RF Front-End Module Comparison 2020 – Volume 4

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

RF Front-End Module Comparison 2020 – Volume 4 Technical and cost overview of the latest radio frequency front-end module technologies integrated in Asian based smartphones manufacturers. SP20524 - RF report by Stéphane ELISABETH LABORATORY ANALYSIS by Youssef EL GMILI

October 2020 – Sample 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 1 Table of Contents

Overview / Introduction 4 ✓ Die View And Dimensions o Executive Summary ✓ Estimated Front-End Bloc Diagram o Reverse Costing Methodology o AFEM-9206 vs. AFEM-8100 Company Profile 12 o HiSilicon – Front-End Analysis 83 o Huawei, OnePlus, Oppo, Vivo, Xiaomi, ZTE o Huawei P40 Pro – RFFE Architecture o Smartphones Teardown: o Front-End Analysis P40 Pro, 8 5G, Reno3 5G, X30 Pro 5G, Mi 10 Pro, Nubia Red Magic 5G o Hi6HD05V100 vs. SKY77643-61 o Summary of the analyzed RF components o Murata – Front-End Analysis 95 o Physical Analysis Summary 34 Huawei P40 Pro – RFFE Architecture o Front-End Analysis o Database Contains: Number of phones, LTE/5G bands per smartphones, Module in RF Area o 429 vs. SKY58255 o Comparative Analysis: o Qorvo – Front-End Analysis 111 RFFE Area, Design Win, Main Supplier, Function, OEMs main Supplier o Vivo X30 Pro vs. Xiaomi Mi 10 Pro 5G vs. Huawei P40 Pro – RFFE Physical Comparison 45 Architecture o Area Distribution per Supplier & Function o Front-End Module Analysis o o Die Design Win in Number & Area QM75005 vs. SKY58254-11 o Qualcomm – Front-End Analysis 135 o Die Distribution per Function o OnePlus 8 5G vs. Xiaomi Mi 10 Pro 5G vs. ZTE/Nubia Red Magic 5G – o Filter Distribution per Smartphone: Technology and Substrate RFFE Architecture o PA/LNA/Switch Distribution per Smartphone: Technology and Substrate o Front-End Module Analysis o Material Substrate Distribution per Smartphone o QPM5679 vs. Hi6D03V100 o Cost Comparison 57 Skyworks – Front-End Analysis 137 o Oppo Reno3 5G – RFFE Architecture o Cost Distribution per Supplier & Function o Front-End Module Analysis Market Analysis 61 o SKY58254-11 vs. QPM6585 o Wifi Evolution Feedbacks 139 o Connectivity Market Ecosystem & Forecast SystemPlus Consulting services 141 Physical Analysis 67 o Summary of the analyzed RF components o Summary of Comparative Study o Broadcom – Front-End Analysis 70 o OnePlus 8 5G – RFFE Architecture o AFEM-9206 Analysis ✓ Package View & Dimensions ✓ Package Opening

Overview / Introduction RF Front-End Module Comparison 2020 – Vol. 1 RF Front-End Module Comparison 2020 – Vol. 2 o Executive Summary o Reverse Costing Study on smartphones on Q3 2019 Study on Huawei smartphones Methodology o Glossary

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow The report includes the study of at least twenty FEM and several The report includes the study of at least eighty FEM and several components found in three smartphones: Apple iPhone 11 Pro, components found in ten smartphones: Mate and P series from Cost Analysis Samsung Galaxy Note10+ and OnePlus 7 Pro 5G. Also, it comes 2015 to 2019. Also, it came along with a database including Cost Comparison along with a database including information on 485 components information on 483 components in 13 smartphones. in 17 smartphones. Selling Price Analysis Smartphone List Serie Generation Version # of Components Smartphone List 11 Pro 26 Serie Generation Version Addon # of Components Feedbacks Apple iPhone 11 - 20 30 Pro 5G 60 11 Pro Max 27 20 X 5G 45 Related Reports Note 10 Plus 19 Note 10 - 33 20 - - 22 Huawei Mate 10 Lite - 34 About System Plus Samsung Galaxy A80 - 22 Fold - 24 10 - - 28 Xcover 4 S 21 9 - - 40 OnePlus OnePlus 7 Pro 5G 33 8 - - 42 Meizu - 16 S 22 30 Pro - 41 Xiaomi Black Shark 2 - 41 30 - - 31 Asus ROG Phone II - 33 20 Pro - 37 Motorola One Vision - - 28 Huawei P 10 - - 45 Huawei Mate 20 X (5G) 45 Oppo Reno - 5G 24 9 - - 30 Royole FlexPai - - 31 9 Lite - 28 LG Electronics V50 ThinQ 5G 36 Total 483 Total 485 ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 3 Executive Summary

