2019 Technology Outlook
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Second Generation of TSMC's Integrated Fan-Out (Info
Apple A11 Application Processor Second generation of TSMC’s inFO packaging PACKAGING report by Stéphane ELISABETH February 2018 – version 1 ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 1 Table of Contents Overview / Introduction 4 o Application Processor 87 o Executive Summary Die Views, Marking & Dimensions o Reverse Costing Methodology Die Cross-Section Company Profile 8 Die Process Characteristics o Apple Physical Comparison 94 o Apple APE Portfolio o Apple’s APE Series: A9, A10, A11 o Fan-Out Packaging o APE’s PoP Technology: Standard PoP, MCeP, inFO o TSMC inFO Technology Manufacturing Process 98 o Apple iPhone 8 & X Teardown o APE Die Front-End Process & Fabrication Unit o Fan-Out Market o Deep Trench Capacitor Die Front-End Process Flow Physical Analysis 22 & Fabrication Unit o Summary of the Physical Analysis 23 o inFO Packaging Process Flow & Fabrication unit o Packaging 25 Cost Analysis 117 Package Views, Marking & Dimensions o Summary of the cost analysis 118 o Yields Explanation & Hypotheses 119 Package X-Ray o APE die 122 Package RDL Deprocessing Wafer & Die Front-End Cost Package Memory: X-Ray view & Opening Preparation Wafer Cost Package Opening o LSC die 126 Board Cross-Section: Via Frame, PCB, Dimensions Wafer & Die Front-End Cost Package Cross-Section: TiV, Adhesive, RDLs Frond-End cost per Process Steps Package Process o inFO Packaging 131 Summary of Physical Data inFO Wafer Cost o Land-Side Capacitor 65 inFO Front-End Cost per Process Steps Die Views & Dimensions Component Cost Die Deprocessing & Delayering Company services 136 Die Process Die Cross-Section Die Process Characteristics ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 2 Executive Summary Overview / Introduction o Executive Summary • This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of o Reverse Costing Methodology the Apple A11. -
TSMC Integrated Fan-Out (Info) Package Apple A10
Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected] www.systemplus.fr September 2016 – Version 1 – Written by Stéphane ELISABETH DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Return to TOC Glossary 1. Overview / Introduction 4 – A10 Die Analysis 57 – Executive Summary – A10 Die View, Dimensions & Marking – Reverse Costing Methodology – A10 Die Cross-Section – A10 Die Process Characteristics 2. Company Profile 7 – Comparison with previous generation 65 – Apple Inc. – A9 vs. A10 PoP – Apple Series Application processor – A9 vs. A10 Process – Fan-Out Packaging – TSMC Port-Folio 4. Manufacturing Process Flow 70 – TSMC inFO packaging – Chip Fabrication Unit – Packaging Fabrication Unit 3. Physical Analysis 15 – inFO Reconstitution Flow – Physical Analysis Methodology – iPhone 7 Plus Teardown 17 5. Cost Analysis 81 – A10 Die removal – Synthesis of the cost analysis – A10 Package-on-Package Analysis 23 – Main steps of economic analysis – A10 Package View, Dimensions – Yields Hypotheses – A10 Package XRay View – Die Cost Analysis 86 – A10 Package Opening – Wafer Cost – A10 Package Marking – Die Cost – A10 Package Cross-Section – inFO Packaging Cost Analysis 90 – A10 Package Cross-Section – Adhesive & Passivation – Packaging Wafer Cost – A10 package cross-Section - TIVs – Packaging Cost per process Steps – A10 package cross-Section – Solder Balls – Component Cost – A10 package cross-Section – RDL – Land-Side Decoupling Capacitor Analysis 48 6. -
Survey and Benchmarking of Machine Learning Accelerators
