The 10th Annual China Semiconductor Technology International Conference March 18-19, 2019 Shanghai, China
Plenary Keynote Speakers
Dr. Simon M. Sze Dr. Yaoguo (Gary) Ding Honorary Chair Professor, NCTU Vice President, Technology and Manufacturing Group, Intel
Dr. Min Cao Dr. Evangelos Elefthriou Vice President, Path-finding, TSMC Fellow, Neuromorphic Computing, IBM CSTIC 2019 Organizers and Sponsors Attendee Numbers
CSTIC Attendee Number 2019 2018 Conference 830 684 Plenary Session 666 549 Symposium I: Device Engineering and Memory Technology 327 287 Symposium II: Lithography and Patterning 415 318 Symposium III: Dry & Wet Etch and Cleaning 385 206 Symposium IV: Thin Film, Plating and Process Integration 264 172 Symposium V: CMP and Post-Polish Cleaning 246 178 Symposium VI: Metrology, Reliability and Testing 145 110 Symposium VII: Packaging and Assembly 212 175 Symposium VIII:MEMS, Sensors and Emerging Semiconductor Technologies 135 89 Symposium IX: Design and Automation of Circuits and Systems 149 86 Symp II &III Joint Session 214 239 Symp II, VIII & IXJoint Session 201 Panel Discussion 214 239 WFD Short Course (Front-end) 99 24 WFD Short Course (Back-end) 116 47 *Symposium I-IX attendee number was Day 1 and Day 2 in total Attendee Industry Distribution
Service Company 2% Media Software Company 1% • 70% attendees from industry 2% Semiconductor Design Company Chip Maker • Chip makers like HLMC, 4% 20% HHGrace, Intel, IBM, SMIC,TSMC, UMC, AMT, YMTC, Global Foundries, Samsung, Hynix, JCET, ASE, Huatian and etc. Academy/University joined the conference 29% • Design and software companies like Huawei, ZTE, Qualcomm, Equipment Company Lattice, Synopsys, Mentor joined 28% the conference
Material/ Consumables Company 14% Attendee’s Job Titles
Chief Editors/ Editors CEO, CTO, GM and 1% VPs 13%
Professors/ Researchers/Students 28% Directors 14%
• 27% of our attendees were directors or above, who were the decision makers in companies.
Managers 18%
Process Engineers 21% Fellows/Scientists 5% Attendee Country Distribution
Taiwan China USA 10% 5% Japan 4% • Speakers and attendees were Korea from 17 different countries or 2% districts Belgium 1% • More than 200 speakers and Germany attendees are oversea 1% industry leaders or experts
Mainland China Other countries or 75% districts (Singapore, France, UK, Hongkong, Netherlands, Sweden, Finland, India, Israel, Switzerland) 2% Local Attendee City Distribution
Nanjing Jiangyin Wuhan Shenzhen 2% 2% 3% 2% Huai'an Tianjin 3% 3% Dalian 3% Suzhou 3% Others （Ningbo, Xuzhou, Wuxi, Fuzhou, Hangzhou, • Speakers and attendees were Longyan, Xi'an,Guangzhou, from 34 different cities in Hefei, Nantong, Shanghai China Shenyang, 49% Dongguan, Jinan, Haerbin,Weifang, Changzhou, Chengdu, Huizhou,Lanzhou, Qingdao, Huangshan, Weihai, Wulumuqi) 10%
Beijing 21% HLMC HTTC Huawei IBM ICT, Chinese Academy of Sciences IME, CAS IMEC Infineon Institute of Electronics，CAS Intel JCET Jiangsu HHCK advanced materials Co., Ltd. JSR KCTech KLA-Tencor KU Leuven Kulicke & Soffa Kyushu University Lam Research Lanzhou University of Technology Leuven Instruments Liverpool John Moores University Macronix International Ltd. Massachusetts Institute of Technology Mattson Technology Mentor Merck Meyer Burger (Germany) GmbH Micron Missouri University of Science and Technology MKS Instruments Mycronic NAIST Nalco Nanjing University Nanjing University of Posts and Telecommunications National Center for Advanced Packaging National Chiao Tung University National Taiwan Central University NISSAN CHEMICAL TAIWAN North China University of Technology Novellus, USA NuFlare Technology Ohio State University Osaka University Pall Panasonic PDF Solutions Peking University Penn State University Powertech Technology Protronics