Digital and Analog Applications of Double Gate Mosfets

Total Page:16

File Type:pdf, Size:1020Kb

Digital and Analog Applications of Double Gate Mosfets DIGITAL AND ANALOG APPLICATIONS OF DOUBLE GATE MOSFETS A thesis presented to the faculty of the Fritz J. and Dolores H. Russ College of Engineering and Technology of Ohio University In partial fulfillment of the requirements for the degree Master of Science Swetha Varadharajan November 2005 This thesis entitled DIGITAL AND ANALOG APPLICATIONS OF DOUBLE GATE MOSFETS by SWETHA VARADHARAJAN has been approved for the School of Electrical Engineering and Computer Science and The Russ College of Engineering and Technology by Savas Kaya Assistant Professor of Electrical Engineering and Computer Science Dennis Irwin, Dean, Russ College of Engineering and Technology VARADHARAJAN, SWETHA. M.S. November 2005. Electrical Engineering and Computer Science Digital and Analog Applications of Double gate MOSFETs(72pp.) Director of Thesis: Savas Kaya Moore’s law projects a continuous scaling down of devices with time. The technological trends to keep up with this empirical observation have ascertained Double gate MOSFETs as the imminent next generation transistor. This thesis investigates the digital and analog applications of the DG-MOSFETs. We illustrate the digital circuit applications of this novel device in the pass transistor logic (PTL).The ON resistance of the Double-gate MOSFET in the PTL logic shows attractive results over the conventional MOS PTL logic circuits. Also, we have implemented the PTL logic as an XOR gate and compared the device performance. The digital applications also include configurable structures based on a theoretical concept put forth by Paul Beckett. Furthermore, the analog applications include the mixer applications of DG-MOSFETs demonstrating an improved performance over the traditional MOSFET mixers. The effects of varying the physical parameters of the DG-MOSFET have been studied in a mixer. Approved: Savas Kaya Assistant Professor of Electrical Engineering and Computer Science ACKNOWLEDGEMENTS My thesis has been an extremely delightful and an enriching experience throughout. Thanks to Dr. Kaya for making my graduate research work a thoroughly enjoyable task. His genial disposition and enthusiasm has been a constant driving force and has helped me look beyond the text books. I would like to thank Dr.Janusz Starzyk for his valuable class discussions and course work in VLSI. I also want to express my appreciation to my committee members Dr.Henryk Lozykowski and Dr.Xiaoping Shen . 5 TABLE OF CONTENTS ABSTRACT ........................................................................................................................... 3 ACKNOWLEDGEMENTS ......................................................................................................... 4 LIST OF TABLES .................................................................................................................... 7 LIST OF FIGURES ................................................................................................................... 8 LIST OF ABBREVIATIONS..................................................................................................... 11 1. INTRODUCTION............................................................................................................... 12 1.1. OVERVIEW............................................................................................................... 12 1.2. CURRENT RESEARCH................................................................................................ 14 2. BACKGROUND ................................................................................................................ 16 2.1. OUTLINE .................................................................................................................. 16 2.2. DEVICE SCALING...................................................................................................... 17 2.3. SILICON ON INSULATOR ........................................................................................... 19 2.4. RF APPLICATIONS OF SOI.......................................................................................... 21 2.5. DOUBLE GATE MOSFET ............................................................................................ 22 2.6. DEVICE SIMULATOR................................................................................................. 25 2.6.1. ISE-TCAD .......................................................................................................... 25 2.6.2. MDRAW ............................................................................................................ 25 2.6.3. DESSIS .............................................................................................................. 27 2.6.4. INITIAL STEPS ................................................................................................... 27 2.6.5. PHYSICS SECTION.............................................................................................. 28 2.6.6. CIRCUIT SIMULATION........................................................................................ 29 2.6.7. INSPECT AND XMGRACE.................................................................................... 29 2.6.8. MATLAB ........................................................................................................... 29 3. DIGITAL APPLICATIONS................................................................................................... 