: Shock andvibrationresistant: - 20 Humidity: Altitude: Temperature range -working iih ltdcpe 40 Platedcopper- Finish: eprtr ag soae- 40 Temperature range-storage Environmental 30Npercontact Min. pintoboardretentionforce: Withdrawal force(unmating)/pair: oymtra:glassfilledpolyester Insertion force(mating)/pair: material: Body IEC 603-2(DIN41612)96way Grant (ABG) Connectors -Standard DIN41612andAuto Bus number E. 116551 Bare boardsareUL94V-0 rated components, File
9.09 Bus Based Technology9 of highperformanceVMEsystems, Designed tocopewiththeeverincreasingdemands VMEbus backplanes. reaches newlevelsofperformanceforstandard oia hcns 4,5mm 35 4584 BS Base copperthickness: Nominal thickness: Dielectric epoxyglassto Board MATERIAL SPECIFICATIONS HIGH PERFORMANCE VME PERFORMANCE HIGH ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● FEATURES pins enablesverylowcrosstalkfigurestobeachieved. additional groundtrackpatternsthroughconnector Surface mountterminationandVERO'sunique typical applicationarea. important systemrequirements-VME64beinga tightly controlledimpedanceorhighpowerare backplanes shouldbeusedwhereverylownoise, The VME VME and positionsprovidedonJ2 Decoupling capacitorsfittedforeachslotonJ1 very highpowerapplications Extra powerconnectorsavailableoptionallyfor M6 studs New low-profilehighperformancebusbarswith ■ ■ ■ Three powerconnectionoptions: Autobahn terminationpositionsavailable lead lengthandreducecrosstalk Surface mountterminationtoreduceinductive surface mountterminationwithSchottkyclamp Mechanically in-board,electricallyout-board patterns additional guardtracksthroughconnectorpin Patented earthguardtrackingtechniqueswith Excellent crosstalkperformance. 50 10 layerstriplineconstruction. capability. High performance80Mbyte/secsystems 1994) Conforms to VME64 specification(ANSI/VITA1- VME64 compatible Auto busgrantconnectorsoptional. Excellent groundshiftperformance. positions. shrouds fittedtoallJ2andslots1&“n”J1 Gold platedrearplug-upconnectorsand system functionsandremotepowersensing. Two optionsfor retainedandlatchingheaderfor provided foreachJ1slotposition Voltage smoothingcapacitorpositionsare Ω Busbars Powerbug withdualfaston Mate 'N'Lokconnector ELITE optionally Tin lead - 5 5 Tin lead- controlledcharacteristicimpedance. ELITE MONOLITHICBACKPLANE highperformancebackplanerange VERO Electronics Temperature 25 µ m approximately UL 94V-0 rated o EP-GC-CU-3 (FR4) C to+120 o µ C to+85 m average ͧ ͧ ELITE 90N 90N µ o o o m C C C VME connectors issurroundbyanannularearthring. coaxial transmissionline,buteachsignalpinonthe trace completelyguardtracked,creatingaquasi- The newlayoutensuresthatnotonlyiseachsignal stopped shortoneithersideofaslotposition. length ofthebackplane. Previously, theguardtrack that guardtracksarenowcontinuousdowntheentire the connectorareaoftrackinginterconnectso The designofVME the backplanes’crosstalkperformance. new latticedguardtracklayoutthatfurtherenhances GENERATIONS OF VMEbus BACKPLANE CROSSTALK PERFORMANCEOFFOUR Electronics. VMEbus backplane ever offered by VERO VME M akln crosstalk VME Backplane M 4(99 3 -1,6dB 83% VME 64(1989) making VME The featuresdescribedabovehavecontributedto elements. inductive couplingbetweenthetermination lengths andstublengths,whichinturnreduces improves crosstalkperformancebyreducinglead termination layout.UsingSMDcomponents VERO’s VME CROSSTALK PERFORMANCE High Performance VME Technical Enquiries Technical tnadVE%of5layer Standard VME ae 18)Rfrne0dB Reference 5 layer(1981) akln crosstalk Backplane ELITE ELITE ELITE XCEL incorporatesanadvancedsurfacemount (92 0 -0,9dB 90% (1992) (94 1 -10,2dB 31% (1994) ELITE BACKPLANES ELITE thehighestperformingstandard design incorporates acompletely designincorporates ELITE % of5layer
hasincreasedthespacein ☎ U.K.
01489 780078 780078 01489 Decibel VERO’s VME 64backplane range. way headertoprovidebackwardcompatibilitywith Decibel from VME mating halfandflyingleadstoallowsimpleupgrade with twoservicesheaders:a5wayheader All VME LATCHABLE SERVICES HEADER YRST91 SYSRESET 10 9 SYSRESET YFI SYSFAIL 8 7 SYSFAIL U.S.A. CAL56ACFAIL 6 5 ACFAIL PIN ALLOCATION 10 WAY HEADER ASSEMBLY N GND 2 1 GND 5 +5V 4 3 +5V ELITE XCEL
1 800 242 2863 242 800 1 backplanesaresuppliedasstandard Note: Headerispolarised atpin1 monolithicstoVME ELITE , anda10 HIGH PERFORMANCE VMEELITE BACKPLANES
VMEELITE HIGH PERFORMANCE BACKPLANES WITH STANDARD CONNECTORS Ordering information MONOLITHIC 6U Preferred Slot Order code POWER RATINGS (21 SLOT BACKPLANE) width Mate “n” lok Power bug/spade Busbar Voltage Max. Total Total 5 243-451005B 243-451105J 243-451205E per slot Std. Optional 7 243-451007J 243-451107E 243-451207A 5V 9A 160A 300A 9 243-451009E 243-451109A 243-451209H +12V 1.5A 40A 40A 10 243-451010J 243-451110E 243-451210A -12V 1.5A 40A 40A 12 243-451012E 243-451112A 243-451212H 5VSTBY 1.5A 40A 40A 14 243-451014A 243-451114H 243-451214D 16 243-451016H 243-451116D 243-451216L The above figures are provided as an indication of 20 243-451020F 243-451120B 243-451220J the maximum power handling capabilities of VMEELITE. The maximum per slot figures are taken 21 243-451021D 243-451121L 243-451221G from the VMEbus specification using a figure of VMEELITE HIGH PERFORMANCE BACKPLANES WITH ABG CONNECTORS Ordering information 1,5A per pin for the DIN connectors. Preferred Slot Order code The maximum figures are obtained from a 21 slot width Mate “n” lok Power bug/spade Busbar backplane with busbar power connection. 5 243-453005C 243-452105D 243-453205F It is possible to modify standard product to provide 7 243-453007K 243-453107F 243-453207B in excess of 300A on the +5V line if required. 9 243-453009F 243-453109B 243-453209J Please contact VERO Electronics. 10 243-453010K 243-453110F 243-453210B To maximise power distribution efficiency the 12 243-453012F 243-453112B 243-453212J VMEELITE backplane has three 5V power planes 14 243-453014B 243-453114J 243-453214E and four 0V ground planes. 16 243-453016J 243-453116E 243-453216A
20 243-453020G 243-453120C 243-453220K 9 21 243-453021E 243-453121A 243-453221H For any other configuration or slot size please contact VERO Electronics Sales Office. MECHANICAL SPECIFICATIONS BACKPLANE WIDTH Where N = number of slots 0,665” is the sum of the overhang at either end of The VMEELITE backplane range employs the The width of all VMEELITE backplanes can be the backplane following mechanical specifications calculated using the following formula; CONNECTOR PITCH
BACKPLANE HEIGHT Board width = 0,665” + ([N-1] x 0,8) inches Technology Bus Based (x 25,4 = mm) All connectors mounted on VMEbus backplanes Monolithic 6U = 262 mm (10,31”) use a 4HP (20,32mm / 0,8”) pitch
BOARD THICKNESS
All VMEELITE backplanes are 4,5mm (0,177”) thick multilayer constructions.
MOUNTING POSITIONS
VMEELITE backplanes have three rows of mounting holes. Each row of backplane mounting holes is aligned with the connector mounting holes. The connector mounting holes are 0,3mm (0,012”) to the left of centre of row b pins when viewed from the front (connector side) of the backplane. Each backplane is supplied with enough screws (M2,5 x 6mm long cheese head) to secure it to the tie bars of a subrack. Backplane spacer strips are also required and must X = 0,313”+ Y = 0,352” be ordered separately. Please refer to Subracks; 0,665” section 4, page 4.31 for spacer details. BACKPLANE ASSEMBLY DEPTH Backplane Width The overall depth of the VMEELITE backplane assembly, X, covers the distance from the front face of the subrack tie bar to the rear of the rear connector shroud, where X = 18mm. QUALITY ASSURANCE
VMEELITE backplanes are manufactured in accordance with quality assurance levels to BS9000, CECC 23000 and IECQ PCQ88, with systems approval in accordance with BS EN ISO 9001, ISO 9002 and EN 29002.