PSK Pusan National University Qorvo Qualchip Technologies, Inc. Qualcomm Raintree Technologies Corp Richtek Robert Bosch Rudolph Technologies SAMSUNG Sao Paulo State University (UNESP) SCREEN Semiconductor Solutions SEAJ (Semiconductor Equipment Association of Japan) Seasonfair Seoul National University Shanghai University Shanghai Tech University SIMMTECH SK Materials SKW Associates, Inc. SMIC Southeast University SPIL-SZ Sumitomo Bakelite (Suzhou) Co., Ltd. Sumitomo Heavy Industries Ion Technology Co., Ltd. Sun Yat-sen University Suzhou IV Technologies SuZhou Speed Semiconductor Synopsys Taiflex Scientific Co.ltd Technical University of Munich TFME The Hong Kong University of Science and Technology Thermo Fisher Scientific Tianjin University of Technology Tohoku University Tokyo Electron Tokyo Institute of Technology Tri Chemical Laboratories Inc. Tsinghua university Tsinghua University TSMC UC Berkeley UESTC ULVAC UMC University of Massachusetts, Amherst University of Michigan-Shanghai Jiao Tong University Joint Institute, China University of Notre Dame University of Texas at Austin University of Wisconsin-Madison Uppsala University Versum Materials Technology LLC Taiwan Branch VLSI System Design Watty Corporation WDC Xcerra Xi'an UniIC Semiconductors Co., Ltd. Yuan Ze University ZEON Zhejiang University
>240 Anticipating Companies 3M DISPLAYLINK UK Huatian Technology（Kunshan） Electronics Co.,Ltd 3MTS DK Nanotechnology Inc Huawei ACM Dow Chemical Huazhong University of Science and Technology Advantest Dow DuPont IBM Air Liquide Duke University IMEC A-kelon (Huizhou) Optronics Ltd DuPont IMECAS AMEC East China Normal University Institute of Computing Technology, Chinese Academy of Sciences Anji Microelectronics Ebara Intel Applied Material Edwards IRSD Roadmap ASAKA RIKEN CO., LTD. Electronic Fluorocarbons ITRI ASE EpiGaN JCET ASML Etown IP Jiangsu Advanced Memory Semiconductor Ltd. ASML Brion Financial Times China Jiangsu Normal University ASML-Cymer Finisar Corporation Jiangsun Advanced Memory Technology Aufirst Chemicals Foxconn Johoku Chemical Avantor Fraunhofer ENAS JSR Shanghai Beihang University French Institute for Scientific Research(CNRS) Kanomax FMT Inc Beijing Chenjing Electronics Fudan Univeristy KANOMAX JAPAN INC Beijing Normal University Fuzhou University KCTech Beijing Sevenstar G&P Technology KLA Beijing Yandong Microelectronics Georgia Institute of Technology Korea Advanced Institute of Science and Technology Beneq Gigaphoton Inc. KU Leuven BOE Global Research & Innovative Solutions Co.,Ltd. Lam Reaearch Brewer Science Globalfoundries Lanzhou University of Technology BriteIP Gredmann Group Lattice Semiconductor Co. Brooks Instrument Guangdong University of Technology Leuven Instruments Bruckewell Technology Gwangju Institute of Science and Technology Liverpool John Moores University Cabot Microelectronics Hanyang University Macronix Canon Inc. Harbin insititute of technology Mattson Technology Carl Zeiss Hebei University of Technology Mentor Graphics Changxin Memory Technology HEIDENHAIN LIMITED Merck Display Materials(Shanghai) Co., Ltd. D2S Hermes Epitek Middlesex Industries SA Dai Nippon Printing Co., Ltd. HHGrace Minghsin University of Science and Technology(MUST) Dalian University of Technology HiSilicon MLI Darbond Hitachi High-Technologies Corporation MooreElite Delta Electronics HLMC Moses Lake Industries, Inc. Department of Electronic Engineering, Feng Chia University Hon Hai Precision Industry Co Ltd Nanjing University DIGITIMES Hua Hong Wuxi Nanjing University of Posts and Telecommunication Diodes Huada Emprean Nanjing University of Technology Disco Huangshan University Nanyang Technological University
>240 Anticipating Companies
