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Chunichisha 株式会社 中 日 社 〒111-0053 東 京 都 台 東 区 浅 草 橋3-24-8 伊 藤 ビ ル TEL.03-3861-5201 FAX.03-3861-5202

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Chunichisha 株式会社 中 日 社 〒111-0053 東 京 都 台 東 区 浅 草 橋3-24-8 伊 藤 ビ ル TEL.03-3861-5201 FAX.03-3861-5202 ●発行 2016年11月25日 ●本体価格 92,000円（＋税、送料共） ●体裁 CD版（PDFファイル 全195頁） chunichisha 株式会社 中 日 社 〒111-0053 東 京 都 台 東 区 浅 草 橋3-24-8 伊 藤 ビ ル http://www.chunichisha.co.jp TEL.03-3861-5201 FAX.03-3861-5202 半導体、特にInFO-WLPによりモーションプロセッ サM10を内蔵したA10のＣＴ写真やA9との比較など、 A10解析関連情報を数多く掲載している。 また、各チップ・モジュールにおけるEMI対策状 況を掲載。さらに6sPlusの情報を付加することで従 来端末との違いと次世代機へ向けた施策を垣間見る ことができる。 a r e 内 容 構 成 m a 【Summary on Apple iPhone 7 Plus】 c e l ・Summary on Apple iPhone 7 Plus g n ・External Views and Function Keys of iPhone 7 Plus a e ・Chipset for iPhone 7 and iPhone 7 Plus Based on d i Qualcomm W ・Functional Block Supposed for Apple iPhone 7/7 Plus ・Key Components of Apple iPhone 7 Plus 【Specifications of Apple iPhone 7 Plus】 ・Transition of Apple iPhones ・Transition of iPhone Mother Boards ・Comparison of Apple iPhone 7 Series and 6s Series ・Features and Specification of Apple iPhone 7 Plus Weight: 0.75g ・Comparison of Chipset for Intel-based and Qualcomm- based iPhone 7/7 Plus ・Qualcomm MDM9645 vs Intel XMM7360（裏面へ続く） 書籍購入ご希望の際は下記の購読申込書をＦＡＸまたは郵送で弊社宛にお送り下さい。 資料名 i P h o n e 7 P l u s キ ー デ バ イ ス 解 析 部 資料名 部 貴社名 部課名 お名前 ご住所 TEL. （備考） お支払い予定 日締め 日払い 銀行振込 郵便振替 〒111-0053 東京都台東区浅草橋3-24-8 伊藤ビル ●申込先 株式会社 内 容 構 成 【Teardown Analysis of Apple iPhone 7 Plus】 ・Avago's PA, FBAR Duplexers, and GPS FEMs for RF ・Inner Structure of Apple iPhone 7 Plus Front-End ・External Views of Apple iPhone 7 Plus ・Chipset by Qualcomm ・Details of Key Semiconductor/Electronic Devices ・iPhone 7 Board Lay-out Based on Qualcomm Chipset ・X-ray Pictures of Touch ID Sensor for iPhone 7 and ・Intel's and Qualcomm's Chipset for iPhone Series iPhone 7 Plus ・Bands Supported by Intel and Qualcomm RF & Modem ・Transition of iPhone Main Cameras Ics ・CT Analysis of Dual Camera Area by UHS's Si-300 ・Qualcomm WTR3925 and WTR4905, RFIC ・Key Parts of Apple iPhone 7 Plus Dual Camera ・Qualcomm WTR3925, RFIC ・X-ray Pictures of Dual Lens Camera Module ・Specification of Qualcomm MDM9645M ・Disassembly of Apple iPhone 7 Plus Camera Module ・Outline of Apple A10 Fusion CPU ・Structure of iPhone 7 and 7 Plus Camera Module ・What Is An Apple A10 Fusion (part number APL1W2 ・Camera Differences of iPhone 7 Plus and Huawei Honor 4)? 8 ・Effectiveness of InFO-WLP ・New True Tone Flash for iPhone 7 and iPhone 7 Plus ・Outline of Apple A10 Fusion CPU & InFO-WLP ・X-ray Pictures of 7MP "Face Time" Camera Module ・Specification Comparison of Apple A9 CPU and A10 Fu- ・Key Parts of Apple iPhone 7 Plus "Face Time" Cameras sion ・Comparison of New Taptic Engines for iPhone 7 Series ・Key Components of Apple iPhone 6s/6s Plus ・Overcoat and Cushion Seal Around Connectors ・Transition of Apple SoC Chip ・Special Treatment for Speaker Housing for