VMEELITE is a trade mark of VERO Electronics Limited Backplane Mounting Positions Backplane Assembly Depth Mate 'N' Lok is a trademark of AMP
VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.10 the World’sfirst VME64 FEATURES switching viathe(optional)useofETLdevices. andincidentwavespecification for live insertion Development isinprogressonasupporting work addressing. connector onthebackplane togive slotgeographic shall betiedtogroundorleftopenontheJ1 Geographical addresspinsGA0-GA4andGAP 9.11 boards and VME64 between moregroundreturns Thirty-five VME64x more +5Vpower. Improved supplyvoltages of+3,3Vand48Vplus definable connector. pinsona2mmhardmetric the P1/J1andP2/J2toprovideanextra 95user An optionalP0/J0connectorcanbeusedbetween Bus Based Technology9 tothedevelopmentcontribution ofthe VME64 maintenance anddiagnosticsof VME64 give improved manufacturability, testability, An optionaltestandmaintenancebus interface to J1 for futureuse. Ten sparebussed pinsand2unbussed ontheP1/ 46. User definedI/OpinsontheP2/J2increasedby - 47groundreturns. open architecturebusses by manufacturing VME for new support itslongtraditionofearly confirmed VERO ElectronicsCircuitBoardDivisionhas edge of VMEbus boardtechnology. BACKPLANE when viewed fromtheconnector side). slot positionbefore slot1islost (totheleftofbackplane to “grow” the backplaneslightly. Asaresultofthisgrowth one itisnecessary increased numberoflinesrequiringtermination, NOTE ● ● ● ● ● ● ● ● with the160pin VME64 compatible sothata96pinDINconnectorcanmate areas. These new connectorsarebackward row “z” and “d” pinrows inboththeP1/J1andP2/J2 The introductionofa160pinDINconnectorwith backplane designareasfollows: boards. The majornew features whichaffect the features thatcanbeaddedto VME and VME64 The VME64 Standard, VITA1-1994, definesasetof of theevolution ofthedraftspecifications. contribution tothedesignprocessanditsawareness Standards Organisation(VSO),ensuresbothits specifications. VERO’s involvement withthe VITA VERO's new VME VME VME optionally Cast +3,3Vbusbar andstiffener available All longtailsgoldplated Decoupling capacitorsfitted Power connectionsviabusbars andpower studs Electronic on-boardAuto BusGrant clamp Surface mountpassive withSchottky termination Tightly controlledimpedance 12 layer construction stripline : Duetothewidthof160pinconnectorand 2 - VME64 EXTENSIONS - VME64 2 BACKPLANE FOR VME 64 64 VME FOR BACKPLANE 2 backplane representsthecutting X backplanes, providing -intotal X X VERO Electronics backplane, as part ofits backplane, aspart connector. X boards. iih ltdcpe 40 Platedcopper- Finish: number E. 116551 Bare boardsareUL 94V-0 rated components, File 2 X , oia hcns 4,5mm 35 4584 BS Base copperthickness: Nominal thickness: Dielectric epoxyglassto Board MATERIAL SPECIFICATIONS For anyOffice. otherconfigurationorslotsize pleasecontactVEROElectronicsSales VME VME Technical Enquiries Technical 2 2 VME64 VME64 Tin lead - 5 5 Tin lead- X X BACKPLANES(WITHP0/J0CONNECTOR) BACKPLANES(WITHOUTP0/J0CONNECTOR) Preferred Preferred it ls+,Vbsassifnr 0V,+5V plus+3,3Vbusbars/stiffeners 0V,+5V width plus+3,3Vbusbars/stiffeners width X So ubr V 5 Busbars Busbars0V,+5V Slot ltBsas0,+VBusbars Busbars0V,+5V Slot 20 17 14 10 20 17 14 10 7 7
☎ U.K. µ m approximately 01489 780078 780078 01489 EP-GC-CU-3 (FR4) µ m average liue 3000m Groundbenign 0.5to 5 per1000hours 90%R.H. non-condensing hours >225000 frequency: Insertion commercial Conditions: MTBF toMIL-HBK-217E: Shock andvibrationresistant: - 20 Humidity: Altitude: Temperature range -working µ m 4-760 243-479220A 243-479217A 243-479620G 243-479617G 4-764 243-479214G 243-479210D 243-479207D 243-479614B 243-479610K 243-479607K 4-760 243-470220B 243-470217B 243-470214H 243-470620H 243-470617H 243-470614C 4-760 243-470210E 243-470207E 243-470610L 243-470607L U.S.A. eprtr ag soae- 40 Temperature range-storage Environmental
1 800 242 2863 242 800 1 Order code Order code Temperature 25 o C to+120 o C to+85 Ordering information Ordering information o o o C C C VME 2 EXTENDER FOR VME 64 X MECHANICAL SPECIFICATIONS BACKPLANE WIDTH Where N = number of slots
2 1,550” is the sum of the overhang at either end of The VME2 backplane range employs the following The width of all VME backplanes can be calculated the backplane mechanical specifications using the following formula; CONNECTOR PITCH BACKPLANE HEIGHT Board width = 1,550” + ([N-1] x 0,8) inches (x 25,4 = mm) All connectors mounted on VMEbus backplanes Monolithic 6U = 262 mm (10,31”) use a 4HP (20,32mm / 0,8”) pitch
BOARD THICKNESS All VME2 backplanes are 4,5mm (0,177”) thick multilayer constructions.
MOUNTING POSITIONS VME2 backplanes have three rows of mounting holes, only two of which (the top and bottom) are usable when the optional P0/J0 connector is installed. The top and bottom row of backplane mounting holes are aligned with the connector mounting holes, but the centre row of mounting holes is offset by 2HP (0,4” or 10,16mm). The connector mounting holes are 0,3mm (0,012”) to the left of centre of row b pins when viewed from the front (connector side) of the backplane. Each backplane is supplied with enough screws (M2,5 x 6mm long cheese head) to secure it to the tie bars of a 9 subrack.
Backplane Width Backplane spacer strips are also required and must be ordered separately. Please refer to Subracks; section 4, page 4.31 for spacer details. BACKPLANE ASSEMBLY DEPTH The overall depth of the VME2 backplane assembly,
X, covers the distance from the front face of the Technology Bus Based subrack tie bar to the rear of the rear connector shroud, where X = 18mm. QUALITY ASSURANCE VME2 backplanes are manufactured in accordance with quality assurance levels to BS9000, CECC 23000 and IECQ PCQ88, with systems approval in Backplane Mounting Positions Backplane Assembly Depth accordance with BS EN ISO 9001, ISO 9002 and EN 29002. VME2 - VME64 EXTENSIONS EXTENDER VERO introduces a new 6U high extender for use with VME64X product applications. Designed to extend all J1 and J2 positions, all signal tracks are provided with jumper links. The extender is also fitted with a connector to allow the fitting of logic analyser or terminator modules.
FEATURES ● 10 layer stripline construction ● Individual signal track screening ● Jumper links on all signal tracks for interrogation purposes ● Connector position for logic analyser or terminator ● Cutout in P0/J0 area to allow dedicated cable assemblies to be connected to J0 on backplane to P0 on boards - improves flexibility of use ● Card support frame with ejector mechanism provided
NOTE: For details of the P0/J0 fully tracked version please contact VERO Electronics
VME2 EXTENDER Ordering information
Description Order code VME2 Extender 243-315442B
VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.12 liue 3000m Groundbenign ISO 9001,9002andEN29002. with systemsapprovalinaccordanceBSEN levels toBS9000,CECC23000andIECQPCQ88, manufactured inaccordancewithqualityassurance High performanceVMEbusJ1backplanesare 0.5to5per1000hours QUALITY ASSURANCE 90%R.H.non-condensing hours >225000 frequency: Insertion commercial Conditions: MTBF toMIL-HBK-217E: Shock andvibrationresistant: - 20 Humidity: Altitude: Temperature range -working iih ltdcpe 40 Platedcopper- Finish: eprtr ag soae- 40 Temperature range -storage Environmental 30Npercontact Min. pintoboardretentionforce: Withdrawal force(unmating)/pair: oymtra:glassfilledpolyester Insertion force(mating)/pair: material: Body IEC 603-2(DIN41612)96way Grant (ABG) Connectors -Standard DIN41612andAuto Bus number E. 116551 Bare boardsareUL94V-0 ratedcomponents, File
9.13 Bus Based Technology9 oia hcns 4,7mm 35 4584 BS Base copperthickness: Nominal thickness: Dielectric epoxyglassto Board MATERIAL SPECIFICATIONS ● ● ● ● ● ● ● ● ● ● ● FEATURES attributes foundinlargersystemstothe16bitarena. brought thesamehighperformance,lownoise development of64bitVMEbusproductsVEROhave BACKPLANES Born fromthedesignconceptsutilisedin J1 BACKPLANES PERFORMANCE HIGH PERFORMANCEVMEbusJ1 HIGH VMEbus shrouds fittedtoslot1and'n' Gold platedrearplug-upconnectorsand remote powersensing. Latchable headerforsystemfunctionsand Auto busgrantconnectorsoptional Excellent crosstalkperformance Excellent groundshiftperformance ■ ■ ■ Three powerconnectionoptions: termination. Mechanically in-board,electricallyout-board Patented earthguardtrackingtechniques. 50 11 layer lineconstruction. strip 1994) to Conforms VME64 specification(ANSI/VITA1- Ω Busbars Powerbug withdualfaston Mate 'N'Lokconnector Tin lead - 5 5 Tin lead- controlledcharacteristicimpedance. VERO Electronics Temperature 25 µ m approximately UL 94V-0 rated EP-GC-CU-3 (FR4) o C to+120 o µ C to+85 m average ͧ ͧ 90N 90N µ o o o m C C C For any otherslotsize orconfiguration pleasecontact VERO ElectronicsSalesOffice HIGH PERFORMANCEVMEbusJ1BACKPLANES Technical Enquiries Technical it distribution width ltPower Slot 1Powerbug/spade 21
☎ U.K.
01489 780078 780078 01489 YRST91 SYSRESET 10 9 SYSRESET Mate “n”lok Bus barkit YFI SYSFAIL 8 7 SYSFAIL U.S.A. CAL56ACFAIL 6 5 ACFAIL PIN ALLOCATION 10 WAY HEADERASSEMBLY N GND 2 1 GND 5 +5V 4 3 +5V
1 800 242 2863 242 800 1 Note: Headerispolarisedatpin1 243-305658G 243-305921G 243-305821L Order code Ordering information VMEbus LIVE INSERTION MODULE VMEbus LIVE INSERTION MODULE VERO's new LIModule allows individual daughter boards to be plugged into a powered and operating VME system. The LIModule is totally transparent in operation - even under worst case conditions - and is usable with active VME boards, VMEbus backplanes and extenders and Microracks. The module may also be adapted to support J2 mezzanines such as VSB, VXI and many others with the use of a special I/O mezzanine module. For further details contact VERO Electronics Technical Enquiries. LIModule fully conforms to IEEE P1014 R rev D, the VMEbus specification. Active signal buffering technology is employed to preserve VME compatibility. The LIModule improves productivity in the production, development and maintenance environments by allowing boards to be hot swapped whilst the system is running, avoiding shutdown with the corresponding loss of security and productivity. With the exception of the controller slot, the LIModule can be used in any slot position.
LIModule is a 60mm deep x 6U active extender card 9 second generation live insertion module, employing a combination of tri-state drivers and analog switches. Once inserted, board connection is by software control or mechanical switching. In either case, power-up and bus synchronisation is automatic. The use of the LIModule introduces an insertion delay of
25ns, which is insignificant - even in a 21 slot system. Technology Bus Based FEATURES ● Conforms to VME64 specification (ANSI/VITA1- 1994) ● 6U x 60mm deep extender board ● Tri-state, high speed 3ns, 64mA drivers on critical uni-directional lines i.e. address, data and control signals ● Analog Quickswitches on bi-directional lines such as interrupts and bus request ● Compatible with all VMEbus backplanes, extenders and systems Note: If standard J2 I/O pins are used on slots where the LIModule is employed, an I/O mezzanine module is also required. LIMODULE Ordering information
Description Dimensions Order Code Live Insertion Module 6U x 60mm 243-312082K I/O Mezzanine Module - 243-313122H For VSB and VXI mezzanine module please contact VERO Electronics Sales Office
VMEbus 60mm ADAPTORS VMEbus ADAPTORS Ordering information
When the LIModule is employed in a 220mm deep Description Order code subrack, standard 160mm deep VME cards are J1 60mm Adaptor 243-42629C brought level with the system's front panels. If it is necessary to maintain all cards at the same level it J2 60mm Adaptor 243-42628F is recommended that the VMEbus J1 and J2 adaptors are employed.
VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.14 9.15 Bus Based Technology9 VMEbus ADAPTORS ● ● ● ● ● ● ● FEATURES EXTENDERBOARDS VMEbus SUPPORT VMEbus BUS GRANT/IACKJUMPERBOARD ● ● ● ● FEATURES VMEbus ADAPTORS ● ● ● ● FEATURES BUS GRANT/IACKJUMPERBOARD EXTENDER BOARDS Enhanced BGRANT/IACKboard extender boardsto6Uhigh Conversion kitforcombiningJ1andJ2 Card eject/supportmechanismprovided connection Facility forlogicanalyserorterminatormodule interrogation Jumper linksprovidedtoallowsignalline outer layers Signal pin-outidentificationsilkscreenedonto screening Full groundplaneplusindividualsignaltrack Excellent performancewithamultilayerdesign Patented earthguardtracking Multilayer construction Separate 60mmJ1andJ2designs Single piece120mmJ1/J2design empty slot Maintains integrityofthermalmanagement-no Eliminated theuseofsmalljumperlinks Simplifies accessforfieldservice 6U doubleheightboard J1/J2 120mmAdaptor J2 Extenderboard J1 Extenderboard J2 60mmAdaptor J1 60mmAdaptor 6U Conversionkit Ejector arm Bus Grant/IACKboard Description Description Description connector Reverse DIN VERO Electronics Wirewrapping pins Ordering information Ordering information Ordering information 243-42629C 243-42628F 243-26487G 243-26499H 243-47628J Order code 188-27542E Order code Jumper links 188-308047K 188-47862A Order code VMEbus Powerfail Module Powerfail VMEbus Board Jumper IACK / BUSGRANT Boards Extender VMEbus VSB Backplane VSB Technical Enquiries Technical
☎ U.K.
01489 780078 780078 01489 BOARD VERSION ADDITIONAL FEATURES -ECONOMYON- ADDITIONAL FEATURES -OFF-BOARD VERSION ● ● ● ● ● ● ● ● ● ● ● FEATURES VSB BACKPLANES ACCESSORIES VSB BUSBACKPLANES Manual resettiming: 220V(+10%,-15%) System restarttiming: Power failuretiming: Output: input: Mains SPECIFICATION VMEbus POWERFAIL MODULE ● ● ● ● ● FEATURES POWERFAILVMEbus MODULEREV. D oiin f-or On-board Off-board Positions IEC connector shroud Pkt. 5 Pkt. IEC connectorshroud Passive on-boardtermination Fastons forpower-onconnection Retainer/Ejector kitincluded modulesincluded Off-board terminator Jumper positionsforBGIN*/BGOUT*daisychain Rear pluggableontoVMEJ2backplanes termination Rear shroudsinslots1&nallow for “off-board” Patented earthguardtracking resist protection Reliability ofmultilayerconstructionwithsolder C -November1986 Fully conformstotheVSBspecification-Revision Implements VMESubsystemBus(VSB) Aluminium cassette Universal mounting Special inputforexternalresetbutton Outputs for ACFAIL andSYSRESET Rev. D Conforms toVMEbusspecificationIEEE1014 Retainer/Ejector kits Pkt. 4 Pkt. Retainer/Ejector kits No. of 6 Slot 5 Slot 4 Slot 3 Slot 2 Slot U.S.A. VSB/J2 terminator Pkt. 1 Pkt. VSB/J2 terminator SYSRESET - L after man Reset min 200 ms 200 min opencollector opencollector SYSRESET -LaftermanReset ±50ms ms 300 SYSRESET -HafterDCwithinspec ms ±0,5 ms 3 SYSRESET -HafterACFAIL H SYSRESET -LafterACFAIL L SYSFAIL ACFAIL VMEbuspowerfailmodule ecito Pkt.size Description
1 800 242 2863 242 800 1 Description 4-69K243-312914B 243-312913D 243-312912F 243-56098K 243-56100K 243-56102D 4-69E243-312915L 243-56096E 4-69L243-312916J 243-56094L Order Code Ordering information Ordering information Ordering information 145-44690F Order code 188-39181D 243-53179F 188-53118L 300 ms±50ms Order code MMS - MODULAR MICRORACK SYSTEM MODULAR MICRORACK SYSTEM SUBRACK MODULE / COVERS VERO's VMEbus Microrack range has been A universal subrack forms the basis of all versions comprehensively upgraded with the introduction of of the Modular Microrack. The assembly of a range the Modular Microrack System - a new concept in of covers and panels allows the easy construction the provision of customer specific development of a 6U subrack, a 7U (½U top + 6U + ½U bottom) system requirements. subrack and an 8U (½ top + 6 + 1½ bottom) desk- top caseframe or subrack. The modular nature of this new Microrack system The standard VMEbus card depths of 160mm, allows a customised product to be made available 220mm and 60/160mm (60mm front recess) can be to the user in the shortest possible time. The ability accommodated. to configure the Microrack for specific applications allows the user to tailor the product exactly to his Specification requirements and budget. Extrusions: Aluminium alloy BS 1474HE9TF, conductive Value-engineering, combined with optimised End plates: 1,5mm MS zinc plate production methods, has resulted in a range of 6U Cover: 0,5mm MS zinc plate (ventilated) systems that is competitively positioned, but which 7U/8U Cover: 1,25mm MS zinc plate still enjoys the quality and performance associated Visible surface spray coated (RAL 7035 pale grey) with Microrack systems manufactured by VERO Base cover ventilated Electronics. Handles included on subrack versions The Modular Microrack System “MMS” offers 500mm total depth excellent performance characteristics in the key areas of VME card depths, ventilation, power supply VENTILATION/COOLING MODULE technology, desktop version and EMC protection. 6U VERSION FEATURES 4 different rear fan panels are available for optimised ● system ventilation in the 7U and 8U versions. All
Modular design 9 ● Short lead times fan panels are filtered. ● Available in 6U, 7U and 8U. 3U and 4U are under ● 1U fan tray, 250mm deep, fitted with development and due to be available during 1997 3 AC axial fans ● Optimised ventilation ● 1U filtered fan tray, 250mm deep, fitted with ● Rack mount or desktop version 3 AC axial fans ● VMEXCEL backplanes with ABG ● Various power supply options 7U/8U VERSION ● Standard 19" accessories from the KM6-II range Ventilation of the 6U subrack is achieved by the use of 2 different fan trays. Both fan panels are filtered.
can be used Technology Bus Based ● ● Quick change air filter element 3 AC axial fans 120mm x 120mm ● ● Ventilation systems for boards and power 3 DC axial fans 120mm x 120mm ● supplies operate independently from one another 3 DC temperature dependent variable speed fans ● ● Recessed front panel assembly for EMC shielding 3 DC temperature dependent variable speed fans ● Assembly to EMC standard with fan fail indication ● EMC front panel available on 6U subrack version ● User and display controls at the front on 7U and 8U versions ● Card depths of 160mm and 220mm available POWER SUPPLY/MAINS FILTER ● Easy access to J2 area at rear of unit MODULE ● Integral cable management channels ● Supplied fully assembled, wired and tested 6 different open frame power supply and mains filter combinations are available for the Modular Microrack System. The mains input is supplied through an IEC QUALITY ASSURANCE connector with a double fuse and an additional mains filter for maintaining interference suppression level VMEXCEL backplanes are manufactured in B. Models BVM354, 504 and 754 feature power accordance with quality assurance levels to BS9000, factor correction. A 2-way mains switch is integrated CECC 23000 and IECQPCQ88 with approval in in the top cover for the 7U and 8U versions. accordance with BS EN ISO 9001, ISO9002 and EN29002. ● BVM 200 5V/30A; +12V/8A; -12V/4A ● BVM 350 5V/50A; +12V/12A; -12V/5A ● BVM 450 5V/60A; +12V/20A; -12V/15A ● BVM 354 5V/50A; +12V/8A; -12V/4A VMEbus MODULAR MICRORACKS ● BVM 504 5V/75A; +12V/8A; -12V/4A 3U and 4U versions of the Modular Microrack are also ● BVM 754 5V/120A; +12V/12A; -12V/10A available. Please contact VERO Electronics further details. ● Other power supplies available on request
VMEXCEL BACKPLANES
VMEbus MICRORACKS VMEXCEL backplanes offer excellent performance VERO can also manufacture Microracks to suit specific characteristics in the key areas of controlled customer requirements. Please direct your enquiries to impedance, power distribution and termination VERO Electronics in Hedge End, Bremen, Beauvais, Hamden, Turin, Stockholm or Vaerløse design. ● 6 Layer stripline construction J1 and monolithic ● 4 Layer stripline construction J2 ● 57Ω characteristic impedance control ● Patented 'ground -guard-tracking' CE MARKING ● Excellent crosstalk performance Please refer to CE Marking statement on page 9.01 ● Auto Bus Grant (ABG)
VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.16 § VME ¶ Specialoption 9.17 Bus Based Technology9 MMS - MODULAR MICRORACK SYSTEM MICRORACK MODULAR - MMS To below configureyour toselectthefeatures ModularMicrorack System,usethechart andoptionsyou require: Example: filter isincluded,togetherwithaVME DC fans. Anopenframe power supply-BVM450withanadditionalmains ventilated basecover withafilterfitted. Attheback isarearfan panelwiththree 6U x84HPsubrackfor160mmdeepboardswitha½Utopcoverand1½ following configuration: 4 XX X X X X - 146 XCEL backplanes 146 -152391 6U 84HP160mm(60mmrecessed)= VERO Electronics isaModularMicrorackSystemassembledtothe ½U top,1½Ubottomfrontventilatedcovers8U= 6U 84HP220mm= 6U 84HP160mm= 160mm (60mmrecessed)ventilatedcovers6U= ½U top,bottomfrontventilatedcovers7U= XCEL 8U Desktop Version (withsidecovers) = 7U Desktop Version (withsidecovers) = 21slotmonolithicbackplane. urc oe etlto oe upyBackplane PowerSupply Ventilation Cover Subrack Rear fan panel, variable speedfans withFANFAIL indication¶= oueMdl oueMdl Module§ Module Module Module Module 220mm ventilatedcovers6U= 160mm ventilatedcovers6U= ẙ ẘ ẗ Technical Enquiries Technical No covers= Rear fanpanel,variablespeedfans= Rear fanpanel,DCfans=
Rear fan panel,AC fans = ẓ Ẓ ẛ ẚ ẙ ẘ ẗ ẻ ☎ 1U filteredfantray= U.K. 1U fantray= No cooling=
01489 780078 780078 01489 Ẓ ẛ ẚ ẙ ẘ ẗ ẻ BVM 350+Filter= BVM 200+Filter= BVM 754+Filter= BVM 504+Filter= BVM 354+Filter= BVM 450+Filter= U.S.A.