1 Survey and Benchmarking of Machine Learning Accelerators Albert Reuther, Peter Michaleas, Michael Jones, Vijay Gadepally, Siddharth Samsi, and Jeremy Kepner MIT Lincoln Laboratory Supercomputing Center Lexington, MA, USA freuther,pmichaleas,michael.jones,vijayg,sid,[email protected] Abstract—Advances in multicore processors and accelerators components play a major role in the success or failure of an have opened the flood gates to greater exploration and application AI system. of machine learning techniques to a variety of applications. These advances, along with breakdowns of several trends including Moore’s Law, have prompted an explosion of processors and accelerators that promise even greater computational and ma- chine learning capabilities. These processors and accelerators are coming in many forms, from CPUs and GPUs to ASICs, FPGAs, and dataflow accelerators. This paper surveys the current state of these processors and accelerators that have been publicly announced with performance and power consumption numbers. The performance and power values are plotted on a scatter graph and a number of dimensions and observations from the trends on this plot are discussed and analyzed. For instance, there are interesting trends in the plot regarding power consumption, numerical precision, and inference versus training. We then select and benchmark two commercially- available low size, weight, and power (SWaP) accelerators as these processors are the most interesting for embedded and Fig. 1. Canonical AI architecture consists of sensors, data conditioning, mobile machine learning inference applications that are most algorithms, modern computing, robust AI, human-machine teaming, and users (missions). Each step is critical in developing end-to-end AI applications and applicable to the DoD and other SWaP constrained users. -
Contrails Ejoa Summer 2018
EJOA EDITION SETTING THE STANDARD CONTROLLING USE TAX ON YOUR AIRCRAFT PURCHASES FOR INNOVATION THE PRIVATE JET MAGAZINE SUMMER 2018 DRONES AND HURRICANES SOARING INTO HURRICANE SEASON SERIOUS ASTUNT STICK AND RUDDER FLYING S E T T I N G THE STANDARD A REVIEW OF THE LAST DECADE Embraer 18Q3.indd 1 8/5/18 9:17 PM NEW Now there’s a Bose aviation headset that’s just your type. AIRCRAFT SALES & ACQUISITIONS AEROCOR has quickly become the world's number one VLJ broker, with more listings and more completed transactions than the competition. Our success is driven by product specialization and direct access to the largest pool of light turbine buyers. Find out why buyers and sellers are switching to AEROCOR. UNPARALLELED Introducing the new Bose ProFlight Aviation ACCURATE INTEGRITY PRICING EXPOSURE Headset with features designed for airline and corporate aircraft fl ight decks. Proprietary market Honest & fair Strategic partnership tracking & representation with Aerista, the world's Designed for the professional pilot, the Bose ProFlight is the industry’s valuation tools largest Cirrus dealer smallest, quietest and most comfortable active noise cancelling communication headset and includes three user selectable levels of noise cancellation, a unique tap control for talk-through communication and quick release side-swappable boom microphone and down cable. CALL US TODAY! All engineered into a form factor unlike any other headset – a highly PROFLIGHT AVIATION HEADSET stable, in-ear confi guration without the usual intrusive deep-insert eartips. In-ear confi guration for pilots The new Bose ProFlight is FAA TSO and EASA E/TSO-C139a certifi ed. -
The Ipad Comparison Chart Compare All Models of the Ipad
ABOUT.COM FOOD HEALTH HOME MONEY STYLE TECH TRAVEL MORE Search... About.com About Tech iPad iPad Hardware and Competition The iPad Comparison Chart Compare All Models of the iPad By Daniel Nations SHARE iPad Expert Ads iPAD Pro New Apple iPAD iPAD 2 iPAD Air iPAD Cases iPAD MINI2 Cheap Tablet PC Air 2 Case Used Computers iPAD Display The iPad has evolved since it was originally announced in January 2010. Sign Up for our The iPad 2 added dual-facing cameras Free Newsletters along with a faster processor and improved graphics, but the biggest jump About Apple was with the iPad 3, which increased the Tech Today resolution of the display to 2,048 x 1,536 iPad and added Siri for voice recognition. The iPad 4 was a super-charged iPad 3, with Enter your email around twice the processing power, and the iPad Mini, released alongside the iPad SIGN UP 4, was Apple's first 7.9-inch iPad. Two years ago, the iPad Air became the TODAY'S TOP 5 PICKS IN TECH first iPad to use a 64-bit chip, ushering IPAD CATEGORIES the iPad into a new era. We Go Hands-On 5 With the OnePlus X New to iPad: How to Get The latest in Apple's lineup include the By Faryaab Sheikh Started With Your iPad iPad Pro, which super-sizes the screen to Smartphones Expert The entire iPad family: Pro, Air and Mini. Image © 12.9 inches and is compatible with a new The Best of the iPad: Apps, Apple, Inc. -
