DOCSLIB.ORG

Microblaze Processor Reference Guide Embedded Development Kit EDK 7.1I

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Microblaze Processor Reference Guide Embedded Development Kit EDK 7.1I MicroBlaze Processor Reference Guide Embedded Development Kit EDK 7.1i UG081 (v5.0) January 20, 2005 R © 2005 Xilinx, Inc. All Rights Reserved. XILINX, the Xilinx logo, and other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners. NOTICE OF DISCLAIMER: Xilinx is providing this design, code, or information "as is." By providing the design, code, or information as one possible implementation of this feature, application, or standard, Xilinx makes no representation that this implementation is free from any claims of infringement. You are responsible for obtaining any rights you may require for your implementation. Xilinx expressly disclaims any warranty whatsoever with respect to the adequacy of the implementation, including but not limited to any warranties or representations that this implementation is free from claims of infringement and any implied warranties of merchantability or fitness for a particular purpose. MicroBlaze Processor Reference Guide www.xilinx.com UG081 (v5.0) January 20, 2005 1-800-255-7778 MicroBlaze Processor Reference Guide UG081 (v5.0) January 20, 2005 The following table shows the revision history for this document. Date Version Revision 10/01/02 1.0 Xilinx EDK 3.1 release 03/11/03 2.0 Xilinx EDK 3.2 release 09/24/03 3.0 Xilinx EDK 6.1 release 02/20/04 3.1 Xilinx EDK 6.2 release 08/24/04 4.0 Xilinx EDK 6.3 release 09/21/04 4.1 Minor corrections for EDK 6.3 SP1 release 11/18/04 4.2 Minor corrections for EDK 6.3 SP2 release 01/20/05 5.0 Xilinx EDK 7.1 release UG081 (v5.0) January 20, 2005 www.xilinx.com MicroBlaze Processor Reference Guide 1-800-255-7778 MicroBlaze Processor Reference Guide www.xilinx.com UG081 (v5.0) January 20, 2005 1-800-255-7778 Table of Contents Preface: About This Guide Manual Contents. 7 Additional Resources . 7 Conventions . 8 Typographical. 8 Online Document . 9 Chapter 1: MicroBlaze Architecture Overview . 11 Features . 11 Data Types and Endianness . 12 Instructions . 13 Registers . 19 General Purpose Registers . 19 Special Purpose Registers . 20 Pipeline Architecture. 25 Branches. 26 Memory Architecture. 26 Reset, Interrupts, Exceptions and Break. 27 Reset . 28 Hardware Exceptions . 28 Breaks . 28 Interrupt . 29 User Vector (Exception) . 30 Instruction Cache . 30 Overview . 30 Instruction Cache Organization . 31 General Instruction Cache Functionality . 31 Instruction Cache Operation . 32 Instruction Cache Software Support . 32 Data Cache. 33 Overview . 33 Data Cache Organization . 33 General Data Cache Functionality . 34 Data Cache Operation . 35 Data Cache Software Support . 35 Floating Point Unit (FPU) . 36 Overview . 36 Format . 36 Rounding . 37 Operations . 37 Exceptions . 38 Fast Simplex Link (FSL) . 38 Hardware Acceleration using FSL. 38 MicroBlaze Processor Reference Guide www.xilinx.com 5 UG081 (v5.0) January 20, 2005 1-800-255-7778 R Debug and Trace . 39 Debug Overview . .39 Trace Overview . 39 Chapter 2: MicroBlaze Signal Interface Description Overview . 41 Features . 41 MicroBlaze I/O Overview . 41 On-Chip Peripheral Bus (OPB) Interface Description . 44 Local Memory Bus (LMB) Interface Description . 45 LMB Signal Interface . 45 LMB Transactions . .47 Read and Write Data Steering . 49 Fast Simplex Link (FSL) Interface Description . 50 Master FSL Signal Interface . 50 Slave FSL Signal Interface . 51 FSL Transactions . 51 Xilinx CacheLink (XCL) Interface Description . 51 CacheLink Signal Interface . ..