1 800 242 2863 242 800 1 ẘ ẗ Ẓ ẛ ẚ ẙ Mono. 21slotABG= Mono. 20slotABG= Mono. 16slotABG= Mono. 12slotABG= Mono. 10slotABG= J1/J2 21slotABG= J1/J2 20slotABG= J1/J2 16slotABG= J1/J2 12slotABG= J1/J2 10slotABG= J1 21slotABG= J1 20slotABG= J1 16slotABG= J1 12slotABG= J1 10slotABG= ẟẗ ẟẻ ẞẒ ẞẘ ẞẻ ẛẗ ẛẻ ẚẒ ẚẘ ẚẻ ẘẗ ẘẻ ẗẒ ẗẘ ẗẻ Ordering Information 160mm and220mm. Replacement filtersareavailableforcarddepthsof FILTER KIT SIDE COVERS FORDESKTOP VERSION Supplied asakit. assembly toenableitsuseasadesktopversion. These sidecoverscanbefittedtoaMMSframe VERSION SIDE COVERS FORDESKTOP etc. all compatibledividerkits,plug-inmodules,guides accessories. PleaseseeSection4forfulldetailsof with anextensiverangeofstandardKM6-II The ModularMicrorackSystemcanalsobefitted EMC frontpanels,sidecoversandfilterkits. the varioustypesofModularMicrorackincluding There isawiderangeofaccessoriesavailablefor ACCESSORIES MODULAR MICRORACK EMC-FRONTPANELS is intendedfor useonthe6Uversion only. The anodisedfrontpanelhasnocablingcutoutsand to accommodatecablingonthe7Uand8Uversion. 7035) frontpanelhascutoutsonthebottomflange Modular Microrack Systems. The painted (RAL screening on6U,7Uand8Urecessedversionsof The EMCfrontpanelcanbefittedforincreased EMC FRONT PANEL FILTERS EMC-FP RAL7035 EMC-FP anodised Filter forMMS6Ux220mm Filter forMMS6Ux160mm Side cover8U Side cover7U Description Description Description VERO Electronics Ordering information Ordering information Ordering information 146-010502A 146-010505C 146-010504F 146-010503J Order code Order code 146-010500G 146-010501D Order code Sales End plate for desktop version desktop for plate End Frame Mounting Horizontal EMC Frontpanel EMC Filter
☎ U.K.
01703 260211 01703 MMS - MODULAR MICRORACK SYSTEM MICRORACK MODULAR - MMS
U.S.A. HORIZONTAL MOUNTINGFRAME
For 1 800 242 2863 242 800 1 must beused. KM6-II FRONTDIVIDERKITS Please seeSection4forfulldetails. and themountingof3Uplug-in-unitsinfrontrack. after assembly. They allow thecombinationof3Uand6Uboards KM6-II dividerkitscanbemountedinthefrontofamicrorack KM6-II DIVIDERKITS HORIZONTAL MOUNTINGFRAME format. accommodates upto5I/Omodulesof6Ux4HP microrack, thehorizontalmountingframe Mounted intheunused3Uareaatrearof GUIDES thickness andplug-inunitsfor Eurocard guidesaresuitableforboardsof1,6mm GUIDES KM6-II PLUG-INDISC-DRIVEMODULES 30HP (HD5¼").PleaseseeSection4forfulldetails. of 3Uandawidth8HP(FD3½"),12HP(HD3½") conjunction withfrontdividerkits. The moduleshave aheight Plug-in discdrivemodulescanbemountedinaMicrorack PLUG-IN DISCDRIVEMODULES Horizontal MountingFrame 84HP incl.FP Divider Width Left hand Right hand Right hand Left Divider Width 5¼ Plug-in unit ud yeBoard length Guide type Eurocard " diskdrivemodulesguidesforplug-in-units Module HD5¼" Module HD3½" Module FD3½" 42HP 36HP 24HP 21HP Description Description Please seeSection4forfulldetails. 5-065 950-202611L 950-202605D 950-202609J 950-202604H 5-065 950-202610B 950-202605F 220 160 160 100 950-202615C - 3½ " diskdrives. 950-201275F Ordering information Ordering information Ordering information Ordering information 174-010001G 174-010199H 146-010506L 174-010198L Order code Order code 950-232665C 950-242850B 950-232664E 950-232662J Order code 9.18
Bus Based Technology9 9.19 3Slot 3U Tower Microrack Watt power supply. The rackmount3slotMicrorackisfittedwitha200 suitable fortherequirementsofmostsmallsystems. (110 Watt ifadditionalcoolingissupplied)which The tower rack isfittedwithan80 Watt power supply be punchedtofacilitatethemountingofconnectors. be usedforI/Omodules,transitionmodulesorcan racks havethree6Ux4HPblankpanelswhichcan disk drives andoneharddiskdrive. The rearofboth rack mountversioncanaccommodate2x3½”floppy 3½” floppy diskdrive andoneharddiskdrive. The There isadequatespaceinthetowersystemfor1x Bus Grantconnectors. Bus BasedFEATURES Technology9 Divider Kit-RackMount EN29002. accordance withBSENISO9001, ISO9002and CECC 23000andIECQPCQ88with approvalin accordance withqualityassurancelevels toBS9000, 3 SLOTVMEbusMICRORACKS to besplitinto6off3Ux4HPpositions. kit whichallowsthe3off6Ux4HPrearI/Opositions Available for the2Urack mountversion isadivider DIVIDER KIT ● quality 3slotVME x 160mm6Uboardswhichplugdirectlyintoahigh The newMicrorackscanaccommodatethree4HP is comparable with VERO’s largerMicroracks. design prioritiesand,inthisrespect,the3slotsystem EMC shieldingandairflowmanagementwerekey in amorecompactform. the featuresandflexibilityoflargerMicroracks,but The new Microracks have beendesignedtooffer all and I/Oconnectors. complete systemswithonlyafewcards,diskdrives products, whichcaneasilybeintegratedinto the developmentofemergingsingleboardcomputer These 3slotMicroracksareintendedtocompliment MICRORACKS MICRORACK VMEBUS 3SLOTDEVELOPMENT VMEbus SLOT 3 VME QUALITY ASSURANCE ● ● ● ● ● ● ● ● Please referto 3Slot 2URackMountMicrorack CE CE CE CE CE supply -towerversion 80/110 Watt,85-264VACuniversalinputpower 1-1994) Conforms tothe VME64 specification(ANSI/VITA Auto BusGrantconnectors 3 slotVME Removable diskdrivehousing mounting position 1 or2x3½”floppydiskandonehard 3 6Ux4HPrearI/Opositions 3 6Ux4HPcardslots - rackmountversion 200 Watt,115/230VACswitchablepowersupply MARKING XCEL Description backplanesaremanufactured in XCEL CE Markingstatementon page9.01 Monolithicbackplane XCEL backplanefittedwithauto VERO Electronics 224-315100G 224-315410C 224-314400L Ordering information Order code Technical Enquiries Technical
☎ U.K.
01489 780078 780078 01489 U.S.A. Airflow
1 800 242 2863 242 800 1 Disk Drive Airflow Power Supply 80/110 Watt 315 Airflow Transition Module Electronics Technical Sales. Electronics Technical customising possibilitiespleasecontactVERO For in-depthdetailsoradiscussionofthe range. fully customisedversionsoftheVXIbusproduct divisions ofVEROenablestheprovisionsemi-or customising capabilitieswithinthemanufacturing The totalin-housedesign,manufactureand latest revision (rev. 1.4)tothe VXIbus specifications. Microracks andmodules-fullyconformswiththe backplanes, extenderboards,prototyping VERO's rangeofVXIbusproducts-multilayer instruments. provision foradditionalchassisscreeningbetween physically screenedagainstEMConallsideswitha incorporated intoasystemmustbecapableofbeing arises fromthefactthatanyVXIbusinstruments The mostimportantvariationinthetwostandards functions ontheP3connector. functions ontheP2connectorandafurthersetof follows theVMEstandards,itincludesdefined Although theVXIbusspecification,broadlyspeaking, System, providing ahighdegreeofflexibility. the useofstandardVMEbusmoduleswithinaVXI may beusedinaCorDsize Microrack. This allows of alargersize, for example, AandBsize cards cards. Any sizemodulemay beplaceinacardcage and Bmodulesthesamesizeas3U6UVMEbus the useoffour bus modulesizes (Fig. 1),withtheA for The specificationgoverningVXIbus-anacronym generic instrumentationarchitecture-VXIbus. VMEbus sinceitsinceptionand,from1987,with VERO Electronicshasbeencloselyinvolvedwith made availablebyhundredsofmanufacturers. decade, withmanythousandsofactivecardsbeing VMEbus hasbecomewellestablishedoverthelast INTRODUCTION VXIbus BACKPLANES FEATURES BACKPLANES VXIbus ● ● ● ● ● ● ● ● ● “D” size 13 slot 395,00 x 395,00 x 395,00 “D” size13slot “C” size 13 slot 262,00 x 395,00 x 262,00 “C” size13slot distribution andminimisingIRshift. and voltageplanesprovidingevenpower Monolithic designofferingcontinuousground permits finetuningofthesystem provided betweeneachconnectorslot.This Additional decouplingcapacitorpositions grounding ofplug-ininstrumentmodules. Exposed groundplaneareatofacilitateRFI between terminationnetworks. High-speed decouplingcapacitorspositioned CLK100 distribution. On-board socketedECLbuffersforCLK10& all highspeedlines. techniques utilizedtominimisesignalskewon Differential trackingandlinelengthequalization Auto busgrantconnectorsfittedasstandard controlled characteristicimpedance. 12 layerstriplineconstructionensuresprecisely revision 1.4 Fully conformstotheVXIbusspecification, “D” size 5 slot 395,00 x 152,40 x 395,00 “D” size5slot “C” size 6 slot 262,00 x 182,88 x 262,00 152,40 x 262,00 “C” size6slot “C” size5slot V ecito Dimensions Description MEbus e X tensions for VERO Electronics I nstrumentation -defines Ordering information 63-310535G Order Code 63-310537A 63-310536D 63-310539F 63-310538J identical tothestandardVXIbusbackplane. All otherfeatures,dimensionsandspecificationsare on theDsize. laminated busbarsfortheCsizebackplaneandfour laminated busbarsfortheremainingvoltages;two Sales 9,53mm To introducethepower tothebackplane, two specifications. current drawnasspecifiedbytheVXIbus to ensurethateveryvoltagecanhavethemaximum Extra powerpositionsareaddedtothebackplane size backplanes. A highpoweroptionisavailableon13slotCandD HIGHPOWERBACKPLANES VXIbus 1 Figure
☎ 2 U.K. copperbusbarsareprovided,plus
01703 260211 01703
U.S.A.