31 6 3.1. BASIC DEVICE STRUCTURE AND SETUP..................................................................... 31 3.2. PASS GATE LOGIC .................................................................................................... 33 3.3. INITIAL RESULTS...................................................................................................... 35 3.4. XOR IMPLEMENTATION ............................................................................................ 36 3.5. RECONFIGURABLE STRUCTURES .............................................................................. 38 3.5.1. BIAS SUSCEPTIBILITY........................................................................................ 45 3.6. NEW RECONFIGURABLE XOR GATE........................................................................... 46 4. ANALOG APPLICATIONS .................................................................................................. 49 4.1. MIXER OVERVIEW.................................................................................................... 49 4.2. MIXING PRINCIPLE................................................................................................... 51 4.3. MIXER SETUP AND RESULTS..................................................................................... 53 4.4. MODIFIED MIXER CONFIGURATION .......................................................................... 58 5. SUMMARY AND CONCLUDING REMARKS......................................................................... 61 5.1. SUMMARY ............................................................................................................... 61 5.2. FUTURE WORK ......................................................................................................... 62 6. REFERENCES................................................................................................................... 64 7. APPENDICES.................................................................................................................... 66 A. MATLAB CODE ........................................................................................................... 66 B. DESSIS COMMAND FILE .............................................................................................. 67 7 LIST OF TABLES Table 2.1Comparison of the effect of scaling on MOSFET device parameters. .............. 17 Table 3.1 Device parameters used in the simulation setup............................................... 32 Table 3.2 Transitional delay comparison of transmission gate and DDG. ....................... 38 Table 3.3 Different operating conditions of gate voltages to derive various functionalities [13]............................................................................................................................ 41 Table 3.4 Biasing the back gate at different levels various functionalities can be realized. ................................................................................................................................... 47 8 LIST OF FIGURES Fig 1.1 Technology node vs. time..................................................................................... 13 Fig 1.2 MOSFET scaling trend for high performance [2] ................................................ 13 Fig 2.1 Time line of conventional MOS structure to the future transistor [4].................. 16 Fig 2.2 MOSFET device scaling [6]................................................................................. 18 Fig 2.3 A simple SOI FET ................................................................................................ 20 Fig 2.4 Structure of DGMOSFET with a thin body ( tsi = 10 nm) and a gate length (Lg) of 50 nm ........................................................................................................................ 23 Fig 2.5 Schematic band diagrams for symmetric and Asymmetric DG-MOSFET .......... 23 Fig 2.6 Variation of electron concentration with body thickness. .................................... 24 Fig 2.7 MDRAW GUI showing the structure of a DGMOSFET ....................................
Recommended publications
  • Chapter 7: AC Transistor Amplifiers
    Chapter 7: Transistors, part 2 Chapter 7: AC Transistor Amplifiers The transistor amplifiers that we studied in the last chapter have some serious problems for use in AC signals. Their most serious shortcoming is that there is a “dead region” where small signals do not turn on the transistor. So, if your signal is smaller than 0.6 V, or if it is negative, the transistor does not conduct and the amplifier does not work. Design goals for an AC amplifier Before moving on to making a better AC amplifier, let’s define some useful terms. We define the output range to be the range of possible output voltages. We refer to the maximum and minimum output voltages as the rail voltages and the output swing is the difference between the rail voltages. The input range is the range of input voltages that produce outputs which are not at either rail voltage. Our goal in designing an AC amplifier is to get an input range and output range which is symmetric around zero and ensure that there is not a dead region. To do this we need make sure that the transistor is in conduction for all of our input range. How does this work? We do it by adding an offset voltage to the input to make sure the voltage presented to the transistor’s base with no input signal, the resting or quiescent voltage , is well above ground. In lab 6, the function generator provided the offset, in this chapter we will show how to design an amplifier which provides its own offset.