Overview / Introduction Smartphone List RF Front-End Module Comparison 2020 – Vol. 3 Serie Generation Version Addon # of Components o Executive Summary 11 - - 5 o Reverse Costing Wifi & Connectivity 11 Pro - 4 Apple iPhone Methodology 11 Pro Max 3 o Glossary SE (2020) - - 3 Asus Rog Phone II - - 8 Google Pixel 4 XL - 6 Company Profile & Supply HTC Desire 19s - - 4 Chain 20 X 5G 8 Mate 30 Pro 5G 9 Huawei Xs - - 8 Physical Analysis P 40 Pro - 10 LG V60 ThinQ - - 8 Edge + - - 7 Physical Comparison Moto G8 Plus - 5 Motorola Hyper - - 6 One Manufacturing Process Flow Macro - - 4 The report includes the study of several FEMs and components Razr 2019 - - 5 7 Pro - 5G 9 found in 14 smartphones: From Apple to Xiaomi. Also, it came OnePlus Cost Analysis 8 - - 5G 10 along with a database including information on 281 components Find X2 - - 10 3 - 5G 6 in 44 smartphones. Oppo Cost Comparison Reno 3 Pro 5G 6 Ace - - 7 Selling Price Analysis A10 s - 4 A50 - - 7 A51 - - 6 Feedbacks Fold - - 5 M11 - - 4 M31 - - 7 Samsung Galaxy Related Reports Note10 - - 7 Note10 + - 8 About System Plus S20 Ultra 5G 8 S20 + 5G 8 Xcover 4S - 5 Z Flip - - 5 Sharp Aquos R - 5G 5 Nex 3s - - 8 Vivo Nex S - - 5 X30 Pro - - 7 Mi 10 Pro 5G 8 Mi Note 10 - 5 Xiaomi K30 - 5G 6 Redmi Note 8 Pro 5 ZTE Nubia Red Magic - 5G 7 Total 281 ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 4 Executive Summary

Overview / Introduction RF Front-End Module Comparison 2020 – Vol. 4 RF Front-End Module Comparison 2020 – Vol. 5 o Executive Summary o Reverse Costing Study on Chinese/Asian OEMs Study on Apple Smartphones Methodology o Glossary

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow The report includes the study of at least 50 FEM and several components found in Five smartphones: Huawei P40 Pro, Cost Analysis OnePlus 8 5G, Oppo Reno3 5G, Vivo X30 Pro, Xiaomi Mi 10 Pro 5G Cost Comparison and ZTE Nubia Red magic 5G. Also, it comes along with a database including information on 516 components in 19 Selling Price Analysis smartphones. Smartphone List Serie Generation Version Addon # of Components Asus ROG Phone II - - 30 Feedbacks HTC Desire 19s - - 29 Mate 30 Pro 5G 36 Related Reports Huawei Mate Xs - - 39 P 40 Pro - 41 OnePlus 8 - - 5G 16 About System Plus Find X2 - - 32 Reno Ace - - 15 Oppo Reno 3 - 5G 19 Reno 3 Pro 5G 32 Sharp Aquos R - - 5G 21 Nex 3s - - 31 Vivo X30 - Pro - 22 Realme X50 - - 5G 31 Mi 10 Pro 5G 28 Mi Note 10 - - 24 Xiaomi Redmi K30 - 5G 22 Redmi Note 8 Pro - 28 ZTE Nubia Red Magic - 5G 20 Total 516 ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 5 Huawei Smartphone Teardown – Huawei P40 Pro

Overview / Introduction

Company Profile & Supply Chain LTE PAMiD

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Feedbacks

Related Reports 5G PAM

About System Plus

Footprint PCB Area: ~ XX mm² Total PCB Area: ~ XX mm² Total RF Area: ~ XX mm²

Huawei P40 Pro Opened View ©2020 by System Plus Consulting ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 6 Vivo Smartphone Teardown – Vivo X30 Pro 5G