1 800 242 2863 242 800 1 VXIbus HIGH POWERBACKPLANES SECTION THROUGH A 12 LAYER VXIbus BACKPLANE VXIbus LAYER 12 A THROUGH SECTION D ie1 lt3,0kW “D” size13slot C ie1 lt1,9kW “C” size13slot ecito Powerrating Description VXIbus BACKPLANES VXIbus Ordering information Vcc GND Vcc Vcc Signal Vcc GND Signal Gnd Signal Vcc GND 63-314295G Order Code 63-314297A 9.20
Bus Based Technology9 9.21 Bus Based Technology9 laboratory applications. in anattractive enclosurefor free-standingofficeor systems, aspartofarackmountedsystem,orhoused available inanumberofoptionstointegrateintolarger Fully wiredandreadyforuse,theMicroracksare management andRFIshielding. and conflictinginterestsofefficientthermal the mosteffective compromisebetweenthediffering Computer AidedDesignhasbeenemployed, ensuring deliver upto1100Wofcloselyregulatedpower. Various highperformance power sourcesareusedto ● ● ● OPTIONS compared againstavalue pre-setonaswitch register. The spottemperatureismonitoreddigitallyand active temperatureprobe. and aspottemperature,whichismeasuredviaan parameters measuredincludeallpowersupplyrails VXIbus Microrack usingtheGPIBdatabus. The of remotelymonitoringtheoperatingparametersa The GPIBMonitorBoardoffers theusercapability GPIB MONITOR BOARD MICRORACKS VXIbus KM6- duty chassissystem,designedaroundthesuccessful The basisoftheseMicroracksisapurposebuiltheavy- transmitting sensitive,highspeedelectronicsignals. connectors andoffering theperfect environment for backplane, fittedasstandardwithAuto BusGrant At theheartofeachMicrorackisaVEROVXIbus standard. hardware requirementsoftheexactingVXIbus VERO's traditionofoffering atotalsolutiontothe systems. The VXIbus Microrack range continues engineered, ready-to-runmicroprocessorsupport The name“Microrack”issynonymouswithwell VXIbus MICRORACKS VXIbus every 100ms. generated ifthewatchdoginputisnotaccessed causing theMICRORACKSYSTEMRESET tobe RESET. Awatchdog functionmay alsobeused, GPIB1 moduletoinitiateMICRORACK SYSTEM The GPIBcontrollercanremotelycommand theVXI or remotely. LEDs, whichmaybemountedeitheron themodule indicating validityofthemeasuredparameterson The modulecanbeusedwithouttheGPIBinterface, voltage monitoring). to monitoranextraparameter(configuredforpositive A spareanalogueinputisavailabletoallowtheuser II andHD-167subracksystems. VERO Electronics ltPral 433x204560 6 Slot Portable ecito Dimensions Description EMC Rating (50% fingers) - VXIbus 6 Slot Portable Slot 6 VXIbus - fingers) (50% Rating EMC SUPPLY VOLTAGE -6SLOT PORTABLE ● ● ● ● ● ● ● ● ● ● ● FEATURES to-run environment. instruments inanEMCscreened,fullywired,ready- providing spaceforuptosixCsizeVXIbusmodular configured, yet cost-effective, systemsolution The 6slotportableVXIbusMicrorackisafully MICRORACK VXIbus 6SLOT PORTABLE “C” SIZE Microrack Technical Enquiries Technical 100 120 20 40 60 80 2 rearmountedAC fans with35cfmthroughput Lockable, EMCshieldeddoor Average 50 Watts perslotpower allowance Easily removablesidecoverallowsfortesting Standard 600 Watt wideinputpower suppply specification revision1.4 Bus GrantconnectorsconformingtoVXIbus 12 layer backplane stripline with Automatic fingers EMC upgradablebytheadditionofcopper Weight 15Kg Usable indesktoportowerconfigurations front panelsforcablemanagement C sizeportablechassiswith60mmrecessed Rugged, portable204x433560mmenclosure 0 5 1V-2 2V-4 52 -2V -5.2V -24V +24V -12V +12V +5V 0 A4 A4 5 8A 15A 4A 6A 4A 6A 40A 0.01 0.10 1.00
☎ 10.00 U.K. Ordering information
01489 780078 780078 01489 100.00 203-313400J Order code 1000.00 FEATURES formats; tower, desktopandrack mount. The CandDsizeMicroracksareavailableinthree accomplished. the upgradetoafullyscreenedEMCrackeasily 5 Slot“D”Sizerackmount 5 Slot“C”Sizerackmount 5 Slot“D”SizeDeskTop 5 Slot“C”SizeDeskTop 5 Slot“D”SizeTower 5 Slot“C”SizeTower ● ● ● ● supported byaconductiveKM6- VERO isahighperformance12layerbackplane, At theheartofall5slotVXIbusMicroracksfrom SUPPLY VOLTAGE -5SLOT C/D ● ● ● ● MICRORACKS VXIbus 5SLOT “C” AND “D” SIZE Weight 25Kgdesktop/tower, 18Kgrack mount 4U x622mmdeepDiplomatenclosure KM6- Accepts 5“C”or“D”sizemodules Optional GPIBmonitoravailable 550W powersupply Removable serviceaccesspanels Bus resettimingmodule 5 1V-2 2V-4 52 -2V -5.2V -24V +24V -12V +12V +5V 0 A6 A6 0 6A 30A 6A 6A 6A 6A 40A U.S.A. Description II conductivecardframe
1 800 242 2863 242 800 1 Ordering information II subrackmaking 203-304012H 203-304015B 203-304014B 203-304013F 203-304016L 203-304017J Order code 13 SlotRackMount ● monitor. additional optionalfanlocationsandGPIB Virginia Panel test interface mountingpositions, positions, rearI/Ocableexitpanel,MacPaneland Available inrack withslidemounting mountformat recessed, freeinganareaforcablemanagement. and vibrationresistantHD-167subracktobe extended by60mm,allowingtheheavydutyshock slot Csizeunitsexceptthattherackhasbeen A rackidenticalinbasicconstructiontostandard13 WITH CABLEMANAGEMENT VXIbus 13SLOT“C”SIZEMICRORACK SUPPLY VOLTAGE -13SLOT C ● ● ● ● ● ● ● ● ● ● FEATURES with BSENISO9001,ISO9002and EN29002. 23000 andIECQPCQ88withapproval inaccordance with qualityassurancelevelstoBS9000, CECC VXIbus backplanesaremanufactured inaccordance QUALITY ASSURANCE Please referto CE CE CE CE CE Description Optional thirdfanforextracooling Optional GPIBmonitoravailable connector mounting 1U removablerearpanelforcableexitorI/O by 75mm 9U highx671mmdeep,cardframerecessed Mac PanelandVirginiacompatible Weight 29Kg 800W powersupply(1100optional) Bus resettimingmodule Heavy dutycardframesystem(HD167) Depth 622mmdesktop,603mmrackmount Accepts 13“C”sizemodules 5 1V-2 2V-4 52 -2V -5.2V -24V +24V -12V +12V +5V 0 A6 A6 0 6A 40A 6A 6A 6A 6A 60A MARKING CE Markingstatementon page9.01 VERO Electronics Ordering information 203-311550L Order code 13 SlotRackMount 13 SlotDeskTop Sales SUPPLY VOLTAGE -13SLOT C formats; desktoporrackmount. The 13slotCsizeMicrorackisavailableintwo dissipation fromtheVXIbusmodules. to copewiththeeverincreasingdemandsofheat Airflow managementhasrecentlybeenupgraded and vibration. providing asystemabletowithstandsevereshock 167 militaryspecification,heavydutysubrack- high performanceVXIbusbackplaneandtheHD- Both racks around areconstructed VERO’s 12layer ● ● ● ● ● ● ● ● ● FEATURES VXIbus 13SLOT“C”SIZEMICRORACK Description Optional GPIBmonitoravailable Weight 42,5Kgdesktop,26rackmount 800W powersupply(1100optional) Removable serviceaccesspanels Bus resettimingmodule Heavy dutycardframesystem(HD167) 9U high Depth 622mmdesktop,603mmrackmount Accepts 13“C”sizemodules 5 1V-2 2V-4 52 -2V -5.2V -24V +24V -12V +12V +5V 0 A6 A6 0 6A 40A 6A 6A 6A 6A 60A
☎ U.K.
01703 260211 01703 Ordering information 203-303169B 203-302533A Order code
U.S.A.
1 800 242 2863 242 800 1 SUPPLY VOLTAGE -13SLOT D fitted heavydutycarryinghandles. The 13slotDsizeMicrorackissuppliedwithpre- maintenance orrepair. isremoveable allowingeasyaccessforroutine The fan tray, locatedatthebaseofunit, a fullyscreenedEMCrackeasilyaccomplished. FEATURES 13 Slot“D”SizeRackMount 5 1V-2 2V-4 52 -2V -5.2V -24V +24V -12V +12V +5V 0 A5 A4 0 20A 40A 4A 4A 5A 5A 80A ● conductive KM6- performance VXIbusbackplane,supportedbya around Constructed VERO’s 12layer high ● ● ● ● ● ● VXIbus 13SLOT“D”SIZEMICRORACK Accepts 13“D”sizemodules Weight 40Kg 1100W power supply 2U removablefantray Bus resettimingmodule KM6-II conductivecardframe 13U x533mmdeep VXIbus MICRORACKS VXIbus Description II subrackmakingtheupgradeto Ordering information 203-306842A Order code 9.22
Bus Based Technology9 oymtra:glass filledpolyester outsidelayers 80mm only. Insertion force(mating)/pair: mm 5,35 35mm. material: Body IEC 603-2(DIN41612)96way average. Plated copper -40mm Grant (ABG) 4584 BS Connectors -Standard DIN41612andAuto Bus Total : Finish : Base copperthickness: Nominal thickness: Dielectric Epoxyglassto BOARD SPECIFICATION BACKPLANES MATERIAL SPECIFICATIONS - VXIbus i.pnt or eeto oc:30Npercontact Min. pintoboardretention force: Withdrawal force(unmating)/pair:
9.23 Bus Based Technology9 ● ● ● ● ● ● ● ● ● ● FEATURES 12.70 mmor15.24pitchintegratedcircuits. BOARDS board patternallowstheuseof7.62mm,10.16 loaded withsocketed pressfitwirewrappins. The EXTENDER A highdensitymultilayerprototypingboardfully AND VXIbus PROTOTYPING BOARDS PROTOTYPING VXIbus File numberE116551 NOTE: Bare boardsareUL94 V-0 recognised components. VXIbus PROTOTYPING BOARDS VXIbus PROTOTYPING I/X or 233,34x340,00 VIC/VXI board Full RFIscreeningcapability. Easy accesstodistributedpowerplanes. pin. Suitable for P.G.A. styledevices upto17x Surface mountde-couplingcapacitors. Socketed pinsfor easeofcomponentassembly. Multilayer construction. Compatible withtheVXIbus“C”sizeformat. High densitywirewrapprototypingpattern. Full VMEbusinterfaceavailable revision 1.4 Fully conformstotheVXIbusspecification ecito Dimensions Description X or 233,34x340,00 VXI board EP-GC-CU-3 (FR4) Tin lead-5mm. UL 94V-0 rated VERO Electronics Ordering information ͧ ͧ 63-302203B 63-303103A 90N 90N Order code 9001, ISO9002andEN29002. Systems approvalinaccordancewithBSENISO and IECQPCQ88. with qualityassurancelevelstoBS9000,CECC23000 VXIbus backplanesaremanufacturedinaccordance QUALITY ASSURANCE ● ● ● ● ● ● ● ● FEATURES compatible withBorCsizecardsmodules. technology, tominimiseinducedcrosstalk. Itis multilayer boardutilisingsignalguardtrack The VEROVXIbusextendercardisa4layer EXTENDERBOARD VXIbus Technical Enquiries Technical generated noise. maximise protectionagainstexternally Compatible withVXIbusscreenedmodulesto Card ejectmechanismprovided. Test pointsprovided atfrontedgeofcard. minimise connectorstress. Cantilever brackettosupportinstrumentand 4 layermultilayerconstruction screened modules Compatible withsingleanddoublewidthVXIbus talk. Earth guardtrackingutilisedtominimisecross- revision 1.4 Fully conformstotheVXIbusspecification VXIbus EXTENDER VXIbus“C”sizeextender
☎ Description U.K.