    [Show full text]
  • Arithmetic and Logic Unit (ALU)
    Computer Arithmetic: Arithmetic and Logic Unit (ALU) Arithmetic & Logic Unit (ALU) • Part of the computer that actually performs arithmetic and logical operations on data • All of the other elements of the computer system are there mainly to bring data into the ALU for it to process and then to take the results back out • Based on the use of simple digital logic devices that can store binary digits and perform simple Boolean logic operations ALU Inputs and Outputs Integer Representations • In the binary number system arbitrary numbers can be represented with: – The digits zero and one – The minus sign (for negative numbers) – The period, or radix point (for numbers with a fractional component) – For purposes of computer storage and processing we do not have the benefit of special symbols for the minus sign and radix point – Only binary digits (0,1) may be used to represent numbers Integer Representations • There are 4 commonly known (1 not common) integer representations. • All have been used at various times for various reasons. 1. Unsigned 2. Sign Magnitude 3. One’s Complement 4. Two’s Complement 5. Biased (not commonly known) 1. Unsigned • The standard binary encoding already given. • Only positive value. • Range: 0 to ((2 to the power of N bits) – 1) • Example: 4 bits; (2ˆ4)-1 = 16-1 = values 0 to 15 Semester II 2014/2015 8 1. Unsigned (Cont’d.) Semester II 2014/2015 9 2. Sign-Magnitude • All of these alternatives involve treating the There are several alternative most significant (leftmost) bit in the word as conventions used to
    [Show full text]
  • FUNDAMENTALS of COMPUTING (2019-20) COURSE CODE: 5023 502800CH (Grade 7 for ½ High School Credit) 502900CH (Grade 8 for ½ High School Credit)
    EXPLORING COMPUTER SCIENCE NEW NAME: FUNDAMENTALS OF COMPUTING (2019-20) COURSE CODE: 5023 502800CH (grade 7 for ½ high school credit) 502900CH (grade 8 for ½ high school credit) COURSE DESCRIPTION: Fundamentals of Computing is designed to introduce students to the field of computer science through an exploration of engaging and accessible topics. Through creativity and innovation, students will use critical thinking and problem solving skills to implement projects that are relevant to students’ lives. They will create a variety of computing artifacts while collaborating in teams. Students will gain a fundamental understanding of the history and operation of computers, programming, and web design. Students will also be introduced to computing careers and will examine societal and ethical issues of computing. OBJECTIVE: Given the necessary equipment, software, supplies, and facilities, the student will be able to successfully complete the following core standards for courses that grant one unit of credit. RECOMMENDED GRADE LEVELS: 9-12 (Preference 9-10) COURSE CREDIT: 1 unit (120 hours) COMPUTER REQUIREMENTS: One computer per student with Internet access RESOURCES: See attached Resource List A. SAFETY Effective professionals know the academic subject matter, including safety as required for proficiency within their area. They will use this knowledge as needed in their role. The following accountability criteria are considered essential for students in any program of study. 1. Review school safety policies and procedures. 2. Review classroom safety rules and procedures. 3. Review safety procedures for using equipment in the classroom. 4. Identify major causes of work-related accidents in office environments. 5. Demonstrate safety skills in an office/work environment.
    [Show full text]
  • The Central Processing Unit(CPU). the Brain of Any Computer System Is the CPU
    Computer Fundamentals 1'stage Lec. (8 ) College of Computer Technology Dept.Information Networks The central processing unit(CPU). The brain of any computer system is the CPU. It controls the functioning of the other units and process the data. The CPU is sometimes called the processor, or in the personal computer field called “microprocessor”. It is a single integrated circuit that contains all the electronics needed to execute a program. The processor calculates (add, multiplies and so on), performs logical operations (compares numbers and make decisions), and controls the transfer of data among devices. The processor acts as the controller of all actions or services provided by the system. Processor actions are synchronized to its clock input. A clock signal consists of clock cycles. The time to complete a clock cycle is called the clock period. Normally, we use the clock frequency, which is the inverse of the clock period, to specify the clock. The clock frequency is measured in Hertz, which represents one cycle/second. Hertz is abbreviated as Hz. Usually, we use mega Hertz (MHz) and giga Hertz (GHz) as in 1.8 GHz Pentium. The processor can be thought of as executing the following cycle forever: 1. Fetch an instruction from the memory, 2. Decode the instruction (i.e., determine the instruction type), 3. Execute the instruction (i.e., perform the action specified by the instruction). Execution of an instruction involves fetching any required operands, performing the specified operation, and writing the results back. This process is often referred to as the fetch- execute cycle, or simply the execution cycle.
