Intel® Desktop Board DG41TX Product Guide
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GPU Developments 2018
GPU Developments 2018 2018 GPU Developments 2018 © Copyright Jon Peddie Research 2019. All rights reserved. Reproduction in whole or in part is prohibited without written permission from Jon Peddie Research. This report is the property of Jon Peddie Research (JPR) and made available to a restricted number of clients only upon these terms and conditions. Agreement not to copy or disclose. This report and all future reports or other materials provided by JPR pursuant to this subscription (collectively, “Reports”) are protected by: (i) federal copyright, pursuant to the Copyright Act of 1976; and (ii) the nondisclosure provisions set forth immediately following. License, exclusive use, and agreement not to disclose. Reports are the trade secret property exclusively of JPR and are made available to a restricted number of clients, for their exclusive use and only upon the following terms and conditions. JPR grants site-wide license to read and utilize the information in the Reports, exclusively to the initial subscriber to the Reports, its subsidiaries, divisions, and employees (collectively, “Subscriber”). The Reports shall, at all times, be treated by Subscriber as proprietary and confidential documents, for internal use only. Subscriber agrees that it will not reproduce for or share any of the material in the Reports (“Material”) with any entity or individual other than Subscriber (“Shared Third Party”) (collectively, “Share” or “Sharing”), without the advance written permission of JPR. Subscriber shall be liable for any breach of this agreement and shall be subject to cancellation of its subscription to Reports. Without limiting this liability, Subscriber shall be liable for any damages suffered by JPR as a result of any Sharing of any Material, without advance written permission of JPR. -
Mali-400 MP: a Scalable GPU for Mobile Devices
Mali-400 MP: A Scalable GPU for Mobile Devices Tom Olson Director, Graphics Research, ARM Outline . ARM and Mobile Graphics . Design Constraints for Mobile GPUs . Mali Architecture Overview . Multicore Scaling in Mali-400 MP . Results 2 About ARM . World’s leading supplier of semiconductor IP . Processor Architectures and Implementations . Related IP: buses, caches, debug & trace, physical IP . Software tools and infrastructure . Business Model . License fees . Per-chip royalties . Graphics at ARM . Acquired Falanx in 2006 . ARM Mali is now the world’s most widely licensed GPU family 3 Challenges for Mobile GPUs . Size . Power . Memory Bandwidth 4 More Challenges . Graphics is going into “anything that has a screen” . Mobile . Navigation . Set Top Box/DTV . Automotive . Video telephony . Cameras . Printers . Huge range of form factors, screen sizes, power budgets, and performance requirements . In some applications, a huge difference between peak and average performance requirements 5 Solution: Scalability . Address a wide variety of performance points and applications with a single IP and a single software stack. Need static scalability to adapt to different peak requirements in different platforms / markets . Need dynamic scalability to reduce power when peak performance isn’t needed 6 Options for Scalability . Fine-grained: Multiple pipes, wide SIMD, etc . Proven approach, efficient and effective . But, adding pipes / lanes is invasive . Hard for IP licensees to do on their own . And, hard to partition to provide dynamic scalability . Coarse-grained: Multicore . Easy for licensees to select desired performance . Putting cores on separate power islands allows dynamic scaling 7 Mali 400-MP Top Level Architecture Asynch Mali-400 MP Top-Level APB Geometry Pixel Processor Pixel Processor Pixel Processor Pixel Processor Processor #1 #2 #3 #4 CLKs MaliMMUs RESETs IRQs IDLEs MaliL2 AXI . -
Intel Desktop Board DG41MJ Product Guide
Intel® Desktop Board DG41MJ Product Guide Order Number: E59138-001 Revision History Revision Revision History Date -001 First release of the Intel® Desktop Board DG41MJ Product Guide February 2009 If an FCC declaration of conformity marking is present on the board, the following statement applies: FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124 1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and the receiver. • Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected. -
Cash Flow Comparison
國立政治大學商學院國際經營管理 英語碩士學位學程 International MBA Program College of Commerce National Chengchi University 碩士論文 治 Master政 ’s Thesis大 立 學 國 三大電腦晶片製造商之財務比較‧ ‧ A ComparisonN of Major Computer Chipset Vendors a y t t i Inio Financial Point of View s n r a e i v l C n heng chi U Student: Roger Chang Advisor: Professor James Liu 中華民國一百年六月 June 2011 三大電腦晶片製造商之財務比較 A Comparison of Major Computer Chipset Vendors In Financial Point of View 研究生: 張鼎昱 Student: Roger Chang 指導教授: 劉助 Advisor: Prof. James Liu 治 政 大 立 國立政治大學 商學院國際經營管理英語碩士學 學位學程 國 碩士論文 ‧ ‧ N a y t t A Thesis i i s o r Sunbmitted to International MBAe Program a i v l NationalC Chengchi nUniversity he i U in partial fulfillmentngch of the Requirements for the degree of Master in Business Administration 中華民國一百年六月 June 2011 i Abstract A Comparison of Major Computer Chipset Vendors In Financial Point of View By Roger Chang The goal of this master thesis is to analyze the治 three major chipset players in today’s Personal 政 大 Computer (PC) industry, while立 providing recommendations in different perspectives. One of the perspectives is from the investor’s point of view to single out a 學company with the most long term 國 investment value. The other is from each company’s management point of view to suggest for the ‧ areas of improvement for the companies. Two of the three companies discussed in this thesis are ‧ American-based global companiesN namely, Intel and AMD, while the other is a Taiwanese company: a y t t i VIA Technology. -
