5 Microprocessors
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2004 Gamers' Hardware Upgrade Guide
Ace’s Hardware 2004 Gamers’ Hardware Upgrade Guide 2004 Gamers’ Hardware Upgrade Guide By Johan De Gelas – January 2004 Introduction Last week, we showed you a preview of the Athlon 64 3400+. Today, we'll investigate this new CPU as an upgrade to an existing system. How much performance do you gain when upgrading? What about the other features aside from performance, such as Cool'n'Quiet and more thermal and mechanical safety? As always, we start with a base system to be upgraded. This time around, our base system is equipped with an Athlon XP 2100+, as previous polls among our readers show that the faster versions of the Athlon XP "Palomino" were very popular in the early days of 2003. Now in 2004, Palomino is getting a little long in the tooth, so it's interesting to know whether or not an upgrade may be worthwhile. Our old system also contains a GeForce Ti 4200 and 512 MB of DDR266 (PC2100) memory. We will upgrade the CPU (to the Athlon 4 3400+) and memory (to DDR400 CAS 2) and compare that upgrade with one that simply upgrades the video card. As mentioned previously, we've done this before in many of our Gamer's Upgrade Guides. However, the gaming industry is not sitting still, and we are moving from hybrid DirectX 7/8 games to DirectX 8/9 games, which - as you will see - behave quite differently. The games you'll see tested in detail today are Halo 1.03, Return to Castle Wolfenstein: Enemy Territory, and X²- The Threat. -
Titan X Amd 1.2 V4 Ig 20210319
English TITAN X_AMD 1.2 Installation Guide V4 Parts List A CPU Water Block A A-1 BPTA-CPUMS-V2-SKA ..........1 pc A-1 A-2 A-2 Backplane assembly ..............1 set B Fittings B-1 BPTA-DOTFH1622 ...............4 pcs B-2 TA-F61 ...................................2 pcs B-3 BPTA-F95 ..............................2 pcs B-4 BP-RIGOS5 ...........................2 pcs B-5 TA-F60 ..................................2 pcs B-6 TA-F40 ..................................2 pcs C Accessory C-1 Hard tube ..............................2 pcs C-2 Fitting + soft tube ....................1 pc C-3 CPU set SCM3FL20 SPRING B SCM3F6 1mm Spacer Back Pad Paste Pad Metal Backplane M3x32mm Screw B-1 B-2 B-3 B-4 B-5 B-6 C C-1 Hard Tube ※ The allowable variance in tube length is ± 2mm C-2 Fitting + soft tube Bitspower reserves the right to change the product design and interpretations. These are subject to change without notice. Product colors and accessories are based on the actual product. — 1 — I. AMD Motherboard system 54 AMD SOCKET 939 / 754 / 940 IN 48 AMD SOCKET AM4 AMD SOCKET AM3 / AM3+ AMD SOCKET AM2 / AM2+ AMD SOCKET FM1 / FM2+ Bitspower Fan and DRGB RF Remote Controller Hub (Not included) are now available at microcenter.com DRGB PIN on Motherboard or other equipment. 96 90 BPTA-RFCHUB The CPU water block has a DRGB cable, which AMD SOCKET AM4 AMD SOCKET AM3 AM3+ / AMD SOCKET AM2 AM2+ / AMD SOCKET FM1 / FM2+ can be connected to the DRGB extension cable of the radiator fans. Fan and DRGB RF Remote Motherboard Controller Hub (Not included) OUT DRGB LED Do not over-tighten the thumb screws Installation (SCM3FL20). -
Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems. -
Pentium II Processor Performance Brief
PentiumÒ II Processor Performance Brief January 1998 Order Number: 243336-004 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Pentium® II processor may contain design defects or errors known as errata. Current characterized errata are available on request. MPEG is an international standard for video compression/decompression promoted by ISO. Implementations of MPEG CODECs, or MPEG enabled platforms may require licenses from various entities, including Intel Corporation. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from by calling 1-800-548-4725 or by visiting Intel’s website at http://www.intel.com. -
Super 7™ Motherboard
