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2004 Gamers' Hardware Upgrade Guide
Ace’s Hardware 2004 Gamers’ Hardware Upgrade Guide 2004 Gamers’ Hardware Upgrade Guide By Johan De Gelas – January 2004 Introduction Last week, we showed you a preview of the Athlon 64 3400+. Today, we'll investigate this new CPU as an upgrade to an existing system. How much performance do you gain when upgrading? What about the other features aside from performance, such as Cool'n'Quiet and more thermal and mechanical safety? As always, we start with a base system to be upgraded. This time around, our base system is equipped with an Athlon XP 2100+, as previous polls among our readers show that the faster versions of the Athlon XP "Palomino" were very popular in the early days of 2003. Now in 2004, Palomino is getting a little long in the tooth, so it's interesting to know whether or not an upgrade may be worthwhile. Our old system also contains a GeForce Ti 4200 and 512 MB of DDR266 (PC2100) memory. We will upgrade the CPU (to the Athlon 4 3400+) and memory (to DDR400 CAS 2) and compare that upgrade with one that simply upgrades the video card. As mentioned previously, we've done this before in many of our Gamer's Upgrade Guides. However, the gaming industry is not sitting still, and we are moving from hybrid DirectX 7/8 games to DirectX 8/9 games, which - as you will see - behave quite differently. The games you'll see tested in detail today are Halo 1.03, Return to Castle Wolfenstein: Enemy Territory, and X²- The Threat. -
Cash Flow Comparison
國立政治大學商學院國際經營管理 英語碩士學位學程 International MBA Program College of Commerce National Chengchi University 碩士論文 治 Master政 ’s Thesis大 立 學 國 三大電腦晶片製造商之財務比較‧ ‧ A ComparisonN of Major Computer Chipset Vendors a y t t i Inio Financial Point of View s n r a e i v l C n heng chi U Student: Roger Chang Advisor: Professor James Liu 中華民國一百年六月 June 2011 三大電腦晶片製造商之財務比較 A Comparison of Major Computer Chipset Vendors In Financial Point of View 研究生: 張鼎昱 Student: Roger Chang 指導教授: 劉助 Advisor: Prof. James Liu 治 政 大 立 國立政治大學 商學院國際經營管理英語碩士學 學位學程 國 碩士論文 ‧ ‧ N a y t t A Thesis i i s o r Sunbmitted to International MBAe Program a i v l NationalC Chengchi nUniversity he i U in partial fulfillmentngch of the Requirements for the degree of Master in Business Administration 中華民國一百年六月 June 2011 i Abstract A Comparison of Major Computer Chipset Vendors In Financial Point of View By Roger Chang The goal of this master thesis is to analyze the治 three major chipset players in today’s Personal 政 大 Computer (PC) industry, while立 providing recommendations in different perspectives. One of the perspectives is from the investor’s point of view to single out a 學company with the most long term 國 investment value. The other is from each company’s management point of view to suggest for the ‧ areas of improvement for the companies. Two of the three companies discussed in this thesis are ‧ American-based global companiesN namely, Intel and AMD, while the other is a Taiwanese company: a y t t i VIA Technology. -
User's Manual User's Manual
User’s Manual (English Edition) Intel Pentium 4 Socket 478 CPU AMD Athlon/ Duron/Athlon XP Socket 462 CPU AMD Athlon 64 Socket 754 CPU ZM-WB2 Gold * Please read before installation http://www.zalman.co.kr http://www.zalmanusa.com 1. Features 1) Gold plated pure copper base maximizes cooling performance and prevents CPU blocks from galvanic corrosion 2) Intel Pentium 4 (Socket 478), AMD Athlon/Duron/Athlon XP (Socket 462),Athlon 64 (Socket 754) compatible design for broad compatibility. 3) Three types of compression fitting are offered for use with water tubes (8X10mm,8X11mm,10X13mm) * Zalman Tech. Co., Ltd. is not responsible for any damage resulting from CPU OVERCLOCKING. 2. Specifications Part No Part name Q’ ty Weight (g) Use 1 CPU block 1 447.0 CPU mountimg 2 Hand screw 2 8.0 Clip mountimg 3 Thermal grease 1 1.8 Apply to cpu core 4 Clip 1 9.6 CPU block mountimg 5 User’s manual 1 6 Clip supports 2 8.2 Socket 478 7 Clip supports A 2 5.0 Socket 462 8 Clip supports B 2 5.0 Socket 462 9 Bolts 4 0.8 Clip supports, A, B-type 10 Paper washer 1 set 7, 8 mountimg 11 Nipple 2 6.2 Socket 754 mountimg 12 Back plate 60.0 Socket 754 mountimg Fitting to 13 Fitting 3 set 8 x 10mm, 8 x 11mm, 10 x 13mm tubes NOTE 1) The maximum weight for the cooler is specified as 450g/450g/300g for socket 478/754/462 respectively. Special care should be taken when moving a computer equipped with a cooler which exceeds the relevant weight limit. -
