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LM2665 Switched Capacitor Voltage Converter Datasheet (Rev. H)

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LM2665 Switched Capacitor Voltage Converter Datasheet (Rev. H) Product Sample & Technical Tools & Support & Folder Buy Documents Software Community LM2665 SNVS009H –NOVEMBER 1999–REVISED MARCH 2016 LM2665 Switched Capacitor Voltage Converter 1 Features 3 Description The LM2665 CMOS charge-pump voltage converter 1• Input Voltage for Voltage Doubler: 2.5 V to 5.5 V operates as a voltage doubler for an input voltage in • Voltage Divider Splits Voltage: 1.8 V to 11 V the range of 2.5 V to 5.5 V. Two low-cost capacitors • Doubles or Splits Input Supply Voltage and a diode (needed during start-up) are used in this • 12-Ω Typical Output Impedance circuit to provide up to 40 mA of output current. The • 90% Typical Conversion Efficiency at 40 mA LM2665 can also work as a voltage divider to split a voltage in the range of 1.8 V to 11 V in half. • 1-µA Typical Shutdown Current The LM2665 operates at 160-kHz oscillator frequency 2 Applications to reduce output resistance and voltage ripple. With an operating current of only 650 µA (operating • Cellular Phones efficiency greater than 90% with most loads) and • Pagers 1-µA typical shutdown current, the LM2665 provides • PDAs ideal performance for battery powered systems. • Operational Amplifier Power Suppliers Device Information(1) • Interface Power Suppliers PART NUMBER PACKAGE BODY SIZE (NOM) • Handheld Instruments LM2665 SOT-23 (6) 2.90 mm × 1.60 mm • Fire Detection and Notification (1) For all available packages, see the orderable addendum at • Industrial Handheld Radios the end of the data sheet. • Blood Pressure Monitors Voltage Doubler Splitting Vin in Half 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM2665 SNVS009H –NOVEMBER 1999–REVISED MARCH 2016 www.ti.com Table of Contents 1 Features .................................................................. 1 8.2 Functional Block Diagram ......................................... 8 2 Applications ........................................................... 1 8.3 Feature Description................................................... 8 3 Description ............................................................. 1 8.4 Device Functional Modes.......................................... 8 4 Revision History..................................................... 2 9 Application and Implementation .......................... 9 5 Pin Configuration and Functions ......................... 3 9.1 Application Information.............................................. 9 9.2 Typical Applications .................................................. 9 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 10 Power Supply Recommendations ..................... 12 6.2 ESD Ratings.............................................................. 4 11 Layout................................................................... 13 6.3 Recommended Operating Conditions....................... 4 11.1 Layout Guidelines ................................................. 13 6.4 Thermal Information.................................................. 4 11.2 Layout Example .................................................... 13 6.5 Electrical Characteristics........................................... 5 12 Device and Documentation Support ................. 14 6.6 Typical Characteristics ............................................. 5 12.1 Community Resources.......................................... 14 7 Parameter Measurement Information .................. 7 12.2 Trademarks ........................................................... 14 7.1 Test Circuit................................................................ 7 12.3 Electrostatic Discharge Caution............................ 14 8 Detailed Description .............................................. 8 12.4 Glossary ................................................................ 14 8.1 Overview ................................................................... 8 13 Mechanical, Packaging, and Orderable Information ........................................................... 14 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (July 2015) to Revision H Page • Added several new "Applications" to page 1.......................................................................................................................... 1 Changes from Revision F (May 2013) to Revision G Page • Added Pin Configuration and Functions section, ESD Rating table, Feature Description , Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections ................................................................................................ 1 Changes from Revision E (May 2013) to Revision F Page • Changed layout of National Data Sheet to TI format ........................................................................................................... 12 2 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM2665 LM2665 www.ti.com SNVS009H –NOVEMBER 1999–REVISED MARCH 2016 5 Pin Configuration and Functions DBV Package 6-Pin SOT-23 Top View 1 6 2 5 3 4 Pin Functions PIN DESCRIPTION TYPE NO. NAME VOLTAGE DOUBLER VOLTAGE SPLIT 1 V+ Power Power supply positive voltage input Positive voltage output 2 GND Ground Power supply ground input Same as doubler Connect this pin to the negative terminal of the 3 CAP− Power Same as doubler charge-pump capacitor. Shutdown control pin, tie this pin to ground in 4 SD Input Same as doubler normal operation. 5 OUT Power Positive voltage output Power supply positive voltage input Connect this pin to the positive terminal of the 6 CAP+ Power Same as doubler charge-pump capacitor. Copyright © 1999–2016, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM2665 LM2665 SNVS009H –NOVEMBER 1999–REVISED MARCH 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1)(2) MIN MAX UNIT V+ to GND voltage 5.8 V OUT to GND voltage 11.6 V OUT to V+ voltage 5.8 V SD (GND − 0.3 V) (V+ + 0.3 V) V+ and OUT continuous output current 50 mA Output short-circuit duration to GND(3) 1 sec (4) Continuous power dissipation (TA = 25°C) 600 mW (4) TJ-MAX 150 °C Lead temperature (soldering, 10 sec.) 300 °C Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) OUT may be shorted to GND for one second without damage. However, shorting OUT to V+ may damage the device and must be avoided. Also, for temperatures above 85°C, OUT must not be shorted to GND or V+, or device may be damaged. (4) The maximum allowable power dissipation is calculated by using PD-MAX = (TJ-MAX − TA)/RθJA, where TJ-MAX is the maximum junction temperature, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance of the specified package. 6.2 ESD Ratings VALUE UNIT (1) V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Operating junction temperature –40 85 °C 6.4 Thermal Information LM2665 THERMAL METRIC(1) DBV (SOT-23) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 210 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM2665 LM2665 www.ti.com SNVS009H –NOVEMBER 1999–REVISED MARCH 2016 6.5 Electrical Characteristics MIN and MAX limits apply over the full operating temperature range. Unless otherwise specified: TJ = 25°C, V+ = 5 V, (1) C1 = C2 = 3.3 μF. PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT V+ Supply voltage 2.5 5.5 V IQ Supply current No load 650 1250 µA ISD Shutdown supply current 1 µA Normal operation 2(4) VSD Shutdown pin input voltage V Shutdown mode 0.8(5) IL Output current 40 mA R Sum of the R of the four internal I = 40 mA 8 SW ds(on) L 3.5 Ω MOSFET switches (6) ROUT Output resistance IL = 40 mA 12 25 Ω (7) ƒOSC Oscillator frequency See 80 160 kHz (7) ƒSW Switching frequency See 40 80 kHz RL (1 kΩ) between GND and OUT 90% 94% PEFF Power efficiency IL = 40 mA to GND 90% VOEFF Voltage conversion efficiency No load 99% 99.96% (1) In the test circuit, capacitors C1 and C2 are 3.3-µF, 0.3-Ω maximum ESR capacitors. Capacitors with higher ESR increase output resistance, reduce output voltage and efficiency. (2) Min. and Max. limits are ensured by design, test, or statistical
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