01489 780078 780078 01489 Ordering information ● ● ● FEATURES CONNECTOR SHROUD CONNECTOR SHROUDS LIGHT DUTYMODULE VXIbus with twopartfrontpanelandnoEMCseals. A lowcostoptionsimilartonormaldutymodulebut LIGHT DUTYVXIMODULE ● ● ● ● ● ● ● ● FEATURES NORMAL DUTYVXIMODULE 63-302270E Order code Beryllium copperfingers Fits tobackplaneconnector Beryllium copperfingers Enhances performance Beryllium copperfingers Card mountingbrackets EMC sealing Ventilated covers Ejector handles Channel sectionfrontpanel Single anddoublewidth C andDsize U.S.A. C size,singlewidth Connector shroud Description Description
1 800 242 2863 242 800 1 VXIbus NORMAL DUTYMODULE C size,doublewidth D size,singlewidth C size,singlewidth Description Ordering information Ordering information 950-203353B 207-203582B
207-222002F
Order code Order code Ordering information 207-203544K 207-203543A
207-222524J
Order code liue 3000m Groundbenign 0.5to 5 per1000hours 90%R.H. non-condensing hours >225000 frequency: Insertion commercial Conditions: MTBF toMIL-HBK-217E: Shock andvibrationresistant: - 20 Humidity: Altitude: Temperature range -working iih ltdcpe 40 Platedcopper- Finish: a.cretprso 33:15A 12A - 40 1,5A 40A Temperature range-storage 500minimum(DINClass1) 24 + 8 Environmental Max. currentperslot-3,3V: Max. current perslot-5V: CompactPCI Connector Insertions: Max. currentperpin-signal: Max. currentperpin-power: Modular PowerConnector Connectors number E. 116551 Bare boardsareUL94V-0 ratedcomponents, File ● ● ● ● FEATURES Electronics forfurtherdetails. phased intoproduction.PleasecontactVERO packaging andpowersupplieswillbedeveloped backplanes, mixedtechnology 1997 afullrangeofproductincluding3Uand6U Initially, two backplanes willbeavailable. During unsuitable. where thestandardDesktopPCIwouldbe to theEurocardformatandusedinapplications allowing standardPCIcomponentstobeadapted CompactPCI iselectricallycompatiblewithPCI, Desktop PCI. more robustmechanicalformfactorthanthe industrial and/orembeddedapplicationsrequiringa Component Interconnect(PCI)specificationfor CompactPCI isanadaptationofthePeripheral extension totheCompany’s productoffering. with thelatestspecificationbecameanatural CompactPCI backplanerangethatisfullycompliant connector systems,producingahighperformance backplanes withhighlayercountsandmetric from designingandmanufacturingdenselytracked Due tothevastexperiencethatVEROhasgained 1.0, 1November, 1995). compatible withtheCompactPCIspecification(Rev. VERO's newCompactPCIbackplanesarefully COMPACTPCI BACKPLANE oia hcns 4,5mm 35 4584 BS Base copperthickness: Nominal thickness: Dielectric epoxyglassto Board MATERIAL SPECIFICATIONS supply connector Available withorwithouton-boardmodularpower Supports 5Vand3,3Vtechnology Supports 32or64bitPCItransfers 10 layerstriplineconstruction Tin lead - 5 5 Tin lead- VERO Electronics Temperature 25 µ m approximately o C to+120 EP-GC-CU-3 (FR4) o µ C to+85 m average µ o o o m C C C Sales For otherslotssizes, heightsorfor detailsofcustomversions pleasecontact VERO ElectronicsSalesOffice COMPACTPCI BACKPLANE
☎ UCmatC akln ihPUcnetr8 Slots 3U CompactPCIbackplanewithPSUconnector U.K.
01703 260211 01703 UCmatC akln 8 Slots 3U CompactPCIbackplane ecito SlotSize Description
U.S.A. COMPACT PCI BACKPLANES PCI COMPACT
1 800 242 2863 242 800 1 425-315337C 425-315737J Order Code Ordering information 9.24
Bus Based Technology9 9.25 Bus Based Technology9 Connector SystemoraseriesofM4PowerStuds. provided totheseplanesviaeithertheLOMET ground planedesign.Externalconnectionsare VERO hasintroducedthismultiplepowerand current demandfromfastleadingedgewaveforms, In ordertocounteracttheskineffect causedby high POWER DISTRIBUTIONSYSTEMS at extremeoperatingspeeds. the 2.1Vsupplyremainswithinspecification-even prevent voltage termination droop. This ensuresthat An arrayofelectroliticcapacitorsisincludedto TERMINATION VOLTAGEDROOP each slot. or 64bitscreeneddatabusandI/Oconnectionsfrom multiple powerandgroundconnections,afull128bit 1301.1 compatiblemetricconnectors,allowing supplied fullyassembledwith2mmpitchIEEE The Futurebus+Multi-profilebackplanesare permitting eliminationofcorneredorangled matrix, maximisinguseablebackplane area. boards andfortrackingtorunthrough theconnector enables theLOMETtointerfacewith high layercount planes withinthebackplane.Pressfit technology between thepowersourceand multiple power 64 connector, andprovides alowinductancepath connector, isbasedona48pin,2mmpitchEIAIS frequency losses. The LOMET, alatching,codeable power moduletothebackplanewithminimumhigh This allowspowertobebroughtfromtheintegrated problems VEROdevelopedtheLOMETSystem. “skin effect” and “wipe out”. To counterthese problems intheareaofpowerdistributionsuchas introduction ofB.T.L. drivers hashighlightednotable The developmentofFuturebus+,andthe CONNECTOR SYSTEM LOMET LOWIMPEDANCE ● ● ● ● ● ● ● ● ● ● FEATURES BACKPLANES BACKPLANES FUTUREBUS+ MULTI-PROFILE FUTUREBUS+ ■ ■ Choice ofpowerdistributionsystems Controlled characteristicimpedance microrack. power supply, ofthe suppliedintegrally aspart conjunction withaconventionalswitchmode of cascadingcapacitors. These operate in offering apassive solutionviatheuseofarange Fully compliantterminationvoltagedesign associated withpackagedterminationdesign. excessive stublengthsandinductivetraces a VERO ‘patented’design.using avoids This High performancesurfacemounttermination by meansofjumpers, toprovideprofile ‘A’ or ‘F’. Geographical encodingcanbeuserselected create partialreflectionoftheincidentsignal. bends insignaltraceswhichwouldotherwise trackUtilises curved technology, thereby Supports centralanddistributedarbitration Hard metricIEEE1301.1compatible 10 layerstriplinetechnology profile specifications Designed toIEEE896.2,rev5.5,July1991, M4 PowerStuds LOMET ConnectorSystem(optionalonrequest) VERO Electronics iih ltdcpe 25 Platedcopper- Finish: oia hcns:6,4mm 35 FUTUREBUS+ BACKPLANES Base copperthickness: Nominal thickness: EP-GC-Cu-3 (FR4) Dielectric epoxyglasstoBS4584 BOARD SPECIFICATION Technical Enquiries Technical i ed-5 Tin Lead- uueu+Mlipoie1 ltbcpae18btM td295x426 M4Stud Futurebus+ Multi-profile14slotbackplane128-bit uueu+Mlipoie1 ltbcpae6-i 4Su 295x426 M4Stud Futurebus+ Multi-profile14slotbackplane64-bit uueu+Mlipoie4so akln 2-i 4Su 295x139 M4Stud Futurebus+ Multi-profile4slotbackplane128-bit uueu+Mlipoie4so akln 4btM td295x139 M4Stud Futurebus+ Multi-profile4slotbackplane64-bit oa 33 Total -
☎ Description U.K. µ m approximately
01489 780078 780078 01489 µ µ µ m m m LOMET CONNECTOR number E116551 Bare boardsareULrecognisedcomponents,file connector Connector specification:EIAIS642mmpitchmetric U.S.A. Lomet Connector Description
1 800 242 2863 242 800 1 distribution Power Dimensions Ordering information 820-307836C Order code Ordering Information
819-309805G 819-310945H 819-309615A 819-309905C Order
code FUTUREBUS+ MICRORACKS FUTUREBUS+ 4 SLOT MICRORACK The result of VERO’s understanding of the Futurebus+ development forum - and our ability to value engineer high specification, high performance products - is the introduction of a number of low cost entry level systems for development projects and advanced, fully specified Futurebus+ development systems. ENTRY-LEVEL FUTUREBUS+ 4 SLOT MICRORACK DEVELOPMENT SYSTEM
● Multi-profile 10 layer stripline backplane (64-bit) ● Full access for development ● 350W power supply standard ● Supplied with 2,1V and 5V to backplane ● 3,3V optional ● 64-bit operation standard, 128-bit optional ● Available in Tower, rack mount and desktop options SYSTEM OPTIONS The 4 slot development system forms a building block to which a number of modifications can be made:- ADVANCED FUTUREBUS+ 4 SLOT 4 SLOT ENTRY LEVEL FUTUREBUS+ MICRORACK
● Additional voltage may be required from the MICRORACK DEVELOPMENT Ordering information 9 power supply (e.g. 3.3V). However, in order to SYSTEM Description Order code avoid damaging voltages being presented to ● Tower case 820-309891G active cards, the Futurebus + specification Multi-profile 10 layer stripline backplane (128- bit standard, 64-bit optional) Rack mount 820-309890J requires provision of power sequencing. A ● module is available to meet this requirement. Power Sequencing board Desktop 820-309892E ● ■ Correct power up and power down A system management module is available to ■ control bus reset and system reset. Enabled only when voltages in spec. ● ■ Compliant shutdown procedure in the event A battery back up and charging circuit module ADVANCED 4 SLOT FUTUREBUS+ MICRORACK is also available. of line failure Technology Bus Based ● ■ Fail-safe operation Ordering information A module to control fan speed in line with ● environmental conditions, minimising fan noise Thermal management control Description Order code ■ Intelligent fan control and maximising fan life is available. The sense ■ Multi-profile Microrack 820-310533F position for this module can be placed as Fan performance increases linearly with temperature needed. ACCESSORIES - FUTUREBUS+ MICRORACKS ● ■ Temperature sensed in two positions A fan fail module can be provided which ■ monitors satisfactory operation of each fan with Audible alarm ■ Visual alarm Description Order code an audible/visible (via front panel LED's)/TTL ■ EMC 12SU x 6SP front panel 932-235081E output of failure condition. Fail-safe operation ● EMC 12SU x 12SP front panel 932-235082C ● 128 bit backplanes. Advanced airflow design ● System management module ■ POWER SUPPLY Bus reset For any of the above special options please contact ● ■ 5V at 40A System reset your local VERO Sales Office. 12V at 12A ■ Power monitor 2.1V at 10A ■ Battery back up ● Autoranging 115V/230V ■ Battery recharge ● Meets UL 478, IEC 950, VDE 0805/6, EN 60950 ● Mass storage - 3½" disk drive mounting kit (safety) ● Fully EMC screened subrack ● Short circuit protection with auto-reset ● POWER SUPPLY Over voltage protection ● ● Power supply can be optionally upgraded 5V at 60A 12V at 20A THERMAL MANAGEMENT 2.1V at 4A ● High capacity, positive pressure card area ● Autoranging 115V/230V cooling (2 x 110 CFM fans), with isolated power ● Meets UL 478, IEC 950, VDE 0805/6, EN 60950 supply chamber (1 x 30 CFM fan). (safety) ● Short circuit protection with auto-reset CHASSIS ● ● Over voltage protection Removable panels fitted to both sides to permit ● Power supply can be optionally upgraded QUALITY ASSURANCE ready access to boards during development work. Futurebus+ backplanes are manufactured in ● Available in three formats:- accordance with quality assurance levels to BS9000, ■ Tower case CECC 23000 and IECQPCQ88 with approval in ■ Rack mount accordance with BS EN ISO 9001, ISO9002 and ■ Desktop EN29002.