Load more

Recommended publications
  • Electronics/Computers
    Electronics/Computers Spaceborne Hybrid-FPGA System for Processing FTIR Data NASA’s Jet Propulsion Laboratory, Pasadena, California Progress has been made in a continu- vantage of the reconfigurable hardware in the software, it has been possible to re- ing effort to develop a spaceborne com- resources of the FPGAs. duce execution time to an eighth of that puter system for processing readout data The specific FPGA/embedded-proces- of a non-optimized software-only imple- from a Fourier-transform infrared sor combination selected for this effort is mentation. A concept for utilizing both (FTIR) spectrometer to reduce the vol- the Xilinx Virtex-4 FX hybrid FPGA with embedded PowerPC processors to fur- ume of data transmitted to Earth. The one of its two embedded IBM PowerPC ther reduce execution time has also been approach followed in this effort, ori- 405 processors. The effort has involved considered. ented toward reducing design time and exploration of various architectures and This work was done by Dmitriy L. Bekker, reducing the size and weight of the spec- hardware and software optimizations. By Jean-Francois L. Blavier, and Paula J. Pin- trometer electronics, has been to exploit including a dedicated floating-point unit gree of Caltech and Marcin Lukowiak and the versatility of recently developed hy- and a dot-product coprocessor in the Muhammad Shaaban of Rochester Institute brid field-programmable gate arrays hardware and utilizing optimized single- of Technology for NASA’s Jet Propulsion Lab- (FPGAs) to run diverse software on em- precision math library functions and a oratory. For more information, contact iaof- bedded processors while also taking ad- modified PowerPC performance library [email protected].
    [Show full text]
  • Of the Securities Exchange Act of 1934
    FORM 8-K SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 CURRENT REPORT Pursuant to Section 13 or 15(d) of the Securities Exchange Act of 1934 Date of Report: March 10, 1994 ADVANCED MICRO DEVICES, INC. ---------------------------------------------------- (Exact name of registrant as specified in its charter) Delaware 1-7882 94-1692300 - ------------------------------ ------------ ------------------- (State or other jurisdiction (Commission (I.R.S. Employer of incorporation) File Number) Identification No.) One AMD Place P.O. Box 3453 Sunnyvale, California 94088-3453 - --------------------------------------- ---------- (Address of principal executive office) (Zip Code) Registrant's telephone number, including area code: (408) 732-2400 Item 5 Other Events - ------ ------------ I. Litigation ---------- A. Intel ----- General ------- Advanced Micro Devices, Inc. ("AMD" or "Corporation") and Intel Corporation ("Intel") are engaged in a number of legal proceedings involving AMD's x86 products. The current status of such legal proceedings are described below. An unfavorable decision in the 287, 386 or 486 microcode cases could result in a material monetary award to Intel and/or preclude AMD from continuing to produce those Am386(Registered Trademark) and Am486(Trademark) products adjudicated to contain any copyrighted Intel microcode. The Am486 products are a material part of the Company's business and profits and such an unfavorable decision could have an immediate, materially adverse impact on the financial condition and results of the operations of AMD. The AMD/Intel legal proceedings involve multiple interrelated and complex issues of fact and law. The ultimate outcome of such legal proceedings cannot presently be determined. Accordingly, no provision for any liability that may result upon an adjudication of any of the AMD/Intel legal proceedings has been made in the Corporation's financial statements.
    [Show full text]
  • 2003 - 2019 Top 200 Employers for CPT Students**
    2003 - 2019 Top 200 Employers for CPT Students** **If a student is employed at the same Employer while in a different program, he/she will be counted multiple times for that employer. Top 200 Employer Names Number of Students Participating in CPT in 2003-2019 Amazon 9,302 Intel Corporation 6,453 Microsoft Corporation 6,340 Google 6,132 IBM 4,721 Deloitte 3,870 Facebook 3,810 Qualcomm Technologies, Inc 3,371 Ernst & Young 2,929 Goldman Sachs 2,867 Cummins 2,729 JP Morgan Chase 2,474 PricewaterhouseCoopers 2,295 Bank of America 2,241 Apple, Inc 2,229 Cisco System, Inc 2,133 Disney 2,041 Morgan Stanley 1,970 World Bank 1,956 Citigroup 1,904 Merrill Lynch 1,850 KPMG 1,464 Dell, Inc 1,448 Yahoo 1,403 Motorola 1,357 Tesla, Inc 1,314 eBay or PayPal 1,268 Kelly Services 1,195 EMC Corporation 1,119 NVIDIA Corporation 1,110 Walmart 1,108 Samsung Research America 1,102 Ericsson, Inc 1,100 Adobe Systems Incorporated 1,085 PRO Unlimited 1,042 Texas Instruments 1,022 Credit Suisse 1017 Barclays 970 Randstad 942 Sony 930 Schlumberger 928 McKinsey & Company 883 2003 - 2019 Top 200 Employers for CPT Students** **If a student is employed at the same Employer while in a different program, he/she will be counted multiple times for that employer. VMWare 868 Adecco 845 Philips 829 Deutsche Bank 797 Broadcom Corporation 791 HP, Inc 789 Oracle 789 Advanced Micro Devices, Inc 782 Micron Technology, Inc 775 Boston Consulting Group 755 CVS Pharmacy 741 Robert Bosch LLC 723 Bloomberg 711 State Street 705 Hewlett-Packard 702 Alcatel-Lucent 666 Oak Ridge Institute for Science and Education 662 Genentech 657 Symantec Corporation 657 Nokia 642 Aerotek, Inc 638 Los Alamos National Laboratory 638 LinkedIn 635 Tekmark Global Solutions LLC 634 Populus Group 624 Salesforce 623 SAP America, Inc 619 Juniper Network 609 Atrium 584 The Mathworks, Inc 582 Monsanto 581 Wayfair 580 Autodesk 571 Intuit 562 Wells Fargo 559 Synopsys, Inc 546 NEC Laboratories America, Inc.