System Management BIOS (SMBIOS) Reference 6 Specification
1 2 Document Number: DSP0134 3 Date: 2011-01-26 4 Version: 2.7.1 5 System Management BIOS (SMBIOS) Reference 6 Specification 7 Document Type: Specification 8 Document Status: DMTF Standard 9 Document Language: en-US 10 System Management BIOS (SMBIOS) Reference Specification DSP0134 11 Copyright Notice 12 Copyright © 2000, 2002, 2004–2011 Distributed Management Task Force, Inc. (DMTF). All rights 13 reserved. 14 DMTF is a not-for-profit association of industry members dedicated to promoting enterprise and systems 15 management and interoperability. Members and non-members may reproduce DMTF specifications and 16 documents, provided that correct attribution is given. As DMTF specifications may be revised from time to 17 time, the particular version and release date should always be noted. 18 Implementation of certain elements of this standard or proposed standard may be subject to third party 19 patent rights, including provisional patent rights (herein "patent rights"). DMTF makes no representations 20 to users of the standard as to the existence of such rights, and is not responsible to recognize, disclose, 21 or identify any or all such third party patent right, owners or claimants, nor for any incomplete or 22 inaccurate identification or disclosure of such rights, owners or claimants. DMTF shall have no liability to 23 any party, in any manner or circumstance, under any legal theory whatsoever, for failure to recognize, 24 disclose, or identify any such third party patent rights, or for such party’s reliance on the standard or 25 incorporation -
Thermal and Electrical Specification of AMD Semprontm Processors
Thermal and Electrical Specification of AMD SempronTM Processors Thermal and Electrical Specification of AMD SempronTM Processors 27 September 2004 Page 1/5 Thermal and Electrical Specification of AMD SempronTM Processors ©2004 Advanced Micro Devices Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products and are for information purposes only. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppels or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN OR FOR THE PERFORMANCE OR OPERATION OF ANY PERSON’S SYSTEM, INCLUDING, WITHOUT LIMITATION, ANY LOST PROFITS, BUSINESS INTERRUPTION, DAMAGE TO OR DESTRUCTION OF PROPERTY, OR LOSS OF PROGRAMS OR OTHER DATA, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. -
PCSA Oct 2001
Understanding CPU Upgrades In theory, one way to t seems that every time a new software product is released the system require- ments are increased - everything from the hard drive capacity and CPU speed increase the performance of a Ito the required RAM. One of the apparently obvious ways to gain a speed PC with little effort is to increase is by upgrading the CPU. But such an upgrade isn’t always cost effective and in some cases simply increasing the available RAM can help considerably to upgrade the CPU. Surely it boost the apparent speed of the PC. Sometimes though the best (and maybe only) option is to upgrade the CPU, although this can be a more involved process than it can’t be that difficult? might at first seem due to socket/motherboard incompatibilities, differing CPU and Actually there’s lots to think RAM speed requirements, cooling problems and inevitably assorted knock-on effects causing the upgrade to be anything but cost effective. Also, it is worth about. remembering that just because the replacement CPU has, for example, double the clock rate of the old unit doesn’t necessarily mean that the new one will increase the By Phil Morris processing performance of the PC in question by anything like 100%. Technical Writer This article looks at some of the options for upgrading the CPUs in existing systems. It is extremely unlikely that recent processors like AMD’s Duron (and forthcoming Hammer) and Intel’s Pentium 4 and Itanium will require upgrading for some time, so I will omit those in the context of this article. -
