Mobile Intel® 965 Express Chipset Family

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Mobile Intel® 965 Express Chipset Family Mobile Intel® 965 Express Chipset Family Datasheet Revision 003 June 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This device is protected by U.S. patent numbers 5,315,448 and 6,516,132, and other intellectual property rights. The use of Macrovision's copy protection technology in the device must be authorized by Macrovision and is intended for home and other limited pay-per-view uses only, unless otherwise authorized in writing by Macrovision. Devices incorporating Macrovision’s copy protection technology can only be sold or distributed to companies appearing on Macrovision’s list of “Authorized Buyers” at: www.macrovision.com. Reverse engineering or disassembly is prohibited. I2C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I2C bus/protocol and was developed by Intel. Implementations of the I2C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips Corporation. Intel® Active Management Technology requires the platform to have an Intel AMT-enabled chipset, network hardware and software, as well as connection with a power source and a corporate network connection. With regard to notebooks, Intel AMT may not be available or certain capabilities may be limited over a host OS-based VPN or when connecting wirelessly, on battery power, sleeping, hibernating or powered off. For more information, see http://www.intel.com/technology/iamt. Intel, Intel SpeedStep, Intel Core, Centrino, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2007, Intel Corporation. All rights reserved. 2 Datasheet Contents 1Introduction............................................................................................................ 11 1.1 Mobile Intel® PM965 Express Chipset Feature Support ........................................... 12 1.1.1 Processor Support .................................................................................. 12 1.1.2 System Memory Support ......................................................................... 12 1.1.3 Discrete Graphics using PCI Express* Graphics Attach Port .......................... 13 1.1.4 Direct Management Interface................................................................... 13 1.1.5 Power Management ................................................................................ 13 1.1.6 Security and Manageability (Intel® Active Management Technology)............. 13 1.1.7 Package ................................................................................................ 14 1.1.8 Intel® Stable Image Platform Program ..................................................... 14 1.2 Mobile Intel® GM965 Express Chipset Feature Support .......................................... 14 1.2.1 PCI Express Graphics Attach Port.............................................................. 14 1.2.2 Integrated Graphics................................................................................ 14 1.2.2.1 Analog CRT .............................................................................. 15 1.2.2.2 Dual Channel LVDS ................................................................... 15 1.2.2.3 Analog TV-Out.......................................................................... 15 1.2.2.4 SDVO Ports.............................................................................. 16 1.2.3 Power Management ................................................................................ 16 1.2.4 Intel Stable Image Platform Program ........................................................ 16 1.3 Mobile Intel® GL960 Express Chipset Feature Support ........................................... 16 1.3.1 Processor Support .................................................................................. 16 1.3.2 System Memory Support ......................................................................... 17 1.3.3 PCI Express Graphics Attach Port.............................................................. 17 1.3.4 Integrated Graphics................................................................................ 17 1.3.5 ICH Support .......................................................................................... 17 1.3.6 Power Management ................................................................................ 17 1.3.7 Intel Advanced Management Technology ................................................... 17 1.3.8 Intel Stable Image Platform Program ........................................................ 17 1.4 Mobile Intel® GME965 Express Chipset Feature Support......................................... 17 1.4.1 Integrated Graphics................................................................................ 17 1.4.1.1 Analog TV-Out.......................................................................... 17 1.5 Mobile Intel® GLE960 Express Chipset Feature Support ......................................... 18 1.5.1 Integrated Graphics................................................................................ 18 1.5.1.1 Analog TV-Out.......................................................................... 18 1.6 Terminology ..................................................................................................... 18 1.7 Reference Documents ........................................................................................ 19 2 Signal Description ................................................................................................... 21 2.1 Host Interface................................................................................................... 22 2.1.1 Host Interface Signals............................................................................. 22 2.2 DDR2 Memory Interface ..................................................................................... 25 2.2.1 DDR2 Memory Channel A Interface ........................................................... 25 2.2.2 DDR2 Memory Channel B Interface ........................................................... 26 2.2.3 DDR2 Memory Common Signals ............................................................... 27 2.2.4 DDR2 Memory Reference and Compensation .............................................. 28 2.3 PCI Express Based Graphics Interface Signals ....................................................... 28 2.3.1 Serial DVO and PCI Express*-Based Graphics Signal Mapping....................... 28 2.4 DMI – (G)MCH to ICH Serial Interface .................................................................. 29 2.5 Integrated Graphics Interface Signals .................................................................. 30 2.5.1 CRT DAC Signals .................................................................................... 30 2.5.2 Analog TV-out Signals............................................................................. 31 Datasheet 3 2.5.3 LVDS Signals .........................................................................................32 2.5.4 Serial DVO Interface ...............................................................................33 2.5.5 Display Data Channel (DDC) and GMBUS Support .......................................34 2.6 Intel® Management Engine Interface Signals ........................................................35 2.7 PLL Signals .......................................................................................................35 2.8 Reset and Miscellaneous Signals ..........................................................................36 2.9 Non-Critical to Function (NCTF) ...........................................................................37 2.10 Power and Ground .............................................................................................37 3 Host Interface..........................................................................................................41 3.1 FSB Source Synchronous
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