iPhone 7 Se- ・An Example of Apple Ax CPU Series ries ・CPUの性能向上のサイクルと消費電力・発熱量 ・Differences of Home Button for iPhone 6s Plus and i- ・History of Apple Ax CPUs Phone 7 Plus ・Impact of TSMC's InFO-WLP to Other OSAT ・Comparison of 3D Touch Sensor Assy ・TSMC's FOWLP Formation: Chip-First(Die-Up) ・Mechanism of Apple 3D Touch Sensor ・Possibility of TSMC's InFO-PoP Manufacturing Process ・Cross-sectional Views of Qualcomm MDM9645M ・Different LPDDR4 Capacity of iPhone 7 Series ・Footprint Comparison of A9 CPU and A10 Fusion ・Samsung LPDDR4 Line-up ・TMV-PoP for A9 CPU vs InFO WLP PoP for A10 Fusion ・Samsung Mobile LPDDR4 Development ・Chip and Package Pictures of Apple/TSMC A10 Fusion ・Samsung Line-up of LPDDR4 CPU ・Low Power DRAM Bandwidth Roadmap ・X-ray Pictures of A10 Fusion and LPDDR4 Packages ・PoP Package Issues: Thickness ・X-ray CT Analysis around A10 Fusion CPU ・Pop Package Issues: Electrical ・De-coupling Capacitor for Apple A10 Fusion ・2GB or 3GB LPDDR4 for iPhone 7 Series ・Cross-sectional Views of iPhone 7 Plus Mother Board ・PoP Package Issues: Thermal ・X-ray Pictures of Apple A10 Fusion InFO-PoP Sliced ・32GB, 128GB and 256GB NAND Memories for iPhone 7 ・Cross-sectional Views of Apple A10 Fusion CPU Packa- Series ge ・Samsung Re-entries to Supply NAND Memories to iPhones ・Image of A10 Fusion CPU InFO-WLP ・Why Is EMI Shielding Required to The Individual Packa- ・Alps Electric Compass, HSCDTDOOxA ges? ・LCP Antenna Cables for iPhone 7 Series ・Effectiveness of EMI Shielding Performance ・X-ray and Inside Pictures of Bosch Sensortec BMP280 ・Measurement data of different shielding methods. All ・X-ray Pictures of SK Hynix 32GB NAND Memory data is normalized to the non-shielded reference part ・X-ray Pictures of Samsung 256GB 3D NAND Memory ・LGA vs BGA for Mobile NAND Memories ・Audio CODEC and Audio Amplifiers for iPhone 7 Series ・Requirements to Thermal Conductive Sheet for Portable ・EMI Shielded Packages on Apple iPhone 7 Series Products ・Anti-static Stickers for Apple iPhones ・Transition of Camera Specification for Apple iPhones ・EMI Shielded Packages for iPhone 7 Series ・Camera Comparison of iPhone 7 and iPhone 7 Plus ・Cross-sectional Views ・Bosch Sensortec's MEMS Sensors ・Analysis of Elements Coated ・Texas Instruments Battery Charger SN2400ABO ・Built-in Sensors for iPhone 7/7 Plus ・Lattice Semiconductor FPGA, ICE5LP4K ・Sensors and Their Suppliers ・Features and Application of NXP NFC Control IC ・Sips for Apple iPhone 7 and 8 ・Background of NFC Type-F and NXP's Product Examples ・What is the Difference of IP67 and IP68? 【Appendix on Apple iPhone 7 Plus】 ・Features of LCD Substrates ・LTE Carrier Aggregation ・Antenna LCP Cables for iPhone 5 and iPhone 7 Series ・6 Models of iPhone 7 and iPhone 7 Plus on the Market ・Apple's Patent for Water-proof iPhones ・Cellular and Wireless System of Apple iPhone 7 Series ・Murata's RF Switches and FEMs ・Murata's RF Modules ・AVAGO RF Products.
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