SY-5EH5/5EHM V1.0 Super 7Ô Motherboard ************************************************ Pentium® Class CPU supported ETEQ82C663 PCI/AGP Motherboard AT Form Factor ************************************************ User's Guide & Technical Reference NSTL “Year 2000 Test” Certification Letter September 23, 1998 Testing Date: September 23, 1998 Certification Date: September 23, 1998 Certification Number: NCY2000-980923-004 To Whom It May Concern: We are please to inform you that the “SY-5EHM/5EH5” system has passed NSTL Year 2000 certification test program. The Year 2000 test program tests a personal computer for its ability to support the year 2000. The “SY-5EHM/5EH5: system is eligible to carry the NSTL :Year 2000 Certification” seal. The Year 2000 certification test has been done under the following system configuration: Company Name : SOYO COMPUTER INC. System Model Name : SY-5EHM/5EH5 Hardware Revision : N/A CPU Model : Intel Pentium 200/66Mhz On Board Memory/L2 Cache : PC100 SDRAM DIMM 32MBx1 /1MB System BIOS : Award Modular BIOS V4.51PG, An Energy Star Ally Copyright © 1984—98, EH-1A6,07/15/1998-VP3-586B- 8669-2A5LES2AC-00 Best regards, SPORTON INTERNATIONAL INC. Declaration of Conformity According to 47 CFR, Part 2 and 15 of the FCC Rules Declaration No.: D872907 July.10 1998 The following designated product EQUIPMENT: Main Board MODEL NO.: SY-5EH Which is the Class B digital device complies with 47 CFR Parts 2 and 15 of the FCC rules. Operation is subject to the following two conditions : (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
8088 8-Bit Hmos Microprocessor 8088 8088-2
8088 8-BIT HMOS MICROPROCESSOR 8088/8088-2 Y 8-Bit Data Bus Interface Y Byte, Word, and Block Operations Y 16-Bit Internal Architecture Y 8-Bit and 16-Bit Signed and Unsigned Arithmetic in Binary or Decimal, Y Direct Addressing Capability to 1 Mbyte of Memory Including Multiply and Divide Y Two Clock Rates: Y Direct Software Compatibility with 8086 CPU Ð 5 MHz for 8088 Ð 8 MHz for 8088-2 Y 14-Word by 16-Bit Register Set with Symmetrical Operations Y Available in EXPRESS Ð Standard Temperature Range Y 24 Operand Addressing Modes Ð Extended Temperature Range The Intel 8088 is a high performance microprocessor implemented in N-channel, depletion load, silicon gate technology (HMOS-II), and packaged in a 40-pin CERDIP package. The processor has attributes of both 8- and 16-bit microprocessors. It is directly compatible with 8086 software and 8080/8085 hardware and periph- erals. 231456±2 Figure 2. 8088 Pin Configuration 231456±1 Figure 1. 8088 CPU Functional Block Diagram August 1990 Order Number: 231456-006 8088 Table 1. Pin Description The following pin function descriptions are for 8088 systems in either minimum or maximum mode. The ``local bus'' in these descriptions is the direct multiplexed bus interface connection to the 8088 (without regard to additional bus buffers). Symbol Pin No. Type Name and Function AD7±AD0 9±16 I/O ADDRESS DATA BUS: These lines constitute the time multiplexed memory/IO address (T1) and data (T2, T3, Tw, T4) bus. These lines are active HIGH and float to 3-state OFF during interrupt acknowledge and local bus ``hold acknowledge''. -
Computer Organization and Architecture Designing for Performance Ninth Edition
COMPUTER ORGANIZATION AND ARCHITECTURE DESIGNING FOR PERFORMANCE NINTH EDITION William Stallings Boston Columbus Indianapolis New York San Francisco Upper Saddle River Amsterdam Cape Town Dubai London Madrid Milan Munich Paris Montréal Toronto Delhi Mexico City São Paulo Sydney Hong Kong Seoul Singapore Taipei Tokyo Editorial Director: Marcia Horton Designer: Bruce Kenselaar Executive Editor: Tracy Dunkelberger Manager, Visual Research: Karen Sanatar Associate Editor: Carole Snyder Manager, Rights and Permissions: Mike Joyce Director of Marketing: Patrice Jones Text Permission Coordinator: Jen Roach Marketing Manager: Yez Alayan Cover Art: Charles Bowman/Robert Harding Marketing Coordinator: Kathryn Ferranti Lead Media Project Manager: Daniel Sandin Marketing Assistant: Emma Snider Full-Service Project Management: Shiny Rajesh/ Director of Production: Vince O’Brien Integra Software Services Pvt. Ltd. Managing Editor: Jeff Holcomb Composition: Integra Software Services Pvt. Ltd. Production Project Manager: Kayla Smith-Tarbox