MICROPROCESSOR REPORT the INSIDERS’ GUIDE to MICROPROCESSOR HARDWARE Slot Vs
VOLUME 12, NUMBER 1 JANUARY 26, 1998 MICROPROCESSOR REPORT THE INSIDERS’ GUIDE TO MICROPROCESSOR HARDWARE Slot vs. Socket Battle Heats Up Intel Prepares for Transition as Competitors Boost Socket 7 A A look Look by Michael Slater ship as many parts as they hoped, especially at the highest backBack clock speeds where profits are much greater. The past year has brought a great deal The shift to 0.25-micron technology will be central to of change to the x86 microprocessor 1998’s CPU developments. Intel began shipping 0.25-micron A market, with Intel, AMD, and Cyrix processors in 3Q97; AMD followed late in 1997, IDT plans to LookA look replacing virtually their entire product join in by mid-98, and Cyrix expects to catch up in 3Q98. Ahead ahead lines with new devices. But despite high The more advanced process technology will cut power con- hopes, AMD and Cyrix struggled in vain for profits. The sumption, allowing sixth-generation CPUs to be used in financial contrast is stark: in 1997, Intel earned a record notebook systems. The smaller die sizes will enable higher $6.9 billion in net profit, while AMD lost $21 million for the production volumes and make it possible to integrate an L2 year and Cyrix lost $6 million in the six months before it was cache on the CPU chip. acquired by National. New entrant IDT added another com- The processors from Intel’s challengers have lagged in petitor to the mix but hasn’t shipped enough products to floating-point and MMX performance, which the vendors become a significant force. -
Communication Theory II
Microprocessor (COM 9323) Lecture 2: Review on Intel Family Ahmed Elnakib, PhD Assistant Professor, Mansoura University, Egypt Feb 17th, 2016 1 Text Book/References Textbook: 1. The Intel Microprocessors, Architecture, Programming and Interfacing, 8th edition, Barry B. Brey, Prentice Hall, 2009 2. Assembly Language for x86 processors, 6th edition, K. R. Irvine, Prentice Hall, 2011 References: 1. Computer Architecture: A Quantitative Approach, 5th edition, J. Hennessy, D. Patterson, Elsevier, 2012. 2. The 80x86 Family, Design, Programming and Interfacing, 3rd edition, Prentice Hall, 2002 3. The 80x86 IBM PC and Compatible Computers, Assembly Language, Design, and Interfacing, 4th edition, M.A. Mazidi and J.G. Mazidi, Prentice Hall, 2003 2 Lecture Objectives 1. Provide an overview of the various 80X86 and Pentium family members 2. Define the contents of the memory system in the personal computer 3. Convert between binary, decimal, and hexadecimal numbers 4. Differentiate and represent numeric and alphabetic information as integers, floating-point, BCD, and ASCII data 5. Understand basic computer terminology (bit, byte, data, real memory system, protected mode memory system, Windows, DOS, I/O) 3 Brief History of the Computers o1946 The first generation of Computer ENIAC (Electrical and Numerical Integrator and Calculator) was started to be used based on the vacuum tube technology, University of Pennsylvania o1970s entire CPU was put in a single chip. (1971 the first microprocessor of Intel 4004 (4-bit data bus and 2300 transistors and 45 instructions) 4 Brief History of the Computers (cont’d) oLate 1970s Intel 8080/85 appeared with 8-bit data bus and 16-bit address bus and used from traffic light controllers to homemade computers (8085: 246 instruction set, RISC*) o1981 First PC was introduced by IBM with Intel 8088 (CISC**: over 20,000 instructions) microprocessor oMotorola emerged with 6800. -
User's Manual