    [Show full text]
  • Hybrid Memristor–CMOS Implementation of Combinational Logic Based on X-MRL †
    electronics Article Hybrid Memristor–CMOS Implementation of Combinational Logic Based on X-MRL † Khaled Alhaj Ali 1,* , Mostafa Rizk 1,2,3 , Amer Baghdadi 1 , Jean-Philippe Diguet 4 and Jalal Jomaah 3 1 IMT Atlantique, Lab-STICC CNRS, UMR, 29238 Brest, France; [email protected] (M.R.); [email protected] (A.B.) 2 Lebanese International University, School of Engineering, Block F 146404 Mazraa, Beirut 146404, Lebanon 3 Faculty of Sciences, Lebanese University, Beirut 6573, Lebanon; [email protected] 4 IRL CROSSING CNRS, Adelaide 5005, Australia; [email protected] * Correspondence: [email protected] † This paper is an extended version of our paper published in IEEE International Conference on Electronics, Circuits and Systems (ICECS) , 27–29 November 2019, as Ali, K.A.; Rizk, M.; Baghdadi, A.; Diguet, J.P.; Jomaah, J. “MRL Crossbar-Based Full Adder Design”. Abstract: A great deal of effort has recently been devoted to extending the usage of memristor technology from memory to computing. Memristor-based logic design is an emerging concept that targets efficient computing systems. Several logic families have evolved, each with different attributes. Memristor Ratioed Logic (MRL) has been recently introduced as a hybrid memristor–CMOS logic family. MRL requires an efficient design strategy that takes into consideration the implementation phase. This paper presents a novel MRL-based crossbar design: X-MRL. The proposed structure combines the density and scalability attributes of memristive crossbar arrays and the opportunity of their implementation at the top of CMOS layer. The evaluation of the proposed approach is performed through the design of an X-MRL-based full adder.
    [Show full text]
  • Three-Dimensional Integrated Circuit Design: EDA, Design And
    Integrated Circuits and Systems Series Editor Anantha Chandrakasan, Massachusetts Institute of Technology Cambridge, Massachusetts For other titles published in this series, go to http://www.springer.com/series/7236 Yuan Xie · Jason Cong · Sachin Sapatnekar Editors Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures 123 Editors Yuan Xie Jason Cong Department of Computer Science and Department of Computer Science Engineering University of California, Los Angeles Pennsylvania State University [email protected] [email protected] Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota [email protected] ISBN 978-1-4419-0783-7 e-ISBN 978-1-4419-0784-4 DOI 10.1007/978-1-4419-0784-4 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009939282 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Foreword We live in a time of great change.
    [Show full text]
  • Is EE Right for You?
    Erik Jonsson School of Engggineering and The Un ivers ity o f Texas a t Da llas Computer Science Is EE Right for You? • “Toto, I have a feeling we’re not in Kansas anymore.” • Now that you are here, diii?id you make the right choice? • Electrical engineering is a challenging and satisfying profession. That does not mean it is easy. In fact, with the possible exceptions of medicine or law, it is the MOST difficult. • There are some things you need to consider if you really, really want to be an engineer. • We will consider a few today. EE 1202 Lecture #1 – Why Electrical Engineering? 1 © N. B. Dodge 01/12 Erik Jonsson School of Engggineering and The Un ivers ity o f Texas a t Da llas Computer Science Is EE Right for You (2)? • Why did you decide to be an electrical engineer? – Parents will pay for engineering education (it’s what they want). – You like math and science. – A relative is an engineer and you like him/her. – You want to challenge yourself, and engineering seems challenging. – You think you are creative and love technology. – You want to make a difference in society . EE 1202 Lecture #1 – Why Electrical Engineering? 2 © N. B. Dodge 01/12 Erik Jonsson School of Engggineering and The Un ivers ity o f Texas a t Da llas Computer Science The High School “Science Student” Problem • In high school, you were FAR above the average. – And you probably didn’t study too hard, right? • You liked science and math, and they weren’t terribly hard.