Zacks Equity Research Zacks Equity Research
September 3, 2019 Zacks Equity Research Zacks Equity Research www.zacks.com 10 S. Riverside Plaza, Suite 1600 - Chicago, Il 60606 Industry Outlook The Zacks Computer – Mini Computers industry comprises prominent companies like Apple (AAPL) and HP (HPQ) that offer devices including smartphones, desktops, laptops, printers, wearables and 3-D printers. Such devices primarily adopt a multi-operating system, multi-architecture strategies using Apple’s iOS, MacOS, Microsoft Windows, Google Chrome and Android operating systems. They predominantly use processors from Apple, Intel (INTC), AMD, Qualcomm (QCOM ), NVIDIA (NVDA), Samsung, Broadcom and MediaTek, among others. Here are the four major industry themes: Expanding screen size, better display and enhanced storage capabilities have been key catalysts driving rapid proliferation of smartphones. This has been well-supported by faster mobile processors from the likes of Qualcomm (Snapdragon-brand), NVIDIA (Tegra X1), Apple (A12 Bionic) and Samsung (Exynos 9609). Moreover, improved Internet penetration and speed along with evolution of mobile apps have made smartphones indispensable for consumers. Further, the improved graphics quality is making smartphones suitable for playing games like PUBG and Fortnite. This is expected to boost demand for high-end smartphones which open up significant opportunities for device makers. Personal computers (desktops and laptops), be it Windows or Apple’s MacOS-based, have been facing the risk of extinction due to rapid proliferation of smartphones and tablets. Shipment of Personal Computers (PCs) has also suffered due to inventory constraints of Intel’s CPU. Stiff competition from smartphones has compelled global PC makers to not only upgrade hardware frequently but also add apps and cloud-based services to attract consumers. -
Tmobile Device Matrix
Device Portfolio Apple iPhone 5C Apple iPhone 5S Apple iPhone 6 Apple iPhone 6 Device Name 8 GB 16 GB 16GB Plus 16GB Image Up-Front Purchase Price: $449.76 $549.84 $649.92 $749.91 Monthly EIP Price: $18.74 $22.91 $27.08 $31.25 Device Size 2.33" x 4.90" x 0.35" 2.31" x 4.87" x 0.30" 2.64" x 5.44" x 0.27" 3.06" x 6.22" x 0.28" Display Size 4.0" 4.0" 4.7" 5.5" Weight 4.65 ounces 3.95 ounces 4.55 ounces 6.07 ounces Talk Time Up to 10 hours Up to 10 hours Up to 14 hours Up to 24 hours Standby Time Up to 10 days Up to 10 days Up to 10 days Up to 16 days Built-in, rechargeable, Built-in, rechargeable, Built-in, rechargeable, Built-in, rechargeable, Included Battery lithium-ion lithium-ion lithium-ion lithium-ion Charger Type Lightning Lightning Lightning Lightning Network Technology 2G, 3G, 4G, LTE 2G, 3G, 4G, LTE 2G, 3G, 4G, LTE 2G, 3G, 4G, LTE 1, 2, 3, 4, 5, 7, 8, 13, 1, 2, 3, 4, 5, 7, 8, 13, 1, 2, 3, 4, 5, 8, 13, 17, 1, 2, 3, 4, 5, 8, 13, 17, Operating Band 17, 18, 19, 20, 25, 26, 17, 18, 19, 20, 25, 26, 19, 20, 25 19, 20, 25 28, 29 28, 29 Part Number N/A N/A N/A N/A Operating System iOS 7 iOS 7 iOS 8 iOS 8 Apple A7 Dual Apple A6 Dual A8 processor with M8 A8 processor with M8 Processor Processor with M7 Processor co-processor co-processor motion co-processor Memory 8 GB Storage 16 GB Storage 16 GB Storage 16 GB Storage Micro SD Card Not supported Not supported Not supported Not supported Keyboard Type Touch Touch Touch Touch Wi-Fi Yes Yes Yes Yes Wi-Fi Calling Yes with iOS 8 update Yes with iOS 8 update Yes Yes Bluetooth Yes Yes Yes Yes Tethering Yes Yes Yes Yes Camera F: 1.2; R: 8.0 F: 1.2; R: 8.0 F: 1.2; R: 8.0 F: 1.2; R: 8.0 Media Player Yes Yes Yes Yes Text, IM & Email Yes Yes Yes Yes SIM Type Nano GBA Nano GBA Nano GBA Nano GBA CMAS, HD Voice, CMAS, HD Voice, CMAS, HD Voice, CMAS, HD Voice, Notes HAC M3/T4 HAC M3/T4 HAC M3/T4, VoLTE HAC M3/T4, VoLTE http://support.t- http://support.t- http://support.t- http://support.t- Full Specs List mobile.com/docs/DOC- mobile.com/docs/DOC- mobile.com/docs/DOC- mobile.com/docs/DOC- 9041 9042 16498 16500 SP - iOS Page 1. -
Apple Iphone SE 16GB 4-Inch Powerhouse Smartphone!