Printer/Binder: Edward Brothers Production Editor: Pat Brown Cover Printer: Lehigh-Phoenix Color/Hagerstown Manufacturing Buyer: Pat Brown Text Font: Times Ten-Roman Creative Director: Jayne Conte Credits: Figure 2.14: reprinted with permission from The Computer Language Company, Inc. Figure 17.10: Buyya, Rajkumar, High-Performance Cluster Computing: Architectures and Systems, Vol I, 1st edition, ©1999. Reprinted and Electronically reproduced by permission of Pearson Education, Inc. Upper Saddle River, New Jersey, Figure 17.11: Reprinted with permission from Ethernet Alliance. Credits and acknowledgments borrowed from other sources and reproduced, with permission, in this textbook appear on the appropriate page within text. Copyright © 2013, 2010, 2006 by Pearson Education, Inc., publishing as Prentice Hall. All rights reserved. Manufactured in the United States of America. -
Webcore: Architectural Support for Mobile Web Browsing
WebCore: Architectural Support for Mobile Web Browsing Yuhao Zhu Vijay Janapa Reddi Department of Electrical and Computer Engineering The University of Texas at Austin [email protected], [email protected] Abstract The Web browser is undoubtedly the single most impor- Browser Browser tant application in the mobile ecosystem. An average user 63% 54% spends 72 minutes each day using the mobile Web browser. Web browser internal engines (e.g., WebKit) are also growing 23% 8% 32% Media 6% in importance because they provide a common substrate for 7% 7% Others developing various mobile Web applications. In a user-driven, Media Games Others interactive, and latency-sensitive environment, the browser’s Email performance is crucial. However, the battery-constrained na- (a) Time dist. of window focus. (b) Time dist. of CPU processing. ture of mobile devices limits the performance that we can de- Fig. 1: Mobile Web browser share study conducted by our industry liver for mobile Web browsing. As traditional general-purpose research partner on their employees’ devices [2]. Similar observa- techniques to improve performance and energy efficiency fall tions were reported by NVIDIA on Tegra-based mobile handsets [3,4]. short, we must employ domain-specific knowledge while still maintaining general-purpose flexibility. network limited. However, this trend is changing. With about In this paper, we first perform design-space exploration 10X improvement in round-trip time from 3G to LTE, network to identify appropriate general-purpose architectures that latency is no longer the only performance bottleneck [51]. uniquely fit the characteristics of a popular Web browsing Prior work has shown that over the past decade, network engine. -
INTEL Central Processing Units (CPU) This Page of Product Is Rohs Compliant
INTEL Central Processing Units (CPU) This page of product is RoHS compliant. CENTRAL PROCESSING UNITS (CPU) Intel Processor families include the most powerful and flexible Central Processing Units (CPUs) available today. Utilizing industry leading 22nm device fabrication techniques, Intel continues to pack greater processing power into smaller spaces than ever before, providing desktop, mobile, and embedded products with maximum performance per watt across a wide range of applications. Atom Celeron Core Pentium Xeon For quantities greater than listed, call for quote. MCU \ MPU / DSP MPU / MCU \ MOUSER Intel Core Cache Data TDP Price Each Package Processor Family Code Freq. Size No. of Bus Width (Max) STOCK NO. Part No. Series Name (GHz) (MB) Cores (bit) (W) 1 25 50 100 Desktop 607-DF8064101211300Y DF8064101211300S R0VY FCBGA-559 D2550 Atom™ Cedarview 1.86 1 2 64 10 607-CM8063701444901S CM8063701444901S R10K FCLGA-1155 G1610 Celeron® Ivy Bridge 2.6 2 2 64 55 Intel 607-CM8062301046804S CM8062301046804S R05J FCLGA-1155 G540 Celeron® Sandy Bridge 2.5 2 2 64 65 607-AT80571RG0641MLS AT80571RG0641MLS LGTZ LGA-775 E3400 Celeron® Wolfdale 2.6 1 2 64 65 607-HH80557PG0332MS HH80557PG0332MS LA99 LGA-775 E4300 Core™ 2 Conroe 1.8 2 2 64 65 607-AT80570PJ0806MS AT80570PJ0806MS LB9J LGA-775 E8400 Core™ 2 Wolfdale 3.0 6 2 64 65 607-AT80571PH0723MLS AT80571PH0723MLS LGW3 LGA-775 E7400 Core™ 2 Wolfdale 2.8 3 2 64 65 607-AT80580PJ0676MS AT80580PJ0676MS LB6B LGA-775 Q9400 Core™ 2 Yorkfield 2.66 6 4 64 95 607-CM80616003060AES CM80616003060AES LBTD FCLGA-1156 -
