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TSMC Integrated Fan-Out (Info) Package Apple A10
Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected] www.systemplus.fr September 2016 – Version 1 – Written by Stéphane ELISABETH DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Return to TOC Glossary 1. Overview / Introduction 4 – A10 Die Analysis 57 – Executive Summary – A10 Die View, Dimensions & Marking – Reverse Costing Methodology – A10 Die Cross-Section – A10 Die Process Characteristics 2. Company Profile 7 – Comparison with previous generation 65 – Apple Inc. – A9 vs. A10 PoP – Apple Series Application processor – A9 vs. A10 Process – Fan-Out Packaging – TSMC Port-Folio 4. Manufacturing Process Flow 70 – TSMC inFO packaging – Chip Fabrication Unit – Packaging Fabrication Unit 3. Physical Analysis 15 – inFO Reconstitution Flow – Physical Analysis Methodology – iPhone 7 Plus Teardown 17 5. Cost Analysis 81 – A10 Die removal – Synthesis of the cost analysis – A10 Package-on-Package Analysis 23 – Main steps of economic analysis – A10 Package View, Dimensions – Yields Hypotheses – A10 Package XRay View – Die Cost Analysis 86 – A10 Package Opening – Wafer Cost – A10 Package Marking – Die Cost – A10 Package Cross-Section – inFO Packaging Cost Analysis 90 – A10 Package Cross-Section – Adhesive & Passivation – Packaging Wafer Cost – A10 package cross-Section - TIVs – Packaging Cost per process Steps – A10 package cross-Section – Solder Balls – Component Cost – A10 package cross-Section – RDL – Land-Side Decoupling Capacitor Analysis 48 6. -
Apple Iphone SE 16GB 4-Inch Powerhouse Smartphone!
Apple iPhone SE 16GB 4-inch Powerhouse Smartphone! Apple makes the compact smartphone king again with its new iPhone SE. A 4-inch powerhouse that easily fits in your pocket yet delivers the same high speeds and stunning graphics as the iPhone 6s. It’s designed with an improved battery, a rear-facing 12- megapixel iSight camera with Focus Pixels, True Tone Flash and Live Photos, and FaceTime HD camera with Retina Flash for gorgeous selfies. Same powerful chip as iPhone 6s Engineered to bring desktop-class architecture to the iPhone, the 64-bit A9 chip delivers incredible performance and console-standard graphics in apps and games. Overall computing performance is improved by up to 70% over the previous generation, while graphics are as much as 90% faster, ensuring you get a more reactive, immersive experience. Built within the A9 chip is the M9 motion coprocessor, which is connected to the accelerometer, compass and gyroscope to improve city navigation and fitness tracking. It also works to strengthen your connection to Siri, so you don’t have to hold up your iPhone to ask your questions. Capture amazing photos and 4K videos Take sharp, detailed photos and brilliant 4K video with the new 12 megapixel iSight camera. It’s faster, with improved tone mapping and image stabilisation, so you can just tap the shutter and let iPhone do the rest. And with four times the resolution of 1080p Full HD video, the detail you can capture in videos is simply extraordinary. Live Photos Don’t just capture a still; capture the moment with Live Photos. -
Ece Connections
ECE2019/2020 CONNECTIONS BUILDING THE NEW COMPUTER USING REVOLUTIONARY NEW ARCHITECTURES Page 16 ECE CONNECTIONS DIRECTOR’S REFLECTIONS: ALYSSA APSEL Wishna Robyn s I write this, our Cornell scaling alone isn’t the answer to more community is adapting powerful and more efficient computers. to the rapidly evolving We can build chips with upwards of four conditions resulting from billion transistors in a square centimeter the COVID-19 pandemic. (such as Apple’s A11 chip), but when My heart is heavy with attempting to make devices any smaller the distress, uncertainty and anxiety this the electrical properties become difficult to Abrings for so many of us, and in particular control. Pushing them faster also bumps seniors who were looking forward to their up against thermal issues as the predicted last semesters at Cornell. temperatures on-chip become comparable