Overview / Introduction RF Components Manufacturer Band Type Area Quantity RF Board Cost Company Profile & Supply Chain (Marking) (mm²) Proportion QM77040 Qorvo MB/HB PAMiD XX X XX % $ XX Physical Analysis QM77032 Qorvo LB PAMiD XX X XX % $ XX Physical Comparison 434 Murata Diversity XX X XX % $ XX QM78200 Qorvo n77/n78 PAMiD XX X XX % $ XX Manufacturing Process Flow QM75005 Qorvo n41 PAMiD XX X XX % $ XX Total XX X XX % $ XX Cost Analysis

Cost Comparison

Selling Price Analysis RF Board Area :

Feedbacks XX mm²

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Module Disassembly o Package Assembly o Views & Dimensions o Cross-Section o Patent o Sensor Die o Views & Dimensions o Delayering o Die Process Package Opened View – Optical View o Die Cross-section ©2020 by System Plus Consulting o ASIC Die o Views & Dimensions o Delayering o Die Process o Die Cross-section

Physical Comparison n41 BAW-SMR Filter Die View – Optical View Manufacturing Process Flow ©2020 by System Plus Consulting Cost Analysis Cost Comparison Selling Price Analysis Feedbacks • Die area: XX mm² Related Reports About System Plus (XX x XX mm) • Die marking: XX n41 BAW-SMR Filter Die Schematic View – Optical View ©2020 by System Plus Consulting • Die substrate: XX

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis o Module Disassembly o Package Assembly o Views & Dimensions o Cross-Section o Patent o Sensor Die o Views & Dimensions o Delayering o Die Process o Die Cross-section o ASIC Die o Views & Dimensions o Delayering o Die Process o Die Cross-section

Physical Comparison Manufacturing Process Flow Cost Analysis Qorvo QM75005 Skyworks SKY58254-11 Cost Comparison ©2020 by System Plus Consulting ©2020 by System Plus Consulting Selling Price Analysis Feedbacks QM75005 SKY58254 Related Reports About System Plus Total number of dies 4 - 4 Power amplifier 1 (XX mm²) +XX % 1 (XX mm²) Filter 1 (XX mm²) +XX % 1 (XX mm²) Switch 1 (XX mm²) +XX % 1 (XX mm²) RFIC 1 (XX mm²) -XX % 1 (XX mm²) ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 9 AFEM-9206 – Package Views & Dimensions

Overview / Introduction • Package Type : XX BGA • Marking : Company Profile & Supply • Dimensions : XX mm² x XX mm 9206 Chain (XX x XX x XX mm) MD005 • Pin Pitch : XX mm KA008 Physical Analysis XX mm Physical Comparison o Module vs Module

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Feedbacks mm XX

Related Reports

About System Plus

Package Top View – Optical View Package Bottom View – Optical View

©2020 by System Plus Consulting ©2020 by System Plus Consulting XX mm XX Package Side View – Optical View ©2020 by System Plus Consulting ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 10 Huawei P40 Pro – RFFE Architecture

Overview / Introduction XX XX XX XX XX XX XX Duplexer XX Duplexer Company Profile & Supply Duplexer Duplexer Chain

Physical Analysis

Physical Comparison o Module vs Module

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Feedbacks RxTx

Related Reports RF Components Manufacturer Band Type Area Quantity RF Board Cost (Marking) (mm²) Proportion About System Plus QM78202 Qorvo n77/n78/n79 PAMiD XX X XX% $ XX 429 Murata n77/n78 PAMiD XX X XX% $ XX Hi6HD05V100 HiSilicon LB/HB/MB PAM XX X XX% $ XX SKY78191 Skyworks LB PAMiD XX X XX% $ XX QM77038 Qorvo MB/HB PAMiD XX X XX% $ XX QDM2310 Qualcomm Diversity XX X XX% $ XX Total XX X XX% $ XX

Overview / Introduction

Company Profile & Supply • Chain The functions of the 8 dies inside the packaging have a following repartition. Physical Analysis • PA: X Physical Comparison o Module vs Module SMD XX number: X • Switch: X