System Management BIOS (SMBIOS) Reference 6 Specification
1 2 Document Number: DSP0134 3 Date: 2011-01-26 4 Version: 2.7.1 5 System Management BIOS (SMBIOS) Reference 6 Specification 7 Document Type: Specification 8 Document Status: DMTF Standard 9 Document Language: en-US 10 System Management BIOS (SMBIOS) Reference Specification DSP0134 11 Copyright Notice 12 Copyright © 2000, 2002, 2004–2011 Distributed Management Task Force, Inc. (DMTF). All rights 13 reserved. 14 DMTF is a not-for-profit association of industry members dedicated to promoting enterprise and systems 15 management and interoperability. Members and non-members may reproduce DMTF specifications and 16 documents, provided that correct attribution is given. As DMTF specifications may be revised from time to 17 time, the particular version and release date should always be noted. 18 Implementation of certain elements of this standard or proposed standard may be subject to third party 19 patent rights, including provisional patent rights (herein "patent rights"). DMTF makes no representations 20 to users of the standard as to the existence of such rights, and is not responsible to recognize, disclose, 21 or identify any or all such third party patent right, owners or claimants, nor for any incomplete or 22 inaccurate identification or disclosure of such rights, owners or claimants. DMTF shall have no liability to 23 any party, in any manner or circumstance, under any legal theory whatsoever, for failure to recognize, 24 disclose, or identify any such third party patent rights, or for such party’s reliance on the standard or 25 incorporation -
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components the FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED in THIS CHAPTER
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components THE FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED IN THIS CHAPTER: Ûß1.2 Explain motherboard components, types and features Nß Form Factor Nß ATX / BTX, Nß micro ATX Nß NLX Nß I/O interfaces Material Nß Sound Nß Video Nß USB 1.1 and 2.0 Nß Serial Nß IEEE 1394 / FireWire Nß Parallel Nß NIC Nß Modem Nß PS/2 Nß Memory slots Nß RIMM Nß DIMM Nß SODIMM CopyrightedNß SIMM Nß Processor sockets Nß Bus architecture 86498book.indb 1 7/22/09 5:37:17 AM Nß Bus slots Nß PCI Nß AGP Nß PCIe Nß AMR Nß CNR Nß PCMCIA Chipsets Nß BIOS / CMOS / Firmware Nß POST Nß CMOS battery Nß Riser card / daughterboard Nß [Additional subobjectives covered in chapter 2] Ûß1.4 Explain the purpose and characteristics of CPUs and their features Nß Identify CPU types Nß AMD Nß Intel Nß Hyper threading Nß Multi core Nß Dual core Nß Triple core Nß Quad core Nß Onchip cache Nß L1 Nß L2 Nß Speed (real vs. actual) Nß 32 bit vs. 64 bit Ûß1.5 Explain cooling methods and devices Nß Heat sinks Nß CPU and case fans 86498book.indb 2 7/22/09 5:37:18 AM Nß Liquid cooling systems Nß Thermal compound Ûß1.6 Compare and contrast memory types, characteristics and their purpose Nß Types Nß DRAM Nß SRAM Nß SDRAM Nß DDR / DDR2 / DDR3 Nß RAMBUS Nß Parity vs. Non-parity Nß ECC vs. non-ECC Nß Single sided vs. double sided Nß Single channel vs. -
Thermal and Electrical Specification of AMD Semprontm Processors
Thermal and Electrical Specification of AMD SempronTM Processors Thermal and Electrical Specification of AMD SempronTM Processors 27 September 2004 Page 1/5 Thermal and Electrical Specification of AMD SempronTM Processors ©2004 Advanced Micro Devices Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products and are for information purposes only. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppels or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN OR FOR THE PERFORMANCE OR OPERATION OF ANY PERSON’S SYSTEM, INCLUDING, WITHOUT LIMITATION, ANY LOST PROFITS, BUSINESS INTERRUPTION, DAMAGE TO OR DESTRUCTION OF PROPERTY, OR LOSS OF PROGRAMS OR OTHER DATA, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.