I recognize that these are difficult to that of a rocket nozzle. times and many uncertainties remain, Does that mean the end of innovation very nature of computation by building but I sincerely believe that by working in electronics? No, it’s just the beginning. memory devices, algorithms, circuits, and together as a community, we will achieve Instead of investing in manufacturing devices that directly integrate computation the best possible results for the health and that matches the pace of Moore’s law, even at the cellular level. The work well-being of all of Cornell. Although we major manufacturers have realized highlighted in this issue is exciting in that are distant from each other, our work in that it is cost effective to pursue other it breaks the traditional separation between ECE continues. -
Final Project Milestone APA Format
Running head: FINAL PROJECT MILESTONE ONE 1 FINAL PROJECT MILESTONE ONE [Author] [Institution] FINAL PROJECT MILESTONE ONE 2 Essay Technology is basically an application of scientific knowledge which is utilized for practical purposes, more likely in industry. Moreover, it can be referred to as the use of tools, machines, techniques, material and power sources for making the work in an easier and productive manner. Generally, science is concerned with the understanding on how and why things happen, whereas, technology deals with making things happen. The world in today’s life is surrounded with technologies. In every aspect of human lives, technology is making their work easier and in a productive way (Abroms & Phillips, 2011). Although, there are various disadvantages of these technologies but the advantages are always more. Whenever, someone hears the word technology, the first company which comes into their mind is Apple Inc. This is a firm which has brought enormous change in the world by introducing their iPhones and other i products. The company has changed the entire thought process of the humans. Apple Inc. is an American multinational technological corporation which is headquartered in Cupertino, California. The firm designs, develops and sells the consumer electronics products, computer software products and many other online services. Moreover, the hardware product of the firm includes iPhone smartphone, iPad Tablet computer, Mac personal computer, iPod portable media player, Apple smart watch, Apple TV and HomePod smart speaker. Software products include the macOS and iOS operating system, iTunes media player and many more. This firm was founded by Steve Jobs, Steve Wozniak and Ronald Wayne in 1976 and it was incorporated as Apple Computer, Inc. -
June 2017 Welcome to the Idevices (Iphone, Ipad, Apple Watch & Ipod) SIG Meeting
June 2017 Welcome to the iDevices (iPhone, iPad, Apple Watch & iPod) SIG Meeting. To find Apps that are free for a short time, click these icons below: http://www.iosnoops.com/iphone-ipad- apps-gone-free/ http://appsliced.co/apps Important Note: I have been conducting the iDevice SIG for 6-1/2 years. It is time for me to pass along the hosting of this SIG to someone else. Thank you, everyone, for of your attendance and support. Phil Pensabene will take over the iDevice SIG beginning in July. Thank you, Phil. Click HERE to see the Keynote Address Apple just changed its storage plan options ... again Tuesday, Jun 6, 2017 at 8:08 pm EDT Apple updated its iCloud storage plan again. The good news is that it'll cost you a lot less to get a lot more! If you've been thinking about upgrading (or downgrading) your iCloud storage plan, you're in luck. Apple has just made some changes to its iCloud storage plan that will probably make you happy. Apple has dropped the 1TB storage tier from the iCloud lineup. But have no fear 1TB subscribers! Apple also dropped the price of 2TB of storage by half the price. All former 1TB subscribers will be automatically upgraded to the 2TB plan without any extra cost. All 2TB subscribers will now only pay $9.99 per month for all the storage you can handle! The new tier structure is as follows: 5GB - Free 50GB - $0.99 200GB - $2.99 2TB - $9.99 If you're still not sure which plan is right for you, we've got a useful little guide to help you out. -