    [Show full text]
  • Electrical Engineering Technology
    Electrical Engineering Technology Electrical Engineering Program Accreditation The Electrical Engineering Technology program at Central Piedmont is accredited by the Engineering Technology Accreditation Commission Technology (TAC) of the Accreditation Board of Engineering and Technology (ABET). The Associate in Applied Science degree in Electrical Engineering How to Apply: Technology has been specifically designed to prepare individuals to Complete a Central Piedmont admissions application through Get become advanced technicians in the workforce. Started on the Central Piedmont website. Electrical Engineering Technicians (Associates degree holders) typically build, install, test, troubleshoot, repair, and modify developmental and Contact Information production electronic components, equipment, and systems such as For questions about the program or for assistance as a student in the industrial/computer controls, manufacturing systems, instrumentation program, contact faculty advising. The Electrical Engineering Technology systems, communication systems, and power electronic systems. program is in the Engineering Technology Division. For additional information, visit the Electrical Engineering Technology website or call the A broad-based core of courses ensures that students develop the skills Program Chair at 704.330.6773. necessary to perform entry-level tasks. Emphasis is placed on developing the ability to think critically, analyze, and troubleshoot electronic systems. General Education Requirements Beginning with electrical fundamentals, course work progressively ENG 111 Writing and Inquiry 3.0 introduces electronics, 2D Computer Aided Design (CAD), circuit Select one of the following: 3.0 simulation, solid-state fundamentals, digital concepts, instrumentation, C++ programming, microprocessors, programmable Logic Controllers ENG 112 Writing and Research in the Disciplines (PLCs). Other course work includes the study of various fields associated ENG 113 Literature-Based Research with the electrical/electronic industry.
    [Show full text]
  • LDMOS for Improved Performance
    > Submitted to IEEE Transactions on Electron Devices < Final MS # 8011B 1 Extended-p+ Stepped Gate (ESG) LDMOS for Improved Performance M. Jagadesh Kumar, Senior Member, IEEE and Radhakrishnan Sithanandam Abstract—In this paper, we propose a new Extended-p+ Stepped Gate (ESG) thin film SOI LDMOS with an extended-p+ region beneath the source and a stepped gate structure in the drift region of the LDMOS. The hole current generated due to impact ionization is now collected from an n+p+ junction instead of an n+p junction thus delaying the parasitic BJT action. The stepped gate structure enhances RESURF in the drift region, and minimizes the gate-drain capacitance. Based on two- dimensional simulation results, we show that the ESG LDMOS exhibits approximately 63% improvement in breakdown voltage, 38% improvement in on-resistance, 11% improvement in peak transconductance, 18% improvement in switching speed and 63% reduction in gate-drain charge density compared with the conventional LDMOS with a field plate. Index Terms—LDMOS, silicon on insulator (SOI), breakdown voltage, transconductance, on- resistance, gate charge I. INTRODUCTION ATERALLY double diffused metal oxide semiconductor (LDMOS) on SOI substrate is a promising Ltechnology for RF power amplifiers and wireless applications [1-5]. In the recent past, developing high voltage thin film LDMOS has gained importance due to the possibility of its integration with low power CMOS devices and heterogeneous microsystems [6]. But realization of high voltage devices in thin film SOI is challenging because floating body effects affect the breakdown characteristics. Often, body contacts are included to remove the floating body effects in RF devices [7].