    [Show full text]
  • ICE User Guide
    ICE User Guide Document # 38-12005 Rev. *D Cypress Semiconductor 198 Champion Court San Jose, CA 95134-1709 Phone (USA): 800.858.1810 Phone (Intnl): 408.943.2600 http://www.cypress.com Copyrights Copyrights Copyright © 2005 Cypress Semiconductor Corporation. All rights reserved. “Programmable System-on-Chip,” PSoC, PSoC Designer, and PSoC Express are trademarks of Cypress Semiconductor Corporation (Cypress), along with Cypress® and Cypress Semiconductor™. All other trademarks or registered trademarks referenced herein are the property of their respective owners. The information in this document is subject to change without notice and should not be construed as a commitment by Cypress. While reasonable precautions have been taken, Cypress assumes no responsibility for any errors that may appear in this document. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of Cypress. Made in the U.S.A. Disclaimer CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PAR- TICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may rea- sonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems appli- cation implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
    [Show full text]
  • 3Rd Gen Intel® Xeon® Scalable Platform Technology Preview
    Performance made flexible. 3rd Gen Intel® Xeon® Scalable Platform Technology Preview Lisa Spelman Corporate Vice President, Xeon and Memory Group Data Platforms Group Intel Corporation Unmatched Portfolio of Hardware, Software and Solutions Move Faster Store More Process Everything Optimized Software and System-Level Solutions 3 Announcing Today – Intel’s Latest Data Center Portfolio Targeting 3rd Gen Intel® Xeon® Scalable processors Move Faster Store More Process Everything Intel® Optane™ SSD P5800X Fastest SSD on the planet 3rd Gen Intel® Xeon® Scalable Intel® Optane™ Persistent processor Memory 200 series Intel® Ethernet E810- Intel’s highest performing server CPU 2CQDA2 Up to 6TB memory per socket with built-in AI and security solutions + Native data persistence Up to 200GbE per PCIe 4.0 slot for Intel® Agilex™ FPGA bandwidth-intensive workloads Intel® SSD D5-P5316 First PCIe 4.0 144-Layer QLC Industry leading FPGA logic performance and 3D NAND performance/watt Enables up to 1PB storage in 1U Optimized Solutions >500 Partner Solutions 4 World’s Most Broadly Deployed Data Center Processor From the cloud to the intelligent edge >1B Xeon Processor Cores Deployed in the >50M Cloud Since 20131 Intel® Xeon® >800 cloud providers Scalable Processors with Intel® Xeon® processor-based servers Shipped deployed1 Intel® Xeon® Scalable Processors are the Foundation for Multi-Cloud Environments 1. Source: Intel internal estimate using IDC Public Cloud Services Tracker and Intel’s Internal Cloud Tracker, as of March 1, 2021. 5 Why Customers Choose
    [Show full text]
  • 10Th Gen Intel® Core™ Processor Families Datasheet, Vol. 1
    10th Generation Intel® Core™ Processor Families Datasheet, Volume 1 of 2 Supporting 10th Generation Intel® Core™ Processor Families, Intel® Pentium® Processors, Intel® Celeron® Processors for U/Y Platforms, formerly known as Ice Lake July 2020 Revision 005 Document Number: 341077-005 Legal Lines and Disclaimers You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel technologies' features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com. Intel technologies may require enabled hardware, specific software, or services activation. Check with your system manufacturer or retailer. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548- 4725 or visit www.intel.com/design/literature.htm.