Apple A11 Bionic
Apple A11 The Apple A11 Bionic is a 64-bit ARM-based system on a chip (SoC), designed by Apple Inc.[6] and manufactured by TSMC.[1] It first appeared in the iPhone 8, iPhone 8 Plus, and iPhone Apple A11 Bionic X which were introduced on September 12, 2017.[6] It has two high-performance cores which are 25% faster than the Apple A10 and four high-efficiency cores which are up to 70% faster than the energy-efficient cores in the A10.[6][7] Contents Design Neural Engine Products that include the Apple A11 Bionic See also References Produced From Design September 12, 2017 to [1][6][4] The A11 features an Apple-designed 64-bit ARMv8-A six-core CPU, with two high-performance cores at 2.39 GHz, called Monsoon, and four energy-efficient cores, called Mistral. present The A11 uses a new second-generation performance controller, which permits the A11 to use all six cores simultaneously,[8] unlike its predecessor the A10. The A11 also integrates an Apple- Designed by Apple Inc. designed three-core graphics processing unit (GPU) with 30% faster graphics performance than the A10.[6] Embedded in the A11 is the M11 motion coprocessor.[9] The A11 includes a new Common [1] image processor which supports computational photography functions such as lighting estimation, wide color capture, and advanced pixel processing.[6] TSMC manufacturer(s) [1] [7] 2 [10] The A11 is manufactured by TSMC using a 10 nm FinFET process and contains 4.3 billion transistors on a die 87.66 mm in size, 30% smaller than the A10. -
Ecodesign Preparatory Study on Mobile Phones, Smartphones and Tablets
Ecodesign preparatory study on mobile phones, smartphones and tablets Draft Task 4 Report Technologies Written by Fraunhofer IZM, Fraunhofer ISI, VITO October – 2020 Authors: Karsten Schischke (Fraunhofer IZM) Christian Clemm (Fraunhofer IZM) Anton Berwald (Fraunhofer IZM) Marina Proske (Fraunhofer IZM) Gergana Dimitrova (Fraunhofer IZM) Julia Reinhold (Fraunhofer IZM) Carolin Prewitz (Fraunhofer IZM) Christoph Neef (Fraunhofer ISI) Contributors: Antoine Durand (Quality control, Fraunhofer ISI) Clemens Rohde (Quality control, Fraunhofer ISI) Simon Hirzel (Quality control, Fraunhofer ISI) Mihaela Thuring (Quality control, contract management, VITO) Study website: https://www.ecosmartphones.info EUROPEAN COMMISSION Directorate-General for Internal Market, Industry, Entrepreneurship and SMEs Directorate C — Sustainable Industry and Mobility DDG1.C.1 — Circular Economy and Construction Contact: Davide Polverini E-mail: [email protected] European Commission B-1049 Brussels 2 Ecodesign preparatory study on mobile phones, smartphones and tablets Draft Task 4 Report Technologies 4 EUROPEAN COMMISSION Europe Direct is a service to help you find answers to your questions about the European Union. Freephone number (*): 00 800 6 7 8 9 10 11 (*) The information given is free, as are most calls (though some operators, phone boxes or hotels may charge you). LEGAL NOTICE This document has been prepared for the European Commission however it reflects the views only of the authors, and the Commission cannot be held responsible for any use which may be made of the information contained therein. More information on the European Union is available on the Internet (http://www.europa.eu). Luxembourg: Publications Office of the European Union, 2020 ISBN number doi:number © European Union, 2020 Reproduction is authorised provided the source is acknowledged. -
A Microarchitectural Study on Apple's A11 Bionic Processor
