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TSMC Integrated Fan-Out TSMC Integrated Fan-Out (inFO) Package in Apple’s A10 Application Processor Reverse engineering and costing of the new inFO packaging technology from TSMC used for Apple’s latest A10 application processor, found in the iPhone 7 and 7 Plus Each year, Apple integrates new technology and innovations into Title: Apple A10 inFO-PoP the iPhone. This year, with the Pages: 100 iPhone 7, Apple is the first to bring Date: October 2016 out Package on Package (PoP) Wafer-Level Packaging (WLP) at the Format: PDF & Excel file consumer scale. For its new Price: Full report: EUR 3,490 application processor (AP), the A10, Apple has decided to use TSMC’s new integrated Fan-Out PoP (inFO- PoP) packaging technology. COMPLETE TEARDOWN WITH: Located under the DRAM package on the main board, the AP is packaged using PoP. The iPhone 7 and iPhone 7 Plus models have different DRAM • Detailed photos memory space management. The Apple A10 is a wafer-level package using • Precise measurements TSMC’s packaging technology with copper pillar Through inFO Vias (TIVs) • Material analysis to replace the well-known Through Molded Via (TMV) technology. With this new technology, Apple has made a huge break from traditional PoP • Manufacturing process packaging found in previous AP generations. flow In this report, we show the differences and the innovations of this • Supply-chain evaluation package, including copper pillars, the redistribution layer, and silicon high • Manufacturing cost density capacitor integration. A detailed comparison will give the pros and analysis cons of inFO technology compared to PoP packaging used in the Exynos 8 and the Snapdragon 820. • Estimated sales price Thanks to the inFO process, Apple is able to offer a very thin package on • Comparison with Samsung package, with a high number of I/O pads and better thermal Exynos 8 and Qualcomm management. The result is a very cost-effective component that can Snapdragon 820 compete with any well-known PoP. This report also compares costs with • Comparison of Apple A10 other chips and includes a technical comparison with the previous Apple with Apple A9 AP, the A9. TABLE OF CONTENTS Overview/Introduction Manufacturing Process Flow AUTHORS: Company Profile and • Chip Fabrication Unit Stéphane Elisabeth Supply Chain • Packaging Fabrication Unit • inFO Package Process Flow Stéphane has a Physical Analysis deep knowledge • Physical Analysis Cost Analysis of materials characterizations Methodology • Synthesis of the Cost Analysis and electronics systems. He holds an Engineering Degree in • iPhone 7 Plus Disassembly • Supply Chain Description Electronics and Numerical • Yield Hypotheses A10 die removal Technology, and a PhD in • A10 Packaging Analysis • A10 Die Cost Analysis Materials for Microelectronics. Package view and dimensions Wafer cost YvonAuthor (Lab): Package opening Die cost LeVéronique Goff (Lab) Package cross-section • inFO Package Cost Analysis YvonLe TroadecLe Goff has • Land-Side Decoupling inFO wafer front-end cost joined System Capacitor inFO cost by process step Plus Consulting in 2011, in Die view and dimensions Véronique is in charge of • Final Test Cost order to set up the laboratory • PoP Comparison (Samsung’s structure analysis of semi- • Component Cost of System Plus Consulting. He PoP and Shinko’s MCeP) conductors. She has a deep previously worked during 25 • A10 Die Analysis Estimated Price Analysis knowledge in chemical & physicalyears technicalin AtmelanalysesNantes. She Die view and dimensions Cost and Price Comparison previouslyTechnologicalworked for 20Analysisyears Die cross-section with Samsung’s PoP and inLaboratoryAtmel Nantesas Laboratoryfab support. in physical analysis, and 3 years Die process Shinko’s MCeP • Comparison with Previous at Hirex Engineering in Generation (A9) Toulouse, in a DPA lab. ANALYSIS PERFORMED WITH OUR COSTING TOOL 3D PACKAGE COSIM+ System Plus Consulting offers powerful costing tools to evaluate the production cost & selling price from single chip to complex structures. 3D Package Cosim+ Cost simulation tool to evaluate the cost of any Packaging process: Wafer-level packaging, TSV, 3D integration… 3D-Package CoSim+ 3D Package CoSim+ is a process- based costing tool used to evaluate the manufacturing cost per wafer using your own inputs or using the pre-defined parameters included in the tool. It is possible to enter any Package process flow. Performed by RELATED REPORTS TSMC Deep Trench Capacitor Samsung’s Galaxy S7 Fan-Out: Land-Side Decoupling Processor Packages: Technologies & Market Capacitor in Apple’s A10 Qualcomm/Shinko’s MCeP Trends 2016 Application Processor vs. Samsung’s PoP Reverse engineering and costing of A comparison of Qualcomm Fan-Out packaging: the most the new Integrated Passive Device Snapdragon 820 MSM8996 with dynamic advanced packaging technology from TSMC used for MCeP packaging technology vs. platform. Will it be sustainable Apple’s latest A10 application Samsung Exynos 8 with TMV PoP. long-term? processor, found in the iPhone 7. Pages: 100 Pages: 113 Pages: 240 Date: October 2016 Date: June 2016 Date: July 2016 Full report: EUR 3,490* Full report: EUR 3,790* Full report: EUR 6,490* ANNUAL SUBSCRIPTION OFFER Each year System Plus Consulting releases a comprehensive collection of new reverse engineering & costing analyses in various domains. You can choose to buy over 12 months a set of 3, 4, 5, 7, 10 or 15 Reverse Costing® reports. Up to 47% discount! More than 40 reports released each year on the following topics (considered for 2016): • MEMS & Sensors (20 reports): • ICs (3 reports): • Gyros/Accelerometers/IMU • Multimedia SoC • Oscillators/RF switches • Ethernet for car IC, etc. • Pressure sensors/Gas sensors • Imaging & LEDs (11 reports): • Camera modules, Infrared • Power Electronics & Systems (12 reports): sensors & cameras GaN and SiC devices • • LEDs • Inverters & modules • Automotive radars • Advanced Packaging (5 reports): • Head Up displays, Displays • WLP, TSV • Embedded devices, etc. Performed by ORDER FORM Please process my order for “Apple A10 inFO-PoP” Reverse Costing Report Ref.: SP16290 Full Reverse Costing report: EUR 3,490* Bundle Offer with TSMC DTC: EUR 5,500* Annual Subscription (including this report as the first of the year): o 3 reports EUR 8 400* o 7 reports EUR 16 000* o 4 reports EUR 11 000* o 10 reports EUR 21 000* o 5 reports EUR 12 500* o 15 reports EUR 27 500* *For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 20 % for VAT *Our prices are subject to change. 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