Manufacturing Process Flow • PMIC: X Cost Analysis

Cost Comparison

Selling Price Analysis

Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison o Module vs Module

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison o Module vs Module

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Filter substrate Area Chain

Physical Analysis 2% 8% Physical Comparison o Module vs Module Filter Distribution per technology

Manufacturing Process Flow 2% LT/LN 25% Sapphire Cost Analysis 2% 8% Silicon Cost Comparison (blank) ? Selling Price Analysis 62% SAW IHP 3% Feedbacks 20% SAW (blank) Related Reports BAW FBAR BAW SMR About System Plus IPD (blank) 19 Smartphones; From 2019 to 2020; 523 Components; 1,230 Dies MLC (blank) 2% Filter die substrate distribution ©2020 by System Plus Consulting 66%

19 Smartphones; From 2019 to 2020; 523 Components; 1,230 Dies Filter die type distribution ©2020 by System Plus Consulting ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 15 Material Distribution per smartphone

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison o Module vs Module

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Feedbacks

Related Reports

About System Plus

Overview / Introduction Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type Company Profile & Supply Broadcom AFEM-9206 MB/HB PAMiD OnePlus Double Side BGA Chain HiSilicon Hi6D05V10 LB/MB/HB PAM Huawei MCM LGA 429 n77/n78 PAMiD Huawei MCM LGA Murata Physical Analysis 434 Diversity Vivo MCM LGA QM75005 n41 PAMiD Vivo MCM LGA QM77033B LB PAMiD Xiaomi MCM LGA Physical Comparison Qorvo QM77040 MB/HB PAMiD Oppo; Vivo; Xiaomi MCM LGA QM78202 n77/n78/n79 PAMiD Huawei MCM LGA Manufacturing Process Flow QDM5630 n28/n5/n2/n66 Diversity OnePlus MCM LGA o Sensor Die Front-End Process QDM5677 n77/n78 Diversity OnePlus; Xiaomi; ZTE MCM LGA o Sensor Fabrication Unit QDM5679 n79 Diversity ZTE MCM LGA o ASIC Die Front-End Process QPA5581 n1/n3/n7/n28 PAM Xiaomi MCM LGA o ASIC Fabrication Unit QPM4650 n28/n5/n2/n66 PAMiD OnePlus MCM LGA o Final Test & Assembly Unit Qualcomm QPM5677 n77/n78 PAMiD Oppo; Xiaomi; ZTE MCM LGA QPM5679 n79 PAMiD Oppo; ZTE MCM LGA Cost Analysis QPM6585 n41 PAMiD Oppo; ZTE MCM LGA QPM8820 LB PAMiD ZTE MCM LGA Cost Comparison QPM8885 MB/HB PAMiD ZTE MCM LGA QTM525 V3 n260/n261 AiP OnePlus MCM AiP Selling Price Analysis SKY58211 LB PAMiD OnePlus MCM LGA SKY53735 LB/LMB/MB/HB Diversity Oppo MCM LGA Skyworks Feedbacks SKY58255 n77/n79 PAMiD Oppo MCM LGA SKY58254 B41/n41 PAMiD Oppo MCM LGA Related Reports • The components will be opened to present the internal structure. About System Plus • The die pictures will be presented in this report with estimated bloc diagram.

Overview / Introduction Serie Generation Version Addon Availability 5G Support # of Components Smartphone List 9 Company Profile & Supply Asus ROG Phone II - - 09/09/2019 None 30 HTC Desire 19s - - 14/11/2019 None 29 Chain Mate 30 Pro 5G 18/10/2019 Sub-6 36 8 Huawei Mate Xs - - 26/03/2020 Sub-6 40 Physical Analysis P 40 Pro - 07/04/2020 Sub-6 42 7 OnePlus 8 - - 5G 29/04/2020 Sub-6/mmWave 16 Physical Comparison Find X2 - - 06/05/2020 Sub-6 32 6 Reno Ace - - 18/10/2020 None 15 Oppo Reno 3 - 5G 26/12/2019 Sub-6 19 Manufacturing Process Flow 5 o Sensor Die Front-End Process Reno 3 Pro 5G 26/12/2019 Sub-6 33 o Sensor Fabrication Unit Sharp Aquos R - - 5G 09/04/2020 Sub-6 21 o ASIC Die Front-End Process Nex 3s - - 10/03/2020 Sub-6 31 4 Vivo o ASIC Fabrication Unit X30 - Pro - 24/12/2019 Sub-6 22 o Final Test & Assembly Unit Realme X50 - - 5G 05/03/2020 Sub-6 32 3 Mi 10 Pro 5G 07/04/2020 Sub-6 29

