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Second Generation of TSMC's Integrated Fan-Out (Info Apple A11 Application Processor Second generation of TSMC’s inFO packaging PACKAGING report by Stéphane ELISABETH February 2018 – version 1 ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 1 Table of Contents Overview / Introduction 4 o Application Processor 87 o Executive Summary Die Views, Marking & Dimensions o Reverse Costing Methodology Die Cross-Section Company Profile 8 Die Process Characteristics o Apple Physical Comparison 94 o Apple APE Portfolio o Apple’s APE Series: A9, A10, A11 o Fan-Out Packaging o APE’s PoP Technology: Standard PoP, MCeP, inFO o TSMC inFO Technology Manufacturing Process 98 o Apple iPhone 8 & X Teardown o APE Die Front-End Process & Fabrication Unit o Fan-Out Market o Deep Trench Capacitor Die Front-End Process Flow Physical Analysis 22 & Fabrication Unit o Summary of the Physical Analysis 23 o inFO Packaging Process Flow & Fabrication unit o Packaging 25 Cost Analysis 117 Package Views, Marking & Dimensions o Summary of the cost analysis 118 o Yields Explanation & Hypotheses 119 Package X-Ray o APE die 122 Package RDL Deprocessing Wafer & Die Front-End Cost Package Memory: X-Ray view & Opening Preparation Wafer Cost Package Opening o LSC die 126 Board Cross-Section: Via Frame, PCB, Dimensions Wafer & Die Front-End Cost Package Cross-Section: TiV, Adhesive, RDLs Frond-End cost per Process Steps Package Process o inFO Packaging 131 Summary of Physical Data inFO Wafer Cost o Land-Side Capacitor 65 inFO Front-End Cost per Process Steps Die Views & Dimensions Component Cost Die Deprocessing & Delayering Company services 136 Die Process Die Cross-Section Die Process Characteristics ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 2 Executive Summary Overview / Introduction o Executive Summary • This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of o Reverse Costing Methodology the Apple A11. o Glossary Company Profile & Supply Chain • Comparing the Apple iPhone X and the Apple iPhone 8, the two flagship has different way to integrate the main board. On the iPhone X, the main board is using special PCB technology from AT&S to reduce about 53 % of the main board footprint. AT&S has Physical Analysis managed to use two side mounted PCB and a via frame to compact the main board. The APE is located inside the structure under the DRAM package using PoP technology. This new version comes along with a new land-side decoupling capacitors (LSC) Physical Comparison technology. Manufacturing Process Flow Cost Analysis • The Apple A11 is a wafer-level package using new generation of TSMC’s packaging technology with copper pillar as Through inFO Via (TiV) to replace the well-known Through Molded Via (TMV) technology. Compared to standard PoP technology, Apple still have Feedbacks a head start with the inFO packaging and its innovations: Copper Pillars, Redistribution layer, silicon high density capacitor integration, … About System Plus • In this report, the complete packaging is analyzed from the DRAM memory to the LSC developed by TSMC. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the packaging. It also features a complete technology comparison with standard PoP and Shinko’s MCeP PoP packaging used in the market. ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 3 Apple iPhone 8 & X Teardown Overview / Introduction Company Profile & Supply Chain o Apple o Apple APE PortFolio o TSMC inFO o Apple 8 & X Teardown o Fan-Out Market Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 4 Summary of the Physical Analysis Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 5 Package Views & Dimensions Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 6 Package X-Ray View Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 7 Package Overview – RDL #3 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 8 A11 & Samsung – Package X-Ray Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 9 Board Cross-Section – Via Frame Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 10 Package Cross-Section Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 11 Package Cross-Section – RDLs Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 12 Land-Side Decoupling Capacitor – Die View & Dimensions Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 13 Land-Side Decoupling Capacitor – Die Process Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 14 Land-Side Decoupling Capacitor – Die Cross-Section Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 15 APE Die Dimensions Overview / Introduction Company Profile & Supply Chain Physical Analysis o Packaging o Board Cross-Section o Package Cross-Section o Land-side Capacitor o Application Processor Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 16 Package Comparison – Apple‘s APE Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison o Apple APE’s Series o APE’s PoP Technology Manufacturing Process Flow Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 17 Deep Trench Capacitor Front-End Process Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow o APE Die Front-End Process o Deep Trench Capacitor FE Process o inFO Packaging Process Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 18 Packaging Process Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow o APE Die Front-End Process o Deep Trench Capacitor FE Process o inFO Packaging Process Cost Analysis Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11 with TSMC inFO Packaging 19 inFO Packaging Cost Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis o Synthesis o Supply Chain o Yield hypothesis o APE Wafer & Die Cost o LSC Wafer & Die Cost o inFO Packaging Cost Feedbacks About System Plus ©2017 by System Plus Consulting | Apple A11
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