Apple iPhone SE 16GB 4-inch Powerhouse Smartphone! Apple makes the compact smartphone king again with its new iPhone SE. A 4-inch powerhouse that easily fits in your pocket yet delivers the same high speeds and stunning graphics as the iPhone 6s. It’s designed with an improved battery, a rear-facing 12- megapixel iSight camera with Focus Pixels, True Tone Flash and Live Photos, and FaceTime HD camera with Retina Flash for gorgeous selfies. Same powerful chip as iPhone 6s Engineered to bring desktop-class architecture to the iPhone, the 64-bit A9 chip delivers incredible performance and console-standard graphics in apps and games. Overall computing performance is improved by up to 70% over the previous generation, while graphics are as much as 90% faster, ensuring you get a more reactive, immersive experience. Built within the A9 chip is the M9 motion coprocessor, which is connected to the accelerometer, compass and gyroscope to improve city navigation and fitness tracking. It also works to strengthen your connection to Siri, so you don’t have to hold up your iPhone to ask your questions. Capture amazing photos and 4K videos Take sharp, detailed photos and brilliant 4K video with the new 12 megapixel iSight camera. It’s faster, with improved tone mapping and image stabilisation, so you can just tap the shutter and let iPhone do the rest. And with four times the resolution of 1080p Full HD video, the detail you can capture in videos is simply extraordinary. Live Photos Don’t just capture a still; capture the moment with Live Photos. -
Sigurnost Apple Platforme Proljeće 2020
Sigurnost Apple platforme Proljeće 2020. Sadržaj Uvod u sigurnost Apple platforme 5 Obveza za sigurnost 6 Sigurnost hardvera i biometrija 8 Pregled sigurnosti hardvera 8 Secure Enclave 9 Dedicirani AES modul 10 Touch ID i Face ID 12 Hardversko isključivanje mikrofona u Macu i iPadu 17 Express Card kartice sa štednjom energije u iPhoneu 17 Sigurnost sustava 18 Pregled sigurnosti sustava 18 Generiranje nasumičnih brojeva 18 Sigurno podizanje sustava 19 Sigurnosna ažuriranja softvera 28 Integritet sustava OS u sustavu iOS i iPadOS 29 Integritet sustava OS u sustavu macOS 31 Sigurnost sustava watchOS 37 Enkripcija i zaštita podataka 40 Pregled enkripcije i zaštite podataka 40 Kako Apple štiti osobne podatke korisnika 40 Uloga Apple sustava datoteka 41 Zaštita podataka u sustavu iOS i iPadOS 42 Enkripcija u sustavu macOS 48 Šifre i lozinke 54 Autentikacija i digitalno potpisivanje 56 Zbirke ključeva 58 Sigurnost Apple platforme 2 Sigurnost aplikacija 61 Pregled sigurnosti aplikacija 61 Sigurnost aplikacija u sustavu iOS i iPadOS 62 Sigurnost aplikacija u sustavu macOS 67 Sigurnosne značajke u aplikaciji Bilješke 70 Sigurnosne značajke u aplikaciji Prečaci 71 Sigurnost usluga 72 Pregled sigurnosti usluga 72 Apple ID i Upravljani Apple ID 72 iCloud 74 Upravljanje šiframa i lozinkama 78 Apple Pay 85 iMessage 97 Dopisivanje s poduzećem 100 FaceTime 101 Pronalaženje 101 Kontinuitet 105 Sigurnost mreže 109 Pregled sigurnosti mreže 109 Sigurnost TLS mreže 109 Virtualne privatne mreže (VPN-ovi) 110 Sigurnost Wi-Fi mreže 111 Sigurnost Bluetootha 114 -
Apple Inc.: Managing a Global Supply Chain1
For the exclusive use of T. Ausby, 2015. W14161 APPLE INC.: MANAGING A GLOBAL SUPPLY CHAIN1 Ken Mark wrote this case under the supervision of Professor P. Fraser Johnson solely to provide material for class discussion. The authors do not intend to illustrate either effective or ineffective handling of a managerial situation. The authors may have disguised certain names and other identifying information to protect confidentiality. This publication may not be transmitted, photocopied, digitized or otherwise reproduced in any form or by any means without the permission of the copyright holder. Reproduction of this material is not covered under authorization by any reproduction rights organization. To order copies or request permission to reproduce materials, contact Ivey Publishing, Ivey Business School, Western University, London, Ontario, Canada, N6G 0N1; (t) 519.661.3208; (e) [email