    [Show full text]
  • U.S. Integrated Circuit Design and Fabrication Capability Survey Questionnaire Is Included in Appendix E
    Defense Industrial Base Assessment: U.S. Integrated Circuit Design and Fabrication Capability U.S. Department of Commerce Bureau of Industry and Security Office of Technology Evaluation March 2009 DEFENSE INDUSTRIAL BASE ASSESSMENT: U.S. INTEGRATED CIRCUIT FABRICATION AND DESIGN CAPABILITY PREPARED BY U.S. DEPARTMENT OF COMMERCE BUREAU OF INDUSTRY AND SECURITY OFFICE OF TECHNOLOGY EVALUATION May 2009 FOR FURTHER INFORMATION ABOUT THIS REPORT, CONTACT: Mark Crawford, Senior Trade & Industry Analyst, (202) 482-8239 Teresa Telesco, Trade & Industry Analyst, (202) 482-4959 Christopher Nelson, Trade & Industry Analyst, (202) 482-4727 Brad Botwin, Director, Industrial Base Studies, (202) 482-4060 Email: [email protected] Fax: (202) 482-5361 For more information about the Bureau of Industry and Security, please visit: http://bis.doc.gov/defenseindustrialbaseprograms/ TABLE OF CONTENTS EXECUTIVE SUMMARY .................................................................................................................... i BACKGROUND................................................................................................................................ iii SURVEY RESPONDENTS............................................................................................................... iv METHODOLOGY ........................................................................................................................... v REPORT FINDINGS.........................................................................................................................
    [Show full text]
  • UG898 (V2019.2) October 30, 2019 Revision History
    See all versions of this document Vivado Design Suite User Guide Embedded Processor Hardware Design UG898 (v2019.2) October 30, 2019 Revision History Revision History The following table shows the revision history for this document. Section Revision Summary 10/30/2019 Version 2019.2 General Updates • Updated for Vivado 2019.2 release • Updated for Vitis™ software platform 06/04/2019 Version 2019.1 General Updates Initial 2019.1 release. MicroBlaze Configuration Wizard: MMU Page Updated links to Cache Page. Using the MicroBlaze Configuration Window Clarified number of block RAMs in 32-bit and 64-bit modes. Trace and Profiling Additional information on Extended Profiling. UG898 (v2019.2) October 30, 2019 Send Feedback www.xilinx.com Embedded Processor Hardware Design 2 Table of Contents Revision History...............................................................................................................2 Chapter 1: Introduction..............................................................................................5 Device Tools Flow Overview....................................................................................................... 5 General Steps for Creating an Embedded Processor Design................................................ 7 Completing Connections Using Designer Assistance.............................................................9 Making Manual Connections in a Design...............................................................................15 Manually Creating and Connecting to I/O Ports...................................................................16
    [Show full text]
  • 7 Series Fpgas Selectio Resources User Guide (UG471)
    7 Series FPGAs SelectIO Resources User Guide UG471 (v1.10) May 8, 2018 The information disclosed to you hereunder (the "Materials") is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL WARRANTIES AND CONDITIONS, EXPRESS, IMPLIED, OR STATUTORY, INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE; and (2) Xilinx shall not be liable (whether in contract or tort, including negligence, or under any other theory of liability) for any loss or damage of any kind or nature related to, arising under, or in connection with, the Materials (including your use of the Materials), including for any direct, indirect, special, incidental, or consequential loss or damage (including loss of data, profits, goodwill, or any type of loss or damage suffered as a result of any action brought by a third party) even if such damage or loss was reasonably foreseeable or Xilinx had been advised of the possibility of the same. Xilinx assumes no obligation to correct any errors contained in the Materials, or to advise you of any corrections or update. You may not reproduce, modify, distribute, or publicly display the Materials without prior written consent. Certain products are subject to the terms and conditions of the Limited Warranties which can be viewed at http://www.xilinx.com/warranty.htm; IP cores may be subject to warranty and support terms contained in a license issued to you by Xilinx.