Nata Chemicals Shanghai Sunrise Unimos National Central University Shanghai Tech University University of California, Santa Barbara National Chiao Tung University Shanghai University University of Chinese Academy of Sciences National Taiwan Central University Shanghai University of Technology University of Electronic Science and Technology of China National Taiwan University of Science and Technology SIEMENS University of Massachusetts National Tsing Hua University SiEn (Qingdao) Integrated Circuits University of Michigan-Shanghai Jiao Tong University Joint Institute Naura SIMIT University of Notre Dame NBU SIMMTECH University of Twente NCTU Singulus Technologies AG Uppsala University Nikon SITRI Versum Materials Ningbo University SJ Semiconductor (Jiangyin) Corp. Viking Global Investors Nissan Chemical Corporation SK HYNIX Wolfspeed Novel Crystal Technology SKW Associates Wuxi Sky Chip Interconnection Technology Co.,Ltd NuFlare Technology SMIC Xi'an UniIC Semiconductors Co., Ltd. ONRG SMNC Xinanna Electronics Technology Pall Corp. Soochow University Yangtze Memory Technologies Co. PDF South University of Science and Technology Zhejiang University Peking University SPIL Zijin Jia Bo Electronics Pes University Spirox Technology Zing Semiconductor Photronics STATS ChipPAC ZTE Piotech Sungkyunkwan University 北京元芯碳基集成电路研究院 Plasma-Therm Suntific Materials 北京紫光存储科技有限公司 PMS Suzhou IV technology 东莞记忆存储科技有限公司 Prismark Partners, LLC Suzhou Shinhao materials LLC 广东惠尔特纳米科技有限公司 Purdue University Synopsys 国新风险投资管理（深圳）有限公司 Qorvo, Inc. Tanjin University of Science & Technology 今井 基勝, 水戸工業（株） QSIL Technical University of Munich 摩西湖（大连）化学工业有限公司 Qualcomm TEL 南通至晟微电子技术有限公司 Raintree Technologies TEL FSI 上海亨斯迈聚氨酯特种材料 S&J Electronics TFME 上海华丽工程技术有限公司 Samsung Thermo Fisher Scientific 深圳阿科威达 Sanechips Tokyo Electron 威海金鼎机械制造股份有限公司 Science China Press Tokyo Institute of Technology 无锡湃泰材料科技有限公司 SCREEN Semiconductors Solutions Co.,Ltd. Tongfu Microelectronics 武汉华星光电技术有限公司 Senju Metal Industry Co., Ltd., Toshiba Memory Corp. 西安奕斯伟硅片技术有限公司 Seoul Natioanl University Towerjazz 芯思想 Shandong Shengquan Tsinghua University 意发薄膜科技(上海)有限公司 Shanghai IC R&D Center Co., Ltd. TSMC 元智大學 Shanghai Jiaotong University UC Los Angeles 浙江舜宇光学 Shanghai Kaixi Tech UC San Diego 中国电子系统工程第二建设有限公司 Shanghai Microelectronics Equipment ULVAC 紫金矿业集团黄金冶炼有限公司
CSTIC 2020 Chair and Co-chairs
Dr. Steve X. Liang Dr. Qinghuang Lin Chair Executive Co-Chair JCET, China ASML, USA
Dr. Ru Huang Dr. Cor Claeys Dr. Hanming Wu Co-Chair Co-Chair Co-Chair Peking University, China KU Leuven, Belgium Etown, China CSTIC 2020 Symposia and Chairs
Symposium I: Device Engineering and Memory Technology Symposium II: Lithography and Patterning Symposium III: Dry &Wet Etch and Cleaning Symposium IV: Thin Film, Plating and Process Integration Symposium V: CMP and Post-Polish Cleaning Symposium VI: Metrology, Reliability and Testing Symposium VII: Packaging and Assembly Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies Symposium IX: Design and Automation of Circuits and Systems
Dr. Ru HUANG Symp-I, Chair Peking University, China Dr. Kafai LAI Symp-II, Chair IBM, USA Dr. Ying ZHANG Symp-III, Chair Naura, USA Dr. Zhen GUO Symp-IV, Chair Intel, USA Dr. Xinping QU Symp-V, Chair Fudan University, China
Dr. Steve LIANG Symp-VI, Chair JCET, China
Dr. Peilin SONG Symp-VII, Chair IBM, USA
Dr. Qinghuang LIN Symp-VIII, Chair ASML, USA.
Dr. Wenjian YU Symp-IX, Chair Tsinghua University, China CSTIC 2020 Plan
• CSTIC 2020 will be held on Mar 15-16, 2020 in Shanghai, in conjunction with SEMICON China
• CSTIC 2020 call for papers and manuscript deadlines Call for paper online: Jun. 30, 2019 Abstract deadline: Sep. 30, 2019 Acceptance notification: Nov. 15, 2019 Manuscript deadline: Dec. 26, 2019
Thank you See you at CSTIC 2020