CE MARKING Please refer to CE Marking statement on page 9.01
VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.26 9.27 Bus Based Technology9 ● ● ● ● ● ● FEATURES products. to engineerhighspecification,performance of theFuturebus+developmentforumandourability slot systemsistheresultof VERO’s understanding The recentintroductionofanumberadvanced14 MICRORACKS FUTUREBUS+ 14SLOTMICRORACK FUTUREBUS+ ● ● ■ ■ ■ Power Sequencingboard ■ ■ ■ ■ ■ ■ bit, 64-bitoptional) Multi-profile 10layerstriplinebackplane(128- Weight 31kg Status LEDsonfront panel Hard metric(KM25)chassis Rechargeable batterypack ■ ■ ■ ■ ■ System managementmodule ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Thermal managementcontrol ■ A fan fail moduleisprovided whichmonitors Battery recharge Battery backup Power monitor System reset Bus reset for thismodulecanbeplacedasneeded. and maximisingfan life. The sense positions ronmental conditions,minimisingfannoise A moduletocontrolfanspeedinlinewithenvi- exhaust area. board areaandwithinthepowersupply Thermal safetytripsareprovidedabovethe (power supplyhasintegralfan). fans), withisolatedpowersupplychamber High capacity, ductedcooling(3x110CFM Fail-safe operation Visual alarm Audible alarm Temperature sensedintwo positions temperature Fan performanceincreaseslinearlywith Intelligent fancontrol Fail-safe operation of linefailure Compliant shutdownprocedureintheevent Enabled onlywhenvoltagesinspec. Correct powerupanddown below). integrally aspartofthemicrorack(see switch modepower supply, supplied operate inconjunctionwithaconventional range ofcascadingcapacitors. These offering apassive solutionviatheuseofa Fully compliantterminationvoltagedesign 10 layerstriplineconstruction. rear. 128 bitdatalinewithI/Oconnectorsonthe packaged terminationdesign. and inductivetracesassociatedwith design. This avoids excessive stublengths termination usingaVERO‘patented’ High performancesurfacemount profile ‘A’or ‘F’. selected bymeansofjumpers,toprovide Geographical encodingcanbeuser incident signal. otherwise createpartialreflectionofthe bends insignaltraceswhichwould permitting eliminationofcorneredorangled trackUtilises curved technology, thereby of failurecondition. ble /visible (viafrontpanelLED’s) / TTL output satisfactory operationofeachfanwithanaudi- VERO Electronics CHASSIS ● ● ● ● ● ● ● Technical Enquiries Technical Current limitonalloutputs Over voltageprotection Short circuitprotectionwithauto-reset Meets VDE 0871, FCC20780ClassA 115V /230V(strappable) 12V at4A 3.3V at10A 2.1V at20A 5V at120A Supplied inrackmountformat. POWER SUPPLY
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01489 780078 780078 01489 ACCESSORIES -FUTUREBUS+MICRORACKS ADVANCED FUTUREBUS+14SLOT MICRORACK EN29002. accordance withBSENISO9001, ISO9002and CECC 23000andIECQPCQ88with approvalin accordance withqualityassurancelevels toBS9000, Futurebus+ backplanesaremanufacturedin Electronics SalesOffice For anyoftheabovespecialoptionspleasecontactVERO ENTRY LEVEL 14SLOT FUTUREBUS+ MICRORACK 64-bit backplaneisavailableasanoption. +12V/4A) anda128-bitbackplane asstandard. A features alowerpowerPSU(5V/70A,2.1V/10A, isalsoavailable. trips) control, andthermal This unit Management Module,batteryback-up,fanfail, (excluding thePowerSequencingModule,System A 14slotFuturebus+DevelopmentMicrorack FUTUREBUS+ MICRORACK ENTRY LEVEL14SLOT Please referto CE CE CE CE CE Multi-profile Microrack Multi-profile Microrack U.S.A. MARKING EMC 12SUx12SPfrontpanel EMC 12SUx6SPfrontpanel Description Description
1 800 242 2863 242 800 1 CE Description Markingstatementon page9.01 QUALITY ASSURANCE Ordering information Ordering information 820-310843B 820-310425J Order code Order code 932-235082C 932-235081E Order code MULTIBUS BACKPLANES MULTIBUS iPSB BACKPLANES FEATURES ● Fully conforms to the Intel Multibus specification revision 04 - June 1982, IEEE 796 ● Reliability of multilayer construction with solder resist protection ● Available in 6 and 12 slot widths ● Option provided for either serial or parallel priority ● Supplied fully assembled complete with termination ● 6,3mm power pick-up tabs ● Interlocking fingers allow positive location of iLBX 9
MULTIBUS iPSB BACKPLANE Ordering information
No.of Backplane dimensions No. of Order Positions Width x Length(mm) Layers code 6 slots 218,41 x 113,38 6 408-56386C 12 slots 218,41 x 204,8 5 408-56387L Bus Based Technology Technology Bus Based
MULTIBUS iLBX BACKPLANE FEATURES ● Fully conforms to the Intel Multibus specification revision 04 - June 1982, IEEE796 ● Double sided construction with solder resist protection ● Earth guard tracking ● Interlocking design to ensure alignment with iPSB backplanes ● 6,3 mm power pick-up tabs
BOARD SPECIFICATION - iPSB AND iLBX
Dielectric Epoxy Glass to BS 4584 EP-GC-CU-3(FR4) Nominal thickness: 2,4 mm Base Copper thickness: 30 µm Finish: Plated copper 25 µm average Tin lead 10 µm max Total 70 µm - outside layers only iLBX BACKPLANE Ordering information Maximum working temperature 85oC No. of Backplane dimensions No. of Order positions Width x Length(mm) Layers code Multibus is a trade mark of Intel Corporation 6 slot 120,10 x 90,93 2 408-52873D
Note:bare boards are UL94 V-0 Recognised components. File number E116551 VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.28 9.29 Bus Based Technology9 iPSB TERMINATORiPSB MODULE ACCESSORIES BACKPLANES II MULTIBUS WITH “ON-BOARD”TERMINATION iPSB BACKPLANE WITH “OFF-BOARD”TERMINATION iPSB BACKPLANE VERO Electronics are suppliedinpairs. terminator modulesmaybeorderedseparatelyand mounted atrightanglestothebackplane. Additional complete withtwoterminatormoduleswhicharerear Each iPSB TERMINATORMODULE Technical Enquiries Technical PBtriao 95,00x26,50 iPSB terminator ecito Dimensions Description iPSB off-boardbackplane
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01489 780078 780078 01489 Ordering information 188-39027D Order code issupplied with 12slotsorless. is fittedtoslotposition“0”onalliPSB backplanes BE REMOVEDfromtheterminator module whenit iih ltdcpe 30 Platedcopper Finish: ● ● ● ● ● FEATURES -ON-BOARD TERMINATION iPSB BACKPLANES“OFFBOARD” ● ● ● ● ● FEATURES -OFF-BOARD TERMINATION terminating resistors(110 terminating being centralisedonthesebackplanes.The four backplanes whichhave13through20slots:slot“0” suitable foruseateitherendofalltheiPSB and120W) resistors(110W fitted andis terminating The iPSBterminatormodulehastherequired pointfromthedriver. at the furthest be terminated Note:Signal linesBCLKandCCLKarerequiredto FOR iPSB BACKPLANE TERMINATIONREQUIREMENTS 3,2mm number E116551. Note: bareboardsareUL95 V-0 recognised components. File BS4584 Base copperthickness: Nominal thickness: Dielectric EpoxyGlassto BOARD SPECIFICATION BACKPLANES iPSB terminator modules. complete withpolarizedmatingpowerconnectorsandtwo Note: i PSB BACKPLANES“ONBOARD” oa 70 Total i ed5 Tin lead between resistornetworks High speedde-couplingcapacitorsprovided All terminationlinesfullybussed Power connectionvia25Aratedpowertaps 6 layerswithsolderresistprotection Reliability ofmultilayerconstructionusing - IEEE1296 Fully conformstoMultibusIISpecification between resistornetworks High speedde-couplingcapacitorsprovided requirements implement BCLKandCCLKtermination Full “off-board” withfacilities termination to pressfit IEC603-2connectors Completely assembledusinghighreliability 6 layerswithsolderresistprotection Reliability ofmultilayerconstructionusing - IEEE1296 Fully conformstoMultibusIISpecification 20 slot iPSB 128,55 x 400,49 x 128,55 298,88 x 128,55 197,28 x 128,55 20 slotiPSB 15 slotiPSB 10 slotiPSB 20 slot iPSB 128,55 x 400,48 x 128,55 197,28 x 128,55 20 slotiPSB 10 slotiPSB 7 slot iPSB 128,55 x 136,32 x 128,55 95,68 x 128,55 7 slotiPSB 5 slotiPSB U.S.A. 8 slot iPSB 128,55 x 156,64 x 128,55 8 slotiPSB ubro Dimensions Number of oiin widthxlength(mm) positions All iPSB off-board terminated backplanes aresupplied AlliPSBoff-boardterminated
1 800 242 2863 242 800 1 µ m -outsidelayers only(av.) Ω 35 and120 µ µ m forouterlayers m forinnerlayers 70 µ Ordering information Ω Ordering information EP-GU-CU3(FR4) m average ) NEED TO µ m min. 34-301381J 34-302847J 34-302144J 34-53176G 34-39021K 34-39020C 34-39019E 34-56178L Order code MULTIBUS II BACKPLANES iLBX II BACKPLANE FEATURES WITH “OFF-BOARD” TERMINATION ● Fully conforms to Multibus II Specification - Revision C, August 1984 - IEEE P1296 ● Reliability of multilayer construction, with solder resist protection ● Available in four backplane slot widths ● Completely assembled using high reliability pressfit IEC 603-2 connector ● Removable “off-board” termination ● High speed de-coupling capacitors provided between resistor networks
