Package Specification

Gowin Devices Package Specification

PK100-1.01E,08/26/2016

Copyright©2016 Guangdong Gowin Semiconductor Corporation. All Rights Reserved. No part of this document may be reproduced or transmitted in any form or by any means, electronic, mechanical, photo-copying, recording or otherwise, without the prior written consent of GOWINSEMI. Disclaimer GOWINSEMI®, LittleBee®, AroraTM, and the GOWINSEMI logos are trademarks of GOWINSEMI and registered in China, the U.S. Patent and Trademark Office and other countries. All other words and logos identified as trademarks or service marks are the property of their respective holders as described at www.gowinsemi.com.cn. GOWINSEMI assumes no liability, provides no warranty either expressed or implied relating to the usage, or intellectual property right infringement except as provided for by GOWINSEMI Terms and Conditions of Sale. All information in this document should be treated as preliminary. GOWINSEMI may make changes to this document without notice. Anyone relying on this documentation shall contact GOWINSEMI for the current documentation and errata.

Revision History Date Version Description 08/26/2016 1.0E Initial version.

Contents

Contents ...... i List of Figures ...... ii List of Tables ...... iii 1 About This Guide ...... 1 1.1 Purpose ...... 1 1.2 Supported Products ...... 1 1.3 Related Documents ...... 1 1.4 Abbreviations and Terminology ...... 1 1.5 Support and Feedback ...... 2 2 Introduction ...... 3 3 Device Packaging Specification ...... 4 3.1 Device Packaging Materials ...... 4 3.2 Package Seals and Labels ...... 5 3.3 Device Humidity Rating and Precautions ...... 5 3.4 Packaging Specifications for LQFP Devices ...... 6 3.5 Package Specification for PBGA Devices ...... 6 3.6 WLCSP Device Package Specification ...... 7 3.7 QFN Device Package Specification ...... 8 3.8 Package Specifications for MBGA Devices ...... 8 3.9 UBGA Device Package Specification ...... 8 4 Package Specification Guide ...... 9 5 Transport Specification Guide ...... 10 6 Safe Operation Guide for Product Transporting ...... 11

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List of Figures

Figure 3-1 WLCSP72 Device Package ...... 7

PK100-1.01E ii

List of Tables

Table 1-1 Abbreviations and Terminologies ...... 1 Table 3-1 Device Packaging Material List ...... 4 Table3-2 Packaging Seals ...... 5 Table 3-3 Package Label ...... 5 Table 3-4 Tray and Packaging Capacity ...... 6 Table 3-5 PBGA Device Packaging Specifications ...... 6 Table 3-6 WLCSP72 Device Packaging Specification ...... 7 Table 3-7 QFN Device Package Specification ...... 8 Table 3-8 MBGA Device Package Specification ...... 8 Table 3-9 UBGA Device Package Specification ...... 8

PK100-1.01E iii

1About This Guide 1.1Purpose

1About This Guide

1.1 Purpose Gowin products package specification is based on different types of packaging, which mainly provides guidelines for quality assurance in terms of packaging, storage, transportation and safe operation. 1.2 Supported Products The information in the guide applies to the following products: 1. LQFP 2. PBGA 3. WLCSP 4. QFN 5. MBGA 6. UBGA 1.3 Related Documents The latest user guides are available on our Website. Refer to the related documents via http://www.gowinsemi.com.cn: Gowin Products Device Specification (PK100-1.01). 1.4 Abbreviations and Terminology The abbreviations and terminologies used in this manual are as shown in Table 1-1 below. Table 1-1 Abbreviations and Terminologies Abbreviations and Full Name Meaning Terminology ESD Electro-Static discharge Electro-Static discharge Joint Electron Device Joint Electron Device Engineering JEDEC Engineering Council Council Low-profile Quad Flat LQFP Low-profile Quad Flat Package Package PBGA Plastic Ball Grid Array Plastic Ball Grid Array

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1About This Guide 1.5Support and Feedback

Abbreviations and Full Name Meaning Terminology Wafer Level Chip Scale WLCSP Wafer Level Chip Scale Package Package QFN Quad Flat No-lead Package Quad Flat No-lead Package Micro Ball Grid Array MBGA Micro Ball Grid Array Package Package Ultra Ball Grid Array UBGA Ultra Ball Grid Array Package Package PK Packing Packing 1.5 Support and Feedback Gowin Semiconductor provides customers with comprehensive technical support. If any questions, comments, or suggestions, please feel free to contact us directly. Website:http://www.gowinsemi.com.cn E-mail: [email protected] Tel: +86 755 8262 0391

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2Introduction

Gowin products package specification is based on different types of packaging, which mainly provides guidelines for quality assurance in terms of packaging, storage, transportation and safe operation.