    [Show full text]
  • Basic DC Motor Circuits
    Basic DC Motor Circuits Living with the Lab Gerald Recktenwald Portland State University [email protected] DC Motor Learning Objectives • Explain the role of a snubber diode • Describe how PWM controls DC motor speed • Implement a transistor circuit and Arduino program for PWM control of the DC motor • Use a potentiometer as input to a program that controls fan speed LWTL: DC Motor 2 What is a snubber diode and why should I care? Simplest DC Motor Circuit Connect the motor to a DC power supply Switch open Switch closed +5V +5V I LWTL: DC Motor 4 Current continues after switch is opened Opening the switch does not immediately stop current in the motor windings. +5V – Inductive behavior of the I motor causes current to + continue to flow when the switch is opened suddenly. Charge builds up on what was the negative terminal of the motor. LWTL: DC Motor 5 Reverse current Charge build-up can cause damage +5V Reverse current surge – through the voltage supply I + Arc across the switch and discharge to ground LWTL: DC Motor 6 Motor Model Simple model of a DC motor: ❖ Windings have inductance and resistance ❖ Inductor stores electrical energy in the windings ❖ We need to provide a way to safely dissipate electrical energy when the switch is opened +5V +5V I LWTL: DC Motor 7 Flyback diode or snubber diode Adding a diode in parallel with the motor provides a path for dissipation of stored energy when the switch is opened +5V – The flyback diode allows charge to dissipate + without arcing across the switch, or without flowing back to ground through the +5V voltage supply.
    [Show full text]
  • Understanding Performance Numbers in Integrated Circuit Design Oprecomp Summer School 2019, Perugia Italy 5 September 2019
    Understanding performance numbers in Integrated Circuit Design Oprecomp summer school 2019, Perugia Italy 5 September 2019 Frank K. G¨urkaynak [email protected] Integrated Systems Laboratory Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 2/74 Who Am I? Born in Istanbul, Turkey Studied and worked at: Istanbul Technical University, Istanbul, Turkey EPFL, Lausanne, Switzerland Worcester Polytechnic Institute, Worcester MA, USA Since 2008: Integrated Systems Laboratory, ETH Zurich Director, Microelectronics Design Center Senior Scientist, group of Prof. Luca Benini Interests: Digital Integrated Circuits Cryptographic Hardware Design Design Flows for Digital Design Processor Design Open Source Hardware Integrated Systems Laboratory Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 3/74 What Will We Discuss Today? Introduction Cost Structure of Integrated Circuits (ICs) Measuring performance of ICs Why is it difficult? EDA tools should give us a number Area How do people report area? Is that fair? Speed How fast does my circuit actually work? Power These days much more important, but also much harder to get right Integrated Systems Laboratory The performance establishes the solution space Finally the cost sets a limit to what is possible Introduction Cost Design Flow Area Speed Area/Speed Trade-offs Power Conclusions 4/74 System Design Requirements System Requirements Functionality Functionality determines what the system will do Integrated Systems Laboratory Finally the cost sets a limit
    [Show full text]
  • Computer Monitor and Television Recycling
    Computer Monitor and Television Recycling What is the problem? Televisions and computer monitors can no longer be discarded in the normal household containers or commercial dumpsters, effective April 10, 2001. Televisions and computer monitors may contain picture tubes called cathode ray tubes (CRT’s). CRT’s can contain lead, cadmium and/or mercury. When disposed of in a landfill, these metals contaminate soil and groundwater. Some larger television sets may contain as much as 15 pounds of lead. A typical 15‐inch CRT computer monitor contains 1.5 pounds of lead. The State Department of Toxic Substances Control has determined that televisions and computer monitors can no longer be disposed with typical household trash, or recycled with typical household recyclables. They are considered universal waste that needs to be disposed of through alternate ways. CRTs should be stored in a safe manner that prevents the CRT from being broken and the subsequent release of hazardous waste into the environment. Locations that will accept televisions, computers, and other electronic waste (e‐waste): If the product still works, trying to find someone that can still use it (donating) is the best option before properly disposing of an electronic product. Non‐profit organizations, foster homes, schools, and places like St. Vincent de Paul may be possible examples of places that will accept usable products. Or view the E‐waste Recycling List at http://www.mercedrecycles.com/pdf's/EwasteRecycling.pdf Where can businesses take computer monitors, televisions, and other electronics? Businesses located within Merced County must register as a Conditionally Exempt Small Quantity Generator (CESQG) prior to the delivery of monitors and televisions to the Highway 59 Landfill.
    [Show full text]