BOARD SPECIFICATION ILBX BACKPLANE Dieletric Epoxy Glass to BS4584 EP-GC-CU-3(FR4) Nominal thickness: 3,2 mm Base copper thickness: 70 µm for inner layers 35 µm for outer layers Finish: Plated copper 30 µm average Tin lead 5 µm max. Total 70 µm - outside layers only Note:bare boards are UL94 V-0 recognised components. File number E116551 iLBX BACKPLANES Ordering information Note: All iLBX II backplanes are supplied with polarized mating power connectors and one terminator board. 9 No.of Positions Board Dimensions (mm) Order code 2 Slot iLBX II 128,55 x 39,80 34-42854J 3 Slot iLBX II 128,55 x 60,12 34-52881J 4 Slot iLBX II 128,55 x 80,44 34-52883A 6 Slot iLBX II 128,55 x 110,92 34-39025E ACCESSORIES
iLBX II TERMINATOR MODULE REMOTE INTERFACE PANEL Technology Bus Based iLBX II TERMINATOR MODULE Each iLBX II backplane is supplied complete with one terminator module which is rear mounted at right angles to the backplane at the opposite end to slot position “0”. REMOTE INTERFACE PANEL The Remote Interface Panel is a single slot backplane for use in the lower position of slot position “0” of the Central Services Module. Wired connections to the appropriate points in the Multibus iLBX TERMINATOR MODULE Ordering information II System can be easily made as it has three signal REMOTE PANEL INTERFACE Ordering information lines tracked out to a pin header assembly. Description Dimensions (mm) Order code These signals are: ACLO - A.C. Low Description Dimensions (mm) Order code iLBX II Terminator 95,00 x 36,50 188-39028A CRST - Cold start Remote Panel 128,55 x 19,46 110-42777A WRST - Warm start Interface
MULTIBUS II EXTENDER BOARDS Ejector arm FEATURES Jumper link ● Wirewrapping Reliability of multilayer construction using pins balanced five layer design ● Solder resist protection on outer layers ● Patented earth guard tracking ● Signal pin-out identification silk screened onto outer layers Reverse DIN connector ● Jumper links provided to allow signal line interrogation MULTIBUS II EXTENDER BOARDS ● Facility for logic analyser or “stub” terminator Ordering information connection ● Card ejector/support mechanism provided Description Order code ● Conversion kit for combining iPSB and iPSB Extender board 34-39022F iLBX II extender boards to 6U high iLBX II Extender board 34-39026A 6U Conversion kit 188-39120J
A range of Multibus II Microracks are available to special order For a compatible range of general purpose extender cards, only . please refer to Section 8 of this publication For further information contact VERO Electronics. VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.30 resistor 9.31 Bus Based Technology9 Terminator module ● ● ● ● ● ● ● ● ● ● ● EXTENDERS AND ● FEATURES TERMINATORS BACKPLANES STEbus BACKPLANES, STEbus ● ● ● ● ● ● ● FEATURES STEbus TERMINATORMODULE 14 to21slotbackplanes:multilayerconstruction construction 3 to10slotbackplanes:doublesided provided forremotediagnostics Additional 96/wayrearplug-upconnector multilayer designs Patented earthguardtrackingarrangementon dependent uponslotwidth Double sidedormultilayerconstruction press-fit connectors Fully assembledusinghighreliabilityIEC603-2 Off-board termination achieved withboardconstruction Constant characteristicimpedanceofsignaltrack terminated Connector rows“a”and“c”fullybussed SYSRST, ATNRQO, TFRERR, 0Vand+5V Pick-up positionsprovidedbypinheaderfor Available inawiderangeofbackplane slotwidths IEEE 1000 Fully conformstotheSTEbusspecification SECTIONAL Four signallinesdiodeclamped All 49signallinesterminatedviaa270 Max. 25mmprotrusionfrombackplane Rear pluggableandreversible Active terminationdesign Small, 4HPwidedetachablemodule 3 layermultilayerconstruction Description DRA WING OF WING Signal 0V +5V 0V Signal 5 LA 5 YER BOARD YER VERO Electronics SECTIONAL Ordering information DRA 161-42790E Order code WING OF WING Signal Signal DOUBLE SIDED BOARD SIDED DOUBLE Ω iih ltdcpe 30 Platedcopper Finish: series For furtherinformation contactVEROElectronics. A range ofSTEbusMicroracks areavailable tospecialorderonly. EXTENDER CARDS 1,6mm 35 Note: AllSTEbusbareboardsareUL94 V-0 recognisedcomponents. Filenumber E116551 4584 BS Base copperthickness: Nominal thickness: Copper cladepoxyglassto BACKPLANES BOARD SPECIFICATION -DOUBLESIDED STEbus MULTILAYERBACKPLANES STEbus DOUBLESIDEDBACKPLANES Technical Enquiries Technical i ed5 Tin lead oiin it eghm)Layers widthxlength(mm) positions Ucneso i 2 - 6U conversionkit 0so 2,5x134 2 128,55x193,47 10 slot o fBaddmnin No.of Board dimensions No. of lt185 3,12 2 2 2 128,55x132,51 128,55x95,86 128,55x75,36 128,55x55,04 7 slot 5 slot 4 slot 3 slot oiin it eghm)Layers widthxlength(mm) positions 1so 2,5x469 5 5 128,55x416,99 128,55x274,75 21 slot 14 slot o fBaddmnin No.of Board dimensions No. of ecito or i.WxL(m No.of Layers Boarddim. WxL(mm) Description tnad100 0,42 100,00x305,24 Standard ue 0,0x352 3 100,00x305,24 Super
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01489 780078 780078 01489 µ EP-GC-CU3(FR4) m average µ m min. iih ltdcpe 30 Platedcopper Finish: µ m sophisticated applications. multilayer, superversion for highperformance, version forbasic,lowcostapplicationsanda types ofextenderboard-adoublesided,standard of theSTEbus,VEROElectronicshasdesignedtwo In ordertoaddressthewidelydiffering applications oia hcns:2,4mm 35 4584 BS Base copperthickness: Nominal thickness: Dielectric EpoxyGlassto BACKPLANES BOARD SPECIFICATION -MULTILAYER ● ● ● ● ● ● FEATURES EXTENDER BOARDS STANDARD ANDSUPER oa 70 Total i ed5 Tin lead connection Facility forlogicanalyseror“stub”terminator outer layers Signal pin-outidentificationsilkscreenedonto Signal resistprotectiononouterlayers Jumper linkedaccesstoeachsignalline Super version-multilayer Standard version-doublesided U.S.A.
1 800 242 2863 242 800 1 µ m -outsidelayersonly EP-GC-CU-3(FR4) µ m average µ m min. µ 159-42639G 159-42792K 159-52886A 159-56140B 159-56138D m Ordering information Ordering Information Ordering information 161-42794D Order 161-42796J code 161-53172B 159-42787K 188-27642E Order code Order code G-64bus and G-96bus BACKPLANES G-64 BUS FEATURES ● Fully conforms to G-64 bus specification, Revision 02.Nov.1984. ● Reliability of double sided PTH board with solder resist protection ● Available in five standard backplane slot widths ● Completely assembled using high reliability press-fit IEC 603-2 (DIN 41612) type “B”connectors ● Board construction allows constant characteristic impedance of signal tracks ● Full ground plane screen ● 6,3mm tabs provided for power pick-up The backplane is supplied completely with a -5V, voltage regulator already assembled.
BOARD SPECIFICATION Double sided copper clad epoxy glass to BS 4584 EP-GC-CU-3(FR4) Nominal thickness: 1.6 mm Base copper thickness: 35 µm Finish: Plated copper 30 µm average Tin lead 5 µm min. G-64 BUS Ordering information Total 70 µm
Signal No.of Backplane dim. Order 9 Note:bare boards are UL94 V-0 recognised components. File slots width x length code number E116551. 4 128,55 x 82,7 162-53124H Signal 8 128,55 x 164,0 162-42807G 12 128,55 x 245,0 162-42808D 16 128,55 x 326,3 162-42809A SECTIONAL DRAWING OF DOUBLE SIDED BOARD 20 128,55 x 407,6 162-53125E Bus Based Technology Technology Bus Based
G-96BUS MULTILAYER BACKPLANES
FEATURES
● Fully conforms to G-96 specification, revision 02 - November 1984 ● Reliability of multilayer construction with solder resist protection on both sides ● Available in five standard backplane widths ● Completely assembled using high reliability press- fit IEC 603-2 (DIN 41612) type C connectors ● On-board passive termination ● Board construction allows for constant characteristic impedance of signal tracks ● 6,3 mm tabs provided for power pick-up The connector pin definitions are so arranged as to allow a mixture of G-64 and G-96 boards within a G-96 system (a revised connector was introduced 1st January 1985 to ensure compatibility).
BOARD SPECIFICATION Double sided copper clad epoxy glass to BS 4584 EP-GC-CU-3(FR4) G-96 BUS Ordering information Nominal thickness: 2,4 mm No.of Backplane dim. Order Base copper thickness: 35 µm Signal Finish: Plated copper 30 µm average 0V slots width x length code Tin lead 5 µm min. Vcc 4 128,55 x 88,95 410-59956L Total 70 µm 8 128,55 x 170,23 410-59960C Signal Note:bare boards are UL94 V-0 recognised components.File 12 128,55 x 251,51 410-59964B number E116551. 16 128,55 x 332,79 410-59968A 20 128,55 x 414,07 410-59972D A range of G-64bus and G-96bus Microracks are available to SECTIONAL DRAWING OF 4 LAYER BOARD special order only. For further information contact VERO Electronics.
VERO Electronics Sales ☎ U.K. 01703 260211 U.S.A. 1 800 242 2863 9.32