A Microarchitectural Study on Apple’s A11 Bionic Processor Debrath Banerjee Department of Computer Science Arkansas State University Jonesboro,AR,USA debrath.banerjee@smail. astate.edu Abstract—Over the 10 years of evolution in iPhone ARM Cortex A9 CPU with ARM’s advanced SIMD extension generations, world has experienced a revolutionary advancement called NEON and a dual core Power VR SGX543MP2 GPU. in iPhone processor which was first brought into palm through According to Apple , the A5 was clocked at 1GHz on the iPad2 iPhone first generation embedded with APL0098 processor. After while it could dynamically adjust its frequency to save its a rapid progression in microarchitecture , currently iPhone battery life.A5 processor came up with two different variants of market is dominated by Apple's new A11(SoC) Bionic processor 45nm and 32nm ,where 32nm was said to provide 12% better chipped with iPhone 8 and iPhone X which is based on ARM battery life. big.LITLE architecture. Apple’s new A11 is based of two performance cores to handle heavy duty multithreaded The high performance variant of Apple A5X was introduced workloads and four efficiency cores to cover more mundane tasks when Apple launched third generation iPad. This SoC had a when the requirements arises in order to preserve power quadcore graphics unit instead of the previous dual core as well consumption. A11 sports a new heavy duty performance as quad core channel memory controller that provided a controller which allows the chip to use these six cores at same memory bandwidth of 12.8GB/sec which was about three times time which is a great departure from A10 processor. -
Apple Iphone 6S Plus 5.5" 128GB 4G Sølv
Apple iPhone 6s Plus 5.5" 128GB 4G Sølv Beskrivelse Apple iPhone 6s Plus - Smartphone - 4G LTE Advanced - 128 GB - CDMA / GSM - 5.5" - 1920 x 1080 pixels (401 ppi) - Retina HD - 12 MP (5 MP frontkamera) - sølv Features Den næste generation af Multi-Touch Da den første iPhone kom til verden, tog den også Multi-Touch med sig. En funktion, som lige siden har ændret den måde, man oplever teknologi på. Nu kommer 3D Touch, så du får mulighed for at gøre ting, der slet ikke har været mulige før. Og fordi din iPhone nu også kan mærke, hvor hårdt du trykker på skærmen, kan du interagere med den og alt det, du har på den, på en helt ny måde. Endda både hurtigere og nemmere end før. Og takket være den nye Taptic Engine får du også feedback i realtid i form af små prik. Minder for livet Verdens mest populære kamera er blevet endnu mere avanceret. 12-megapixels iSight-kameraet tager skarpe og detaljerede billeder, det optager strålende 4K-video med op til fire gange så høj opløsning som 1080p HD-video, og det indbyggede 5-megapixels FaceTime HD-kamera forvandler dine selfies til små kunstværker. iPhone 6s kommer også med en helt ny funktion: Live Photos - en ny måde at genopleve dine minder på. Live Photos fanger sekunderne, før og efter du tager et stillbillede, så du kan se en levende version af billedet med både bevægelse og lyd. Den mest avancerede processor i en smartphone iPhone 6s kører på en særligt tilpasset 64-bit A9-processor. -
Technical Specifications
TECHNICAL SPECIFICATIONS 1. Desktop Minimum Requirements APPLE MAC MINI BUILD HARDWARE MINIMUM REQUIREMENTS 1. Motherboard MAC MINI Motherboard 2. Processor / CPU i3 8TH Gen Intel Processor 3. Memory / RAM 8GB DDR4 4. Hard Disk Drive or Solid State Drive 256gb SSD 5. PSU / Power Supply MAC MINI Built-in PSU 6. Monitor 1920x1080 or 1080p Resolution Monitor 7. Camera/Webcam w/ Microphone 720p / 1080p HD Web Cam (You will buy separately) INTEL BUILD HARDWARE MINIMUM REQUIREMENTS 1. Motherboard LGA 1151 Motherboard 2. Processor / CPU i3 7th Generation 3. Memory / RAM 4GB RAM DDR4 4. Hard Disk Drive or Solid State Drive 250 GB SSD 5. PSU / Power Supply Generic Power Supply 6. Monitor 1366x768, 720p Wide Monitor 7. Camera/Webcam w/ Microphone 720 / 1080p HD 1 AMD BUILD HARDWARE MINIMUM REQUIREMENTS 1. Motherboard AM4 Motherboard 2. Processor / CPU AMD Ryzen 3 Processors 3. Memory / RAM 4GB RAM DDR4 4. Hard Disk Drive or Solid State Drive 250 GB SSD 5. PSU / Power Supply Generic Power Supply 6. Monitor 1366x768, 720p Wide Monitor 7. Camera/Webcam w/ Microphone 720 / 1080p HD 2. Laptop Minimum Requirements APPLE / MAC LAPTOPS HARDWARE MINIMUM REQUIREMENTS 1. Processor / CPU i3 10th Generation Intel Processor 2. Memory / RAM 8gb LPDDR4X Memory 3. Hard Disk Drive or Solid State Drive 256GB SSD 4. Screen 2560x1600 Native Resolution 5. Camera/Webcam w/ Microphone 720p Facetime HD INTEL LAPTOPS HARDWARE MINIMUM REQUIREMENTS 1. Processor / CPU i3 8th Generation Intel Processor 2. Memory / RAM 4 or 8GB Memory 3. Hard Disk Drive or Solid State Drive 128/250GB SSD 4. Screen 13 - 15 inches, 1366x768, 720p Resolution 5. -