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3Device Packaging Specification 3.1Device Packaging Materials

3Device Packaging Specification

3.1 Device Packaging Materials Table 3-1 Device Packaging Material List

Name Spec. No. Material Feature Picture

MPPO, black Pallet See the attached list See the attached list MAX=150℃

Accord with Desiccant 1/2 unit 17g 2-DE-01-0000021 environmental

requirements

Humidity Halogen free 54*37（mm） 2-HI-01-000020 Indicator Cobalt free

Black Packing 9*0.8mm 2-PP-01-0000016 104~1011ohm/sq Tape

Bubble Low density ethylene 455*455（mm） 2-CH-01-0000002 Package 97%

Aluminiu Aluminum foil, shiny m foil 500*255*0.17（mm） 2AB-01-000078 surface package

Packing Corrugated paper > 420 355*149*90(mm) 2-IB-01-0000204 box g/m2

Packing Corrugated paper > 385*322*30（mm） 2-OB-01-0000038 container 560g/m2

Scotch PVC colorless and 60mm 9AA021225MFG0087 tape transparent

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3Device Packaging Specification 3.2Package Seals and Labels

3.2 Package Seals and Labels Table3-2 Packaging Seals Name EMPTY Seal PARTIAL Seal Size 50*20(mm) 21*9（mm）

Pattern

Table 3-3 Package Label Antistatic Name MSL 3 Label Product Package Label Label Label Size 70*38mm 76*76mm 110*55mm

Pattern

3.3 Device Humidity Rating and Precautions 1. Product handling and storage must meet IPC/JEDEC J-STD-033. 2. If temperature is less than 40°C and RH is less than 90%, the product life in a sealed bag is 30 months. 3. If the product meets the following conditions, it must be baked before sealing: a). In the temperature of 23±5°C, the humidity indicator card is more than 10% for products with a humidity sensitivity level of 2a-5a, or is more than 60% for products with a humidity sensitivity level of level 2. b). Factory life reaches or exceeds. 4. If baking is required, the products are needed baked at 125°C: a). LGA products are baked for 24 hours. b). All other products are baked for 12 hours. (Do not baking with tapes)

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3Device Packaging Specification 3.4Packaging Specifications for LQFP Devices

Note! The moisture sensitivity level and the reflux peak temperature are defined in IPC/JEDEC J-STD-020. 3.4 Packaging Specifications for LQFP Devices Table 3-4 Tray and Packaging Capacity Items LQFP144 LQFP100 Tray No. PTCPL202014HTTY02 - Tray Specifications 20*20*1.4 - Tray Capacity 60 90 Product direction in Packing Upward Upward the tray. Type 10+1 10+1 and Stacked layers Capacity Box/case 6 6 Piece/case 3600 5400 Band material PP PP Max. temperature for pallets and 150℃/125℃ 150℃/125℃ bands.

3.5 Package Specification for PBGA Devices Table 3-5 PBGA Device Packaging Specifications PBGA PBGA PBGA PBGA PBGA Items 204 256 484 672 1156 Tray No. - - 4601353111 - 4601956121 Tray 90 90 60 40 24 Capacity Product direction in Upward Upward Upward Upward Upward the tray. Stacked 10+1 10+1 10+1 10+1 Packing 10+1 Type and layers Capacity Box/case 6 6 6 6 6 Piece/case 5400 5400 3600 2400 1440 Band PP PP PP PP PP material Band width - - 11.4 mm - 11.4 mm Max. temperature 150℃/125 150℃/125 150℃/125℃ 150℃/125℃ 150℃/125℃ for pallets ℃ ℃ and bands.

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3Device Packaging Specification 3.6WLCSP Device Package Specification

3.6 WLCSP Device Package Specification Table 3-6 WLCSP72 Device Packaging Specification Packing Package Material Name Piece/Band Piece/Box Piece/Case Suppliers Modes Name Carrier tape Package tape WLCSP72 Tape 3000 3000 18000 ADVANTEK 13" REEL / 4" HUB (axis) WLCSP30 Tape 3000 3000 18000 - -

see Figure 3-1 for WLCSP72 device package. Figure 3-1 WLCSP72 Device Package

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3Device Packaging Specification 3.7QFN Device Package Specification

3.7 QFN Device Package Specification Table 3-7 QFN Device Package Specification

Items QFN32 Tray Capacity 490 Product direction in the tray. Upward Packing Type Stacked layers 10+1 and Capacity Box/case 6 Piece/case 29,400 Band material PP Max. temperature for pallets 150℃/125℃ and bands 3.8 Package Specifications for MBGA Devices Table 3-8 MBGA Device Package Specification

Items MBGA160 Tray Capacity 260 Product direction in the tray Upward Packing Type Stacked layers 10+1 and Capacity Box/case 6 Piece/case 15,600 Band material PP Max. temperature for pallets 150℃/125℃ and bands 3.9 UBGA Device Package Specification Table 3-9 UBGA Device Package Specification

Items UBGA332 Tray Capacity 90 Product direction in the tray Upward Packing Type Stacked layers 10+1 and Capacity Box/case 6 Piece/case 5,400 Band material PP Max. temperature for pallets 150℃/125℃ and bands

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4Package Specification Guide 3.9UBGA Device Package Specification

4Package Specification Guide

During transportation and storage, the stacked pallet shall follow these guidelines:  Tie the stacked trays with ties.  Make sure all trays are in the same direction.  The direction on pin1 of all trays are same.  Before strapping, stack the trays correctly.

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5Transport Specification Guide

When transporting products packaged in trays, the products are packaged with paper boxes, and fillers should be placed inside the boxes to avoid the trays from moving or colliding in the cartons. The filler must meet the following requirements:  Must be antistatic, non-corrosive.  Must not be debris, debris, powder.  Do not scratch or puncture the packaging bag.

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6Safe Operation Guide for Product Transporting

It is recommended to transport products using the automatic picking and placing machines to in an ESD protection environment. If you need to manually transport products, you need to follow the following guidelines:  Operate in an ESD protecting environment.  When operating the product, do not touch the product directly with your hands. You need to wear electrostatic rings and finger covers.  Manually transport LQFP and BGA products using a vacuum pencil.  When transporting the product, ensure that the product is positive upward, and the product is properly placed in the tray before releasing the vacuum.  LQFP pins should not contact the tray.

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