Cost Analysis Mi Note 10 - - 12/02/2020 None 25 5GPhones of Number Xiaomi 2 Redmi K30 - 5G 07/01/2020 Sub-6 23 Cost Comparison Redmi Note 8 Pro - 22/11/2019 None 28 1 ZTE Nubia Red Magic - 5G 21/04/2020 Sub-6 20 Selling Price Analysis Total 523 0 Q4-2019 Q1-2020 Q2-2020 Feedbacks

Related Reports

About System Plus

Overview / Introduction # of Phones with known 5G spectrum support # of Phones with known 4G spectrum support Company Profile & Supply n78 B1 Chain B8 n41 B3 Physical Analysis n1 B40 B5 n79 Physical Comparison B38 n77 B41 B7 n3 Manufacturing Process Flow B39 o Sensor Die Front-End Process n28 B4 o Sensor Fabrication Unit n261 B2 o ASIC Die Front-End Process B34 n260 o ASIC Fabrication Unit B20 o Final Test & Assembly Unit n66 B18 B19 n2 B28 Cost Analysis n5 B26 B12 Cost Comparison 0 2 4 6 8 10 12 14 B17 Number of devices B32 B6 Selling Price Analysis B25 B9 Feedbacks Number of Phones with known 5G Spectrum Support B13 ©2020 by System Plus Consulting B46 Related Reports B42 B66 B29 About System Plus B48 B30 B71 B14 0 2 4 6 8 10 12 14 16 18 20 Number of devices

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow o Sensor Die Front-End Process o Sensor Fabrication Unit o ASIC Die Front-End Process o ASIC Fabrication Unit o Final Test & Assembly Unit

Cost Analysis

Cost Comparison

Selling Price Analysis

Feedbacks

Overview / Introduction Component Distribution per Funtion 1% 0% Company Profile & Supply 2% 0% Chain 2% 3% Physical Analysis 3% Switch 27% Filter 6% Tuner Physical Comparison PAMiD LNA Manufacturing Process Flow 8% Diversity Multiplexer o Sensor Die Front-End Process ET o Sensor Fabrication Unit LNA/Switch o ASIC Die Front-End Process 8% RxTx o ASIC Fabrication Unit PAM o Final Test & Assembly Unit RFIC 21% FEM Component Distribution per Supplier 9% AiP Cost Analysis 1% 0% 0% 10% 1% 1% 1% QUALCOMM Cost Comparison 1% 0% 1% 0% QORVO 19 Smartphones; From 2019 to 2020; 523 Components 2% MURATA Selling Price Analysis MAXSCEND Share in implemented function 2% ©2020 by System Plus Consulting 3% WISOL HISILICON Smartphone List Serie Generation Version Addon Availability 5G Support # of Components Feedbacks 3% 28% SKYWORKS Asus ROG Phone II - - 09/09/2019 None 30 HTC Desire 19s - - 14/11/2019 None 29 4% UNIDENTIFIED Mate 30 Pro 5G 18/10/2019 Sub-6 36 TAIYO YUDEN Related Reports Huawei Mate Xs - - 26/03/2020 Sub-6 40 4% INFINEON TECHNOLOGIES P 40 Pro - 07/04/2020 Sub-6 42 ON SEMICONDUCTOR About System Plus OnePlus 8 - - 5G 29/04/2020 Sub-6/mmWave 16 5% NXP Find X2 - - 06/05/2020 Sub-6 32 TST Reno Ace - - 18/10/2020 None 15 Oppo MEDIATEK Reno 3 - 5G 26/12/2019 Sub-6 19 Reno 3 Pro 5G 26/12/2019 Sub-6 33 STMICROELECTRONICS 9% Sharp Aquos R - - 5G 09/04/2020 Sub-6 21 KYOCERA Nex 3s - - 10/03/2020 Sub-6 31 SONY Vivo 20% X30 - Pro - 24/12/2019 Sub-6 22 SAMSUNG Realme X50 - - 5G 05/03/2020 Sub-6 32 14% CANAANTEK Mi 10 Pro 5G 07/04/2020 Sub-6 29 TOSHIBA Mi Note 10 - - 12/02/2020 None 25 Xiaomi Redmi K30 - 5G 07/01/2020 Sub-6 23 19 Smartphones; From 2019 to 2020; 523 Components Redmi Note 8 Pro - 22/11/2019 None 28 ZTE Nubia Red Magic - 5G 21/04/2020 Sub-6 20 Share in design win Total 523 ©2020 by System Plus Consulting ©2020 by System Plus Consulting | SP20524 - RF Front-End Module Comparison 2020 – Volume 4 | Sample 21 Comparative Study

