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Quad Flat Package
INTEGRATED CIRCUITS Introduction
Package Outline Diagram Page Layout Used in This Data Book
EE Concierge Style Guide PCB Layout and Component Creation
PDF Package Information
Quad Flat No-Lead (QFN) Evauation Test
AN1902: Assembly Guidelines for QFN and SON Packages
(HSOP) and Power Quad Flat Package (PQFP) PCB Assembly Guidelines
Electronic Materials and Components-Semiconductor Packages
Classification of Semiconductor Package
PCB Layout Recommendations for Leaded Packages
Packaging Product Specification
Flat Packages Mounting Adhesives
PCB Layout Recommendations for QFN Packages” to “PCB Layout Recommendations for Leaded Packages”
AT40KAL Series FPGA 2818F–FPGA–07/06 AT40KAL Series FPGA
Device Marking Conventions National Semiconductor Marks Devices Sold in Order to Pro- Vide Device Identification and Manufacturing Traceablility In- Formation
An Improved Quad Flat Package for High Frequency Sip Applications
Layout Library Advanced Design System
Mlx80004-2-Datasheet-Melexis.Pdf
Top View
QFN Package Mount Manual
"Medium-Pin-Count Surface-Mount Package Information"
Application Note
Passive Smd Tantalum Capacitors Aluminum
QFP Package Type
ASIC Technology Handbook Gate-Array, Cellbased, Co
Master Index for Jedec Publication No
Series Field-Programmable Gate Arrays
Coprocessor Field Programmable Gate Arrays AT6000(LV)
Package Lineup/ Forms/ Structures
ORCA Series 2 Field-Programmable Gate Arrays
Library Expert Surface Mount Families
Appendix a Addresses of Standards Organizations
There Are Two Classes of Electronic Components – Active and Passive
Cpre 281 1 CMOS Realization of a NAND Gate CMOS Realization of a and Gate
Package Specification
PCB Layout Recommendations for Leaded Packages Technical Note
FPGA Configuration EEPROM Memory AT17LV65A AT17LV128A AT17LV256A AT17LV512A AT17LV010A AT17LV002A 3.3V and 5V System Support
Master Index for Jedec Publication No
1 Attachment a Whitepaper on Semiconductor Die and Packaging
IC Package Kohoku-Ku Yokohama Kanagawa 222-0033, Japan Tel: +81-45-415-5858