GMAI: a GPU Memory Allocation Inspection Tool for Understanding and Exploiting the Internals of GPU Resource Allocation in Critical Systems
The final publication is available at ACM via http://dx.doi.org/ 10.1145/3391896 GMAI: A GPU Memory Allocation Inspection Tool for Understanding and Exploiting the Internals of GPU Resource Allocation in Critical Systems ALEJANDRO J. CALDERÓN, Universitat Politècnica de Catalunya & Ikerlan Technology Research Centre LEONIDAS KOSMIDIS, Barcelona Supercomputing Center (BSC) CARLOS F. NICOLÁS, Ikerlan Technology Research Centre FRANCISCO J. CAZORLA, Barcelona Supercomputing Center (BSC) PEIO ONAINDIA, Ikerlan Technology Research Centre Critical real-time systems require strict resource provisioning in terms of memory and timing. The constant need for higher performance in these systems has led industry to recently include GPUs. However, GPU software ecosystems are by their nature closed source, forcing system engineers to consider them as black boxes, complicating resource provisioning. In this work we reverse engineer the internal operations of the GPU system software to increase the understanding of their observed behaviour and how resources are internally managed. We present our methodology which is incorporated in GMAI (GPU Memory Allocation Inspector), a tool which allows system engineers to accurately determine the exact amount of resources required by their critical systems, avoiding underprovisioning. We first apply our methodology on a wide range of GPU hardware from different vendors showing itsgeneralityin obtaining the properties of the GPU memory allocators. Next, we demonstrate the benefits of such knowledge in resource provisioning of two case studies from the automotive domain, where the actual memory consumption is up to 5.6× more than the memory requested by the application. ACM Reference Format: Alejandro J. Calderón, Leonidas Kosmidis, Carlos F. Nicolás, Francisco J. -
Intel® Desktop Board DG965RY Product Guide
Intel® Desktop Board DG965RY Product Guide Order Number: D46818-003 Revision History Revision Revision History Date -001 First release of the Intel® Desktop Board DG965RY Product Guide June 2006 -002 Second release of the Intel® Desktop Board DG965RY Product Guide September 2006 -003 Added operating system support December 2006 If an FCC declaration of conformity marking is present on the board, the following statement applies: FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124 1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. -
Mobile Intel® 965 Express Chipset Family
Mobile Intel® 965 Express Chipset Family Datasheet Revision 003 June 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This device is protected by U.S. patent numbers 5,315,448 and 6,516,132, and other intellectual property rights. -
The Bifrost GPU Architecture and the ARM Mali-G71 GPU
The Bifrost GPU architecture and the ARM Mali-G71 GPU Jem Davies ARM Fellow and VP of Technology Hot Chips 28 Aug 2016 Introduction to ARM Soft IP . ARM licenses Soft IP cores (amongst other things) to our Silicon Partners . They then make chips and sell to OEMs, who sell consumer devices . “ARM doesn’t make chips”… . We provide all the RTL, integration testbenches, memories lists, reference floorplans, example synthesis scripts, sometimes models, sometimes FPGA images, sometimes with implementation advice, always with memory system requirements/recommendations . Consequently silicon area, power, frequencies, performance, benchmark scores can therefore vary quite a bit in real silicon… 2 © ARM2016 ARM Mali: The world’s #1 shipping GPU 750M 65 27 Mali-based new Mali GPUs shipped 140 Total licenses in in 2015 Total licenses licensees FY15 Mali is in: Mali graphics based IC shipments (units) 750m ~75% ~50% ~40% 550m of of of 400m DTVs… tablets… smartphones 150m <50m 2011 2012 2013 2014 2015 3 © ARM2016 ARM Mali graphics processor generations Mali-G71 BIFROST … GPU Unified shader cores, scalar ISA, clause execution, full coherency, Vulkan, OpenCL MIDGARD Mali-T600 GPU series Mali-T700 GPU series Mali-T800 GPU series Unified shader cores, SIMD ISA, OpenGL ES 3.x, OpenCL, Vulkan Presented at HotChips 2015 Mali-200 Mali-300 Mali-400 Mali-450 Mali-470 UTGARD GPU GPU GPU GPU GPU Separate shader cores, SIMD ISA, OpenGL ES 2.x 4 © ARM2016 Bifrost features . Leverages Mali’s scalable architecture . Scalable to 32 shader cores 20% Scalable to 32 Higher energy Shader cores . Major shader core redesign efficiency* . -
VIA EPIA M-Series Mini-ITX Mainboard Operation Guidelines