User’s Manual (English version) CNPS9500 Intel Pentium 4 Socket 478 CPU Intel Dual Core Pentium/Pentium 4 Socket 775 CPU AMD Sempron/AMD64 (Athlon 64 X2/Opteron/Athlon 64) Socket 754/939/940 CPU * Applies to all versions of CNPS9500. * Please read before installation. http://www.zalman.co.kr http://www.zalmanusa.com 1. Features 1) 100% copper heatsink with aerodynamically optimized “tunnel” design for maximum cooling efficiency. 2) Innovative and patented, curved heatpipe design for a heat transfer capacity of up to 6 heatpipes with just 3. 3) Optimized heatsink layout for maximum cooling efficiency with minimal materials. 4) 0.2mm ultra-slim fins for minimized weight and reduced airflow resistance. 5) Ultra quiet CNPS 92mm opaque fan with blue LEDs. 6) Aerodynamically optimized heatsink for smoother airflow and minimal noise. 7) Compatible CPUs (Refer to “7. Compatible CPUs” on page 3. for more information.) - Intel : All Dual Core Pentium CPUs (Socket 775) All Pentium 4 CPUs (Socket 775/478) - AMD : All Dual Core AMD Athlon 64 X2 CPUs (Socket 939) All AMD Sempron/AMD64 CPUs (Socket 754/939/940) 8) Adjustable fan speed controller (FAN MATE 2) enables control of noise and fan speed. 2. Specifications 1) Flower Heatsink (FHS) Spec. Model CNPS9500 Materials Pure Copper Weight(g) 530(1) Thermal Resistance Silent Mode 0.16 (°C/W ) Normal Mode 0.12 Dimensions (mm) 85(L) X 112(W) X 125(H) Dissipation Area (㎠) 3,698 2) Fan - Bearing Type : 2-Ball - Rotation Speed : 1,350RPM ± 10 % (Silent Mode) 2,600RPM ± 10 % (Low-noise Mode) - Noise (dB) : 18.0dB ± 10% (Silent Mode) - measured at 1m from noise source 27.5dB ± 10% (Low-noise mode) - measured at 1m from noise source 3) FAN MATE 2 - Output Voltage : 5V ~ 11V ± 2 % - Allowable Power : 6W or lower (Note 1) The maximum weight for a cooler is specified as 450g for Intel Socket 775 and AMD Socket 754/939/940. -
Mobile Intel® 965 Express Chipset Family
Mobile Intel® 965 Express Chipset Family Datasheet Revision 003 June 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This device is protected by U.S. patent numbers 5,315,448 and 6,516,132, and other intellectual property rights. -
K7KX-A Manual(27-0M0370-27)
MAINBOARD User's Manual Rev: 1.00 Date: April - 2000 * All other product names are trademarks or copyrights of their respective owners. * Specifications and information contained in this manual are subject to change without notice. FCC & DoC Compliance Statement This device complies with Part 15 of the FCC rules, operation is subject to the following two conditions. 1. This device may not cause harmful interference and, 2. This device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in residential installations. This equipment generates, uses, and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interface to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause interference to radio or television equipment reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: , Reorient or relocate the receiving antenna. , Move the equipment away from the receiver. , Plug the equipment into an outlet on a circuit different from that to which the receiver is connected. , Consult the dealer or an experienced radio/television technician for additional suggestions. The FCC requires the user to be notified that any change or modifications to the equipment by the user not expressly approved by the grantee or manufacturer could void the user's authority to operate such equipment. -
Intel® Desktop Board DG41TX Product Guide
Intel® Desktop Board DG41TX Product Guide Order Number: E88309-001 Revision History Revision Revision History Date ® -001 First release of the Intel Desktop Board DG41TX Product Guide February 2010 Disclaimer INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Intel Desktop Board DG41TX may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from Intel Corporation by going to the World Wide Web site at: http://intel.com/ or by calling 1-800-548-4725. Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. * Other names and brands may be claimed as the property of others.