    [Show full text]
  • Microblaze Processor Reference Guide Embedded Development Kit EDK 10.1I
    MicroBlaze Processor Reference Guide Embedded Development Kit EDK 10.1i UG081 (v9.0) R © 2008 Xilinx, Inc. All Rights Reserved. XILINX, the Xilinx logo, and other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners. NOTICE OF DISCLAIMER: Xilinx is providing this design, code, or information “as is.” By providing the design, code, or information as one possible implementation of this feature, application, or standard, Xilinx makes no representation that this implementation is free from any claims of infringement. You are responsible for obtaining any rights you may require for your implementation. Xilinx expressly disclaims any warranty whatsoever with respect to the adequacy of the implementation, including but not limited to any warranties or representations that this implementation is free from claims of infringement and any implied warranties of merchantability or fitness for a particular purpose. MicroBlaze Processor Reference Guide UG081 (v9.0) The following table shows the revision history for this document. Date Version Revision 10/01/02 1.0 Xilinx EDK 3.1 release 03/11/03 2.0 Xilinx EDK 3.2 release 09/24/03 3.0 Xilinx EDK 6.1 release 02/20/04 3.1 Xilinx EDK 6.2 release 08/24/04 4.0 Xilinx EDK 6.3 release 09/21/04 4.1 Minor corrections for EDK 6.3 SP1 release 11/18/04 4.2 Minor corrections for EDK 6.3 SP2 release 01/20/05 5.0 Xilinx EDK 7.1 release 04/02/05 5.1 Minor corrections for EDK 7.1 SP1 release 05/09/05 5.2 Minor corrections for EDK 7.1 SP2 release
    [Show full text]
  • Sanders and Advanced Micro Devices: the First Fifteen Years, 1969—1984
    A Case Study In Realizing The American Dream: Sanders and Advanced Micro Devices: The First Fifteen Years, 1969—1984 Copyright (c) 1984, 2004 by Thomas A. Skornia All Rights reserved under International and Pan American Copyright Conventions A CASE STUDY IN REALIZING THE AMERICAN DREAM: SANDERS AND ADVANCED MICRO DEVICES: THE FIRST FIFTEEN YEARS, 1969—1984 BY: THOMAS A. SKORNIA (c) 1984, 2004 PROLOGUE 6 It's a Long Way to a Gigabuck 6 I . IN THE BEGINNING 8 February 21, 1969 8 The Three Musketeers 9 Pillsbury, Brobeck & Who? 9 ""...and *** [he] could talk as fast as Ed Turney. " 10 II. BEFORE THE BEGINNING 13 Hogan's Heroes 13 The Intel Troika 14 Bay: ""You're on Thin Ice.'1 15 Malibu 16 Enter the King and Court 17 Gifford, Stenger, Giles & Botte 38 A Generous Settlement 18 Drucker to the Max 49 April 4, 1969 20 III. THE SOUTH SIDE 22 September 12, 1936 22 My Grandfather/Myself 23 Champaign (but no caviar - yet) 23 Mr. Moto 24 Hollywood Now - And Later 26 2 IV. MAY DAY 28 The Incorporation of Advanced Micro Devices 28 AMD - Choice Number 17 29 ""We're *** Going to Get the Money.11 31 How to Make a Million - and Take it with You 33 ""You Mean They're Really Gonna Try to Make the Stuff?'' .. 36 V. A WALK ON THE MOON 38 One Small Step for the Semiconductor Industry: One Giant Step for a Man 3 8 July 22, 1969: ""At the End of the Pushups, My Heart Was Slower Than At the Beginning.'1 39 Five to Spare - ""Good Old Henry." 41 Business Week: ""The Last Quarter to Get Into the Business '' 42 VI .
    [Show full text]
  • 1 Profitability in the Semiconductor Industry 1 Profitability in the Semiconductor Industry
    1 Profitability in the Semiconductor Industry 1 Profitability in the Semiconductor Industry The profitability of firms in the semiconduc- average selling price (ASP) of devices, capi- tor industry depends on a vast array of vari- tal spending, factory utilization, and prof- ables from manufacturing costs to name itability. Capital spending trends are recognition. Throughout the electronics reviewed, followed by a discussion of recent infrastructure the rules are changing as industry downsizing and the role the stock global competition intensifies, product life- market plays in the semiconductor industry. cycles shorten, and technology accelerates. As a result, the management of human Changes in product lifecycles, time-to- resources and compensation approaches market and fab cycle time are then exam- change, time-to market becomes more criti- ined. Next, typical methods of measuring cal, and business strategies are being re-eval- company profitability are reviewed, fol- uated. Despite the incredible profits of most lowed by a profitability comparison between semiconductor companies between 1993 and large and medium-sized semiconductor 1996, industry over-capacity in 1996 forced manufacturers as well as IC equipment sup- company restructuring and workforce pliers. Finally, the reasons why IC manufac- reductions, especially among semiconductor turing is so costly are presented, leading into equipment suppliers. an expanded analysis of cost per wafer in Chapter 2. In recent years, investors have become very attracted to high technology firms and the The Profitability Cycle stock market is influencing the way compa- nies are doing business. Having become the Long term, the sustained profitability of the objects of such close scrutiny, companies are semiconductor manufacturers depends on changing their approaches to capital spend- each company's ability to maintain high ing and risk.
    [Show full text]