Overview / Introduction Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type Broadcom AFEM-9206 MB/HB PAMiD OnePlus Double Side BGA Company Profile & Supply Chain Vs. Broadcom AFEM-8100 MB/HB PAMiD Apple Double Side BGA Physical Analysis Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type Physical Comparison HiSilicon Hi6D05V10 LB/MB/HB PAM Huawei MCM LGA Vs. Manufacturing Process Flow o Sensor Die Front-End Process Skyworks SKY77643-61 LB/MB/HB PAM Motorola MCM LGA o Sensor Fabrication Unit o ASIC Die Front-End Process Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type o ASIC Fabrication Unit Murata 429 n77/n78 PAMiD Huawei MCM LGA o Final Test & Assembly Unit Vs. Cost Analysis Skyworks SKY58255-11 n77/n78 PAMiD Oppo MCM LGA

Cost Comparison Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type Qorvo QM75005 n41 PAMiD Vivo MCM LGA Selling Price Analysis Vs. Skyworks SKY58254-11 B41/n41 PAMiD Oppo MCM LGA Feedbacks Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type Related Reports Qualcomm QPM5679 n79 PAMiD ZTE MCM LGA Vs. About System Plus HiSilicon Hi6D03V100 n79 PAM P40 Pro MCM LGA

Manufacturer Model Band Type Smartphone OEMs SiP Packaging Type EMI Shielding Type Internal Shielding Type External Shielding Type Skywo SKY58254-11 n41 PAMiD Oppo MCM LGA Vs. Qualcomm QPM6585 n41 PAMiD ZTE MCM LGA

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison o Module vs Module sensor

Selling Price Analysis

Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT Physical Analysis RF DEVICES RF DEVICES Physical Comparison • RF Front-End Module Comparison 2020 – Volume 3 • Status of the Radar Industry: Players, Applications and Manufacturing Process Flow • RF Front-End Module Comparison 2020 – Volume 2 Technology Trends 2020 • RF Front-End Module Comparison 2020 – Volume 1 Cost Analysis • SAW Filter Comparison 2020 • Skyworks’ FBAR-BAW Filter Technology in 2G/UHB PAMiD Cost Comparison SKY78221 • Qualcomm’s Second Generation 5G mmWave Chipset, Selling Price Analysis from Modem to Antenna

Feedbacks

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Physical Comparison Custom Analyses (>130 analyses per year) Manufacturing Process Flow

Cost Analysis

Cost Comparison Reports (>60 reports per year) Selling Price Analysis

Feedbacks Related Reports Costing Tools About System Plus o Company services o Contact

Trainings

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis FRANKFURT/MAIN Europe Sales Office Physical Comparison NANTES LYON KOREA Manufacturing Process Flow Headquarter YOLE HQ YOLE CORNELIUS TOKYO YOLE Inc. YOLE KK Cost Analysis

GREATER CHINA Cost Comparison YOLE

Selling Price Analysis

Feedbacks

Related Reports About System Plus America Sales Office Asia Sales Office o Company services Headquarters Europe Sales Office o Contact 22 bd Benoni Goullin Lizzie LEVENEZ Steve LAFERRIERE Takashi ONOZAWA 44200 Nantes Frankfurt am Main WESTERN US Tokyo FRANCE GERMANY T : +1 310 600 8267 JAPAN +33 2 40 18 09 16 +49 151 23 54 41 82 [email protected] T : +81 804 371 4887 [email protected] [email protected] [email protected] Chris YOUMAN EASTERN US & CANADA Mavis WANG T : +1 919 607 9839 TAIWAN www.systemplus.fr [email protected] T :+886 979 336 809 CN: +8613661566824 [email protected]