protected]; www.iveycases.com. Copyright © 2014, Richard Ivey School of Business Foundation Version: 2014-06-12 INTRODUCTION Jessica Grant was an analyst with BXE Capital (BXE), a money management firm based in Toronto.2 It was February 28, 2014, and Grant was discussing her U.S. equity mandate with BXE’s vice president, Phillip Duchene. Both Grant and Duchene were trying to identify what changes, if any, they should make to BXE’s portfolio. “Apple is investing in its next generation of products, potentially the first new major product lines since Tim Cook took over from Steve Jobs,” she said. Apple Inc., the world’s largest company by market capitalization, had introduced a series of consumer products during the past dozen years that had transformed it into the industry leader in consumer devices. -
Apple A11 Bionic
Apple A11 The Apple A11 Bionic is a 64-bit ARM-based system on a chip (SoC), designed by Apple Inc.[6] and manufactured by TSMC.[1] It first appeared in the iPhone 8, iPhone 8 Plus, and iPhone Apple A11 Bionic X which were introduced on September 12, 2017.[6] It has two high-performance cores which are 25% faster than the Apple A10 and four high-efficiency cores which are up to 70% faster than the energy-efficient cores in the A10.[6][7] Contents Design Neural Engine Products that include the Apple A11 Bionic See also References Produced From Design September 12, 2017 to [1][6][4] The A11 features an Apple-designed 64-bit ARMv8-A six-core CPU, with two high-performance cores at 2.39 GHz, called Monsoon, and four energy-efficient cores, called Mistral. present The A11 uses a new second-generation performance controller, which permits the A11 to use all six cores simultaneously,[8] unlike its predecessor the A10. The A11 also integrates an Apple- Designed by Apple Inc. designed three-core graphics processing unit (GPU) with 30% faster graphics performance than the A10.[6] Embedded in the A11 is the M11 motion coprocessor.[9] The A11 includes a new Common [1] image processor which supports computational photography functions such as lighting estimation, wide color capture, and advanced pixel processing.[6] TSMC manufacturer(s) [1] [7] 2 [10] The A11 is manufactured by TSMC using a 10 nm FinFET process and contains 4.3 billion transistors on a die 87.66 mm in size, 30% smaller than the A10. -
Iphone 5S Deconstruction Full Document (Pdf)
278E ATLAS West Salem Titans 2018 Texas Instruments Electronics Online Challenge Team 278E ATLAS, West Salem High, Oregon, USA Team members: Christopher Bingham Tyson Fairhurst Matt Brock Caleb Pugmire Ryan Walker 2018 TI Challenge 278E ATLAS Introduction: We chose to deconstruct an Apple iPhone 5s for our Vex Texas Instruments Online Challenge submission. We selected this device because of its advanced technology and the improvements it made in the mobile phone industry when it was announced in 2013. It was one of the first mainstream mobile devices to include biometric security (Touch ID). It also included a revolutionary new motion coprocessor for more efficient processing and power usage. Along with iPhone 5s Apple released iOS 7, a complete revamp of the popular mobile operating system. Parts Overview: • Logic Board o Processor o Co-processor o Flash Storage o Wi-Fi Module o Power management IC o Touchscreen controller and Interface o Accelerometer and Gyro o LTE Modem o Mobile Transceiver o SIM Card • Touch ID and Home button • Cameras • Speakers • Microphones • Haptic Motor • Power port • Audio Mini-jack • Ambient light sensor • Proximity sensor • Antenna • Battery 2018 TI Challenge 278E ATLAS 2018 TI Challenge 278E ATLAS Parts in Depth: Image 1 Image 2 2018 TI Challenge 278E ATLAS Logic Board (Images 1, 2, and 11-4) The logic board houses all major computing components for the iPhone, as well as ribbon cable connectors for the battery and other components. Image 3 Logic Board: Apple A7 SOC (Image 3) The A7 (APL0698) is a system on a chip. It includes the 64-bit ARMv8 Cyclone processor, 1GB LPDDR3 DRAM, PowerVR G6430 GPU, and “Secure Enclave” for storing and protecting biometric data from Touch ID.