REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT RF Front-EndModule Comparison2021 – Vol. 2 – Focus on 5G Chipset Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones in 2020. SPR21530 - RF report by Stéphane Elisabeth April 2021 – Sample 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 1 Table of Contents Overview / Introduction 4 Physical Analysis 99 o Executive Summary o Baseband Physical Analysis 101 o Key Take Away o Qualcomm Analysis – SDR865 and SMR526 o Reverse Costing Methodology ✓ Package View & Dimensions Company Profile 11 ✓ Die View And Dimensions o Apple, Samsung, Huawei, LG, Lenovo, Oppo, OnePlus, Vivo, Xiaomi, ✓ Die Main Block IDs RealMe, Meizu, Sharp, ZTE/nubia o HiSilicon Analysis – Hi6365 o Smartphones Teardown: o Mediatek Analysis – MT6190W iPhone 12 Pro, Galaxy Note20 Ultra 5G, Mate 40 Pro, V60 ThinQ, o Samsung Analysis – SHANNON5510 Edge+, X50 Pro 5G, 8 pro 5G, Find X2 Pro, Mi 10 Ultra 5G, X50 Pro, o SoC Physical and Cost Comparison Aquos R, Red magic 5G, 17 o 5G Phones Comparison: Low-End, Mid-End, High-End, Premium o 5G Sub-6 – PAMiD Front-End Analysis 142 o Preferred band 5G and 4G in 2020 o B41/n41 Module Analysis o Physical Analysis Summary 50 Qorvo QM75005 vs. QM78041 vs. Qualcomm QPM6585 vs. Skyworks SKY58254 o Summary of the analyzed RF components o UHB, MB/HB, n77/n78, n77/n78/n79 Module analysis o Comparative Analysis: Module in RF Area, Pacakging Type, Design Win, Main Supplier, o 5G Sub-6 – PAM Front-End Analysis 188 Function, OEMs main Supplier Ranking o n1/n3/n7/n28/n77/n78/n79, LB/UHB module Analysis Physical Comparison 70 o Area Distribution per Supplier & Function o 5G Sub-6 – Multiplexer Front-End Analysis 209 o o Area Distribution per Supplier & Function Evolution GPS/4G/5G module Analysis o Die Design Win in Number & Area o 5G Sub-6 – Diversity – Front-End Analysis 220 o Die Distribution per Function o n77/n78/n79, UHB Module Analysis o Die Distribution per Function Evolution o Filter Distribution per Smartphone: Technology and Substrate o 5G Sub-6 & mmWave – Front-End Analysis 241 o o PA/LNA/Switch Distribution per Smartphone: Technology and n260/n261/n79 Module Analysis Substrate o 5G mmWave – Front-End Analysis 252 o Material Substrate Distribution per Smartphone o n260/n261 Module Analysis Cost Comparison 89 Feedbacks 272 o Chipset Cost per Smartphones Related Analyses 273 o Cost Distribution per Supplier & Function SystemPlus Consulting services 275 o Cost Distribution per Supplier & Function Evolution Market Analysis 95 o RFFE & Connectivity Market Ecosystem & Forecast o Technology Landscape ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 2 Executive Summary Overview / Introduction o Executive Summary Last year System Plus opened hundreds of Front-End Modules (FEMs) and components to provide an overview of the Radio o Reverse Costing Methodology o Glossary Frequency (RF) FEM market in selected flagship smartphones. We gathered the information into four reports to track the evolution of this technology market. Company Profile & Supply Chain This year, System Plus Consulting again offers technical and cost comparisons of smartphone RFFEMs. Every comparison Physical Analysis Summary report will focus on a specific subject. It can be a player’s evolution, a specific technology, or a comparison of flagship devices. Physical Comparison This, the second volume of 2021, provides insights into technology and cost data for FEMs and several components found Cost Comparison in 31 smartphones from the latest 5G phones. It provides a ranking of 5G phones and suppliers. It features a comprehensive overview of the RFFEM architectures on the market, comparing available smartphones from these Market Analysis companies. It reveals material substrate trends and main used die functions, along with the different choices in integration of communication technology. We even see millimeter wavelength (mmWave) signal support this year. Also, the report Physical Analysis reveals how companies are integrating 5G, from premium to low-end phones. Feedbacks With teardowns of the smartphones, the main RF modules and components have been extracted and physically analyzed, Related Analyses from the output of the transceiver to the antenna. Packaging, sizes, and technologies are studied to provide a large panel of technical and economic choices and an overview of the market. About System Plus Every component has been analyzed to understand the manufacturing process cost. Moreover, the report includes a technical and cost comparison of the modules. It also tries to explain the smartphone makers’ choices and supplier tendencies. Note: Wifi, Bluetooth and UWB Module are not included in this report. ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 3 Company Profile – Apple, Samsung, Huawei and LG – 5G RF Major Supplier Overview / Introduction Q1 2020 Q2 2020 Q3 2020 Q4 2020 Q4 2020 Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier and Smartphone Teardown o Apple, Samsung, Huawei, Lenovo, LG o Oppo, Vivo, OnePlus, Xiaomi o RealMe, Sharp, ZTE/nubia, Meizu Physical Analysis Summary Physical Comparison Cost Comparison Market Analysis Physical Analysis Feedbacks Related Analyses About System Plus ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 4 Samsung Smartphone Teardown – Samsung Galaxy Note20 Ultra 5G Overview / Introduction Wifi FEM Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier and Smartphone Teardown o Apple, Samsung, Huawei, Lenovo, LG o Oppo, Vivo, OnePlus, Xiaomi o RealMe, Sharp, ZTE/nubia, Meizu Physical Analysis Summary Physical Comparison Cost Comparison Samsung Galaxy Note20 Ultra 5G Front View Market Analysis ©2021 by System Plus Consulting Physical Analysis Feedbacks Related Analyses Modem IF IC About System Plus NFC IC RxTx Footprint Area: UWB FEM ~XX mm² Total Area: ~XX mm² PAMiD RFFE area: ~XX mm² Samsung Galaxy Note20 Ultra 5G Opened View Samsung Galaxy Note20 Ultra 5G Main Board ©2021 by System Plus Consulting ©2021 by System Plus Consulting ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 5 Huawei Smartphone Teardown – Huawei Mate 40 Pro Overview / Introduction RF Components (Marking) Manufacturer Functional Network Band Area (mm²) Quantity RF Board Proportion Cost ($) Company Profile & Supply Chain 429# MURATA PAM 5G n77/n78 XX X Xx o OEMs Financial, RFFEM Supplier HI6H12V100 HISILICON LNA/Switch XX X Xx and Smartphone Teardown Jt xx MURATA Filter XX X Xx o Apple, Samsung, Huawei, KA00 KYOCERA Filter 4G B1/B3/B7 XX X Xx Lenovo, LG QAxx TAIYO YUDEN Filter 4G B40 XX X Xx o Oppo, Vivo, OnePlus, Xiaomi QM12114 QORVO Switch XX X Xx o RealMe, Sharp, ZTE/nubia, 24 xx MURATA Filter 4G B39 XX X Xx EP UNIDENTIFIED Switch XX X Xx Meizu SN MAXSCEND Switch XX X Xx QM11022A QORVO Switch XX X Xx Physical Analysis Summary HI6H13V100B21 HISILICON LNA/Switch XX X Xx QM12112 QORVO Switch XX X Xx xx OJ MURATA Filter 4G B1/B3 XX X Xx Physical Comparison B8367 (85F) QUALCOMM Filter 4G B41 XX X Xx BGS12P2L6 INFINEON TECHNOLOGIES Switch XX X Xx Cost Comparison SKY19249 SKYWORKS Tuner XX X Xx QM13144 QORVO Tuner XX X Xx HI6H11SV100 HISILICON LNA/Switch XX X Xx Market Analysis QM77038 QORVO PAMiD 3G/4G/5G MB/HB XX X Xx A 5P MURATA Multiplexer 4G B2 XX X Xx Physical Analysis QM77033 QORVO PAMiD 4G LB XX X Xx B8538 (8AT) QUALCOMM Multiplexer 4G B28A XX X Xx TC MAXSCEND Switch XX X Xx Feedbacks SKY13699 SKYWORKS Switch XX X Xx B8651 (8EB) QUALCOMM Multiplexer 4G B1 XX X Xx Related Analyses Hi6D05V100 HISILICON PAMiD 4G XX X Xx QDM2310 QUALCOMM Diversity XX X Xx 1C MURATA Filter 4G B12/B13 XX X Xx About System Plus B8369 (85H) QUALCOMM Filter XX X Xx Hi6365V100 HISILICON RxTx 2G/3G/4G/5G XX X Xx Total XX X Xx Footprint Area: ~XX mm² RFFE area: XX mm² ©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 6 Mid-End Phones – 5G Version Overview / Introduction RF Components Manufacturer Functional Network Band Area (mm²) Quantity RF Board Cost ($) (Marking) Proportion Mid-End Phone QM77040 QORVO PAMiD 3G/4G/5G MB/HB XX X Xx Company Profile & Supply Chain SKY78191 SKYWORKS PAMiD 4G LB XX X Xx o OEMs Financial, RFFEM Supplier QET5100 QUALCOMM ET XX X Xx LFx WISOL Filter 4G B34 XX X Xx and Smartphone Teardown QM11022 (1.5x1.1) QORVO Switch XX X Xx o WX UNIDENTIFIED Switch XX X Xx Apple, Samsung, Huawei, SN MAXSCEND Switch XX X Xx Lenovo, LG QLN5030 QUALCOMM LNA XX X Xx o MXD8643 (1.55x1.55) MAXSCEND Switch XX X Xx Oppo, Vivo, OnePlus, XiaomiMXD8643 (1.18x1.18) MAXSCEND Switch XX X Xx o RealMe, Sharp, ZTE/nubia, QM12114 QORVO Switch XX X Xx X6 MURATA Filter 4G B40 XX X Xx Meizu xx Lt MURATA Filter 4G B39/B41 XX X Xx 4Hxx WISOL Filter 4G B1/B3 XX X Xx QAT3518 QUALCOMM Tuner XX X Xx Physical Analysis Summary Cr xx MURATA Filter 4G B41 XX X Xx INFINEON BGA5H1BN6 LNA 4G HB XX X Xx TECHNOLOGIES RF Components Manufacturer Functional Network Band Area (mm²) Quantity RF Board Cost ($) Physical Comparison RF1630 QORVO Switch XX X Xx (Marking) Proportion QET6100 QUALCOMM ET XX X Xx MXD8543S MAXSCEND Tuner XX X Xx QDM2310 QUALCOMM Diversity XX X Xx JJ MAXSCEND