Operating Guidelines Version 1.20 VIA EPIA M-Series Mini-ITX Mainboard Operation Guidelines Contents • Overview • Layout • Specifications • Processor SKUs • CLE266 Chipset Overview • I/O Back Panel Layout • Layout Diagram & Mounting Holes • Noise Levels Data • DVD Playback Tests • Power Consumption Data • Compatible Chassis • Power Specifications • FliteDeck – System Management Suite • Smart5.1 – Intelligent 6 Channel Audio • Linux & Microsoft Driver Support • Contact Operating Guidelines Version 1.20 EPIA M-Series Overview Optimized for today’s killer digital media applications such as watching DVD movies and listening to music, the 17cm x 17cm VIA EPIA M-Series includes a growing range of feature rich and highly versatile solutions for building a complete range of connected multimedia entertainment devices that meet the technical, ergonomic and aesthetic requirements of this emerging but highly demanding market. In addition to an integrated VIA C3 or fanless VIA Eden processors running at speeds of up to 1GHz, the VIA EPIA M-Series features the VIA Apollo CLE266 chipset with embedded UniChrome MPEG-2 decoder and integrated 2D/3D graphics core to ensure smooth DVD playback and a rich overall entertainment experience. With the sizable memory bandwidth of DDR266 SDRAM and the high data transfer speeds of ATA/133, the VIA EPIA M-Series ensures the high performance levels required of today’s most popular digital media and productivity applications. The user’s digital media experience is further enhanced by support for 5.1 surround sound, courtesy of the onboard VIA Six-TRAC 6 Channel AC’97 codec. The latest in high-bandwidth connectivity is supported with IEEE 1394 and USB 2.0 connections provided, as well as S-Video and RCA TV-Out (NTSC & PAL) and 10/100 Ethernet for seamless broadband connectivity. -
User's Manual for Future Reference
User’s Manual EPIA Version 1.31 September 23, 2008 Copyright Copyright © 2003-2008 VIA Technologies Incorporated. All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise without the prior written permission of VIA Technologies, Incorporated. Trademarks All trademarks are the property of their respective holders. PS/2 is a registered trademark of IBM Corporation. Award BIOS is a registered trademark of Phoenix Technologies Ltd. Disclaimer No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no warranties, implied or otherwise, in regard to this document and to the products described in this document. The information provided in this document is believed to be accurate and reliable as of the publication date of this document. However, VIA Technologies assumes no responsibility for the use or misuse of the information in this document and for any patent infringements that may arise from the use of this document. The information and product specifications within this document are subject to change at any time, without notice and without obligation to notify any person of such change. FCC-B Radio Frequency Interference Statement This equipment has been tested and found to comply with the limits for a class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. -
AI Acceleration – Image Processing As a Use Case
AI acceleration – image processing as a use case Masoud Daneshtalab Associate Professor at MDH www.idt.mdh.se/~md/ Outline • Dark Silicon • Heterogeneouse Computing • Approximation – Deep Neural Networks 2 The glory of Moore’s law Intel 4004 Intel Core i7 980X 2300 transistors 1.17B transistors 740 kHz clock 3.33 GHz clock 10um process 32nm process 10.8 usec/inst 73.4 psec/inst Every 2 Years • Double the number of transistors • Build higher performance general-purpose processors ⁻ Make the transistors available to masses ⁻ Increase performance (1.8×↑) ⁻ Lower the cost of computing (1.8×↓) Semiconductor trends ITRS roadmap for SoC Design Complexity Trens ITRS: International Technology Roadmap for Semiconductors Expected number of processing elements into a System-on-Chip (SoC). 4 Semiconductor trends ITRS roadmap for SoC Design Complexity Trens 5 Semiconductor trends Network-on-Chip (NoC) –based Multi/Many-core Systems Founder: Andreas Olofsson Sponsored by Ericsson AB 6 Dark Silicon Era The catch is powering exponentially increasing number of transistors without melting the chip down. 10 10 Chip Transistor Count 2,200,000,000 109 Chip Power 108 107 106 105 2300 104 103 130 W 102 101 0.5 W 100 1970 1975 1980 1985 1990 1995 2000 2005 2010 2015 If you cannot power them, why bother making them? 7 Dark Silicon Era The catch is powering exponentially increasing number of transistors without melting the chip down. 10 10 Chip Transistor Count 2,200,000,000 109 Chip Power 108 107 Dark Silicon 106 105 (Utilization Wall) 2300 104 Fraction of transistors that need to be 103 powered off at all times due to power 130 W 2 constraints. -
User's Manual EPIA-EX
User’s Manual EPIA-EX Version 1.14 January 18, 2012 Copyright Copyright © 2010-2012 VIA Technologies Incorporated. All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise without the prior written permission of VIA Technologies, Incorporated. Trademarks All trademarks are the property of their respective holders. PS/2 is a registered trademark of IBM Corporation. Award BIOS is a registered trademark of Phoenix Technologies Ltd. FCC-B Radio Frequency Interference Statement This equipment has been tested and found to comply with the limits for a class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at his personal expense. Notice 1 The changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Notice 2 Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits. Tested To Comply With FCC Standards FOR HOME OR OFFICE USE Safety Instructions 1.