Single Chip and Multi Chip Integration
2019 Edition Chapter 8: Single Chip and Multi-Chip Integration http://eps.ieee.org/hir The HIR is devised and intended for technology assessment only and is without regard to any commercial considerations pertaining to individual products or equipment. We acknowledge with gratitude the use of material and figures in this Roadmap that are excerpted from original sources. Figures & tables should be re-used only with the permission of the original source. October, 2019 Table of Contents To download additional chapters, please visit Table of Contents http://eps.ieee.org/hir CHAPTER 1: HETEROGENEOUS INTEGRATION ROADMAP: OVERVIEW .......................................................................... 1 CHAPTER 2: HIGH PERFORMANCE COMPUTING AND DATA CENTERS ............................................................................. 1 CHAPTER 3: THE INTERNET OF THINGS (IOT) .................................................................................................................. 1 CHAPTER 4: MEDICAL, HEALTH & WEARABLES ............................................................................................................... 1 CHAPTER 5: AUTOMOTIVE ............................................................................................................................................ 1 CHAPTER 6: AEROSPACE AND DEFENSE ......................................................................................................................... 1 CHAPTER 7: MOBILE ..................................................................................................................................................... -
Evolution of Apple's “A” Series Processors
Vinay Nagrani Journal of Engineering Research and Application www.ijera.com ISSN: 2248-9622 Vol. 8, Issue 12 (Part -II) Dec 2018, pp 71-77 RESEARCH ARTICLE OPEN ACCESS Evolution of Apple's “A” Series Processors Vinay Nagrani*, Mr. Amit S. Hatekar** *(Research Scholar, Department of Electronics and Telecommunication, Thadomal Shahani Engineering College, Mumbai-50 ** (Assistant Professor, Department of Electronics and Telecommunication, Thadomal Shahani Engineering College, Mumbai-50 Corresponding Author : Vinay Nagrani ABSTRACT Apple's known to be a company which embraces in-house technology. While other companies outsource, Apple likes to keep things in-house whenever potential and therefore the chips found in iOS devices are no exception whereas other smartphones makers rely on Qualcomm, Mediatek and Intel for chipsets. Apple houses its own team of engineers to work on designs exclusive to their devices and it all began in 2008 when Apple purchased a small semiconductor company called P. A. Semi (i.e. Palo Alto Semiconductor). With a continuous thrive to push the human race forward, Apple‟s been exploiting the smartphones industry to the very limits possible. The first "Systems on Chip" (SoC) was used in the first iPhone in 2007 it was called the APL0098. A12X, which is the latest chipset by Apple, stands out to be the most advanced processor ever found on a Smartphone. The latest generation of Apple processors are manufactured by TSMC Keywords – Apple Processors, Face ID, FinFET, System on Chip (SoC), Touch ID, ----------------------------------------------------------------------------------------------------------------------------- --------- Date of Submission: 20-12-2018 Date of Acceptance: 04-01-2019 -------------------------------------------------------------------------------------------------------------------------------------- I. INTRODUCTION chipset. The original iPhone housed AAPL0298 with With the advancement in digital age, Apple single thread clock speed of 0.41GHz.